CN113358237A - Sensor, measurement and control system and aircraft - Google Patents
Sensor, measurement and control system and aircraft Download PDFInfo
- Publication number
- CN113358237A CN113358237A CN202110524737.3A CN202110524737A CN113358237A CN 113358237 A CN113358237 A CN 113358237A CN 202110524737 A CN202110524737 A CN 202110524737A CN 113358237 A CN113358237 A CN 113358237A
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- pressure
- signal
- temperature
- conditioning circuit
- circuit
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- 238000005259 measurement Methods 0.000 title claims abstract description 26
- 230000003750 conditioning effect Effects 0.000 claims abstract description 49
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 21
- 239000010980 sapphire Substances 0.000 claims abstract description 21
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 18
- 239000000523 sample Substances 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 6
- 239000012080 ambient air Substances 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 210000005036 nerve Anatomy 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
- G01L9/045—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges with electric temperature compensating means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2215/00—Details concerning sensor power supply
Abstract
One embodiment of the invention discloses a sensor, a measurement and control system and an aircraft, wherein the sensor comprises: a probe, comprising: the platinum resistor is used for sensing the ambient temperature and generating a temperature signal; the silicon-sapphire pressure sensitive core is used for sensing the ambient air pressure and generating a pressure signal; a signal converter, comprising: the temperature compensation circuit is used for compensating a second voltage signal output by the pressure signal conditioning circuit through a first voltage signal output by the temperature signal conditioning circuit; and the voltage conversion circuit is used for converting the first voltage signal and the second voltage signal into voltage signals required by the measurement and control system.
Description
Technical Field
The present invention relates to the field of sensors. And more particularly, to a sensor, a measurement and control system, and an aircraft.
Background
The sensor is a device which can convert the sensed information into electric signals or output in other required forms according to a certain rule, is an important component of a measurement and control system, particularly an aviation and aerospace measurement and control system, has a large number of applications in temperature sensors and pressure sensors, is a nerve terminal which is sensitive to the measurement and control system and measures temperature environment parameters and pressure parameters, and plays an important role in monitoring and controlling the health of an aircraft.
With the rapid development of aviation and aerospace aircraft technology, the flying speed of the aircraft is faster and faster, and meanwhile, the integration and miniaturization of internal equipment are required, and the independent distribution and independent working form of each sensor in a measurement and control system cannot meet the requirement of the current aircraft technology development.
Disclosure of Invention
The invention aims to provide a sensor, which can accurately and reliably realize the sensitivity of temperature signals and pressure signals under the condition of high-temperature environment, convert the sensitive signals into standard voltage signals used by a measurement and control system, solve the problem of integrated measurement of the temperature signals and the pressure signals under the condition of high temperature, and realize the miniaturization of the sensor.
In order to achieve the purpose, the invention adopts the following technical scheme:
a first aspect of the invention provides a sensor comprising:
a probe, comprising:
the platinum resistor is used for sensing the ambient temperature and generating a temperature signal;
the silicon-sapphire pressure sensitive core is used for sensing the ambient air pressure and generating a pressure signal;
a signal converter, comprising:
the conditioning circuit comprises a temperature signal conditioning circuit and a pressure signal conditioning circuit,
the temperature compensation circuit is used for compensating a second voltage signal output by the pressure signal conditioning circuit through a first voltage signal output by the temperature signal conditioning circuit;
and the voltage conversion circuit is used for converting the first voltage signal and the second voltage signal into voltage signals required by the measurement and control system.
In a specific embodiment, the temperature signal conditioning circuit is configured to condition the temperature signal into the first voltage signal;
the pressure signal conditioning circuit is used for conditioning the pressure signal into the second voltage signal.
In a specific embodiment, the signal converter further comprises:
and the power supply circuit is used for supplying power to the platinum resistor and the silicon-sapphire pressure sensitive core body.
In a specific embodiment, the probe further comprises:
a first housing comprising: a first opening and a second opening;
an electrical connector;
a cable;
the first cover body is arranged at the second opening, and the electric connector penetrates through the first cover body through the cable to be electrically connected with the platinum resistor and the silicon-sapphire pressure sensitive core body;
the joint is arranged at the first opening and comprises a temperature hole and a pressure hole;
the platinum resistor is exposed to the environment through the temperature hole;
the silicon-sapphire pressure sensitive core is arranged in the first shell cavity;
the silicon-sapphire pressure sensitive core sensing region is aligned with the pressure hole.
