CN113353937A - Polycrystalline silicon reduction furnace with good heat dissipation effect - Google Patents
Polycrystalline silicon reduction furnace with good heat dissipation effect Download PDFInfo
- Publication number
- CN113353937A CN113353937A CN202110805185.3A CN202110805185A CN113353937A CN 113353937 A CN113353937 A CN 113353937A CN 202110805185 A CN202110805185 A CN 202110805185A CN 113353937 A CN113353937 A CN 113353937A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- air inlet
- parts
- reduction furnace
- polycrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 47
- 230000000694 effects Effects 0.000 title claims abstract description 37
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 30
- 238000006243 chemical reaction Methods 0.000 claims abstract description 21
- 239000000498 cooling water Substances 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 26
- 239000011247 coating layer Substances 0.000 claims description 18
- 230000003139 buffering effect Effects 0.000 claims description 11
- 229920005591 polysilicon Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 239000002912 waste gas Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 abstract description 28
- 239000011248 coating agent Substances 0.000 abstract description 27
- 238000001816 cooling Methods 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 20
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 20
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 20
- 239000006185 dispersion Substances 0.000 description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 12
- 229910021389 graphene Inorganic materials 0.000 description 12
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 10
- 235000017491 Bambusa tulda Nutrition 0.000 description 10
- 241001330002 Bambuseae Species 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 10
- 235000021355 Stearic acid Nutrition 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000011425 bamboo Substances 0.000 description 10
- 239000011324 bead Substances 0.000 description 10
- 239000000440 bentonite Substances 0.000 description 10
- 229910000278 bentonite Inorganic materials 0.000 description 10
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 10
- 239000003610 charcoal Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 239000010445 mica Substances 0.000 description 10
- 229910052618 mica group Inorganic materials 0.000 description 10
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 10
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 10
- 239000004417 polycarbonate Substances 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 10
- 229910010271 silicon carbide Inorganic materials 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 10
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 239000008117 stearic acid Substances 0.000 description 10
- 239000004408 titanium dioxide Substances 0.000 description 10
- 239000011812 mixed powder Substances 0.000 description 8
- 239000011268 mixed slurry Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 238000010574 gas phase reaction Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910003822 SiHCl3 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000012496 blank sample Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/03—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition of silicon halides or halosilanes or reduction thereof with hydrogen as the only reducing agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
The invention discloses a polycrystalline silicon reduction furnace with a good heat dissipation effect, which comprises a bell jar, a chassis and a support frame; a cavity between the bell jar and the chassis forms a reaction cavity, the bell jar is a double-layer furnace body containing jacket cooling water, and a guide plate is arranged between the double-layer furnace body; a plurality of electrodes are uniformly arranged on the base plate, and one ends of the electrodes penetrate through the base plate and extend into the reaction cavity; a main air inlet pipe is further arranged below the base plate, one end of the main air inlet pipe, which is positioned right below the base plate, is connected with a disc-shaped cavity, a plurality of air inlet branch pipes are uniformly arranged above the disc-shaped cavity, and the air inlet branch pipes penetrate through the base plate and are communicated with nozzles arranged in the reaction cavity; a flow slowing plate is arranged in the disc-shaped cavity, and the main air inlet pipe and the branch air inlet pipe are respectively arranged on two sides of the flow slowing plate; the device is uniformly dispersed and sprayed into the reaction cavity when air is fed, the coating coated outside the bell jar can greatly reduce the temperature of a heat source, and the problems of difficult heat dissipation and unsatisfactory cooling effect of the polycrystalline silicon reduction furnace are solved.
Description
Technical Field
The invention relates to a polycrystalline silicon reduction furnace with a good heat dissipation effect.
Background
The production technology of the polycrystalline silicon mainly comprises an improved Siemens method and a silane method. The Siemens method is used for producing the columnar polysilicon in a vapor deposition mode, and in order to improve the utilization rate of raw materials and protect the environment, a closed-loop production process is adopted on the basis of the former method, namely the improved Siemens method is adopted. The process comprises the steps of reacting industrial silicon powder with HCl, processing the industrial silicon powder into SiHCl3, and reducing and depositing SiHCl3 in a reducing furnace with an H2 atmosphere to obtain polycrystalline silicon. The existing polysilicon reduction furnace has the following defects: 1. the reduction furnace can only be positioned at a fixed position for carrying out the steps of loading, reaction, unloading and the like, and the furnace body is heavy and inconvenient to move and operate; when H2 is conveyed from the gas inlet main pipe, the gas mixture in the furnace body is easily distributed unevenly, and the gas phase reaction effect is influenced; 3. the existing reduction furnace generally adopts cooling water to cool the furnace body, and the cooling effect is not ideal.
