CN113359393B

CN113359393B - Method and device for adjusting position relation between objective lens and illuminating device and photoetching machine

Info

Publication number: CN113359393B
Application number: CN202010149344.4A
Authority: CN
Inventors: 杨宏伟
Original assignee: Shanghai Micro Electronics Equipment Co Ltd
Current assignee: Shanghai Micro Electronics Equipment Co Ltd
Priority date: 2020-03-03
Filing date: 2020-03-03
Publication date: 2023-02-07
Anticipated expiration: 2040-03-03
Also published as: CN113359393A

Abstract

The invention provides a method, a device and a photoetching machine for adjusting the position relation between an objective lens and an illuminating device, wherein the method comprises the following steps: after the complete machine adjustment of the objective lens is finished, mounting the lighting device on the complete machine, and preliminarily adjusting the position relation between the lighting device and the objective lens; mounting a mask table on the whole machine, and adjusting the position relation between the mask table and the objective lens; mounting a sensor on a bearing plate of the workpiece table, and adjusting the position relation between the sensor and the bearing plate; mounting a workpiece table on the whole machine, and adjusting the position relation between the workpiece table and the objective lens; the illumination device is electrified and initialized and emits an alignment beam, and the alignment beam passes through an alignment hole on a reference plate of the mask table and forms a light spot on the sensor after being imaged by the objective lens; the position of the light spot is determined by the sensor, and the position relation between the lighting device and the objective lens is adjusted again according to the position of the light spot so as to meet the precision requirement of the optical axis. The invention can effectively reduce the adjusting procedures, improve the assembly and adjustment efficiency and effectively reduce the manufacturing cost of the tool.

Description

Method and device for adjusting position relation between objective lens and lighting device and photoetching machine

Technical Field

The invention relates to the technical field of adjustment of photoetching machines, in particular to a method and a device for adjusting the position relation between an objective lens and an illuminating device and a photoetching machine.

Background

For the manufacturing process of large scale integrated circuits, projection lithography is the most critical process, and a projection lithography machine is required, while a projection objective is the core of the projection lithography machine, and the performance of the projection objective directly determines the pattern transfer capability of lithography. In order to ensure that the projection objective has good graph transmission capacity, high installation precision requirements are required on the projection objective correspondingly, and the installation requirements on the projection objective comprise calibration requirements on the optical axis position of the projection objective.

The conventional method for calibrating the relationship between the motion stage and the optical axis of the objective lens is shown in fig. 1: firstly, determining the position relation between an energy sensor (ESS) and an optical axis through an objective lens positioning tool, then measuring the positions of two light-transmitting square holes on a mask table reference plate by using the ESS, calculating the deviation between a mask table (RS) and the optical axis, and correcting the horizontal position of the mask table to ensure that the zero position of the mask table is superposed with the optical axis; and finally, aligning the alignment sensor on the Workpiece Stage (WS) to a mark on a reference plate of the mask stage, calculating the deviation of the workpiece stage relative to the mask stage, compensating the horizontal position of the workpiece stage, and finally enabling the zero position of the workpiece stage to coincide with the optical axis.

In addition, according to the integrated flow of the whole photoetching machine, after the objective lens is adjusted, the position relationship between the illumination device and the objective lens needs to be calibrated, in the prior art, a positioning tool needs to be used for calibrating the position relationship between the illumination device and the objective lens, and the assembly, disassembly and position adjustment of the positioning tool need to consume a large amount of time, so that the integration efficiency is reduced.

Therefore, in the calibration method of the objective lens and the lighting device in the prior art, the positioning tool is adopted for adjustment, the steps are complex and tedious, and the adjustment process is greatly influenced by the measuring method and experience of an operator, so that the integration and calibration efficiency is low, and the integration efficiency of the lithography equipment is influenced.

Disclosure of Invention

The invention aims to provide a method and a device for adjusting the position relation between an objective lens and an illuminating device and a photoetching machine, which can reduce the assembling and debugging procedures of the objective lens and an illuminating positioning tool, improve the integration efficiency and reduce the assembling and debugging cost.

To achieve the above object, the present invention provides a method for adjusting a positional relationship between an objective lens and an illumination device, comprising:

after the complete machine adjustment of the objective lens is finished, mounting an illuminating device on the complete machine, and preliminarily adjusting the position relation between the illuminating device and the objective lens so that the initial mounting position between the illuminating device and the objective lens meets the preset dimensional tolerance requirement;

mounting a mask table on a complete machine, and adjusting the position relation between the mask table and the objective lens so that the mounting position between the mask table and the objective lens meets the preset dimensional tolerance requirement;

mounting a sensor on a bearing plate of a workpiece table, and adjusting the position relation between the sensor and the bearing plate so that the mounting position of the sensor on the bearing plate meets the preset dimensional tolerance requirement;

mounting a workpiece table on a complete machine, and adjusting the position relation between the workpiece table and the objective lens so that the mounting position between the workpiece table and the objective lens meets the preset dimensional tolerance requirement;

the illumination device is electrified and initialized and emits an alignment beam, the alignment beam passes through an alignment hole in a reference plate of the mask table and forms a light spot on the sensor after being imaged by the objective lens; and

and determining the position of the light spot through the sensor, and adjusting the position relation between the lighting device and the objective lens again according to the position of the light spot so as to meet the precision requirement of the optical axis.

Optionally, before the lighting device is mounted on the complete machine, the method further includes:

and a top plate is arranged at the top of the objective lens, and a through hole for the light beam to pass through is formed in the top plate.

