CN113359904A - Heating control unit and device - Google Patents
Heating control unit and device Download PDFInfo
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- CN113359904A CN113359904A CN202110685128.6A CN202110685128A CN113359904A CN 113359904 A CN113359904 A CN 113359904A CN 202110685128 A CN202110685128 A CN 202110685128A CN 113359904 A CN113359904 A CN 113359904A
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- heating control
- power supply
- operational amplifier
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
Abstract
The invention provides a heating control unit and a device, comprising: a heating control switch circuit and a power supply output circuit; the heating control switch circuit comprises a first negative temperature coefficient thermistor, an operational amplifier and a PMOS (P-channel metal oxide semiconductor) tube; and the power supply output circuit comprises a buck conversion chip and a second negative temperature coefficient thermistor. The invention uses a general IC chip to construct a heating control switch circuit to output a control level signal so as to control the switching of the power supply voltage, thereby effectively avoiding the influence of the interruption and polling time of a singlechip and effectively reducing the cost; by using the analog control scheme, the response speed is high, the system is not influenced by the single thread interruption of the MCU, the polling period is not influenced, and the closed loop is reliable; by constructing the power supply output circuit, the heating effect is in a control mode of gradually increasing power consumption, the whole power consumption is smooth, and the problems that the quality of a data signal is influenced by instantaneous large-current impact of a switch and the performance index is degraded and the reliability is caused are solved.
Description
Technical Field
The present invention relates to electronic circuits, and particularly to a heating control unit and a heating control device.
Background
Transmitter Optical Subassembly (TOSA) is mainly used for converting electrical signals into Optical signals (E/O conversion). Existing TOSAs mainly include both refrigerated and uncooled (unoool) types.
The internal integrated thermoelectric Cooler (TEC) of the cooling type TOSA mainly uses the peltier effect of a semiconductor material to heat and cool a laser chip. When direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat; the heat release surface of the TEC is kept in thermal contact with the laser chip at low temperature, and direct current is applied to the TEC, so that the laser chip can be heated; and reverse direct current is applied to the TEC at high temperature, so that the laser chip can be refrigerated.
The non-refrigeration type TOSA does not have the TEC subassembly inside, and the laser chip carries out the thermal contact with TOSA's shell, dispels the heat through heat conduction. The non-refrigeration TOSA saves a TEC assembly, so that the cost of the product is greatly reduced, and the power consumption of the whole scheme is greatly reduced; and the internal space of the optical device is greatly saved, the internal routing is convenient and simple, and the evolution of the TOSA to a smaller size is facilitated. However, the laser chip in the non-refrigeration TOSA chip is strongly related to the temperature of the external environment, and the performance index and the reliability index of the laser chip are difficult to be completely guaranteed because the industrial application puts high requirements on the quality of the laser chip.
The design scheme of the heating control circuit for the heating chip in the heating type TOSA has multiple types: the special TEC control chip can be directly used, and a special Digital to Analog converter (IDAC) chip can also be used. However, both of the two design schemes require a dedicated chip, and a Micro Control Unit (MCU) is required to control the heating chip by interruption or polling, which results in high operation cost; and because Printed Circuit Board (PCB) layout area is big, need occupy the resource of MCU simultaneously, the usability price ratio is low in 5G fronthaul scene.
The power supply voltage of the optical module is directly used for supplying power to the heating chip, and the heating chip is controlled to be turned on and turned off through a Micro Controller Unit (MCU) and a switch. Because this scheme heating chip consumption is invariable, the switch has great current fluctuation in the twinkling of an eye, can cause transient state influence to the signal, has the reliability risk.
Disclosure of Invention
In order to overcome the defects of the heating control circuit provided in the prior art, embodiments of the present invention provide a heating control unit and a device.
In a first aspect, the present invention provides a heating control unit comprising: a heating control switch circuit and a power supply output circuit; the heating control switch circuit comprises a first negative temperature coefficient thermistor, an operational amplifier and a PMOS (P-channel metal oxide semiconductor) tube; the first negative temperature coefficient thermistor changes the resistance value according to the change of the temperature so as to control the output state of the operational amplifier; the PMOS tube outputs a corresponding control level signal according to the output state of the operational amplifier; the power supply output circuit comprises a buck conversion chip and a second negative temperature coefficient thermistor; the control level signal is input to an enabling input end of the buck conversion chip; and the resistance value of the second negative temperature coefficient thermistor is changed according to the change of the temperature so as to control the size of the power supply voltage output by the voltage output end of the buck conversion chip.
