CN113351956B

CN113351956B - High-light-efficiency low-thermal-resistance chip processing table for high-power LED outdoor lamp LED lamp

Info

Publication number: CN113351956B
Application number: CN202110645894.XA
Authority: CN
Inventors: 姜如友; 姜如银; 戴福军
Original assignee: Suzhou Lunke New Material Technology Co ltd
Current assignee: Suzhou Lunke New Material Technology Co ltd
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2022-08-16
Anticipated expiration: 2041-06-10
Also published as: CN113351956A

Abstract

The invention relates to a high-light-efficiency low-thermal-resistance high-power LED lamp chip processing table, which comprises a workbench, a welding seat arranged on the workbench, a movable plate which is vertically moved and arranged right above the welding seat and forms a chip clamping station with the welding seat, a storage bin and a feeding device, wherein the storage bin is positioned below the welding seat and is used for storing tin; the feeding assembly comprises a material containing bowl for containing tin, a stirring mechanism rotatably arranged in the material containing bowl and a feeding mechanism arranged in the stirring mechanism and capable of conveying soldering flux into the material containing bowl.

Description

High-light-efficiency low-thermal-resistance chip processing table for high-power LED outdoor lamp LED lamp

Technical Field

The invention relates to LED chip processing equipment, in particular to a chip processing table for an LED lamp of a high-light-efficiency low-thermal-resistance high-power LED outdoor lamp.

Background

The LED (Light Emitting Diode) has the advantages of energy saving, high efficiency, long service life and the like, so that the LED is bound to become a development trend in the future illumination field, when the LED works, only 30-40% of input electric energy is converted into Light energy finally, the rest 60-70% of energy is converted into heat energy mainly in a form of lattice vibration generated by non-radiative recombination, the heat is concentrated in a chip with a small size, the temperature of the chip is increased, and the non-uniform distribution of thermal stress, the luminous efficiency of the chip and the laser emission efficiency of fluorescent powder are reduced; when the temperature exceeds a certain value, the failure rate of the device is increased exponentially, statistical data show that the reliability is reduced by 10% when the temperature of the element rises by 2 ℃, generally speaking, whether the work of the LED lamp is stable or not and whether the quality of the LED lamp is good or bad are important for heat dissipation of the welding quality of the lamp body and the chip.

The invention patent with Chinese patent application number 201710880568.0 discloses a LED chip soldering device, which comprises a soldering chuck, wherein the soldering chuck consists of an upper chuck and a lower chuck, a clamping cylinder is connected between the upper chuck and the lower chuck, an electric heating plate is arranged on the inner side surface of the upper chuck, and an electric heating wire is embedded in the electric heating plate; the inner side surface of the lower chuck is provided with a welding table, the middle part of the welding table is provided with a tin outlet, a tin storage cavity communicated with the tin outlet is arranged in the lower chuck, the bottom of the tin storage cavity is paved with heating wires, an arc-shaped metal cover plate is arranged in the tin storage cavity, the arc-shaped metal cover plate is buckled in the tin storage cavity to divide the tin storage cavity into an upper tin storage cavity and a lower tin storage cavity, and the arc-shaped metal cover plate is provided with a hole for keeping the upper tin storage cavity and the lower tin storage cavity communicated; be equipped with the mounting hole on the welding bench, be equipped with the fore-set in the mounting hole, the mounting hole internal fixation has the spring, and the fore-set passes the spring and stretches into and store up tin intracavity and correspond with arc metal cover plate's surface. The device has the advantages that the device can supply tin in a molten state in a limited amount at any time, and is not easy to cause waste.

However, when the device is used, the solder is difficult to adhere to the welding point, and the chip welding quality is further influenced.

Disclosure of Invention

Aiming at the problems, the invention provides a chip processing table for an LED lamp of a high-light-efficiency low-thermal-resistance high-power LED outdoor lamp, wherein a pumping component is pumped to tin in a material conveying channel by a material containing bowl and is conveyed to a welding spot of the chip, in the process of conveying the tin by the material containing bowl, soldering flux enters the material containing bowl through a feeding mechanism, and the soldering flux is uniformly stirred with the tin under the action of a stirring mechanism, so that the tin can be quickly attached to the welding spot, and the technical problem that the welding quality is reduced because the welding spot is not easy to attach the tin in the prior art is solved.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a high light efficiency low thermal resistance high-power LED outdoor lamp chip processing platform for LED lamp, is in including workstation, setting welding seat on the workstation and reciprocate the setting and be in just forming the movable plate of chip clamping station with this welding seat directly over the welding seat, still include:

the storage bin is positioned below the welding seat and is used for storing tin;

the feeding device comprises a feeding channel, a pumping component and a feeding component, wherein the feeding channel penetrates through the welding seat and extends downwards into the storage bin, the pumping component is arranged in the feeding channel and can pump tin in the storage bin into the feeding channel, and the feeding component is installed on the pumping component and can pump the tin in the feeding channel to a welding point of a chip;

the feeding assembly comprises a material containing bowl for containing tin, a stirring mechanism rotatably installed in the material containing bowl and a feeding mechanism arranged in the stirring mechanism and capable of conveying soldering flux into the material containing bowl.