Optionally, the step of preliminarily adjusting the position relationship between the illumination device and the objective lens so that the initial installation position between the illumination device and the objective lens meets the preset dimensional tolerance requirement includes:

preliminarily adjusting the vertical position relationship between the lighting substrate and the top plate so that the initial mounting position between the lighting device and the objective lens meets the preset vertical dimensional tolerance requirement; and

preliminarily adjusting the horizontal position relationship between the illumination substrate and a mechanical reference surface on an illumination bracket so that the initial installation position between the illumination device and the objective lens meets the preset horizontal dimensional tolerance requirement;

the step of adjusting the position relationship between the illumination device and the objective lens again according to the position of the light spot to meet the precision requirement of the optical axis comprises the following steps:

and according to the position of the light spot, the vertical position relation between the illumination substrate and the top plate is adjusted again, and the horizontal position relation between the illumination substrate and the mechanical reference surface on the illumination support is adjusted again so as to meet the precision requirement of the optical axis.

Optionally, the step of adjusting the position relationship between the mask stage and the objective lens so that the mounting position between the mask stage and the objective lens meets the preset dimensional tolerance requirement includes:

and adjusting the vertical position relation between the mask stage and the top plate so that the mounting position between the mask stage and the objective lens meets the preset vertical dimensional tolerance requirement.

Optionally, the step of adjusting the position relationship between the workpiece stage and the objective lens so that the installation position between the workpiece stage and the objective lens meets a preset dimensional tolerance requirement includes:

and adjusting the vertical position relation between the workpiece table and the main substrate so that the installation position between the workpiece table and the objective lens meets the preset vertical dimensional tolerance requirement.

Optionally, a first alignment hole and a second alignment hole which are arranged oppositely are formed in the reference plate of the mask stage;

the step that the illumination device emits an alignment light beam, the alignment light beam passes through an alignment hole in a reference plate of the mask stage, and a light spot is formed on the sensor after the light spot is imaged by the objective lens comprises the following steps:

the illumination device emits a first alignment light beam, the first alignment light beam passes through a first alignment hole in a reference plate of the mask table and forms a first light spot on the sensor after being imaged by the objective lens;

moving the workpiece table horizontally to align the sensor with the second alignment hole; and

the illumination device emits a second alignment beam, and a second light spot is formed on the sensor after the second alignment beam passes through a second alignment hole in a reference plate of the mask table and is imaged by the objective lens;

the step of determining the position of the light spot through the sensor, and adjusting the position relationship between the lighting device and the objective lens again according to the position of the light spot to meet the precision requirement of the optical axis comprises the following steps:

and determining the positions of the first light spot and the second light spot through the sensor, and adjusting the position relation between the lighting device and the objective lens again according to the positions of the first light spot and the second light spot so as to meet the precision requirement of the optical axis.

Optionally, the sensor is a mask alignment sensor.

Optionally, after the mounting position between the mask stage and the objective lens is made to meet a preset dimensional tolerance requirement, the method further includes:

and electrifying the mask table to complete the initialization of the independent mode so as to establish a unified relation between the mask table position measuring system and the measuring system of the whole machine.

Optionally, after the installation position between the workpiece stage and the objective lens meets the preset dimensional tolerance requirement, the method further includes:

and electrifying the workpiece table to complete initialization so as to establish a unified relationship between the workpiece table position measuring system and the measuring system of the whole machine.

Optionally, the alignment hole is a square hole.

In order to achieve the above object, the present invention further provides an apparatus for adjusting a positional relationship between an objective lens and an illumination device, comprising an illumination device, an objective lens, a mask stage and a workpiece stage;

the illumination device is used for providing an alignment light beam, the illumination device is positioned above the mask table, and the initial installation position between the illumination device and the objective lens meets the preset dimensional tolerance requirement;

a reference plate is arranged on the mask table, an alignment hole is formed in the reference plate, the mask table is located above the objective lens, and the mounting position between the mask table and the objective lens meets the preset size tolerance requirement;

the objective lens is used for imaging the alignment light beam passing through the alignment hole;

the workpiece table is positioned below the objective lens, and the mounting position between the workpiece table and the objective lens meets the preset dimensional tolerance requirement;

a bearing plate is arranged on the workpiece platform, a sensor is arranged on the bearing plate, and the installation position of the sensor on the bearing plate meets the preset dimensional tolerance requirement;

and after the alignment light beam passing through the alignment hole is imaged by the objective lens, a light spot is formed on the sensor, and the sensor is used for determining the position of the light spot.

Optionally, the device further includes a top plate, the top plate is connected to the top of the objective lens, and a through hole for light beams to pass through is formed in the top plate.

Optionally, the lighting device is mounted on a lighting substrate, the lighting substrate is mounted on a lighting bracket, an X-direction mechanical reference surface and a Y-direction mechanical reference surface are arranged at the top of the lighting bracket, and an X-direction horizontal reference surface and a Y-direction horizontal reference surface are arranged on the lighting substrate.

Optionally, the X-direction mechanical reference surface includes a first X-direction mechanical reference surface and a second X-direction mechanical reference surface that are oppositely disposed.

Optionally, a vertical reference surface is further disposed on the illumination substrate.

Optionally, a first alignment hole and a second alignment hole which are arranged oppositely are formed on the reference plate of the mask stage.

Optionally, the alignment hole is a square hole.

Optionally, the sensor is a mask alignment sensor.

To achieve the above object, the present invention further provides a lithographic apparatus including the above device for adjusting the positional relationship between the objective lens and the illumination device.