In one embodiment, the heating control switch circuit further includes: the second resistor, the third resistor, the fourth resistor and the fifth resistor; one end of the second resistor, one end of the first negative temperature coefficient thermistor and the inverting input end of the operational amplifier; the non-inverting input end of the operational amplifier is connected with one end of the third resistor, one end of the fourth resistor and one end of the fifth resistor; the output end of the operational amplifier is connected with the other end of the fifth resistor and the grid electrode of the PMOS tube; the source stage of the PMOS tube, the power supply input end of the operational amplifier, the other end of the first negative temperature coefficient thermistor and the other end of the fourth resistor are connected with a power supply; the other end of the second resistor, the other end of the third resistor and the grounding end of the operational amplifier are all grounded; and the drain of the PMOS tube outputs the control level signal.
In one embodiment, the fifth resistor is an adjustable resistor.
In one embodiment, the heating control switch circuit further includes: a sixth resistor; one end of the sixth resistor is connected with the drain of the PMOS tube, and the other end of the sixth resistor is grounded.
In one embodiment, the power supply output circuit further includes: a seventh resistor; one end of the seventh resistor is connected with one end of the second negative temperature coefficient thermistor and is connected to the feedback end of the buck conversion chip; the other end of the second negative temperature coefficient thermistor is connected to a voltage output end of the buck conversion chip, and the voltage output end of the buck conversion chip outputs the power supply voltage; the power supply is connected to the voltage input end of the buck conversion chip; the control level signal is input to an enabling input end of the buck conversion chip; and the grounding end of the buck conversion chip is grounded.
In one embodiment, the seventh resistor is an adjustable resistor.
In one embodiment, the power supply output circuit further includes: a first capacitor; one end of the first capacitor is connected to the power supply voltage, and the other end of the first capacitor is grounded.
In one embodiment, the power supply output circuit further includes: a second capacitor; one end of the second capacitor is connected to the voltage output end of the buck conversion chip, and the other end of the second capacitor is grounded.
In one embodiment, the heating control switch circuit further includes: the second resistor, the third resistor, the fourth resistor and the fifth resistor; one end of the fourth resistor, one end of the first negative temperature coefficient thermistor and one end of the fifth resistor are connected to the non-inverting input end of the operational amplifier; the inverting input end of the operational amplifier is connected with the other end of the second resistor and the other end of the third resistor; the output end of the operational amplifier is connected with the other end of the fifth resistor and the grid electrode of the PMOS tube; the source stage of the PMOS tube, the power supply input end of the operational amplifier, the other end of the third resistor and the other end of the fourth resistor are connected with a power supply; the other end of the second resistor, the other end of the first negative temperature coefficient thermistor and the grounding end of the operational amplifier are all grounded; and the drain of the PMOS tube outputs the control level signal.
In a second aspect, the present invention provides a heating control apparatus comprising: any one of the heating control unit, the power detection unit and the radio frequency signal driving unit; the power detection unit is used for detecting the luminous power of the heating type tosa; the radio frequency signal driving unit is used for providing bias current and radio frequency driving current for the laser chip of the heating type tosa; and the heating control device is used for providing the power supply voltage for the heating type light emission secondary module according to the change of the temperature.
According to the heating control unit and the device, the universal IC chip is used for constructing the heating control switch circuit to output the control level signal so as to control the switching of the power supply voltage, the influence of the interruption and the polling time of the single chip microcomputer can be effectively avoided, and the cost is effectively reduced; by using the analog control scheme, the response speed is high, the system is not influenced by the single thread interruption of the MCU, the polling period is not influenced, and the closed loop is reliable; by constructing the power supply output circuit, the heating effect is in a control mode of gradually increasing power consumption, the whole power consumption is smooth, and the problems that the quality of a data signal is influenced by instantaneous large-current impact of a switch and the performance index is degraded and the reliability is caused are solved.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a heating control switch circuit according to the present invention;
FIG. 2 is a schematic diagram of a power supply output circuit according to the present invention;
FIG. 3 is a schematic diagram of another heating control switch circuit according to the present invention;
FIG. 4 is a schematic structural diagram of a heating control device provided by the present invention;
FIG. 5 is a schematic diagram of a RF signal driving unit according to the present invention;
fig. 6 is a schematic wiring diagram of a power detection unit according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that in the description of the embodiments of the present invention, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, unit, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, unit, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, unit, article, or apparatus that comprises the element. The terms "upper", "lower", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
A heating control unit and apparatus provided by an embodiment of the present invention will be described below with reference to fig. 1 to 6.