As an improvement, the pumping assembly comprises an installation seat a coaxially and fixedly installed in the feeding channel, an installation seat b arranged in the feeding channel in a vertically sliding mode and located above the installation seat a, two groups of rotating plates respectively installed above the installation seat a and the installation seat b in a rotating mode, and a power assembly driving the installation seat a above the installation seat a to move up and down.

As an improvement, the two groups of rotating plates are arranged in an upward rotatable mode, and the two groups of rotating plates rotate alternately along with the up-and-down movement of the mounting seat b.

As an improvement, the power assembly comprises a power mechanism a driving the mounting seat b to move up and down and a power mechanism b dynamically connecting the moving plate and the power mechanism a.

As an improvement, the power mechanism a comprises a fixed frame fixedly installed below the installation seat b, a rotating seat coaxially and rotatably installed on the feeding channel, and a screw driving assembly in power connection with the fixed frame and the rotating seat.

As an improvement, the power mechanism b comprises a movable column which is elastically arranged on the welding seat in a sliding manner up and down and can be abutted against the movable plate, a contact plate which is arranged at the bottom of the movable column and is provided with an oblique opening, and a gear rack transmission assembly which is in power connection with the contact plate and the rotating seat.

As an improvement, the feeding assembly further comprises a vertical rod fixedly mounted on the rotating plate above, an upper elastic sliding sleeve and a lower elastic sliding sleeve, wherein the vertical rod is arranged on the rotating plate, the upper elastic sliding sleeve and the lower elastic sliding sleeve are sleeved on the vertical rod and used for mounting a sliding sleeve of the material containing bowl, the limiting plate a is fixedly mounted on the outer side of the sliding sleeve, and the limiting plate b is fixedly mounted in the feeding channel and can be abutted to the limiting plate a.

As an improvement, the rabbling mechanism is including rotating to be installed rotating turret in the material bowl of flourishing, setting are in a plurality of groups lug on the rotating turret, with rotating turret fixed connection and setting are in rotating the cover in the slip cover, seting up rotating the helicla flute and the straight line groove that the cover is inside and upper and lower transitional coupling set up, fixed mounting be the montant top just can insert gag lever post and fixed mounting in rotating the cover can just follow the gag lever post side the guide bar that the helicla flute removed.

As the improvement, reinforced mechanism is installed including rotating the cover top and steerable it opens and close shrouding, the drive to rotate the cover shrouding pivoted gear drive subassembly, vertical seting up just communicate in the gag lever post rotate the cover with the passageway a of sliding sleeve, set up the sliding sleeve lateral wall with passageway b in the limiting plate a, set up in the limiting plate b and with passageway c and the control that passageway b can communicate the setting passageway b with the butt joint unit of passageway c break-make.

As an improvement, the butt joint unit is including setting up on the limiting plate a and with sleeve an, the upper and lower elastic sliding that passageway b communicates set up the baffle of this sleeve an break-make of control in the sleeve an, set up and be in on the limiting plate b and with sleeve b, the edge of passageway c intercommunication sleeve b axial elasticity cover is established sleeve b bottom and with the closing cap that the baffle can conflict and set up, set up through-hole an on the closing cap side and set up sleeve b lateral wall and with through-hole a can communicate the through-hole b that sets up.

The invention has the beneficial effects that:

(1) in the process that the material containing bowl sends tin in the feeding channel to be in contact with the welding spots of the chip, the sealing plate rotates to enable the soldering flux to smoothly enter the material containing bowl, and meanwhile, the soldering flux and the tin are uniformly mixed by the stirring mechanism, so that the tin can be quickly attached to the welding spots, the welding efficiency is improved, and the welding spots are full;

(2) according to the invention, the mounting seat b moves up and down, the two groups of rotating plates are matched to enable molten tin to enter the feeding channel from the storage bin, and meanwhile, in the process of moving up the mounting seat b, the material containing bowl can contain the tin in the feeding channel and send the tin to the welding spot of the chip on the welding seat, so that the tin can be quickly and accurately sent to the welding spot, and the welding efficiency can be improved while tin waste is reduced;

(3) when the movable plate moves downwards to be matched with the welding seat for clamping, the movable plate and the welding seat can fix a chip on the welding table, and the movable plate is abutted against a movable column in the power mechanism b, so that the movable column drives the power mechanism a to act through the gear rack transmission assembly, the tin can be conveyed and welding of welding spots can be realized, and the tin soldering efficiency of the chip is further improved.