In a particular embodiment, the pressure port includes a first pressure sub-port adjacent the sensing region and a second pressure sub-port in gaseous communication with the first pressure sub-port, the second pressure sub-port facing the environment, wherein the first pressure sub-port has a smaller pore size than the second pressure sub-port.
In a specific embodiment, the signal converter further comprises:
a second housing including a third opening and a fourth opening;
a first connector;
a second connector;
the second cover body is arranged at the third opening;
a third cover body arranged at the fourth opening;
the power supply circuit and the conditioning circuit are arranged in the second shell;
the supporting frame is used for fixing the power supply circuit and the conditioning circuit in the second shell;
the first connector is electrically connected with the power circuit and the conditioning circuit through the second cover body;
the second connector is electrically connected with the power circuit and the conditioning circuit through the third cover body.
In a specific embodiment, the aperture of the temperature port is smaller than the aperture of the second pressure sub-port.
In a second aspect, the invention provides a measurement and control system comprising a sensor according to the first aspect of the invention.
A third aspect of the invention provides an aircraft comprising a measurement and control system according to the second aspect of the invention.
The invention has the following beneficial effects:
the invention provides a sensor, a measurement and control system and an aircraft, which can accurately and reliably realize the sensitivity of temperature signals and pressure signals under the condition of a high-temperature environment, convert the sensitive signals into standard voltage signals used by the measurement and control system, solve the problem of integrated measurement of the temperature signals and the pressure signals under the high-temperature environment and realize the miniaturization of the sensor.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 shows a block diagram of the working principle of a sensor according to an embodiment of the present invention.
Fig. 2 shows an outline view of a sensor according to an embodiment of the present invention.
FIG. 3 shows a front cross-sectional view of a probe according to an embodiment of the invention.
Fig. 4 shows a front cross-sectional view of a signal converter according to an embodiment of the invention.
Detailed Description
In order to make the technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The invention aims to provide a sensor, which comprises a probe and a signal converter, wherein the probe is connected with the signal converter through a cable, the cable is used for transmitting a power supply signal and a measurement signal, the probe is used for structurally and integrally designing a platinum resistor and a silicon-sapphire pressure sensitive element core body to realize the temperature and pressure signal sensitivity within the range of-40 ℃ to 300 ℃, the pressure measurement range is 0kPa to 100kPa, the signal converter is used for integrally designing a power supply circuit component, a pressure signal conditioning circuit, a temperature compensation circuit, a temperature signal conditioning circuit and a voltage conversion circuit, the signal converter is used for converting external power supply into a +2.5V constant voltage power supply and a 1mA constant current power supply through the power supply circuit component to respectively supply the platinum resistor and the silicon-sapphire pressure sensitive element core body, the platinum resistor is used for sensing a temperature signal, and the silicon-sapphire pressure sensitive core body is used for sensing a, the temperature signal and the pressure signal are converted into voltage signals through the temperature signal conditioning circuit and the pressure signal conditioning circuit respectively, the voltage signal output by the pressure signal conditioning circuit is conditioned through the voltage signal output by the temperature signal conditioning circuit by the temperature compensation circuit, and the two output signals are adjusted to be 0-5V of the voltage signal used by the measurement and control system through the voltage conversion circuit.
A first embodiment of the present invention discloses a sensor 1, as shown in fig. 1 and 2, including:
a probe 2, comprising:
the platinum resistor is used for sensing the ambient temperature and generating a temperature signal;
the silicon-sapphire pressure sensitive core is used for sensing the ambient air pressure and generating a pressure signal;
a signal converter, comprising:
the conditioning circuit comprises a temperature signal conditioning circuit and a pressure signal conditioning circuit,
the temperature compensation circuit is used for compensating a second voltage signal output by the pressure signal conditioning circuit through a first voltage signal output by the temperature signal conditioning circuit;
and the voltage conversion circuit is used for converting the first voltage signal and the second voltage signal into voltage signals required by the measurement and control system.
