CN113354268A - Hot bending equipment, cover plate and forming method thereof and electronic device - Google Patents

Hot bending equipment, cover plate and forming method thereof and electronic device Download PDF

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Publication number
CN113354268A
CN113354268A CN202110731926.8A CN202110731926A CN113354268A CN 113354268 A CN113354268 A CN 113354268A CN 202110731926 A CN202110731926 A CN 202110731926A CN 113354268 A CN113354268 A CN 113354268A
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CN
China
Prior art keywords
die
cover plate
forming
air suction
mold
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CN202110731926.8A
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Chinese (zh)
Inventor
周峰
李聪
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN202110731926.8A priority Critical patent/CN113354268A/en
Publication of CN113354268A publication Critical patent/CN113354268A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00Re-forming shaped glass
    • C03B23/02Re-forming glass sheets
    • C03B23/023Re-forming glass sheets by bending
    • C03B23/03Re-forming glass sheets by bending by press-bending between shaping moulds
    • C03B23/0302Re-forming glass sheets by bending by press-bending between shaping moulds between opposing full-face shaping moulds
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B40/00Preventing adhesion between glass and glass or between glass and the means used to shape it, hold it or support it
    • C03B40/04Preventing adhesion between glass and glass or between glass and the means used to shape it, hold it or support it using gas

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The application discloses a hot bending device, a cover plate, a forming method of the cover plate and an electronic device. The hot bending equipment is used for hot bending and forming of the cover plate. The hot bending equipment comprises a forming die and an air suction demolding mechanism, wherein the forming die comprises a female die and a male die arranged on the female die, a forming cavity is formed by matching the female die and the male die and is used for forming the cover plate, and the female die and the male die are both made of porous materials. The air suction and demolding mechanism comprises a first air suction device and a second air suction device, when demolding is carried out on the forming mold, the first air suction device can suck air to suck the female mold and adsorb the cover plate on the female mold, and the second air suction device can suck air to suck the male mold and drive the male mold to move towards the direction far away from the female mold so as to realize demolding. So, at the drawing of patterns in-process, the apron is adsorbed on the die by first gas suction device, and the apron can not tightly detain on the terrace die and lead to the drawing of patterns difficulty.

Description

Hot bending equipment, cover plate and forming method thereof and electronic device
Technical Field
The application relates to the technical field of product forming, in particular to hot bending equipment, a cover plate, a forming method of the cover plate and an electronic device.
Background
At present, arc-shaped glass cover plates (namely 3D glass cover plates) can be adopted as cover plates of electronic devices such as mobile phones and the like, the 3D glass cover plates are full due to the fact that the cambered surfaces of curved screens are higher than middle frames, and the visual effect of the 3D glass cover plates is obviously superior to that of 2D glass cover plates.
In the related art, the 3D glass cover plate is generally formed by hot bending. However, due to the limitation of the mold, when the bending angle of the cover plate is large, the cover plate is easily fastened to the upper mold during demolding after molding, and the cover plate is lifted by the upper mold, which makes demolding difficult.
Disclosure of Invention
The embodiment of the application provides hot bending equipment, a cover plate, a forming method of the cover plate and an electronic device.
The hot bending equipment of the embodiment of the application comprises a forming die and a suction demolding mechanism. The forming die comprises a female die and a male die, the male die is arranged above the female die, a forming cavity is formed by matching the male die and the female die and is used for forming the cover plate, and the female die and the male die are both made of porous materials. The air suction and demolding mechanism comprises a first air suction device and a second air suction device, when the forming mold is demolded, the first air suction device can suck air to suck the female mold and adsorb the cover plate on the female mold, and the second air suction device can suck air to suck the male mold and drive the male mold to move towards the direction far away from the female mold to realize demolding.
The forming method of the cover plate of the embodiment of the present application performs hot bending forming by using the hot bending apparatus of the above embodiment, and includes:
placing the element to be hot-bent into the forming die;
heating the forming die and pressurizing the element to be bent so that the element to be bent forms the cover plate in the forming cavity;
sucking the female die and the cover plate through the first air suction device and sucking the convex part through the second air suction device;
the male die is driven to move in the direction away from the female die through the air suction and demolding mechanism so as to realize demolding;
and taking out the cover plate.