In conclusion, the invention has the advantages of simple structure, ingenious design, high soldering efficiency, good soldering effect and the like, and is particularly suitable for soldering of LED chips.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a cross-sectional view of the table;

FIG. 3 is a first diagram illustrating the working status of the pumping device;

FIG. 4 is a second diagram illustrating the working status of the pumping device;

FIG. 5 is a schematic view of a feed assembly mechanism;

FIG. 6 is an enlarged view taken at A in FIG. 5;

FIG. 7 is an enlarged view of FIG. 5 at B;

FIG. 8 is a first structural schematic diagram of the feeding mechanism;

FIG. 9 is a schematic view of the inner structure of the rotating sleeve;

FIG. 10 is a schematic view of the structure of the charging mechanism, FIG. two;

FIG. 11 is an enlarged view at C of FIG. 10;

FIG. 12 is a schematic view of the structure of the charging mechanism, FIG. two;

FIG. 13 is a first schematic view of the docking unit;

fig. 14 is a structural schematic diagram of the docking unit shown in fig. two.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Examples

As shown in fig. 1 and fig. 2, a chip processing table for an LED lamp of a high-light-efficiency low-thermal-resistance high-power LED outdoor lamp comprises a worktable 1, a welding seat 2 arranged on the worktable 1, and a moving plate 3 which is arranged right above the welding seat 2 and forms a chip clamping station with the welding seat 2 in an up-and-down moving manner, and is characterized by further comprising:

the storage bin 4 is positioned below the welding seat 2, and the storage bin 4 is used for storing tin;

the feeding device 5 comprises a feeding channel 51 penetrating through the welding seat 2 and extending downwards into the storage bin 4, a pumping assembly 52 arranged in the feeding channel 51 and capable of pumping tin in the storage bin 4 into the feeding channel 51, and a feeding assembly 53 mounted on the pumping assembly 52 and capable of feeding tin in the feeding channel 51 to a chip welding point;

the feeding assembly 53 comprises a material containing bowl 531 for containing tin, a stirring mechanism 532 rotatably mounted in the material containing bowl 531, and a feeding mechanism 533 which is arranged in the stirring mechanism 532 and can convey soldering flux into the material containing bowl 531.

The moving plate 3 is driven by an air cylinder to move up and down.

It should be noted that the electric heating wires are arranged around the feeding channel 2 and the storage bin 4, so that the tin is always kept in a molten state.

It is worth mentioning that the storage bin 4 is in communication with an external tin providing device, and the storage amount of tin in the storage bin 4 is sufficient.

Further, as shown in fig. 3 and 4, the pumping assembly 52 includes an installation seat a521 coaxially and fixedly installed in the feeding channel 51, an installation seat b522 vertically slidably disposed in the feeding channel 51 and located above the installation seat a521, two sets of rotating plates 523 rotatably installed above the installation seat a521 and the installation seat b522, and a power assembly 524 for driving the installation seat a521 above to move up and down.

It should be noted that the mounting seat a521 and the mounting seat b522 divide the feeding channel 51 into three sections, which are respectively a storage section 5111, a temporary storage section 512 and a conveying section 513 from top to bottom, the conveying section 513 is arranged below the mounting seat a521, the temporary storage section 512 is arranged between the mounting seat a521 and the mounting seat b522, and the storage section 5111 is arranged above the mounting seat b 522.

Further, the two sets of the rotating plates 523 are both arranged to rotate upward, and the two sets of the rotating plates 523 rotate alternately along with the up-and-down movement of the mounting seat b 522.

Further, as shown in fig. 2 to 5, the power assembly 524 includes a power mechanism a5241 for driving the mounting seat b522 to move up and down, and a power mechanism b5242 for dynamically connecting the moving plate 3 and the power mechanism a 5241.

Further, the power mechanism a5241 comprises a fixed frame 52411 fixedly installed below the installation seat b522, a rotating seat 52412 coaxially and rotatably installed on the feeding channel 5, and a screw driving assembly 52413 in power connection with the fixed frame 52411 and the rotating seat 52412.