Compared with the prior art, the method, the device and the photoetching machine for adjusting the position relation between the objective lens and the illuminating device have the following advantages:

(1) According to the method for adjusting the position relation between the objective lens and the illuminating device, after the complete machine adjustment of the objective lens is completed, the illuminating device is firstly installed on the complete machine, and the position relation between the illuminating device and the objective lens is adjusted, so that the initial installation position between the illuminating device and the objective lens meets the preset size tolerance requirement; then, mounting the mask table on the whole machine, and adjusting the position relation between the mask table and the objective lens so that the mounting position between the mask table and the objective lens meets the preset dimensional tolerance requirement; mounting a sensor on a bearing plate of the workpiece table, and adjusting the position relation between the sensor and the bearing plate so that the mounting position of the sensor on the bearing plate meets the preset dimensional tolerance requirement; then, mounting a workpiece table on the whole machine, and adjusting the position relation between the workpiece table and the objective lens so that the mounting position between the workpiece table and the objective lens meets the preset dimensional tolerance requirement; then, the lighting device is electrified to initialize and emit an alignment beam, and the alignment beam passes through an alignment hole on a reference plate of the mask table and forms a light spot on the sensor after being imaged by the objective lens; and determining the position of the light spot through the sensor, and adjusting the position relation between the lighting device and the objective lens again according to the position of the light spot so as to meet the precision requirement of the optical axis. Therefore, the method for adjusting the position relation between the objective lens and the lighting device does not need a positioning tool, can effectively reduce the adjusting procedures, further effectively improves the assembly and adjustment efficiency, and can effectively reduce the manufacturing cost of the tool. In addition, the method for adjusting the position relation between the objective lens and the lighting device provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in accordance with the on-line optical axis calibration of the whole machine, and effectively improves the calibration precision.

(2) The device for adjusting the position relation between the objective lens and the lighting device does not need to additionally arrange a positioning tool, so that the adjusting procedures can be effectively reduced, the assembling and adjusting efficiency can be effectively improved, and the manufacturing cost of the tool can be effectively reduced. In addition, the device for adjusting the position relation between the objective lens and the illuminating device provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in line with the on-line optical axis calibration of a whole machine, and effectively improves the calibration precision.

(3) The photoetching machine provided by the invention comprises the device for adjusting the position relation between the objective lens and the illuminating device, so that the photoetching machine has all the advantages of the device for adjusting the position relation between the objective lens and the illuminating device, namely, a positioning tool does not need to be additionally arranged, so that the adjusting procedures can be effectively reduced, the assembling and adjusting efficiency can be effectively improved, and the manufacturing cost of the tool can be effectively reduced. In addition, the photoetching machine provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in check consistency with the on-line optical axis of the whole machine, and effectively improves the calibration precision.

Drawings

FIG. 1 is a schematic diagram of the relationship between a conventional calibration motion stage and the optical axis of an objective lens;

FIG. 2 is a flowchart of a method for adjusting a positional relationship between an objective lens and an illumination device according to an embodiment of the present invention;

FIG. 3 is a schematic view of a connection relationship between a lighting bracket and a lighting substrate according to an embodiment of the present invention and a partially enlarged view;

FIG. 4 is a schematic diagram of an embodiment of the present invention for adjusting the positional relationship between an objective lens and an illumination device;

fig. 5 is a schematic structural diagram of an apparatus for adjusting a positional relationship between an objective lens and an illumination apparatus according to an embodiment of the present invention.

Wherein the reference numbers are as follows:

a light source-1; a lighting device-2; a mask table-3; a reference plate-31; a first alignment hole-311; a second alignment hole-312; an objective lens-4; a workpiece table-5; a carrier plate-51; a sensor-6; a first alignment beam-71; a second alignment beam-72; an illumination bracket-21; an illumination substrate-22; a top plate-41; a main substrate-42; a first X-direction mechanical datum plane-211; a second X-direction mechanical datum-212; y-direction mechanical reference plane-213; an X-direction horizontal reference plane-221; y-direction horizontal reference plane-222; vertical reference plane-223.

Detailed Description

The method, the apparatus and the lithography machine for adjusting the positional relationship between the objective lens and the illumination device according to the present invention will be described in further detail with reference to fig. 2 to 5 and the detailed description. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation that the first and second features are not in direct contact, but are in contact via another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The core idea of the invention is to provide a method and a device for adjusting the position relationship between an objective lens and an illumination device and a photoetching machine, which can reduce the assembly and adjustment procedures of the objective lens and an illumination positioning tool, improve the integration efficiency and reduce the assembly and adjustment cost.

To achieve the above idea, the present invention provides a method for adjusting a positional relationship between an objective lens and an illumination device, and refer to fig. 2, which schematically shows a flowchart of a method for adjusting a positional relationship between an objective lens and an illumination device according to an embodiment of the present invention, as shown in fig. 2, the method for adjusting a positional relationship between an objective lens and an illumination device includes the following steps:

step S100: after the complete machine adjustment of the objective lens is finished, a lighting device is installed on the complete machine, and the position relation between the lighting device and the objective lens is preliminarily adjusted, so that the initial installation position between the lighting device and the objective lens meets the preset dimensional tolerance requirement.

Specifically, the positional relationship between the illumination device and the objective lens may be preliminarily adjusted by adjusting the horizontal position (X, Y, rz) and the vertical position (Rx, ry, Z) of the illumination device.

Preferably, in order to facilitate adjustment of the positional relationship between the illumination device and the objective lens, before mounting the illumination device on the complete machine, the method further includes:

Therefore, the top plate is arranged on the top of the objective lens and can be used as a reference surface so as to determine the relative position relation between each motion table and the optical axis of the objective lens in the photoetching machine.

Preferably, after the complete machine adjustment of the objective lens is completed, the step of mounting the lighting device on the complete machine, and preliminarily adjusting the position relationship between the lighting device and the objective lens so that the initial mounting position between the lighting device and the objective lens meets the preset dimensional tolerance requirement comprises the following steps:

preliminarily adjusting the vertical position relationship between the illumination substrate and the top plate so that the initial installation position between the illumination device and the objective lens meets the preset vertical dimensional tolerance requirement; and

preliminarily adjusting the horizontal position relation between the illumination substrate and a mechanical reference surface on the illumination bracket so that the initial installation position between the illumination device and the objective lens meets the preset horizontal dimensional tolerance requirement.