In summary, it is necessary to find a new polysilicon reduction furnace with uniform gas injection, good gas phase reaction effect, good furnace body heat dissipation effect and convenient operation.
Disclosure of Invention
In view of the above, the present invention aims to provide a novel polysilicon reduction furnace, the equipment is uniformly dispersed and sprayed into a reaction chamber during gas inlet, so that the gas phase reaction effect is good, the coating coated outside a bell jar can greatly reduce the temperature of a heat source, the problems of difficult heat dissipation and unsatisfactory cooling effect of the polysilicon reduction furnace are solved, the reduction furnace is convenient to move, and the inconvenience in the existing operation is solved.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a polysilicon reduction furnace with good heat dissipation effect comprises a bell jar, a chassis arranged below the bell jar and a support frame arranged below the chassis; a cavity between the bell jar and the chassis forms a reaction cavity, the bell jar is a double-layer furnace body containing jacket cooling water, and a guide plate is arranged between the double-layer furnace body; a plurality of electrodes are uniformly arranged on the base plate, and one ends of the electrodes penetrate through the base plate and extend into the reaction cavity; a main air inlet pipe is further arranged below the base plate, one end of the main air inlet pipe, which is positioned right below the base plate, is connected with a disc-shaped cavity, a plurality of air inlet branch pipes are uniformly arranged above the disc-shaped cavity, and the air inlet branch pipes penetrate through the base plate and are communicated with nozzles arranged in the reaction cavity; a flow slowing plate is arranged in the disc-shaped cavity, and the air inlet main pipe and the air inlet branch pipe are respectively arranged on two sides of the flow slowing plate.
Preferably, the electrodes are powered by an external power source.
Preferably, the supporting frames are respectively arranged at four corners of the chassis, the lower ends of the supporting frames are provided with rollers, and the rollers are provided with brake positioning sheets.
Preferably, the guide plates are arranged on two side walls between the double-layer furnace bodies.
Preferably, the double-layer furnace body is also provided with a cooling water inlet pipe and a cooling water outlet pipe.
Preferably, a plurality of through holes are uniformly formed in the flow buffering plate, and the air inlet branch pipes and the through holes are arranged in a staggered mode.
Preferably, the end part of the main air inlet pipe connected with the disc-shaped cavity is of a funnel structure with gradually increased inner diameter.
Preferably, an exhaust gas discharge pipeline is further arranged on the chassis.
Preferably, the outer part of the bell jar is uniformly coated with a heat dissipation coating layer, and the thickness of the heat dissipation coating layer is 3-5 mm.
Preferably, the heat dissipation coating layer is prepared from the following raw materials in parts by weight: 30-40 parts of epoxy resin, 10-12 parts of graphene, 1-3 parts of zirconia, 1-3 parts of mica, 2-3 parts of silicon carbide, 1-2 parts of bentonite, 3-5 parts of copper powder, 3-5 parts of aluminum powder, 2-4 parts of polycarbonate, 3-5 parts of glass beads, 5-7 parts of bamboo charcoal powder, 1-3 parts of silicon dioxide, 2-4 parts of titanium dioxide, 7-9 parts of stearic acid and 8-10 parts of styrene.