Further, the power mechanism b5242 includes a moving column 52421 elastically slidably disposed on the welding seat 2 up and down and capable of abutting against the moving plate 3, a contact plate 52422 mounted at the bottom of the moving column 52421 and having an inclined opening, and a rack and pinion transmission assembly 52423 dynamically connecting the contact plate 52422 and the rotating seat 52412.

It should be noted that the screw driving assembly 52413 includes a screw 52414 coaxially fixed with the fixed frame 52411 and a nut disposed on the rotating seat 52412 and threadedly engaged with the screw.

It should be further noted that the gear transmission assembly 52423 includes a gear a52424 coaxially fixed outside the rotating seat 52412 and a rack 52425 transversely slidably disposed and meshably engaged with the gear 52424.

It should be further noted that a chip is placed on the soldering base 2, the moving plate 3 moves downward to cooperate with the soldering base 2 to fix the chip, meanwhile, the moving plate 3 abuts against the moving column 52421, the moving column 52421 moves downward with the contact plate 52422, the contact plate 42422 pushes the rack 52425 to cooperate with the gear a52424, and then the rotating base 52412 rotates to drive the screw 52414 to move upward and downward, and further the mounting base b522 can move upward and downward.

It is important to note that, as shown in fig. 3 and 4, when the mounting seat b522 moves upward, the rotating plate 523 on the mounting seat b522 seals the mounting seat b522, and the rotating plate 523 on the mounting seat a521 rotates to open the mounting seat a521, so that the molten tin can pass through the conveying section 513 from the storage bin 4 to enter the temporary storage section 512; when the mounting seat b522 moves downwards, the rotating plate 523 on the mounting seat b522 rotates to open the mounting seat b522, the rotating plate 523 on the mounting seat a521 seals the mounting seat a521, and then tin in the temporary storage section 512 enters the storage section 511.

It is worth mentioning that when the mounting post 6421 moves downward, the mounting seat b522 moves upward; when the mounting post 6421 moves upward and returns, the mounting seat b522 moves downward.

Further, as shown in fig. 5, the feeding assembly 53 further includes a vertical rod 534 fixedly installed on the rotating plate 523, a sliding sleeve 535 which is elastically sleeved on the vertical rod 534 and is used for installing the material containing bowl 531, a limiting plate a536 fixedly installed outside the sliding sleeve 535, and a limiting plate b537 which is fixedly installed in the feeding channel 51 and is abutted against the limiting plate a 536.

It should be noted that when the mounting seat b522 moves downward, the material containing bowl 531 is immersed in tin to contain tin; when the mounting seat b522 moves upwards, the limiting plate a536 collides with the limiting plate b537, the material containing bowl 531 carries tin to move upwards to contact with a welding point, and the mounting seat b522 and the vertical rod 534 can continue to move upwards.

It should be noted that the material containing bowl 531 can control the amount of tin more accurately, and waste can be reduced.

Further, as shown in fig. 5 to 11, the stirring mechanism 532 includes a rotating frame 5321 rotatably installed in the material containing bowl 531, a plurality of sets of protrusions 5322 disposed on the rotating frame 5321, a rotating sleeve 5323 fixedly connected to the rotating frame 5321 and disposed in the sliding sleeve 535, a spiral groove 5324 and a linear groove 5327 provided in the rotating sleeve 5323 and connected in a vertical transition manner, a limiting rod 5325 fixedly installed at the top end of the vertical rod 534 and insertable into the rotating sleeve 5323, and a guide rod 5326 fixedly installed at the side of the limiting rod 5325 and movable along the spiral groove 5324.

It should be noted that the vertical rod 534 continuously moves upwards, so that the guide rod 5326 firstly moves along the linear groove 5327, and then the guide rod 5326 moves along the spiral groove 5324, so that the rotating sleeve 5323 rotates, and the rotating rack 5321 rotates in the material containing bowl 531.

Further, as shown in fig. 8, 12, 13 and 14, the feeding mechanism 533 includes a sealing plate 5331 rotatably mounted on the top of the rotating sleeve 5323 and capable of controlling the opening and closing of the rotating sleeve 5323, a gear transmission assembly 5332 driving the sealing plate 5331 to rotate, a channel a5333 vertically arranged in the limiting rod 5325 and communicating the rotating sleeve 5323 with the sliding sleeve 535, a channel b5334 arranged in the side wall of the sliding sleeve 535 and the limiting plate a536, a channel c5335 arranged in the limiting plate b537 and capable of communicating with the channel b5334, and a docking unit 5336 controlling the opening and closing of the channel b5334 and the channel c 5335.