Specifically, the vertical position of the illumination substrate can be preliminarily adjusted by measuring the levelness of the illumination substrate for mounting the illumination device and the vertical distance between the illumination substrate and the top plate, and according to the measured levelness and the vertical distance, so that the initial mounting position between the illumination device and the objective lens meets the preset vertical dimensional tolerance requirement.

Preferably, please refer to fig. 3, which schematically shows a schematic diagram of a connection relationship between the illumination holder 21 and the illumination substrate 22 according to an embodiment of the present invention and a partially enlarged schematic diagram. As shown in fig. 3, the lighting substrate 22 is provided with an X-direction horizontal reference surface 221 and a Y-direction horizontal reference surface 222, so that the levelness of the lighting substrate 22 can be determined by measuring the levelness of the X-direction horizontal reference surface 221 and the Y-direction horizontal reference surface 222, and further, the levelness of the lighting substrate 22 can be preliminarily adjusted according to the measured levelness. More preferably, an X-direction leveling instrument is disposed on the X-direction horizontal reference surface 221, and a Y-direction leveling instrument is disposed on the Y-direction horizontal reference surface 222, so that the levelness of the illumination substrate 22 can be detected in real time by the X-direction leveling instrument and the Y-direction leveling instrument, and further, the rotation of the illumination substrate 22 in the Rx direction and the Ry direction can be more conveniently controlled.

Preferably, as shown in fig. 3, a vertical reference surface 223 is further disposed on the illumination substrate 22, so that the vertical distance between the illumination device and the objective lens can be determined by measuring the vertical distance between the vertical reference surface 223 and the top plate. More preferably, in order to measure the vertical distance between the vertical reference surface 223 and the top plate, a Z-position sensor may be disposed on the vertical reference surface 223, so that the vertical distance between the illumination substrate 22 and the top plate can be measured in real time by the Z-position sensor, and thus the vertical distance between the illumination device and the objective lens can be adjusted more conveniently.

Preferably, as shown in fig. 3, the main body unit of the lighting bracket 21 is positioned with the whole machine by a machining surface and a positioning pin, and meets the precision requirement, the top surface of the lighting bracket 21 is provided with an X-direction mechanical reference surface and a Y-direction mechanical reference surface 213, and the X-direction reference surface and the Y-direction reference surface can be used as references for adjusting the horizontal position of the lighting device. Thereby, the horizontal position of the illumination substrate 22 can be preliminarily adjusted by measuring the distance between the illumination substrate 22 and the X-direction mechanical reference plane and the distance between the illumination substrate 22 and the Y-direction mechanical reference plane 213, so that the initial installation position between the illumination device and the objective lens satisfies the preset horizontal dimensional tolerance requirement.

More preferably, an X-direction position sensor may be disposed on the X-direction mechanical reference surface, and a Y-direction position sensor may be disposed on the Y-direction mechanical reference surface 213. Therefore, the X-direction distance between the illumination substrate 22 and the illumination holder 21 can be measured in real time by the X-direction position sensor, and the Y-direction distance between the illumination substrate 22 and the illumination holder 21 can be measured in real time by the Y-direction position sensor, so that the horizontal position between the illumination device and the objective lens can be adjusted more conveniently. Preferably, in order to facilitate the installation of the X-direction position sensor and the Y-direction position sensor, the X-direction mechanical reference surface and the Y-direction mechanical reference surface 213 are located on different sides of the lighting bracket 21, that is, the X-direction mechanical reference surface is located on one side of the lighting bracket 21, and the Y-direction mechanical reference surface 213 is located on the other side of the lighting bracket 21.

Further, as shown in fig. 3, the X-direction mechanical reference surface includes a first X-direction mechanical reference surface 211 and a second X-direction mechanical reference surface 212 which are oppositely arranged. Thus, the first X-direction mechanical reference surface 211 and the second X-direction mechanical reference surface 212 which are oppositely arranged can be used for more conveniently controlling the rotation of the illumination substrate 22 in the Rz direction. A first X-direction position sensor may be placed on the first X-direction mechanical reference surface 211, and a second X-direction position sensor may be placed on the second X-direction mechanical reference surface 212.

Preferably, the first X-direction mechanical reference surface 211, the second X-direction mechanical reference surface 212, and the Y-direction mechanical reference surface 213 are all positioning pins. Thus, the installation of the first X-direction position sensor, the second X-direction position sensor, and the Y-direction position sensor may be more facilitated.

Step S200: and mounting the mask table on the whole machine, and adjusting the position relation between the mask table and the objective lens so that the mounting position between the mask table and the objective lens meets the preset dimensional tolerance requirement.

Since the X-, Y-, and Rz-directional positions of the mask stage are aligned with the overall machine reference by the alignment pins, in this step, the positional relationship between the mask stage and the objective lens is adjusted mainly by adjusting the vertical position (Rx, ry, Z) of the mask stage.

Preferably, the step of adjusting the positional relationship between the mask stage and the objective lens so that the mounting position between the mask stage and the objective lens satisfies a preset dimensional tolerance requirement includes:

Specifically, in this step, the vertical position of the mask stage may be adjusted by measuring the levelness of the mask stage and the vertical distance between the mask stage and the top plate, and according to the measured levelness and the vertical distance, so that the mounting position between the mask stage and the objective lens meets the preset dimensional tolerance requirement.

Preferably, after the step is performed, the method further comprises: and electrifying the mask table to complete the initialization of the independent mode so as to establish a unified relationship between the mask table position measuring system and the measuring system of the whole machine. Therefore, the mask stage is electrified to complete the initialization of the independent mode, and the zero position of the mask stage can be coincided with the optical axis.