Another technical problem to be solved by the present invention is to provide a method for preparing a heat dissipation coating layer, comprising the following steps:
step 1: putting 10-12 parts of graphene, 1-3 parts of zirconia, 1-3 parts of mica, 2-3 parts of silicon carbide, 1-2 parts of bentonite, 3-5 parts of copper powder, 3-5 parts of aluminum powder, 3-5 parts of glass beads, 5-7 parts of bamboo charcoal powder, 1-3 parts of silicon dioxide and 2-4 parts of titanium dioxide into a high-speed dispersion machine, starting the high-speed dispersion machine, adjusting the rotation degree of the high-speed dispersion machine to be 200-phase mixing 300r/min, and dispersing for 10-20min to obtain mixed powder for later use;
step 2: putting 30-40 parts of epoxy resin, 2-4 parts of polycarbonate and 8-10 parts of styrene into a stirrer for mixing and heating, starting the stirrer, adjusting the rotation degree of the stirrer to be 400r/min for 300-110 ℃ for 30-40min, and preparing mixed resin for later use;
and step 3: adding the mixed powder prepared in the step 1 into the mixed resin prepared in the step 2, then adding 7-9 parts of stearic acid, starting the stirrer again, adjusting the rotation degree of the stirrer to be 250-300r/min, and stirring for 30-40min to prepare mixed slurry for later use;
and 4, step 4: standing the mixed slurry prepared in the step 3 for 24 hours to obtain a coating;
and 5: and (4) uniformly coating the coating prepared in the step (4) on the outer surface of the bell jar, wherein the thickness of the coating is about 3-5 mm.
The technical effects of the invention are mainly reflected in the following aspects:
1. when the reduction furnace is charged, gas flows in from the gas inlet main pipe 4, when the gas enters the disc-shaped cavity 41 through the funnel structure 45, the funnel structure 45 enables the gas flow rate to be slow, the gas is diffused in the disc-shaped cavity 41 and passes through the through holes 441 on the flow plate 44 under the action of air pressure, meanwhile, the through holes 441 and the gas inlet branch pipes 42 are arranged in a staggered mode, the gas cannot directly flow into a certain gas inlet branch pipe 42, therefore, the gas can be evenly dispersed to each gas inlet branch pipe 42 and sprayed out from the nozzles 43, and the gas phase reaction effect is better.
2. Because the traditional reduction furnace body is heavier and inconvenient to move, an operator can drive the polycrystalline silicon reduction furnace to move by using the idler wheels 51 loaded at the bottom of the chassis 2, so that the reduction furnace is more convenient to use and has stronger practicability.
3. The bell jar is a double-layer furnace body containing jacket cooling water, the guide plate is arranged between the double-layer furnace body, the furnace body can be circularly cooled, the furnace body can be well cooled, the temperature is prevented from being overhigh, the coating made of epoxy resin, graphene, zirconia, mica, silicon carbide, bentonite, copper powder, aluminum powder, polycarbonate, glass beads, bamboo charcoal powder, silicon dioxide, titanium dioxide, stearic acid and styrene is coated outside the bell jar, the far infrared effect and the heat dissipation effect are good, the adhesive force is strong, the heat source temperature can be greatly reduced, and the problems that the heat dissipation of the polycrystalline silicon reduction furnace is difficult and the cooling effect is not ideal are solved.
Drawings
Fig. 1 is a sectional view of a polycrystalline silicon reduction furnace with a good heat dissipation effect according to the present invention.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying fig. 1 to make the technical solution of the present invention easier to understand and grasp.
In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin connecting manner, or the like, which is commonly used in the prior art, and therefore, details thereof are not described in the present embodiment.
Example 1
A polysilicon reduction furnace with good heat dissipation effect, as shown in fig. 1: comprises a bell jar 1, a chassis 2 arranged below the bell jar 1 and a supporting frame 5 arranged below the chassis; the bell jar outside coating has the heat dissipation dope layer evenly, the thickness of heat dissipation dope layer is 3 mm. A cavity between the bell jar 1 and the chassis 2 forms a reaction cavity 3, the bell jar 1 is a double-layer furnace body containing jacket cooling water, a guide plate 11 is arranged between the double-layer furnace body, and the guide plate 11 is arranged on two side walls between the double-layer furnace body; a plurality of electrodes 21 are uniformly arranged on the base plate 2, one end of each electrode 21 penetrates through the base plate 2 and extends into the reaction cavity 3, and the electrodes 21 are powered by an external power supply; a main air inlet pipe 4 is further arranged below the chassis 2, one end of the main air inlet pipe 4, which is positioned right below the chassis, is connected with a disc-shaped cavity 41, the end part of the main air inlet pipe 4, which is connected with the disc-shaped cavity 41, is a funnel structure 45 with gradually increased inner diameter, a plurality of air inlet branch pipes 42 are uniformly arranged above the disc-shaped cavity 41, and the air inlet branch pipes 42 penetrate through the chassis 2 and are communicated with a nozzle 43 arranged in the reaction cavity 3; a flow buffering plate 44 is arranged in the disc-shaped cavity 41, a plurality of through holes 441 are uniformly formed in the flow buffering plate 44, the air inlet branch pipes 42 and the through holes 441 are arranged in a staggered manner, and the air inlet main pipe 4 and the air inlet branch pipes 42 are respectively arranged on two sides of the flow buffering plate 44; the support frame 5 is respectively arranged at four corners of the chassis 2, the lower end of the support frame 5 is provided with a roller 51, the roller 51 is provided with a brake positioning sheet, the double-layer furnace body is further provided with a cooling water inlet pipe 6 and a cooling water outlet pipe 7, and the chassis 2 is further provided with a waste gas discharge pipeline 8.