The cover plate of the embodiment of the application is manufactured by the cover plate forming method in the embodiment, so that demolding is facilitated, and the production efficiency is improved.
The electronic device of the embodiment of the present application includes a main body and the cover plate of the above embodiment, and the cover plate is mounted on the main body.
In the hot bending apparatus, the cover plate, the forming method thereof and the electronic device according to the embodiments of the present application, the female mold may be sucked by the first suction device and the housing may be sucked on the female mold to closely attach the housing to the female mold at the time of demolding. The second air suction device can suck the male die and lift the male die to separate the male die from the female die and the cover plate, so that the demolding is realized. So, at the drawing of patterns in-process, the apron is adsorbed on the die by first gas suction device, and the apron can not tightly detain on the terrace die and lead to the drawing of patterns difficulty.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of a hot bending apparatus according to an embodiment of the present application;
fig. 2 is a schematic sectional view of a mold clamping structure of a mold according to an embodiment of the present invention;
fig. 3 is a bottom schematic view of the female mold of the molding die of the embodiment of the present application;
fig. 4 is a schematic view showing a suction state of a suction mold releasing mechanism according to an embodiment of the present application;
fig. 5 is a schematic view of a first mold plate of a suction stripper mechanism of an embodiment of the present application;
FIG. 6 is a schematic view showing a pressurized state of a molding apparatus according to an embodiment of the present application;
fig. 7 is a schematic flow chart of a method of forming a cover plate according to an embodiment of the present application;
fig. 8 is another schematic flow chart of a method of forming a cover plate according to an embodiment of the present application;
fig. 9 is a schematic perspective view of an electronic device according to an embodiment of the present application.
Description of the main element symbols:
the hot bending device 100, the forming die 10, the female die 11, the closed hole 111, the male die 12, the forming cavity 13, the air suction demolding mechanism 20, the first air suction device 21, the first shaping plate 211, the first air suction pipe 212, the first air suction hole 213, the second air suction device 22, the second shaping plate 221, the second air suction pipe 222, the air suction pump 23, the first air suction pump 231, the second air suction pump 232, the heating device 30, the forming device 40, the annealing device 50, the lifting device 60, the feeding part 101, the main body part 102, the discharging part 103, the electronic device 300, the main body 310 and the cover plate 320.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1 to 5, a hot bending apparatus 100 according to an embodiment of the present invention includes a forming mold 10 and a suction and demolding mechanism 20. The forming mold 10 includes a female mold 11 and a male mold 12, the male mold 12 is disposed above the female mold 11, the male mold 12 and the female mold 11 cooperate to form a forming cavity 13, the forming cavity 13 is used for forming the cover plate 320, and both the female mold 11 and the male mold 12 are made of a porous material, for example, a graphite material. The air suction and demolding mechanism 20 comprises a first air suction device 21 and a second air suction device 22, when the forming mold 10 is demolded, the first air suction device 21 can suck air to suck the female mold 11 and adsorb the cover plate 320 on the female mold 11, and the second air suction device 22 can suck air to suck the male mold 12 and drive the male mold 12 to move in a direction away from the female mold 11 so as to realize demolding.
In the hot bending apparatus 100 according to the embodiment of the present application, at the time of demolding, the female die 11 may be sucked by the first suction device 21 and the shell may be sucked on the female die 11 to be closely attached to the female die 11. The second suction device 22 can suck the punch 12 and lift the punch 12 to separate the punch 12 from the die 11 and the cover plate 320, so as to realize demoulding. Thus, during the demolding process, the cover plate 320 is adsorbed on the female die 11 by the first air-absorbing device 21, and the cover plate 320 cannot be tightly buckled on the male die 12 to cause the demolding difficulty.