In a specific embodiment, the temperature signal conditioning circuit is configured to condition the temperature signal into the first voltage signal;
the pressure signal conditioning circuit is used for conditioning the pressure signal into the second voltage signal.
In a specific embodiment, the signal converter further comprises:
and the power supply circuit is used for supplying power to the platinum resistor and the silicon-sapphire pressure sensitive core body.
In a specific embodiment, as shown in fig. 3, the probe 2 further includes:
a first housing 206 comprising: a first opening and a second opening;
an electrical connector 201;
a cable 202;
a first cover 204, i.e. an upper cover, disposed at the second opening, wherein the electrical connector 201 penetrates the first cover 204 through the cable 202 to electrically connect the platinum resistor 208 and the silicon-sapphire pressure sensitive core 210; the cable 202 is fixed on the upper cover through a leading-out cable screw 203 and a locking nut 205;
the connector 207 is arranged at the first opening and comprises a large hole and a small hole, the small hole is a temperature hole, the platinum resistor is adhered to the outlet of the small hole by using TS747 glue and is blocked by using the glue, and the platinum resistor 208 is exposed to the environment through the temperature hole; the large hole is a pressure hole, and a pressure sub-hole is embedded in the large hole, namely a small pressure hole, and the silicon-sapphire pressure sensitive core body 210 is arranged in the cavity of the first shell 206; the sensing area of the silicon-sapphire pressure sensitive core 210 is aligned with the pressure hole, the pressure hole enables the pressure sensitive signal to be fully contacted with the surrounding environment, and the small pressure hole enables the silicon-sapphire pressure sensitive core and the pressure hole to be firmly adhered.
The connector 207 is fixed on the first shell 206 by welding and sealed, and the cable wires are connected with the platinum resistor and the silicon-sapphire pressure sensitive core through the connecting wires 211.
In a specific embodiment, as shown in fig. 4, the signal converter further includes:
a second housing 308 including a third opening and a fourth opening;
the first connector 301, the input electrical connector;
a second connector 309, i.e., an output electrical connector;
a second cover body 302, i.e., a left side cover, disposed at the third opening;
a third cover 303, i.e., a right side cover, provided at the fourth opening;
a power supply circuit 305 and a conditioning circuit provided in the second casing 308;
a support frame 310 for fixing the power circuit and the conditioning circuit in the second housing;
the first connector is electrically connected with the power circuit and the conditioning circuit through the second cover body;
the second connector is electrically connected with the power circuit and the conditioning circuit through the third cover body.
The output electric connector is fixed on the left side cover by using a screw 304, the output electric connector is connected with a power circuit and a conditioning circuit by a lead 311, a power circuit component is fixed inside the shell by using the screw 304, the conditioning circuit component is fixed on a support frame 310 inside the shell by using the screw 304, the support frame plays a role of fixing, isolating and protecting the conditioning circuit component, the input electric connector 301 is fixed on the right side cover by using the screw 304, the output electric connector 309 is connected with the power circuit component and the conditioning circuit component by the lead 311, the output electric connector 309 is used for introducing external power supply and outputting a measurement signal, and the input electric connector 301 is used for supplying power to the probe and receiving a sensitive signal.
A second embodiment of the invention provides a measurement and control system comprising the sensor according to the first embodiment of the invention.
A third embodiment of the invention provides an aircraft, such as a satellite, comprising a measurement and control system according to the second embodiment of the invention.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (9)
1. A sensor, comprising:
a probe, comprising:
the platinum resistor is used for sensing the ambient temperature and generating a temperature signal;
the silicon-sapphire pressure sensitive core is used for sensing the ambient air pressure and generating a pressure signal;
a signal converter, comprising:
the conditioning circuit comprises a temperature signal conditioning circuit and a pressure signal conditioning circuit,
the temperature compensation circuit is used for compensating a second voltage signal output by the pressure signal conditioning circuit through a first voltage signal output by the temperature signal conditioning circuit;
and the voltage conversion circuit is used for converting the first voltage signal and the second voltage signal into voltage signals required by the measurement and control system.
2. The sensor of claim 1,
the temperature signal conditioning circuit is used for conditioning the temperature signal into the first voltage signal;
the pressure signal conditioning circuit is used for conditioning the pressure signal into the second voltage signal.