The heat dissipation coating layer is prepared from the following raw materials in parts by weight: 40 parts of epoxy resin, 10 parts of graphene, 1 part of zirconia, 1 part of mica, 2 parts of silicon carbide, 1 part of bentonite, 3 parts of copper powder, 3 parts of aluminum powder, 2 parts of polycarbonate, 3 parts of glass beads, 5 parts of bamboo charcoal powder, 1 part of silicon dioxide, 2 parts of titanium dioxide, 7 parts of stearic acid and 8 parts of styrene.
The preparation method of the heat dissipation coating layer comprises the following steps:
step 1: putting 10 parts of graphene, 1 part of zirconia, 1 part of mica, 2 parts of silicon carbide, 1 part of bentonite, 3 parts of copper powder, 3 parts of aluminum powder, 3 parts of glass beads, 5 parts of bamboo charcoal powder, 1 part of silicon dioxide and 2 parts of titanium dioxide into a high-speed dispersion machine, starting the high-speed dispersion machine, adjusting the rotation degree of the high-speed dispersion machine to be 200r/min, and adjusting the dispersion time to be 10min to obtain mixed powder for later use;
step 2: putting 40 parts of epoxy resin, 2 parts of polycarbonate and 8 parts of styrene into a stirrer for mixing and heating, starting the stirrer, adjusting the rotation degree of the stirrer to be 300r/min, heating the mixture to be 100 ℃, and stirring the mixture for 30min to prepare mixed resin for later use;
and step 3: adding the mixed powder prepared in the step 1 into the mixed resin prepared in the step 2, then adding 7 parts of stearic acid, starting the stirrer again, adjusting the rotation degree of the stirrer to be 250r/min, and stirring for 30min to prepare mixed slurry for later use;
and 4, step 4: standing the mixed slurry prepared in the step 3 for 24 hours to obtain a coating;
and 5: and (4) uniformly coating the coating prepared in the step (4) on the outer surface of the bell jar, wherein the thickness of the coating is about 3 mm.
Example 2
A polysilicon reduction furnace with good heat dissipation effect, as shown in fig. 1: comprises a bell jar 1, a chassis 2 arranged below the bell jar 1 and a supporting frame 5 arranged below the chassis; the bell jar is characterized in that a heat dissipation coating layer is uniformly coated on the outer portion of the bell jar, and the thickness of the heat dissipation coating layer is 5 mm. A cavity between the bell jar 1 and the chassis 2 forms a reaction cavity 3, the bell jar 1 is a double-layer furnace body containing jacket cooling water, a guide plate 11 is arranged between the double-layer furnace body, and the guide plate 11 is arranged on two side walls between the double-layer furnace body; a plurality of electrodes 21 are uniformly arranged on the base plate 2, one end of each electrode 21 penetrates through the base plate 2 and extends into the reaction cavity 3, and the electrodes 21 are powered by an external power supply; a main air inlet pipe 4 is further arranged below the chassis 2, one end of the main air inlet pipe 4, which is positioned right below the chassis, is connected with a disc-shaped cavity 41, the end part of the main air inlet pipe 4, which is connected with the disc-shaped cavity 41, is a funnel structure 45 with gradually increased inner diameter, a plurality of air inlet branch pipes 42 are uniformly arranged above the disc-shaped cavity 41, and the air inlet branch pipes 42 penetrate through the chassis 2 and are communicated with a nozzle 43 arranged in the reaction cavity 3; a flow buffering plate 44 is arranged in the disc-shaped cavity 41, a plurality of through holes 441 are uniformly formed in the flow buffering plate 44, the air inlet branch pipes 42 and the through holes 441 are arranged in a staggered manner, and the air inlet main pipe 4 and the air inlet branch pipes 42 are respectively arranged on two sides of the flow buffering plate 44; the support frame 5 is respectively arranged at four corners of the chassis 2, the lower end of the support frame 5 is provided with a roller 51, the roller 51 is provided with a brake positioning sheet, the double-layer furnace body is further provided with a cooling water inlet pipe 6 and a cooling water outlet pipe 7, and the chassis 2 is further provided with a waste gas discharge pipeline 8.