The hot bending apparatus 100 may be a multi-zone assembly line, and the hot bending apparatus 100 may perform a series of softening, pressing, etc. processes on the components to be hot bent to obtain the cover plate 320 with a desired shape. For example, the various zones may include heat-softened zones, pressure-formed zones, release-cooled zones, and the like. The element to be heated and bent can be an untreated two-dimensional plane plate or a pretreated three-dimensional curved plate. It should be noted that the material amount of the element to be bent is the same as the material amount required by the cover plate 320 to be formed, so as to reduce the subsequent processing amount of the formed cover plate 320, such as steps of polishing, polishing and the like, and at the same time, save materials and reduce unnecessary waste. The cover plate 320 may be a glass cover plate, and of course, the cover plate 320 may be made of other materials, and the material of the cover plate 320 is not limited in this application.
As shown in fig. 2 and 3, the forming die 10 may be applied throughout the entire hot bending apparatus 100. The element to be hot-bent may be placed in a forming mold 10 for forming to form the cover plate 320. The female die 11 and the male die 12 are provided separately. The female mold 11 may be formed with a molding groove, and an inner wall of the molding groove may be matched with an outer wall of the cover plate 320. The punch 12 may be formed with a protrusion, the outer wall of which may mate with the inner wall of the cover plate 320. The bulge can stretch into to the shaping inslot, and the bulge sets up and then is formed with shaping chamber 13 with the shaping inslot interval, and shaping chamber 13's shape and the shape phase-match of apron 320. In the feeding phase, the element to be hot-bent is placed in the forming groove of the female die 11.
The female die 11 and the male die 12 can be made of porous materials, so that the suction demolding mechanism 20 can conveniently adsorb and demold the female die 11 and the male die 12, and can adsorb the cover plate 320 in the female die 11, so as to prevent the cover plate 320 from tightly holding the male die 12 during demolding, and further easily cause the cover plate 320 to break when collecting the cover plate 320. It should be noted that, the inner wall of the female die 11 and the outer wall of the male die 12 may be smooth and have no holes, so as to prevent the element to be hot-bent from penetrating into the holes when being softened and affecting the forming of the cover plate 320.
Meanwhile, the female die 11 and the male die 12 need to have good thermal stability, so that the female die 11 and the male die 12 can be used under the conditions of high temperature and high pressure without deformation; the female die 11 and the male die 12 also need to have good thermal conductivity so as to transfer heat into the forming cavity 13 to soften and deform the element to be hot-bent; the cavity die 11 and the cavity die 12 also need to have stable chemical properties, and do not react with the cover plate 320 at high temperature and high pressure to affect the molding of the cover plate 320. Thus, in certain embodiments, the female die 11 and the male die 12 may be graphite pieces, the graphite material meeting many of the requirements set forth above. Of course, in some other embodiments, the female die 11 and the male die 12 may be made of other materials according to requirements.
As shown in fig. 4 and 5, a suction and demolding mechanism 20 may be disposed in a rear region of the hot-bending apparatus 100, and the suction and demolding mechanism 20 is configured to demold the forming mold 10 after the cover plate 320 is preliminarily formed, so as to prevent the cover plate 320 from embracing the male mold 12 during cooling and shrinking, which affects the removal of the cover plate 320 from the forming mold 10, and improve the yield of the cover plate 320.
The first and second air- breathing devices 21 and 22 may be oppositely disposed. The first suction device 21 may be disposed at a lower side of the hot bending apparatus 100 and connected with the female mold 11, and the second suction device 22 may be disposed at an upper side of the hot bending apparatus 100 and connected with the male mold 12.
The first air suction device 21 can relatively stably fix the female die 11 in the hot bending apparatus 100 during air suction, and meanwhile, since the female die 11 is made of a porous material, when the cover plate 320 is located in the forming cavity 13, the first air suction device 21 can provide a certain suction force to the cover plate 320 through the micro holes in the female die 11 so that the cover plate 320 is stably stopped in the female die 11.
The second suction device 22 is capable of separating the punch 12 from the die 11 and moving the punch 12 away from the die 11 during suction. The male die 12 may also be made of a porous material, so that when the second suction device 22 sucks air, a certain suction force is applied to the cover plate 320. It will be appreciated that the suction force of the first suction device 21 may be greater than the suction force of the second suction device 22, and thus the cover plate 320 will stay within the die 11 and will not follow the movement of the punch 12 away from the die 11. In this manner, the cover plate 320 does not snap into place with the punch 12 during cooling and fracture occurs when the cover plate 320 is removed.