Step S300: and mounting a sensor on a bearing plate of the workpiece table, and adjusting the position relation between the sensor and the bearing plate so that the mounting position of the sensor on the bearing plate meets the preset dimensional tolerance requirement.

Therefore, the sensor arranged on the bearing plate of the workpiece table can receive the space image formed by the alignment holes and give the position of the space image.

Step S400: and mounting a workpiece table on the complete machine, and adjusting the position relation between the workpiece table and the objective lens so that the mounting position between the workpiece table and the objective lens meets the preset dimensional tolerance requirement.

In the step, the position of the workpiece stage in the X direction, the Y direction and the Rz direction is positioned with the whole machine reference by the positioning pins, so that the position relationship between the workpiece stage and the objective lens is adjusted mainly by adjusting the vertical position (Rx, ry, Z) of the workpiece stage.

Preferably, the step of adjusting the positional relationship between the workpiece stage and the objective lens so that the mounting position between the workpiece stage and the objective lens satisfies a preset dimensional tolerance requirement includes:

Specifically, the vertical position of the workpiece table can be adjusted by measuring the levelness of the workpiece table and the vertical distance between the workpiece table and the main substrate, and according to the measured levelness and the vertical distance, so that the installation position between the workpiece table and the objective lens meets the preset dimensional tolerance requirement.

Preferably, after the step is performed, the method further comprises: and electrifying the workpiece table to complete initialization so as to establish a unified relationship between the workpiece table position measuring system and the measuring system of the whole machine. Therefore, the zero position of the workpiece platform can be coincided with the optical axis by electrifying the workpiece platform to complete initialization.

Step S500: the illumination device is electrified to initialize and emits an alignment beam, the alignment beam passes through an alignment hole on a reference plate of the mask table, and a light spot is formed on the sensor after the alignment beam is imaged by the objective lens.

Therefore, the mask table reference plate is adopted to calibrate the position of the optical axis, the calibration can be consistent with the on-line optical axis calibration of the whole machine, and the calibration precision is effectively improved.

Referring to fig. 4, which schematically illustrates a schematic diagram for adjusting a positional relationship between an objective lens and an illumination device according to an embodiment of the present invention, as shown in fig. 4, a light beam emitted from a light source 1 (e.g., a laser) is collimated by an illumination device 2, passes through an alignment hole on a reference plate 31 of the mask stage 3, and then irradiates on the objective lens 4, and is imaged by the objective lens 4 to form a light spot on the sensor 6.

Preferably, the alignment holes are square holes. Thus, by providing the alignment holes as squares, the machining of the alignment holes is facilitated even more.

Preferably, the sensor 6 is a mask alignment sensor. Since the measurement range of the mask alignment sensor (RA) is twice as large as the measurement range of the energy sensor (ESS), the present invention can reduce the initial adjustment accuracy requirements for the illumination device 2 by using the mask alignment sensor.

Preferably, as shown in fig. 4, the reference plate 31 of the mask stage 3 is provided with a first alignment hole 311 and a second alignment hole 312 which are oppositely arranged. Thus, by providing the first alignment hole 311 and the second alignment hole 312, which are oppositely disposed, on the reference plate 31 of the mask stage 3, the alignment accuracy can be improved, and the occurrence of errors can be reduced, thereby improving the alignment accuracy.

Preferably, as shown in fig. 4, the step of forming a light spot on the sensor 6 after the illumination device 2 emits an alignment beam and the light spot is imaged by the objective lens 4 through an alignment hole on the reference plate 31 of the mask stage 3 includes:

the illumination device 2 emits a first alignment beam 71, which passes through a first alignment hole 311 on the reference plate 31 of the mask stage 3, and forms a first light spot on the sensor 6 after being imaged by the objective lens 4;

horizontally moving the workpiece table 5 so that the sensor 6 is aligned with the second alignment hole 312; and

the illumination device 2 emits a second alignment beam 72, which passes through a second alignment hole 312 of the reference plate 31 of the mask stage 3 and forms a second spot on the sensor 6 after being imaged by the objective lens 4.

Step S600: and determining the position of the light spot through the sensor, and adjusting the position relation between the lighting device and the objective lens again according to the position of the light spot so as to meet the precision requirement of the optical axis.

Specifically, the horizontal position (X, Y, rz) and the vertical position (Rx, ry, Z) of the illumination device may be adjusted again according to the position of the spot, so that the positional relationship between the illumination device and the objective lens satisfies the accuracy requirement of the optical axis. The zero position of the mask table is coincident with the optical axis, and the zero position of the workpiece table is also coincident with the optical axis, so that the position relation between the illuminating device and the optical axis can be determined according to the position of the light spot, the position relation between the illuminating device and the optical axis can be obtained through calculation of an overlay model, and the position relation between the illuminating device and the objective lens can be adjusted again according to the position relation between the illuminating device and the optical axis so as to meet the precision requirement of the optical axis.

Preferably, the step of adjusting again the positional relationship between the illumination device and the objective lens according to the position of the light spot to meet the precision requirement of the optical axis includes:

Preferably, the step of determining the position of the light spot through the sensor, and adjusting the positional relationship between the illumination device and the objective lens again according to the position of the light spot to meet the accuracy requirement of the optical axis includes:

Therefore, the horizontal position and the vertical position of the illumination device can be more accurately adjusted through the positions of the first light spot and the second light spot, so that the position relation between the illumination device and the objective lens meets the precision requirement of an optical axis.

In summary, the method for adjusting the position relationship between the objective lens and the illumination device provided by the invention does not need to use a positioning tool, can effectively reduce the adjustment procedures, further effectively improve the assembly and adjustment efficiency, and can effectively reduce the manufacturing cost of the tool. In addition, the method for adjusting the position relation between the objective lens and the lighting device provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in accordance with the on-line optical axis calibration of the whole machine, and effectively improves the calibration precision.