The heat dissipation coating layer is prepared from the following raw materials in parts by weight: 30 parts of epoxy resin, 12 parts of graphene, 3 parts of zirconia, 3 parts of mica, 3 parts of silicon carbide, 2 parts of bentonite, 5 parts of copper powder, 5 parts of aluminum powder, 4 parts of polycarbonate, 5 parts of glass beads, 7 parts of bamboo charcoal powder, 3 parts of silicon dioxide, 4 parts of titanium dioxide, 9 parts of stearic acid and 10 parts of styrene.
The preparation method of the heat dissipation coating layer comprises the following steps:
step 1: putting 12 parts of graphene, 3 parts of zirconia, 3 parts of mica, 3 parts of silicon carbide, 2 parts of bentonite, 5 parts of copper powder, 5 parts of aluminum powder, 5 parts of glass beads, 7 parts of bamboo charcoal powder, 3 parts of silicon dioxide and 4 parts of titanium dioxide into a high-speed dispersion machine, starting the high-speed dispersion machine, adjusting the rotation degree of the high-speed dispersion machine to be 300r/min, and adjusting the dispersion time to be 20min to obtain mixed powder for later use;
step 2: putting 30 parts of epoxy resin, 4 parts of polycarbonate and 10 parts of styrene into a stirrer for mixing and heating, starting the stirrer, adjusting the rotation degree of the stirrer to 400r/min, the heating temperature to 110 ℃, and the stirring time to 40min to prepare mixed resin for later use;
and step 3: adding the mixed powder prepared in the step 1 into the mixed resin prepared in the step 2, then adding 9 parts of stearic acid, starting the stirrer again, adjusting the rotation degree of the stirrer to be 300r/min, and stirring for 40min to prepare mixed slurry for later use;
and 4, step 4: standing the mixed slurry prepared in the step 3 for 24 hours to obtain a coating;
and 5: and (4) uniformly coating the coating prepared in the step (4) on the outer surface of the bell jar, wherein the thickness of the coating is about 5 mm.
Example 3
A polysilicon reduction furnace with good heat dissipation effect, as shown in fig. 1: comprises a bell jar 1, a chassis 2 arranged below the bell jar 1 and a supporting frame 5 arranged below the chassis; the bell jar is characterized in that a heat dissipation coating layer is uniformly coated on the outer portion of the bell jar, and the thickness of the heat dissipation coating layer is 4 mm. A cavity between the bell jar 1 and the chassis 2 forms a reaction cavity 3, the bell jar 1 is a double-layer furnace body containing jacket cooling water, a guide plate 11 is arranged between the double-layer furnace body, and the guide plate 11 is arranged on two side walls between the double-layer furnace body; a plurality of electrodes 21 are uniformly arranged on the base plate 2, one end of each electrode 21 penetrates through the base plate 2 and extends into the reaction cavity 3, and the electrodes 21 are powered by an external power supply; a main air inlet pipe 4 is further arranged below the chassis 2, one end of the main air inlet pipe 4, which is positioned right below the chassis, is connected with a disc-shaped cavity 41, the end part of the main air inlet pipe 4, which is connected with the disc-shaped cavity 41, is a funnel structure 45 with gradually increased inner diameter, a plurality of air inlet branch pipes 42 are uniformly arranged above the disc-shaped cavity 41, and the air inlet branch pipes 42 penetrate through the chassis 2 and are communicated with a nozzle 43 arranged in the reaction cavity 3; a flow buffering plate 44 is arranged in the disc-shaped cavity 41, a plurality of through holes 441 are uniformly formed in the flow buffering plate 44, the air inlet branch pipes 42 and the through holes 441 are arranged in a staggered manner, and the air inlet main pipe 4 and the air inlet branch pipes 42 are respectively arranged on two sides of the flow buffering plate 44; the support frame 5 is respectively arranged at four corners of the chassis 2, the lower end of the support frame 5 is provided with a roller 51, the roller 51 is provided with a brake positioning sheet, the double-layer furnace body is further provided with a cooling water inlet pipe 6 and a cooling water outlet pipe 7, and the chassis 2 is further provided with a waste gas discharge pipeline 8.