The TOSA in the prior art mainly comprises a refrigeration type TOSA and a non-refrigeration type TOSA, and although the refrigeration type TOSA can effectively realize heating and refrigeration of a laser chip, the cost and power consumption are high, and the size is large; although the non-refrigeration type TOSA has low cost, the performance index and the reliability index are difficult to completely ensure.
The invention integrates the advantages and the disadvantages of the TOSA of the two types, and provides the heating type TOSA, wherein a heating chip is additionally arranged in the optical device between the two types; heating the laser chip by the heating chip at a low temperature, and keeping the temperature of the laser chip higher at the low temperature; the heating chip does not work at high temperature, and the laser chip dissipates heat through heat conduction; the temperature change range of the working environment of the laser chip is effectively reduced, and the performance and reliability indexes are greatly enhanced. As a solution with low cost and low power consumption, the method meets the application of a 5G forward-transmission scene.
The heating control unit is a key component of the heating type TOSA, and the design scheme thereof has multiple types: a special TEC control chip can be directly used, and a special IDAC chip based on a digital adjustable current source can also be used; the two schemes both need a special chip and a micro control unit, and the MCU controls the chip through interruption or polling, so that the cost is high; and because the PCB layout area is large and the MCU resource is occupied, the usability and cost ratio of the PCB in a 5G forward-transmission scene is low.
In view of the above-mentioned shortcomings of the existing heating control circuit, the present invention provides a heating control unit, which mainly includes but is not limited to: a heating control switch circuit and a power supply output circuit; the heating control switch circuit comprises a first negative temperature coefficient thermistor, an operational amplifier and a PMOS (P-channel metal oxide semiconductor) tube; the first negative temperature coefficient thermistor changes the resistance value according to the change of the temperature so as to control the output state of the operational amplifier; the PMOS tube outputs a corresponding control level signal according to the output state of the operational amplifier; the power supply output circuit comprises a buck conversion chip and a second negative temperature coefficient thermistor; the control level signal is input to an enabling input end of the buck conversion chip; and the resistance value of the second negative temperature coefficient thermistor is changed according to the change of the temperature so as to control the size of the power supply voltage output by the voltage output end of the buck conversion chip.
Generally, the heating control unit provided by the invention adopts a gradual power consumption heating closed-loop control scheme based on an analog circuit, and comprises:
an analog Circuit is constructed by adopting a common IC Chip (Integrated Circuit Chip), and comprises a heating control switch Circuit and a power supply output Circuit, so that the heating current for heating the heating Chip is controlled to be switched on and off, the influence of an MCU terminal and polling time can be effectively avoided, and the cost is effectively reduced.
Negative Temperature Coefficient thermistor (NTC _ R), which is a Resistor with a large Negative Temperature Coefficient, is manufactured by using metal oxides such as manganese, cobalt, nickel, and copper as main materials and adopting a ceramic process. These metal oxide materials all have semiconductor properties because they are completely similar in conduction to semiconductor materials such as germanium, silicon, etc. At low temperatures, these oxide materials have a low number of carriers (electrons and holes) and therefore have a high resistance value; as the temperature increases, the number of carriers increases, and the resistance value thereof gradually decreases.
The heating control unit provided by the invention uses a first negative temperature coefficient thermistor (R _ NTC1) to adjust and control the output state of an operational amplifier (U1), and concretely comprises the following components:
when the temperature is reduced, the resistance value of the R _ NTC1 is increased, the voltage of the negative input end of the U1 is reduced, the voltage of the positive input end is unchanged, and the output of the operational amplifier is low level; when the temperature rises, the resistance value of the R _ NTC1 is reduced, the voltage of the negative input end of the U1 rises, the voltage of the positive input end is unchanged, and the output of the operational amplifier is at a high level.
And then, the output level of the operational amplifier controls the conduction and the disconnection of the PMOS tube so as to output a corresponding control level signal, thereby realizing the control of the on and the off of the heating current.
Furthermore, the invention also utilizes the power supply output circuit to adjust the magnitude of the heating current by adjusting the magnitude of the power supply voltage according to the temperature variation of the resistance value of the second negative temperature coefficient thermistor (hereinafter referred to as R _ NTC2) along with the temperature variation.