To achieve the above-mentioned idea, the present invention further provides an apparatus for adjusting a positional relationship between an objective lens and an illumination apparatus, and refer to fig. 5, which schematically shows a structural diagram of an apparatus for adjusting a positional relationship between an objective lens and an illumination apparatus according to an embodiment of the present invention. As shown in fig. 5, the apparatus for adjusting the positional relationship between the objective lens and the illumination apparatus includes an illumination apparatus 2, an objective lens 4, a mask stage 3, and a work stage 5.

Wherein the illumination device 2 is used for providing an alignment light beam, the illumination device 2 is positioned above the mask stage 3, and the initial installation position between the illumination device 2 and the objective lens 4 meets the preset dimensional tolerance requirement. Specifically, the position relationship between the illumination device 2 and the objective lens 4 may be preliminarily adjusted by preliminarily adjusting the horizontal position (X, Y, rz) and the vertical position (Rx, ry, Z) of the illumination device 2, so that the initial installation position between the illumination device 2 and the objective lens 4 satisfies the preset dimensional tolerance requirement.

Preferably, as shown in fig. 5, the apparatus further includes a top plate 41, the top plate 41 is connected to the top of the objective lens 4, and the top plate 41 is provided with a through hole for passing the light beam. Thus, by mounting the top plate 41 on top of the objective lens 4, the top plate 41 can be used as a reference surface to determine the relative positional relationship between each motion stage and the optical axis of the objective lens 4 in the lithography machine.

The lighting device 2 is mounted on a lighting substrate 22, the lighting substrate 22 is mounted on a lighting bracket 21, and the lighting substrate 22 is movably connected with the lighting bracket 21. The vertical position (Rx, ry, Z) and the horizontal position (X, Y, rz) of the illumination substrate 22 are adjustable, so that the vertical position and the horizontal position of the illumination device can be adjusted by adjusting the vertical position and the horizontal position of the illumination substrate 22.

Preferably, as shown in fig. 3, the top of the illumination holder 21 is provided with an X-direction mechanical reference surface and a Y-direction mechanical reference surface 213. Thus, the vertical position relationship between the illumination base plate 22 and the top plate 41 can be preliminarily adjusted, so that the initial installation position between the illumination device 2 and the objective lens 4 meets the preset vertical dimensional tolerance requirement; and preliminarily adjusting the horizontal position relationship between the illumination substrate 22 and the mechanical reference surface on the illumination support 21, so that the initial installation position between the illumination device 2 and the objective lens 4 meets the preset horizontal dimensional tolerance requirement.

More preferably, an X-direction position sensor may be disposed on the X-direction mechanical reference surface, and a Y-direction position sensor may be disposed on the Y-direction mechanical reference surface 213. Therefore, the X-direction distance between the illumination substrate 22 and the illumination holder 21 can be measured in real time by the X-direction position sensor, and the Y-direction distance between the illumination substrate 22 and the illumination holder 21 can be measured in real time by the Y-direction position sensor, so that the horizontal position between the illumination device 2 and the objective lens 4 can be adjusted more conveniently. Preferably, in order to facilitate the installation of the X-direction position sensor and the Y-direction position sensor, the X-direction mechanical reference surface and the Y-direction mechanical reference surface 213 are located on different sides of the lighting bracket 21, that is, the X-direction mechanical reference surface is located on one side of the lighting bracket 21, and the Y-direction mechanical reference surface 213 is located on the other side of the lighting bracket 21.

Further, as shown in fig. 3, the X-direction mechanical reference surface includes a first X-direction mechanical reference surface 211 and a second X-direction mechanical reference surface 212 which are oppositely arranged. Therefore, the first X-direction mechanical reference surface 211 and the second X-direction mechanical reference surface 212 which are oppositely arranged are arranged on the top of the illumination support 21, so that the Rz-direction rotation of the illumination substrate 22 can be more conveniently controlled. A first X-direction position sensor may be placed on the first X-direction mechanical reference surface 211, and a second X-direction position sensor may be placed on the second X-direction mechanical reference surface 212.

Preferably, the illumination substrate 22 is provided with an X-direction horizontal reference surface 221 and a Y-direction horizontal reference surface 222. Therefore, the levelness of the illumination substrate 22 can be determined by measuring the levelness of the X-direction horizontal reference surface 221 and the Y-direction horizontal reference surface 222, and the levelness of the illumination substrate 22 can be adjusted according to the measured levelness. More preferably, an X-direction leveling instrument is disposed on the X-direction horizontal reference surface 221, and a Y-direction leveling instrument is disposed on the Y-direction horizontal reference surface 222, so that the levelness of the illumination substrate 22 can be detected in real time by the X-direction leveling instrument and the Y-direction leveling instrument, and further, the rotation of the illumination substrate 22 in the Rx direction and the Ry direction can be more conveniently controlled.

Preferably, the illumination base 22 is further provided with a vertical reference surface 223, so that the vertical distance between the illumination device 2 and the objective lens 4 can be determined by measuring the vertical distance between the vertical reference surface 223 and the top plate 41. More preferably, in order to measure the vertical distance between the vertical reference surface 223 and the top plate, a Z-position sensor may be disposed on the vertical reference surface 223, so that the vertical distance between the illumination substrate 22 and the top plate 41 can be measured in real time by the Z-position sensor, and thus the vertical distance between the illumination device 2 and the objective lens 4 can be adjusted more conveniently.