The heat dissipation coating layer is prepared from the following raw materials in parts by weight: 35 parts of epoxy resin, 11 parts of graphene, 2 parts of zirconia, 2 parts of mica, 2.5 parts of silicon carbide, 1.5 parts of bentonite, 4 parts of copper powder, 4 parts of aluminum powder, 3 parts of polycarbonate, 4 parts of glass beads, 6 parts of bamboo charcoal powder, 2 parts of silicon dioxide, 3 parts of titanium dioxide, 8 parts of stearic acid and 9 parts of styrene.
The preparation method of the heat dissipation coating layer comprises the following steps:
step 1: putting 11 parts of graphene, 2 parts of zirconia, 2 parts of mica, 2.5 parts of silicon carbide, 1.5 parts of bentonite, 4 parts of copper powder, 4 parts of aluminum powder, 4 parts of glass beads, 6 parts of bamboo charcoal powder, 2 parts of silicon dioxide and 3 parts of titanium dioxide into a high-speed dispersion machine, starting the high-speed dispersion machine, adjusting the rotation degree of the high-speed dispersion machine to be 250r/min, and dispersing for 15min to obtain mixed powder for later use;
step 2: putting 35 parts of epoxy resin, 3 parts of polycarbonate and 9 parts of styrene into a stirrer for mixing and heating, starting the stirrer, adjusting the rotation degree of the stirrer to 350r/min, heating to 105 ℃, and stirring for 35min to prepare mixed resin for later use;
and step 3: adding the mixed powder prepared in the step 1 into the mixed resin prepared in the step 2, then adding 8 parts of stearic acid, starting the stirrer again, adjusting the rotation degree of the stirrer to be 280r/min, and stirring for 35min to prepare mixed slurry for later use;
and 4, step 4: standing the mixed slurry prepared in the step 3 for 24 hours to obtain a coating;
and 5: and (4) uniformly coating the coating prepared in the step (4) on the outer surface of the bell jar, wherein the thickness of the coating is about 4 mm.
Examples of the experiments
Subject: the traditional varnish is used as a first control group, the existing water-based graphene heat dissipation coating is used as a second control group, and the coating prepared in the embodiment 3 of the application is used as an experimental group.
The experimental requirements are as follows: the thickness and the area of the coating layer are consistent, and 5mm x 100 mm.
The experimental method comprises the following steps: the three groups of coatings are subjected to thermal conductivity, adhesive force and infrared emissivity experiments, and the conditions are recorded.
And testing the heat conductivity coefficients of the blank sample and the sample with the coating layer by the heat conductivity coefficient tester. The adhesion is determined by the method of the pull-apart test of paint adhesion using the international standard ISO 4624-1978. The infrared emissivity is detected by a far infrared tester.
The specific results are shown in the following table:
in combination with the above, compared with results obtained by the same experimental method of the conventional varnish, the conventional water-based graphene heat dissipation coating and the heat dissipation coating prepared in the embodiment 3 of the present application, test data of the coating of the present invention are all in obvious advantages, and therefore, the coating of the present invention has the advantages of good far infrared effect, better heat dissipation effect and strong adhesion.
The technical effects of the invention are mainly reflected in the following aspects:
1. when the reduction furnace is charged, gas flows in from the gas inlet main pipe 4, when the gas enters the disc-shaped cavity 41 through the funnel structure 45, the funnel structure 45 enables the gas flow rate to be slow, the gas is diffused in the disc-shaped cavity 41 and passes through the through holes 441 on the flow plate 44 under the action of air pressure, meanwhile, the through holes 441 and the gas inlet branch pipes 42 are arranged in a staggered mode, the gas cannot directly flow into a certain gas inlet branch pipe 42, therefore, the gas can be evenly dispersed to each gas inlet branch pipe 42 and sprayed out from the nozzles 43, and the gas phase reaction effect is better.