The U1 may adopt a rail-to-rail type operational amplifier, that is, the output voltage of the U1 can reach the maximum supply voltage.
According to the heating control unit provided by the invention, a universal IC chip is used for constructing the heating control switch circuit to output the control level signal so as to control the switching of the power supply voltage, the influence of the interruption and the polling time of a single chip microcomputer can be effectively avoided, and the cost is effectively reduced; by using the analog control scheme, the response speed is high, the system is not influenced by the single thread interruption of the MCU, the polling period is not influenced, and the closed loop is reliable; by constructing the power supply output circuit, the heating effect is in a control mode of gradually increasing power consumption, the whole power consumption is smooth, and the problems that the quality of a data signal is influenced by instantaneous large-current impact of a switch and the performance index is degraded and the reliability is caused are solved.
Fig. 1 is a schematic structural diagram of a heating control switch circuit provided in the present invention, as shown in fig. 1, mainly including: a second resistor R2, a third resistor R3, a fourth resistor R4 and a fifth resistor R5;
one end of the second resistor R2, one end of the first negative temperature coefficient thermistor R _ NTC1 and the inverting input end B1 of the operational amplifier U1;
a non-inverting input terminal C1 of the operational amplifier U1 is connected to one end of the third resistor R3, one end of the fourth resistor R4 and one end of the fifth resistor R5;
the output end A1 of the operational amplifier U1 is connected with the other end of the fifth resistor R5 and the gate of the PMOS transistor Q1;
the source stage of the PMOS tube Q1, the power supply input end A2 of the operational amplifier U1, the other end of the first negative temperature coefficient thermistor R _ NTC1 and the other end of the fourth resistor R4 are connected with a power supply;
the other end of the second resistor R2, the other end of the third resistor R3 and a grounding end C2 of the operational amplifier U1 are all grounded;
the drain of the PMOS tube Q1 outputs the control level signal.
As an alternative embodiment, the operational amplifier U1 is a rail-to-rail type operational amplifier, the second resistor R2, the third resistor R3, the fourth resistor R4, and the fifth resistor R5 all select a common constant-resistance resistor, VCC is a power supply, and Enable is an output control level signal.
The first NTC1 has a characteristic that the resistance of the resistor decreases with increasing temperature, and the resistance can be calculated as:
Rt＝R*EXP[B*(1/T1-1/T2)]；
wherein R istIs R _ NTC1 at temperature T1Real-time resistance of the time; r is its temperature T2A resistance value of time; t is1And T2Are both kelvin temperatures; EXP is natural index algorithm, and B is thermal coefficient. Wherein, R, T2And B are given at the factory of the first negative temperature coefficient thermistor R _ NTC 1.
In the heating control switch circuit provided by the invention, the operational amplifier U1, the second resistor R2, the third resistor R3, the fourth resistor R4, the fifth resistor R5, the first negative temperature coefficient thermistor R _ NTC1 and the PMOS transistor Q1 form a hysteresis comparison amplifying circuit.
When R4/R3 is R _ NTC1/R2, the hysteresis comparison and amplification circuit is also considered to be an on/off threshold point of the high and low levels in the output control level signal. Therefore, the appropriate resistances of the second resistor R2, the third resistor R3 and the fourth resistor R4 can be selected according to the resistance of the R _ NTC1, so as to control the operational amplifier U1 to be turned on and off at that temperature point.
As shown in fig. 1, when the temperature decreases, the resistance of the R _ NTC1 increases, the voltage of the negative input terminal of the operational amplifier U1 decreases, and the voltage of the positive input terminal thereof does not change, so that the control level signal output by the operational amplifier U1 is at a low level; when the temperature rises, the resistance value of the R _ NTC1 is reduced, the voltage of the inverting input terminal B1 of the operational amplifier U1 rises, the voltage of the forward input terminal C1 is unchanged, and the control level signal output by the operational amplifier is at a high level.
The heating control switch circuit provided by the invention performs switch control through the analog circuit based on the thermistor without processing by the MCU unit, so that the heating control switch circuit is not influenced by interruption or a polling time period and has high response speed. In addition, the invention uses a universal analog component, and compared with a special IDAC chip, the cost is reduced, and the supply chain is stable.
Based on the above embodiment, as shown in fig. 1, the fifth resistor R5 is an adjustable resistor.