As shown in fig. 5, a reference plate 31 is disposed on the mask stage 3, an alignment hole is disposed on the reference plate 31, the mask stage 3 is located above the objective lens 4, and a mounting position between the mask stage 3 and the objective lens 4 meets a preset dimensional tolerance requirement. Specifically, the positional relationship between the mask stage 3 and the objective lens 4 may be adjusted by adjusting the vertical position (Rx, ry, Z) of the mask stage 3 so that the mounting position between the mask stage 3 and the objective lens 4 satisfies the preset dimensional tolerance requirement.

Preferably, the vertical position relationship between the mask stage 3 and the top plate 41 may be adjusted so that the mounting position between the mask stage 3 and the objective lens 4 meets a preset vertical dimensional tolerance requirement.

The objective lens 4 is used to image the alignment beam passing through the alignment hole. Thus, a light beam emitted from a light source (e.g., a laser) is collimated by the illumination device 2, passes through the alignment hole of the reference plate 31 of the mask stage 3, is irradiated onto the objective lens 4, and is imaged by the objective lens 4.

Preferably, the alignment holes are square holes. Therefore, the alignment hole is square, so that the alignment hole can be more conveniently machined.

The workpiece table 5 is located below the objective lens 4, and the installation position between the workpiece table 5 and the objective lens 4 meets the requirement of preset dimensional tolerance. Specifically, the vertical position (Rx, ry, Z) of the stage 5 may be adjusted to adjust the positional relationship between the stage 5 and the objective lens 4 so that the mounting position between the stage 5 and the objective lens 4 satisfies the predetermined dimensional tolerance requirement.

Preferably, the vertical position relationship between the workpiece stage 5 and the main substrate 42 is adjusted so that the installation position between the workpiece stage 5 and the objective lens 4 meets a preset vertical dimensional tolerance requirement.

The workpiece table 5 is provided with a bearing plate 51, the bearing plate 51 is provided with a sensor 6, and the installation position of the sensor 6 on the bearing plate 51 meets the requirement of preset dimensional tolerance. Thus, by providing the sensor 6 on the carrier plate 51 of the stage 5, an aerial image of the alignment holes can be received and the position of the aerial image given. A light beam emitted by a light source (e.g. a laser) is collimated by the illumination device 2, passes through an alignment hole on the reference plate 31 of the mask stage 3, is irradiated onto the objective lens 4, and is imaged by the objective lens 4 to form a light spot on the sensor 6.

Preferably, the sensor 6 is a mask alignment sensor. Since the measurement range of the mask alignment sensor (RA) is twice as large as the measurement range of the energy sensor (ESS), the present invention can reduce the initial adjustment accuracy requirements for the illumination apparatus 2 by using the mask alignment sensor.

The alignment beam passing through the alignment hole is imaged by the objective lens 4 to form a spot on the sensor 6, and the sensor 6 is used to determine the position of the spot. Because the zero position of the mask stage 3 coincides with the optical axis and the zero position of the workpiece stage 5 also coincides with the optical axis, the position relationship between the illumination device 2 and the optical axis can be determined according to the position of the light spot, the position relationship between the illumination device 2 and the optical axis can be obtained through calculation of an overlay model, and then the horizontal position and the vertical position of the illumination device 2 can be adjusted again according to the position relationship between the illumination device 2 and the optical axis, so that the position relationship between the illumination device 2 and the objective lens 4 meets the precision requirement of the optical axis.

Preferably, as shown in fig. 5, the reference plate 31 of the mask stage 3 is provided with a first alignment hole 311 and a second alignment hole 312 which are oppositely arranged. Thus, by providing the first alignment hole 311 and the second alignment hole 312, which are oppositely disposed, on the reference plate 31 of the mask stage 3, the alignment accuracy can be improved, and the occurrence of errors can be reduced, thereby improving the alignment accuracy.

Correspondingly, as shown in fig. 4, the illumination device 2 first emits a first alignment beam 71, passes through a first alignment hole 311 on the reference plate 31 of the mask stage 3, forms a first light spot on the sensor 6 after being imaged by the objective lens 4, and determines the position of the first light spot according to the sensor 6; then horizontally moving the work table 5 so that the sensor 6 is aligned with the second alignment hole 312; the illumination device 2 emits a second alignment beam 72 again, a second light spot is formed on the sensor 6 after the second alignment beam passes through a second alignment hole 312 on the reference plate 31 of the mask table 3 and is imaged by the objective lens 4, and the position of the second light spot is determined according to the sensor 6; and finally, adjusting the position relation between the lighting device and the objective lens again according to the positions of the first light spot and the second light spot so as to meet the precision requirement of the optical axis.

In summary, the device for adjusting the position relationship between the objective lens and the illumination device provided by the invention does not need to additionally arrange a positioning tool, so that the adjustment procedures can be effectively reduced, the assembly and adjustment efficiency can be effectively improved, and the manufacturing cost of the tool can be effectively reduced. In addition, the device for adjusting the position relation between the objective lens and the illuminating device provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in accordance with the on-line optical axis calibration of the whole machine, and effectively improves the calibration precision.

To achieve the above idea, the present invention further provides a lithography machine, which includes the above device for adjusting the positional relationship between the objective lens and the illumination device. The photoetching machine provided by the invention comprises the device for adjusting the position relation between the objective lens and the illuminating device, so that the photoetching machine has all the advantages of the device for adjusting the position relation between the objective lens and the illuminating device, namely, a positioning tool does not need to be additionally arranged, so that the adjusting procedures can be effectively reduced, the assembling and adjusting efficiency can be effectively improved, and the manufacturing cost of the tool can be effectively reduced. In addition, the photoetching machine provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in accordance with the on-line optical axis calibration of the whole machine, and effectively improves the calibration precision.