2. Because the traditional reduction furnace body is heavier and inconvenient to move, an operator can drive the polycrystalline silicon reduction furnace to move by using the idler wheels 51 loaded at the bottom of the chassis 2, so that the reduction furnace is more convenient to use and has stronger practicability.
3. The bell jar is a double-layer furnace body containing jacket cooling water, the guide plate is arranged between the double-layer furnace body, the furnace body can be circularly cooled, the furnace body can be well cooled, the temperature is prevented from being overhigh, the coating made of epoxy resin, graphene, zirconia, mica, silicon carbide, bentonite, copper powder, aluminum powder, polycarbonate, glass beads, bamboo charcoal powder, silicon dioxide, titanium dioxide, stearic acid and styrene is coated outside the bell jar, the far infrared effect and the heat dissipation effect are good, the adhesive force is strong, the heat source temperature can be greatly reduced, and the problems that the heat dissipation of the polycrystalline silicon reduction furnace is difficult and the cooling effect is not ideal are solved.
The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.
Claims (9)
1. A polysilicon reduction furnace with good heat dissipation effect comprises a bell jar, a chassis arranged below the bell jar and a support frame arranged below the chassis; the method is characterized in that: a cavity between the bell jar and the chassis forms a reaction cavity, the bell jar is a double-layer furnace body containing jacket cooling water, and a guide plate is arranged between the double-layer furnace body; a plurality of electrodes are uniformly arranged on the base plate, and one ends of the electrodes penetrate through the base plate and extend into the reaction cavity; a main air inlet pipe is further arranged below the base plate, one end of the main air inlet pipe, which is positioned right below the base plate, is connected with a disc-shaped cavity, a plurality of air inlet branch pipes are uniformly arranged above the disc-shaped cavity, and the air inlet branch pipes penetrate through the base plate and are communicated with nozzles arranged in the reaction cavity; a flow slowing plate is arranged in the disc-shaped cavity, and the air inlet main pipe and the air inlet branch pipe are respectively arranged on two sides of the flow slowing plate.
2. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: the electrodes are powered by an external power source.
3. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: the supporting frames are respectively arranged at four corners of the chassis, rollers are arranged at the low ends of the supporting frames, and brake positioning sheets are arranged on the rollers.
4. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: the guide plates are arranged on two side walls between the double-layer furnace bodies.
5. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: and the double-layer furnace body is also provided with a cooling water inlet pipe and a cooling water outlet pipe.
6. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: a plurality of through holes are uniformly formed in the flow buffering plate, and the air inlet branch pipes and the through holes are arranged in a staggered mode.
7. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: the end part of the air inlet main pipe connected with the disc-shaped cavity is of a funnel structure with the inner diameter gradually increased.
8. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: and the chassis is also provided with a waste gas discharge pipeline.
9. The polycrystalline silicon reduction furnace with good heat dissipation effect as set forth in claim 1, wherein: the outer part of the bell jar is uniformly coated with a heat dissipation coating layer, and the thickness of the heat dissipation coating layer is 3-5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110805185.3A CN113353937A (en) | 2021-07-16 | 2021-07-16 | Polycrystalline silicon reduction furnace with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110805185.3A CN113353937A (en) | 2021-07-16 | 2021-07-16 | Polycrystalline silicon reduction furnace with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113353937A true CN113353937A (en) | 2021-09-07 |
Family
ID=77539787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110805185.3A Pending CN113353937A (en) | 2021-07-16 | 2021-07-16 | Polycrystalline silicon reduction furnace with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113353937A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201105995Y (en) * | 2007-12-19 | 2008-08-27 | 王存惠 | Modified polycrystalline silicon reducing furnace |