Specifically, when the fifth resistor R5 is an adjustable resistor, the hysteresis interval of turning on and off can be adjusted by adjusting the resistance of the fifth resistor R5. The larger the resistance value of the fifth resistor R5 is, the smaller the hysteresis interval is; the smaller the resistance of the fifth resistor R5, the larger the hysteresis interval.
Based on the content of the above embodiment, as shown in fig. 1, the heating control switch circuit provided by the present invention further includes: a sixth resistor R6;
one end of the sixth resistor R6 is connected with the drain of the PMOS tube Q1, and the other end of the sixth resistor R6 is grounded.
The PMOS transistor Q1 and the sixth resistor R6 constitute a switching jitter suppression circuit to suppress switching fluctuations within the hysteresis interval. The source (S level) of the P MOS tube is connected with a power supply (VCC power supply), the grid (G level) is connected with the output end A1 of the operational amplifier U1, and the drain (D level) outputs the control level signal.
At the moment when the heating control switch circuit is started, and the states of the operational amplifier U1 and the PMOS transistor Q1 are not stable, the control level signal is grounded 5 (namely GND) through the sixth resistor R6 to keep low level, at the moment, the heating current is zero, the heating chip does not work,
however, when the temperature is reduced to the threshold value, the output of the operational amplifier U1 is at a low level, the PMOS transistor is turned on, and the control level signal enters a high level state. At this point, the heating circuit is activated.
When the temperature rises to the threshold value, the output of the operational amplifier is high level, the PMOS tube is switched off, the control level signal enters a low level state, and the heating circuit is switched off at the moment.
In addition, in the heating control switch circuit provided by the invention, the sixth resistor is added, so that the fluctuation in the jitter and hysteresis interval can be suppressed by the intrinsic characteristics of the PMOS tube.
Fig. 2 is a schematic structural diagram of a power supply output circuit provided in the present invention, and as shown in fig. 2, the power supply output circuit further includes: a seventh resistor R7;
one end of the seventh resistor R7 is connected to one end of the second negative temperature coefficient thermistor R _ NTC2 and is connected to a feedback end FB of the BUCK conversion chip (hereinafter referred to as BUCK chip);
the other end of the second negative temperature coefficient thermistor R _ NTC2 is connected to a voltage output end VOUT of the BUCK chip, and the voltage output end of the BUCK chip outputs the power supply voltage VCC _ Heater; a power supply VCC is connected to a voltage input end VIN of the BUCK chip; the control level signal Enable is input to an Enable input end EN of the BUCK chip; and the grounding GND end of the BUCK chip is grounded.
The seventh resistor R7 can be a general resistor, the R _ NTC2 is a negative temperature coefficient thermistor, the BUCK chip is a general step-down DC-DC power supply chip, and Enable is a control level signal.
Under the switching control of the heating control switching circuit shown in fig. 1, the supply voltage VCC _ Heater output by the voltage output terminal of the BUCK chip is the supply voltage supplied to the heating type TOSA.
It should be noted that when the temperature is reduced to the threshold value and the power supply circuit is started, the resistance of the R _ NTC2 is a small value, and the voltage value of the power supply voltage VCC _ Heater is small, and the current fluctuation caused by the on and off moments is small. The maximum value of VCC _ Heater voltage is the voltage value of the power supply VCC, and is determined by the power supply working mechanism of the BUCK chip, and the proper power supply VCC or the heating chip matched with proper resistance inside the TOSA is selected, so that the maximum power consumption of heating can be effectively controlled, and the reliability accident caused by overvoltage, overcurrent and excessive heating can be avoided.
The power supply output circuit provided by the invention is used for carrying out power supply control on the output voltage adjustable circuit based on the negative temperature coefficient, the instantaneous output voltage of the switch is small, the load current is small, and the influence of current fluctuation on signals is small.
Based on the content of the foregoing embodiment, as an alternative embodiment, the seventh resistor R7 is an adjustable resistor.
Since the seventh resistor R7, the second negative temperature coefficient thermistor R _ NTC2 and the BUCK chip together form an adjustable output voltage circuit, wherein:
VCC_Heater＝(R_NTC2+R7)/R7*V_FB；
wherein, V _ FB is the fixed voltage value of BUCK chip, is decided by the power chip itself; by adjusting the resistance of R7 and the V _ FB voltage, the range of the output voltage VCC _ Heater can be controlled.