3. The sensor of claim 1, wherein the signal converter further comprises:
and the power supply circuit is used for supplying power to the platinum resistor and the silicon-sapphire pressure sensitive core body.
4. The sensor of any one of claims 1-3, wherein the probe further comprises:
a first housing comprising: a first opening and a second opening;
an electrical connector;
a cable;
the first cover body is arranged at the second opening, and the electric connector penetrates through the first cover body through the cable and is electrically connected with the platinum resistor and the silicon-sapphire pressure sensitive core body;
the joint is arranged at the first opening and comprises a temperature hole and a pressure hole;
the platinum resistor is exposed to the environment through the temperature hole;
the silicon-sapphire pressure sensitive core is arranged in the first shell cavity;
the silicon-sapphire pressure sensitive core sensing region is aligned with the pressure hole.
5. The sensor of claim 4,
the pressure port includes a first pressure sub-port adjacent the sensing region and a second pressure sub-port in gaseous communication with the first pressure sub-port, the second pressure sub-port facing the environment, wherein the first pressure sub-port has a smaller pore size than the second pressure sub-port.
6. The sensor of any one of claims 1-3, wherein the signal converter further comprises:
a second housing including a third opening and a fourth opening;
a first connector;
a second connector;
the second cover body is arranged at the third opening;
a third cover body arranged at the fourth opening;
the power supply circuit and the conditioning circuit are arranged in the second shell;
the supporting frame is used for fixing the power supply circuit and the conditioning circuit in the second shell;
the first connector is electrically connected with the power circuit and the conditioning circuit through the second cover body;
the second connector is electrically connected with the power circuit and the conditioning circuit through the third cover body.
7. The sensor of claim 5, wherein the temperature vent has a smaller aperture than the second pressure sub-vent.
8. A measurement and control system comprising a sensor as claimed in any one of claims 1 to 7.
9. An aircraft comprising the measurement and control system of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110524737.3A CN113358237A (en) | 2021-05-14 | 2021-05-14 | Sensor, measurement and control system and aircraft |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110524737.3A CN113358237A (en) | 2021-05-14 | 2021-05-14 | Sensor, measurement and control system and aircraft |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113358237A true CN113358237A (en) | 2021-09-07 |
Family
ID=77526676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110524737.3A Pending CN113358237A (en) | 2021-05-14 | 2021-05-14 | Sensor, measurement and control system and aircraft |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113358237A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102221429A (en) * | 2011-06-16 | 2011-10-19 | 沈阳市传感技术研究所 | High-temperature pressure and temperature compounded sensor and preparation method thereof |
| CN105067184A (en) * | 2015-08-08 | 2015-11-18 | 昆山泰莱宏成传感技术有限公司 | High-temperature pressure sensor and manufacturing method thereof |
| CN206772457U (en) * | 2016-12-20 | 2017-12-19 | 中国航天空气动力技术研究院 | Sputtered film temperature and pressure compound sensor |
| CN107505081A (en) * | 2017-08-21 | 2017-12-22 | 北京精密机电控制设备研究所 | A kind of small-sized silicon on sapphire differential pressure pickup |
| CN110431386A (en) * | 2017-01-17 | 2019-11-08 | 剑桥企业有限公司 | Monofilm formula flow pressure sensing device |
-
2021
- 2021-05-14 CN CN202110524737.3A patent/CN113358237A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102221429A (en) * | 2011-06-16 | 2011-10-19 | 沈阳市传感技术研究所 | High-temperature pressure and temperature compounded sensor and preparation method thereof |
| CN105067184A (en) * | 2015-08-08 | 2015-11-18 | 昆山泰莱宏成传感技术有限公司 | High-temperature pressure sensor and manufacturing method thereof |
| CN206772457U (en) * | 2016-12-20 | 2017-12-19 | 中国航天空气动力技术研究院 | Sputtered film temperature and pressure compound sensor |
| CN110431386A (en) * | 2017-01-17 | 2019-11-08 | 剑桥企业有限公司 | Monofilm formula flow pressure sensing device |
| CN107505081A (en) * | 2017-08-21 | 2017-12-22 | 北京精密机电控制设备研究所 | A kind of small-sized silicon on sapphire differential pressure pickup |
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Application publication date: 20210907 |
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