| CN201214631Y (en) * | 2008-04-20 | 2009-04-01 | 徐州东南多晶硅材料研发有限公司 | Polysilicon reduction furnace |
| CN105219220A (en) * | 2015-10-19 | 2016-01-06 | 国网浙江省电力公司湖州供电公司 | A kind of novel high heat conducting nano heat loss through radiation coating and preparation method thereof |
| CN107216726A (en) * | 2016-03-21 | 2017-09-29 | 华越科技股份有限公司 | The preparation method of thermal dispersant coatings and its made heat dissipation metal composite membrane |
| CN107418382A (en) * | 2017-08-25 | 2017-12-01 | 深圳市烯世传奇科技有限公司 | A kind of heat radiation coating based on graphene and preparation method thereof |
| CN208856913U (en) * | 2018-09-14 | 2019-05-14 | 四川永祥多晶硅有限公司 | A kind of polycrystalline silicon reducing furnace air intake structure |
| CN110272684A (en) * | 2019-06-27 | 2019-09-24 | 天长市天泰光电科技有限公司 | A kind of preparation method of LED High temperature resistant heat radiation paint |
-
2021
- 2021-07-16 CN CN202110805185.3A patent/CN113353937A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201105995Y (en) * | 2007-12-19 | 2008-08-27 | 王存惠 | Modified polycrystalline silicon reducing furnace |
| CN201214631Y (en) * | 2008-04-20 | 2009-04-01 | 徐州东南多晶硅材料研发有限公司 | Polysilicon reduction furnace |
| CN105219220A (en) * | 2015-10-19 | 2016-01-06 | 国网浙江省电力公司湖州供电公司 | A kind of novel high heat conducting nano heat loss through radiation coating and preparation method thereof |
| CN107216726A (en) * | 2016-03-21 | 2017-09-29 | 华越科技股份有限公司 | The preparation method of thermal dispersant coatings and its made heat dissipation metal composite membrane |
| CN107418382A (en) * | 2017-08-25 | 2017-12-01 | 深圳市烯世传奇科技有限公司 | A kind of heat radiation coating based on graphene and preparation method thereof |
| CN208856913U (en) * | 2018-09-14 | 2019-05-14 | 四川永祥多晶硅有限公司 | A kind of polycrystalline silicon reducing furnace air intake structure |
| CN110272684A (en) * | 2019-06-27 | 2019-09-24 | 天长市天泰光电科技有限公司 | A kind of preparation method of LED High temperature resistant heat radiation paint |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108148452B (en) | Graphene-containing composite heat conduction filler and preparation method and application thereof | |
| CN112920604B (en) | Method for preparing heat dissipation film based on large-sheet-diameter graphene oxide | |
| US20210332478A1 (en) | Atomic layer deposition device for massively coating micro-nano particles | |
| CN106699228A (en) | Low-cost tantalum carbide coating preparation method | |
| CN102473612B (en) | Plasma CVD apparatus, plasma electrode, and method for manufacturing semiconductor film | |
| CN110358123A (en) | A kind of high thermal conductivity graphene composite film and preparation method thereof | |
| WO2024027294A1 (en) | Hot wire chemical vapor deposition apparatus, silicon-based thin film deposition method and solar cell | |
| CN114989466A (en) | Corona-resistant polyimide film and preparation method thereof | |
| CN110835099A (en) | Preparation method of thin-layer boron nitride nanosheet | |
| CN108912803A (en) | A kind of preparation method of graphene heat dissipation slurry | |
| CN106189229B (en) | Graphene conductive thermally conductive film material of doping metals alloy and preparation method thereof | |
| CN107265416A (en) | The preparation method of pyrolytic boron nitride material | |
| CN113353937A (en) | Polycrystalline silicon reduction furnace with good heat dissipation effect | |
| CN101077825A (en) | Method for producing low radiation coated toughened glass | |
| CN102330081A (en) | Method for preparing Sm2O3 film by solvent heat method | |
| CN113184842A (en) | High-graphitization graphite thick film and preparation method thereof | |
| CN111099596A (en) | Simple method for coating high-hydrophobicity boron nitride nanosheet thin layer on surface of silicon dioxide aerogel particle | |
| CN101857952B (en) | Reaction chamber heating system of vapor phase deposition device | |
| CN108277479B (en) | PECVD device capable of controlling air flow uniformly and stably | |
| CN115044889B (en) | SiC composite coating for graphite base surface and preparation method thereof | |
| CN112409595B (en) | Polyimide film and preparation method thereof | |
| CN109763116B (en) | Dual-axis orthogonal rotation system and method for CVD equipment | |
| CN111334028B (en) | Anti-ultraviolet high-thermal-conductivity modified polyurethane composite film material and preparation method thereof | |
| CN105694034B (en) | Polyamic acid of flexible glue-free copper coated plate of high-dimensional stability and preparation method thereof | |
| CN106519694A (en) | Composite material with high performance and high thermal conductivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210907 |
|
| RJ01 | Rejection of invention patent application after publication |