Referring to fig. 2 and 3, in some embodiments, the female mold 11 has a plurality of closed holes 111 formed therein, and an end of the closed hole 111 facing the forming cavity 13 is closed.
In this way, the provision of the closed hole 111 corresponds to a reduction in the thickness of the die 11, so that the suction force of the first suction device 21 to the cover plate 320 at the closed hole 111 is increased, so that the cover plate 320 can stably stay in the die 11.
Specifically, the closed hole 111 may be opened on a side of the concave die 11 opposite to the forming groove, and the closing of the end of the closed hole 111 facing the forming cavity 13 may be understood as that the closed hole 111 does not penetrate through the concave die 11, so as to prevent the element to be heated from entering the closed hole 111 during the softening process to affect the forming shape of the cover plate 320. Of course, an end of the closed hole 111 opposite to the molding cavity 13 may or may not penetrate through the concave die 11, and the application is not limited thereto.
Referring to fig. 2 and 3, in some embodiments, the thickness of the female mold 11 is less than the thickness of the male mold 12.
In this way, the suction force of the first suction device 21 to the cover plate 320 is greater than the suction force of the second suction device 22 to the cover plate 320, so that the cover plate 320 can stably stay in the cavity 11.
Specifically, the female mold 11 and the male mold 12 may be made of the same porous material, and the suction force to the cover plate 320 may be the same under the same thickness and the same suction force. Since it is necessary to keep the cover plate 320 staying in the cavity die 11, the thickness of the cavity die 11 may be smaller than that of the punch 12, so that the suction force applied to the cover plate 320 in the direction toward the cavity die 11 is greater, and the cover plate 320 can stably stay in the cavity die 11.
Referring to fig. 4 and 5, in some embodiments, the first air suction device 21 includes a first mold plate 211 and a first air suction pipe 212, the first mold plate 211 is located at the bottom of the female mold 11, first air suction holes 213 are formed in the first mold plate 211, the first air suction pipe 212 is communicated with the first air suction holes 213, the second air suction device 22 includes a second mold plate 221 and a second air suction pipe 222, the second mold plate 221 is located at the top of the male mold 12, second air suction holes are formed in the second mold plate 221, the second air suction pipe 222 is communicated with the second air suction holes, the first air suction device 21 sucks the female mold 11 and the cover plate 320 through the first mold plate 211, and the second air suction device 22 sucks the male mold 12 through the second mold plate 221.
So, first getter device 21 can inhale die 11 through first suction hole 213, and second getter device 22 can inhale terrace die 12 through the second suction hole, and then makes the suction that die 11 and terrace die 12 received more even.
Specifically, the first air suction pipe 212 may be connected to a side of the first mold plate 211 opposite to the die 11, the first air suction holes 213 may be provided in plurality, the plurality of first air suction holes 213 are uniformly formed on a side of the first mold plate 211 close to the die 11, and the first mold plate 211 communicates the first air suction holes 213 with the first air suction pipe 212. The first mold plate 211 may be disposed at a position of the female mold 11 corresponding to the cover plate 320, and thus the female mold 11 and the cover plate 320 may be sucked by the uniform suction force applied to the female mold 11 and the cover plate 320 by the first mold plate 211.
The second air suction pipe 222 may be connected to a side of the second mold plate 221 opposite to the male mold 12, the second air suction holes may be provided in plurality, the second air suction holes are uniformly formed in a side of the second mold plate 221 close to the male mold 12, and the second mold plate 221 communicates the second air suction holes and the second air suction pipe 222. The second mold plate 221 may also be disposed at a position where the punch 12 corresponds to the cover plate 320, and the second mold plate 221 is mainly used for providing suction to the punch 12 to drive the punch 12 to move. Since the suction force provided to the cover plate 320 is larger as the area to which the suction force acts is smaller in the case where the cavity die 11 and the cavity die 12 are subjected to the same suction force, the size of the second mold plate 221 may be set to be not smaller than that of the first mold plate 211.