In summary, compared with the prior art, the method, the apparatus and the lithography machine for adjusting the positional relationship between the objective lens and the illumination apparatus provided by the invention have the following advantages:

(1) According to the method for adjusting the position relation between the objective lens and the illuminating device, after the complete machine adjustment of the objective lens is completed, the illuminating device is firstly installed on the complete machine, and the position relation between the illuminating device and the objective lens is preliminarily adjusted, so that the initial installation position between the illuminating device and the objective lens meets the preset size tolerance requirement; then, mounting the mask table on the whole machine, and adjusting the position relation between the mask table and the objective lens so that the mounting position between the mask table and the objective lens meets the preset dimensional tolerance requirement; mounting a sensor on a bearing plate of the workpiece table, and adjusting the position relation between the sensor and the bearing plate so that the mounting position of the sensor on the bearing plate meets the preset dimensional tolerance requirement; then, mounting a workpiece table on the whole machine, and adjusting the position relation between the workpiece table and the objective lens so that the mounting position between the workpiece table and the objective lens meets the preset dimensional tolerance requirement; then, the lighting device is electrified to initialize and emit an alignment beam, and the alignment beam passes through an alignment hole on a reference plate of the mask table and forms a light spot on the sensor after being imaged by the objective lens; and determining the position of the light spot through the sensor, and adjusting the position relation between the lighting device and the objective lens again according to the position of the light spot so as to meet the precision requirement of the optical axis. Therefore, the method for adjusting the position relation between the objective lens and the lighting device does not need a positioning tool, can effectively reduce the adjusting procedures, further effectively improves the assembly and adjustment efficiency, and can effectively reduce the manufacturing cost of the tool. In addition, the method for adjusting the position relation between the objective lens and the lighting device provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in accordance with the on-line optical axis calibration of the whole machine, and effectively improves the calibration precision.

(2) The device for adjusting the position relation between the objective lens and the lighting device does not need to additionally arrange a positioning tool, so that the adjusting procedures can be effectively reduced, the assembling and adjusting efficiency can be effectively improved, and the manufacturing cost of the tool can be effectively reduced. In addition, the device for adjusting the position relation between the objective lens and the illuminating device provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in accordance with the on-line optical axis calibration of the whole machine, and effectively improves the calibration precision.

(3) The photoetching machine provided by the invention comprises the device for adjusting the position relation between the objective lens and the illuminating device, so that the photoetching machine has all the advantages of the device for adjusting the position relation between the objective lens and the illuminating device, namely, a positioning tool does not need to be additionally arranged, so that the adjusting procedures can be effectively reduced, the assembling and adjusting efficiency can be effectively improved, and the manufacturing cost of the tool can be effectively reduced. In addition, the photoetching machine provided by the invention calibrates the optical axis position of the objective lens by using the reference plate on the mask table, can be in accordance with the on-line optical axis calibration of the whole machine, and effectively improves the calibration precision.

The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications may be made in the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A method for adjusting a positional relationship between an objective lens and an illumination device, comprising:

2. The method for adjusting the positional relationship of an objective lens and a lighting device according to claim 1, wherein before mounting the lighting device to the complete machine, the method further comprises:

3. The method according to claim 2, wherein the step of preliminarily adjusting the positional relationship between the illumination device and the objective lens so that the initial mounting position between the illumination device and the objective lens satisfies a preset dimensional tolerance requirement comprises:

4. The method for adjusting a positional relationship of an objective lens and an illumination device according to claim 2, wherein the step of adjusting the positional relationship between the mask stage and the objective lens so that a mounting position between the mask stage and the objective lens satisfies a preset dimensional tolerance requirement includes:

5. The method according to claim 1, wherein the step of adjusting the positional relationship between the stage and the objective lens so that the mounting position between the stage and the objective lens satisfies a predetermined dimensional tolerance requirement comprises:

6. The method according to claim 1, wherein a first alignment hole and a second alignment hole are provided in a reference plate of the mask stage in a manner opposed to each other;

7. The method of claim 1, wherein the sensor is a mask alignment sensor.

8. The method for adjusting a positional relationship of an objective lens and an illumination device according to claim 1, wherein after the mounting position between the mask stage and the objective lens is made to satisfy a preset dimensional tolerance requirement, the method further comprises:

and electrifying the mask table to complete the initialization of the independent mode so as to establish a unified relationship between the mask table position measuring system and the measuring system of the whole machine.

9. The method for adjusting a positional relationship of an objective lens and an illumination device according to claim 1, wherein after the mounting position between the stage and the objective lens is made to satisfy a preset dimensional tolerance requirement, the method further comprises:

10. The method of claim 1, wherein the alignment hole is a square hole.

11. A device for adjusting the position relation of an objective lens and an illuminating device is characterized by comprising the illuminating device, the objective lens, a mask table and a workpiece table;

12. The apparatus according to claim 11, further comprising a top plate connected to a top of the objective lens, wherein the top plate has a through hole for passing the light beam therethrough.

13. The apparatus according to claim 12, wherein the illumination device is mounted on an illumination base plate, the illumination base plate is mounted on an illumination holder, an X-direction mechanical reference surface and a Y-direction mechanical reference surface are provided on a top portion of the illumination holder, and an X-direction horizontal reference surface and a Y-direction horizontal reference surface are provided on the illumination base plate.

14. The apparatus according to claim 13, wherein the X-direction mechanical reference surface includes a first X-direction mechanical reference surface and a second X-direction mechanical reference surface which are disposed opposite to each other.

15. The apparatus according to claim 12, wherein a vertical reference surface is further provided on the illumination base plate.

16. An apparatus according to claim 11, wherein the reference plate of the mask stage is provided with a first alignment hole and a second alignment hole which are opposed to each other.

17. The apparatus according to claim 11, wherein the alignment hole is a square hole.

18. An apparatus as claimed in claim 11, wherein the sensor is a mask alignment sensor.

19. A lithography machine comprising a device for adjusting the positional relationship of an objective lens and an illumination device according to any one of claims 11 to 18.