Based on the content of the foregoing embodiment, as an optional embodiment, the power supply output circuit provided by the present invention may further include: a first capacitance C1; one end of the first capacitor C1 is connected to the power supply voltage VCC, and the other end of the first capacitor C1 is grounded.
Optionally, the power supply output circuit may further include: a second capacitance C2; one end of the second capacitor C2 is connected to a voltage output end VOUT of the BUCK chip, and the other end of the second capacitor C2 is grounded.
Specifically, C1 provides filtering for the supply voltage VCC and C2 provides filtering for the output voltage VCC _ Heater.
Fig. 3 is a schematic structural diagram of another heating control switch circuit provided by the present invention, as shown in fig. 3, which mainly includes: a second resistor R2, a third resistor R3, a fourth resistor R4 and a fifth resistor R5;
one end of the fourth resistor R4, one end of the first negative temperature coefficient thermistor R _ NTC1 and one end of the fifth resistor R5 are connected to the non-inverting input terminal C1 of the operational amplifier U1;
the inverting input end B1 of the operational amplifier U1 is connected with the other end of the second resistor R2 and the other end of the third resistor R3;
the output end A1 of the operational amplifier U1 is connected with the other end of the fifth resistor R5 and the gate (G pole) of the PMOS tube Q1;
the source (S pole) of the PMOS tube Q1, the power input end A2 of the operational amplifier U1, the other end of the third resistor R3 and the other end of the fourth resistor R4 are connected with a power supply VCC;
the other end of the second resistor R2, the other end of the first negative temperature coefficient thermistor R _ NTC1 and the grounding end C2 of the operational amplifier U1 are all grounded;
and the drain (D pole) of the PMOS pipe Q1 outputs the control level signal Enable.
It should be noted that the overall operation principle of the heating control switch circuit shown in fig. 3 is similar to that of the heating control switch circuit shown in fig. 1, and the differences are only that the positions of the first NTC1 and the connection relationship with the operational amplifier U1 are changed, which is not described herein again.
Fig. 4 is a schematic structural diagram of a heating Control apparatus provided by the present invention, and as shown in fig. 4, the heating Control apparatus provided by the present invention at least includes the heating Control unit (Heat Control) described in any of the above embodiments, and further includes a power detection unit (MPD Detect) and a Radio Frequency Signal Driver (RF-Radio Frequency Driver).
The MPD Detect is mainly used for detecting the luminous power of the heating type tosa; the RF Driver is mainly used for providing bias current and radio frequency driving current for the laser chip of the heating type tosa; the Heat Control is mainly used for providing a supply voltage VCC _ Heater for the heating type TOSA according to the change of the temperature.
It should be noted that the RF Driver in the above structure may adopt a BIAS circuit based on a Driver, such as a BIAS-T circuit, and manufacturers integrate the driving circuit of the laser into a monolithic IC chip, and control the laser can be well realized by configuring a corresponding register, so details are not described in this embodiment.
Fig. 5 is a schematic wiring diagram of an RF signal driving unit according to the present invention, and as shown in fig. 5, the RF Driver is specifically a differential RF driving control circuit, which connects the first inductor L1 in parallel with the seventh resistor R7, and connects the second inductor L2 in parallel with the eighth resistor R8, and is used for low frequency filtering.
Fig. 6 is a schematic wiring diagram of a power detection unit provided in the present invention, and as shown in fig. 6, the MPD Detect may adopt the following circuit structure:
the ninth resistor R9 can convert the photo-generated current into a voltage by connecting the power supply VCC to the cathode of the MPD Detect and connecting an Analog-to-digital converter (ADC) to the anode of the MPD Detect.
The present invention is not limited to specific circuit configurations of the RF Driver and the MPD Detect.
According to the heating control device provided by the invention, the universal IC chip is used for constructing the heating control switch circuit to output the control level signal so as to control the switching of the power supply voltage, the influence of the interruption and the polling time of the singlechip can be effectively avoided, and the cost is effectively reduced; by using the analog control scheme, the response speed is high, the system is not influenced by the single thread interruption of the MCU, the polling period is not influenced, and the closed loop is reliable; by constructing the power supply output circuit, the heating effect is in a control mode of gradually increasing power consumption, the whole power consumption is smooth, and the problems that the quality of a data signal is influenced by instantaneous large-current impact of a switch and the performance index is degraded and the reliability is caused are solved.