At the time of demolding, the mold opening may be achieved by pushing the molding die 10 onto the first form 211, then suction-fixing the female mold 11 on the first form 211 and suction-fixing the cover plate 320 on the female mold 11 by opening the first suction device 21, then causing the second form 221 to contact the male mold 12, then suction-fixing the male mold 12 on the second form 221 by the second suction device 22, and then moving the male mold 12 in a direction away from the female mold 11 by driving the second form 221 to move.
Referring to fig. 5, in some embodiments, the suction demolding mechanism 20 further includes a suction pump 23, and the first suction pipe 212 and the second suction pipe 222 are connected to the suction pump 23.
In this way, the suction pump 23 can provide suction to the female mold 11 and the male mold 12 through the first suction pipe 212 and the second suction pipe 222.
Specifically, the suction pump 23 may be provided as one capable of providing the same amount of suction to the female mold 11 and the male mold 12 through the first suction pipe 212 and the second suction pipe 222. The number of the suction pumps 23 may be two, the first suction pump 231 is correspondingly communicated with the first suction pipe 212, the second suction pump 232 is correspondingly communicated with the second suction pipe 222, and the suction force to the female die 11 and the male die 12 can be controlled by the first suction pump 231 and the second suction pump 232. Wherein the suction force of the first suction pump 231 to the female mold 11 may be greater than the suction force of the second suction pump 232 to the male mold 12.
In some embodiments, the suction and demolding mechanism 20 further includes a lifting device 60, the lifting device 60 is connected to the second suction device 22, and the lifting device 60 is used for driving the second suction device 22 to move relative to the first suction device 21. For example, the lifting device 60 can drive the second suction device 22 to move away from the female die 11, and the suction force provided by the second suction device 22 to the male die 12 is greater than the gravity of the male die 12.
Referring to fig. 1 to 6, in some embodiments, the hot bending apparatus 100 further includes a feeding portion 101, a main body portion 102, and a discharging portion 103, which are sequentially connected, the forming mold 10 can be sequentially moved from the feeding portion 101 to the main body portion 102 and the discharging portion 103, a heating device 30, a forming device 40, and an annealing device 50 are sequentially disposed in the main body portion 102, the heating device 30 is configured to heat the forming mold 10, the forming and pressurizing device is configured to apply pressure to the male mold 12, the annealing device 50 includes a slow cooling portion and a fast cooling portion, which are sequentially disposed, and the air-suction and mold-releasing mechanism 20 is disposed in the slow cooling portion.
In this manner, the hot bending apparatus 100 may perform the entire operation of converting the element to be hot bent into the cover plate 320 in the main body portion 102, so that the cover plate 320 is molded.
At the infeed section 101, the element to be hot-bent can be placed into the forming cavity 13 of the forming die 10. The molding die 10 is conveyed into the main body portion 102 by a conveying device.
Within the body portion 102, the heating device 30 may heat the element to be heated by various means, such as thermal conduction, thermal radiation, and electromagnetic induction. The heating device 30 can accurately and stably control the temperature of the molding die 10, wherein the maximum temperature that the heating device 30 can provide can reach over 900 ℃. For example, the heating device 30 can gradually heat the forming mold 10 to 500 ℃, and preheat the element to be hot-bent; the heating device 30 is capable of heating the forming die 10 to 850 ℃, so that the element to be hot-bent is in a softened state and is capable of being deformed by applying pressure thereto.
The forming device 40 is used for applying pressure to the male die 12 to change the shape of the element to be hot bent when the element to be hot bent reaches a softened state. The molding device 40 may include a pressurizing mechanism, the pressurizing mechanism may apply pressure to the male mold 12 by using a motor or a cylinder to lift or lower, and the pressurizing mechanism may precisely control the magnitude of pressure, the pressure applying rate, the descending position, and the like, so as to precisely control the molding quality of the cover plate 320.