It should be noted that, in a specific operation, the heating control device provided in the embodiment of the present invention may execute the heating control unit described in any of the above embodiments, which is not described in detail in this embodiment.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute the units described in the various embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A heating control unit, comprising: a heating control switch circuit and a power supply output circuit;
the heating control switch circuit comprises a first negative temperature coefficient thermistor, an operational amplifier and a PMOS (P-channel metal oxide semiconductor) tube; the first negative temperature coefficient thermistor changes the resistance value according to the change of the temperature so as to control the output state of the operational amplifier; the PMOS tube outputs a corresponding control level signal according to the output state of the operational amplifier;
the power supply output circuit comprises a buck conversion chip and a second negative temperature coefficient thermistor;
the control level signal is input to an enabling input end of the buck conversion chip; and the resistance value of the second negative temperature coefficient thermistor is changed according to the change of the temperature so as to control the size of the power supply voltage output by the voltage output end of the buck conversion chip.
2. The heating control unit of claim 1, wherein the heating control switch circuit further comprises: the second resistor, the third resistor, the fourth resistor and the fifth resistor;
one end of the second resistor, one end of the first negative temperature coefficient thermistor and the inverting input end of the operational amplifier;
the non-inverting input end of the operational amplifier is connected with one end of the third resistor, one end of the fourth resistor and one end of the fifth resistor;
the output end of the operational amplifier is connected with the other end of the fifth resistor and the grid electrode of the PMOS tube;
the source stage of the PMOS tube, the power supply input end of the operational amplifier, the other end of the first negative temperature coefficient thermistor and the other end of the fourth resistor are connected with a power supply;
the other end of the second resistor, the other end of the third resistor and the grounding end of the operational amplifier are all grounded;
and the drain of the PMOS tube outputs the control level signal.
3. The heating control unit of claim 2, wherein the fifth resistance is an adjustable resistance.
4. The heating control unit of claim 2, wherein the heating control switch circuit further comprises: a sixth resistor;
one end of the sixth resistor is connected with the drain of the PMOS tube, and the other end of the sixth resistor is grounded.
5. The heating control unit of claim 1, wherein the power output circuit further comprises: a seventh resistor;
one end of the seventh resistor is connected with one end of the second negative temperature coefficient thermistor and is connected to the feedback end of the buck conversion chip;
the other end of the second negative temperature coefficient thermistor is connected to a voltage output end of the buck conversion chip, and the voltage output end of the buck conversion chip outputs the power supply voltage;
the power supply is connected to the voltage input end of the buck conversion chip;
the control level signal is input to an enabling input end of the buck conversion chip;
and the grounding end of the buck conversion chip is grounded.
6. The heating control unit of claim 5, wherein the seventh resistance is an adjustable resistance.
7. The heating control unit of claim 5, wherein the power output circuit further comprises: a first capacitor;
one end of the first capacitor is connected to the power supply voltage, and the other end of the first capacitor is grounded.
8. The heating control unit of claim 5, wherein the power output circuit further comprises: a second capacitor;
one end of the second capacitor is connected to the voltage output end of the buck conversion chip, and the other end of the second capacitor is grounded.
9. The heating control unit of claim 2, wherein the heating control switch circuit further comprises: the second resistor, the third resistor, the fourth resistor and the fifth resistor;
one end of the fourth resistor, one end of the first negative temperature coefficient thermistor and one end of the fifth resistor are connected to the non-inverting input end of the operational amplifier;
the inverting input end of the operational amplifier is connected with the other end of the second resistor and the other end of the third resistor;
the output end of the operational amplifier is connected with the other end of the fifth resistor and the grid electrode of the PMOS tube;
the source stage of the PMOS tube, the power supply input end of the operational amplifier, the other end of the third resistor and the other end of the fourth resistor are connected with a power supply;
the other end of the second resistor, the other end of the first negative temperature coefficient thermistor and the grounding end of the operational amplifier are all grounded;
and the drain of the PMOS tube outputs the control level signal.
10. A heating control apparatus comprising the heating control unit according to any one of claims 1 to 9, further comprising a power detection unit, a radio frequency signal driving unit;
the power detection unit is used for detecting the luminous power of the heating type tosa;
the radio frequency signal driving unit is used for providing bias current and radio frequency driving current for the laser chip of the heating type tosa;
and the heating control device is used for providing the power supply voltage for the heating type light emission secondary module according to the change of the temperature.
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