The annealing device 50 is used to cool the formed cover plate 320 to shape the cover plate 320. The annealing device 50 can precisely control the cooling condition of the forming die 10. The cooling temperature of the slow cooling portion is slightly lower than the softening temperature of the cover plate 320, for example, the cover plate 320 is a glass cover plate, and the temperature of the slow cooling portion can be 550-600 ℃. During the slow cooling portion, the air suction and demolding mechanism 20 can demold the molding device 40, and at this time, the cover plate 320 gradually decreases from the softening temperature to a temperature lower than the softening point and is initially solidified, so that the cover plate 320 is not greatly deformed and the male mold 12 is not clamped when the male mold 12 of the molding mold 10 is separated from the female mold 11. The temperature of the fast cooling part may be a stable temperature after the cover plate 320 is molded, and the fast cooling part is cooled to stably mold the cover plate 320. The rapid-cooling portion may lower the molding die 10 to room temperature.
At the discharging portion 103, the molded cover plate 320 lowered to room temperature is taken out, and the cover plate 320 is completed.
In some embodiments, the heating device 30 includes a heating plate for heating the forming mold 10, and a heat insulation plate is disposed outside the heating plate.
The heating plate may be disposed on the periphery of the molding die 10, and may be heated by a heating pipe. The heating plate can be made of a material with small thermal expansion coefficient, no deformation during heating, high strength and good thermal conductivity, such as a nickel-based metal material. The heating plate serves as a carrier for heating and supporting the molding die 10 to have good stability and thermal uniformity, facilitating molding of the inner cover plate 320 of the molding die 10. Meanwhile, the heat insulation plate can be arranged on the outer side of the heating plate, is made of refractory materials, has the effects of high temperature resistance, heat preservation and heat insulation, and reduces heat loss, heat loss and energy consumption while protecting surrounding parts.
Referring to fig. 7, a method for forming a cover plate according to an embodiment of the present invention may be implemented by the hot bending apparatus 100 according to the above embodiment, and the method for forming the cover plate 320 includes:
s10: placing the element to be hot-bent into a forming die 10;
s20: heating the forming die 10 and pressurizing the element to be bent so that the element to be bent forms a cover plate 320 in the forming cavity 13;
s30: the female die 11 and the cover plate 320 are sucked by the first suction device 21 and the male die 12 is sucked by the second suction device 22;
s40: the air suction and demolding mechanism 20 drives the male mold 12 to move in the direction away from the female mold 11 so as to realize demolding;
s50: the cover plate 320 is removed.
Specifically, in step S10, the hot bending apparatus 100 is turned on, the main body 102 is filled with inert gas to prevent the hot bending element from generating chemical reaction with the air at high temperature, and the heating device 30 heats the inside of the main body 102 to enable the forming mold 10 to be heated rapidly after entering to soften the hot bending element. At this time, the forming mold 10 is located in the feeding portion 101, the male mold 12 of the forming mold 10 is opened, the member to be hot-bent is placed in the forming groove of the forming mold 10, and the male mold 12 is placed back into the female mold 11.
In step S20, the molding die 10 enters the heat-softened region of the main body portion 102. The heating device 30 gradually heats the molding device 40 to the softening temperature of the member to be hot-bent to soften the member to be hot-bent. The forming die 10 is then transferred to a press-forming zone, and the forming device 40 applies pressure to the punch 12, so that the softened element to be hot-bent is deformed in the forming cavity 13 to form the shape of the cover plate 320.
In step S30, the forming mold 10 is conveyed to the annealing region where the annealing device 50 is located, and first enters the slow cooling portion, and the annealing device 50 cools the forming mold 10 to below the softening temperature of the cover plate 320 to achieve the primary solidification. Meanwhile, the air suction and demolding mechanism 20 is opened, the first air suction device 21 sucks the female die 11 and the cover plate 320 for fixation, and the second air suction device 22 sucks the male die 12 so that the male die 12 can move along with the second air suction device 22. The lifting device 60 lifts the second air suction device 22, so as to drive the second air suction device 22 to move in a direction away from the female die 11, so that the molding device 40 realizes demolding. The male die 12 is lifted for a period of time and then slowly lowered to maintain the entire actuation time within a period. Then, the molding device 40 proceeds to the rapid cooling section, and the molding device 40 is gradually cooled to room temperature. In the rapid cooling portion, the temperature of the cap plate 320 is lower than the strain point temperature, and the cap plate 320 is substantially free from stress, so that the cap plate 320 is completely molded.
In step S40, the molding die 10 is conveyed to the discharge section. And taking out the forming cover plate 320 in the forming die 10 to complete the whole process of forming the cover plate 320 by the element to be thermally bent.
Referring to fig. 8, in some embodiments, after the male mold 12 is moved away from the female mold 11 by the suction and demolding mechanism 20 to perform demolding, before the cover plate 320 is removed, the molding method further includes:
s41: after the male die 12 is demolded for a preset time and the temperature is reduced to a preset temperature, the male die 12 is put down so that the male die 12 is positioned on the female die 11;
s42: the forming die 10 is cooled.
Specifically, the suction demolding mechanism 20 drives the punch 12 to move away from the die 11 during the slow cooling portion to realize demolding, and the temperature of the slow cooling portion is near the strain point temperature of the cover body 320 and slightly lower than the softening temperature of the cover plate 320. If the temperature is too high, the molding of the cover plate 320 is unstable, and the cover plate 320 deforms during demolding; too low a temperature may cause the cover plate 320 to shrink around the mold, and the cover plate 320 may crack during demolding.
Further, after demolding, the temperature of the cover plate 320 is gradually lowered from the strain point temperature to be cooled and formed, and in the process, the cover plate 320 may deform without being supported, thereby affecting the forming of the cover body 320. And then after the air suction and demolding mechanism 20 drives the male die 12 to separate from the preset time and reduce the temperature to the preset temperature, the male die 12 is placed back into the female die 11 to support the cover plate 320 so as to prevent the cover plate 320 from deforming, and the yield is further improved. For example, the air-breathing demolding mechanism 20 demolds at 550 ℃, the cover plate 320 is at the strain point temperature, the preset time can be 10min, the preset temperature can be reduced to 450 ℃, at this time, the cover plate 320 is initially molded, but may also be slightly deformed at this temperature, and then the male mold 12 needs to be placed back into the female mold 11 for supporting and further cooling.
Further cooling is performed with the male mold 12 and the female mold 11 clamped, so that the cover plate 320 is cooled and molded.
The cover plate 320 of the embodiment of the application is manufactured by the method for forming the cover plate 320 in the embodiment, so that demolding is facilitated, and the production efficiency is improved.
Referring to fig. 8, an electronic device 300 according to an embodiment of the present disclosure includes a main body 310 and a cover 320. The cover plate 320 processed by the above embodiment may be mounted on the main body 310 after grinding, polishing, and the like, so that the electronic device 300 has certain aesthetic properties, and can protect the main body 310.
Specifically, the electronic device 300 includes, but is not limited to, an electronic device with a protective housing, such as a mobile phone, a tablet computer, a wearable device (e.g., a smart watch), and the like. Taking a mobile phone as an example, the main body 310 may include a middle frame and a display screen, and the cover 320 may be a rear case of the mobile phone or a cover of the display screen, which is not limited herein.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (13)

1. A hot-bending apparatus for hot-bending forming of a cover sheet, comprising:
the forming die comprises a female die and a male die, the male die is arranged above the female die, the male die and the female die are matched to form a forming cavity, the forming cavity is used for forming the cover plate, and the female die and the male die are both made of porous materials; and
the air suction and demolding mechanism comprises a first air suction device and a second air suction device, wherein the first air suction device can suck air to suck the female die and adsorb the cover plate on the female die when the forming die is demolded, and the second air suction device can suck air to suck the male die and drive the male die to move towards the direction far away from the female die to realize demolding.
2. The apparatus according to claim 1, wherein the female die and the male die are both graphite pieces.
3. The hot bending apparatus according to claim 1, wherein the female die has a plurality of closed holes opened therein, and one end of the closed holes facing the forming cavity is closed.
4. The hot bending apparatus according to claim 1, wherein the female die has a thickness smaller than that of the male die.
5. The apparatus according to claim 1, wherein the first air suction means includes a first pattern plate positioned at a bottom of the female mold, and a first air suction pipe formed on the first pattern plate and communicating with the first air suction hole, and the second air suction means includes a second pattern plate positioned at a top of the male mold, and a second air suction hole formed on the second pattern plate and communicating with the second air suction hole, and the first air suction means sucks the female mold and the cover plate through the first pattern plate and the second air suction means sucks the male mold through the second pattern plate.
6. The apparatus according to claim 5, wherein the suction stripper mechanism further comprises a suction pump, and wherein the first suction tube and the second suction tube are both in communication with the suction pump.
7. The apparatus according to claim 1, wherein the suction and demolding mechanism further comprises a lifting device connected to the second suction device, the lifting device being configured to drive the second suction device to move relative to the first suction device.
8. The hot bending device according to claim 1, further comprising a feeding portion, a main body portion and a discharging portion which are sequentially communicated, wherein the forming mold can sequentially move from the feeding portion to the main body portion and the discharging portion, a heating device, a forming device and an annealing device are sequentially arranged in the main body portion, the heating device is used for heating the forming mold, the forming pressurizing device is used for applying pressure to the male mold, the annealing device comprises a slow cooling portion and a fast cooling portion which are sequentially arranged, and the air suction and demolding mechanism is arranged at the slow cooling portion.
9. The hot bending apparatus according to claim 8, wherein the heating means comprises a heating plate for heating the forming die, and a heat insulating plate is provided outside the heating plate.
10. A method for forming a cover plate, wherein the cover plate is hot-bend formed by using the hot-bending apparatus as claimed in any one of claims 1 to 9, the method comprising:
placing the element to be hot-bent into the forming die;
heating the forming die and pressurizing the element to be bent so that the element to be bent forms the cover plate in the forming cavity;
sucking the female die and the cover plate through the first air suction device and sucking the male die through the second air suction device;
the male die is driven to move in the direction away from the female die through the air suction and demolding mechanism so as to realize demolding;
and taking out the cover plate.
11. The method for forming a cover plate according to claim 10, wherein after the male die is moved away from the female die by the air-suction and demolding mechanism to perform demolding, and before the cover plate is removed, the method further comprises:
after the male die is demoulded for a preset time and the temperature is reduced to a preset temperature, the male die is put down so as to be positioned on the female die;
and cooling the forming die.
12. A cover plate, characterized in that it is manufactured by the method of forming a cover plate according to any one of claims 10 and 11.
13. An electronic device, comprising:
a main body; and
the cover plate of claim 13 mounted on the body.
CN202110731926.8A 2021-06-30 2021-06-30 Hot bending equipment, cover plate and forming method thereof and electronic device Pending CN113354268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110731926.8A CN113354268A (en) 2021-06-30 2021-06-30 Hot bending equipment, cover plate and forming method thereof and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110731926.8A CN113354268A (en) 2021-06-30 2021-06-30 Hot bending equipment, cover plate and forming method thereof and electronic device

Publications (1)

Publication Number Publication Date
CN113354268A true CN113354268A (en) 2021-09-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
CN (1) CN113354268A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002187727A (en) * 2000-12-18 2002-07-05 Matsushita Electric Ind Co Ltd Method of manufacturing glass substrate and die for molding glass substrate
CN107986607A (en) * 2017-11-17 2018-05-04 瑞声精密制造科技(常州)有限公司 The thermoforming process and thermal forming device of glass product
CN212025183U (en) * 2019-12-19 2020-11-27 诚瑞光学(常州)股份有限公司 Forming station
WO2021120115A1 (en) * 2019-12-19 2021-06-24 诚瑞光学(常州)股份有限公司 Forming station

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002187727A (en) * 2000-12-18 2002-07-05 Matsushita Electric Ind Co Ltd Method of manufacturing glass substrate and die for molding glass substrate
CN107986607A (en) * 2017-11-17 2018-05-04 瑞声精密制造科技(常州)有限公司 The thermoforming process and thermal forming device of glass product
CN212025183U (en) * 2019-12-19 2020-11-27 诚瑞光学(常州)股份有限公司 Forming station
WO2021120115A1 (en) * 2019-12-19 2021-06-24 诚瑞光学(常州)股份有限公司 Forming station

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