It should be noted that when the rotating sleeve 5323 and the rotating frame 5321 rotate, under the action of the gear transmission assembly 5332, the sealing plate 5331 rotates to open the rotating sleeve 5323, the soldering flux enters the material containing bowl 531 through the rotating sleeve 5323, and the rotating frame 5321 and the protruding block 5322 uniformly mix the tin and the soldering flux in the material containing bowl 531.

It should be further noted that, in the process of opening the rotating sleeve 5323, the vertical rod 534 moves upward to compress the space inside the rotating sleeve 5323, so that the material in the material containing bowl 531 does not flow into the rotating sleeve 5323.

It is worth mentioning that the gear assembly 5332 comprises an annular rack 53321 annularly arranged in the material containing bowl 531 and a gear b53322 for power connecting the annular rack 53321 and the sealing plate 5331.

Further, the docking unit 5336 includes a sleeve a53361 disposed on the position-limiting plate a536 and communicating with the channel b5334, a baffle 53362 disposed in the sleeve a53361 in a vertically elastic sliding manner for controlling the on-off of the sleeve a53361, a sleeve b53363 disposed on the position-limiting plate b537 and communicating with the channel c5335, a cover 53364 elastically sleeved at the bottom of the sleeve b53363 in an axial direction of the sleeve b53363 and abutting against the baffle 53362, a through hole 53365 disposed on a side edge of the cover 364, and a through hole b53367 disposed on a side wall of the sleeve b53363 and communicating with the through hole a 53365.

It should be noted that when the limiting plate a536 collides with the limiting plate b537, the sleeve b53363 extends into the sleeve a53361, the sealing cover 53364 collides with the baffle 53362, the baffle 53362 is compressed to a position below the sleeve a53361 so that the sleeve a53361 is in a smooth state, then the sealing cover 53364 moves until the sealing cover 53364 collides with the sleeve b53363, at this time, the through hole a53365 is communicated with the through hole b53367, so that the sleeve a53361 is communicated with the sleeve b53363, and further, the soldering flux can enter the sliding sleeve 535 through the channel c5335 and the channel b5334, and then enter the rotating sleeve 5323 through the channel a5333, so that the soldering flux can be continuously supplied.

It should be noted that the position of the limit plates a536 and b537 does not interfere with the rotation of the rotating plate 523 on the mounting seat b 522.

Working process

The chip is placed on the welding seat 2, the movable plate 3 and the welding seat 2 are close to fix the chip, meanwhile, tin in the storage bin 4 is pumped to the feeding channel 51 through the transmission of the power mechanism b642 and the power mechanism a641, meanwhile, in the process that the pumping assembly 52 moves upwards, the material containing bowl 531 contains tin and sends tin to contact with welding spots of the chip, the feeding mechanism 533 sends soldering flux to the material containing bowl 531, and the stirring mechanism 532 evenly mixes the tin in the material containing bowl 531 with the soldering flux.

Claims

1. The utility model provides a high light efficiency low thermal resistance high power LED outdoor lamp chip processing platform for LED lamp, is in including workstation (1), setting welding seat (2) on workstation (1) and reciprocate the setting and be in directly over welding seat (2) and with this welding seat (2) movable plate (3) that form chip clamping station, its characterized in that still includes:

the storage bin (4), the storage bin (4) is positioned below the welding seat (2), and the storage bin (4) is used for storing tin;

the feeding device (5) comprises a feeding channel (51) penetrating through the welding seat (2) and extending downwards into the storage bin (4), a pumping assembly (52) arranged in the feeding channel (51) and capable of pumping tin in the storage bin (4) into the feeding channel (51), and a feeding assembly (53) installed on the pumping assembly (52) and capable of feeding tin in the feeding channel (51) to a chip welding point;

the feeding assembly (53) comprises a material containing bowl (531) for containing tin, a stirring mechanism (532) rotatably installed in the material containing bowl (531) and a feeding mechanism (533) arranged in the stirring mechanism (532) and capable of conveying soldering flux into the material containing bowl (531).

2. The chip processing table for the LED lamp of the high-luminous-efficiency low-thermal-resistance high-power LED outdoor lamp according to claim 1, wherein the pumping assembly (52) comprises an installation seat a (521) coaxially and fixedly installed in the feeding channel (51), an installation seat b (522) which is arranged in the feeding channel (51) in a vertically sliding mode and located above the installation seat a (521), two groups of rotating plates (523) which are respectively installed above the installation seat a (521) and the installation seat b (522) in a rotating mode, and a power assembly (524) which drives the installation seat a (521) above to move up and down.

3. The chip processing table for the LED lamp of the high-luminous-efficiency low-thermal-resistance high-power LED outdoor lamp as claimed in claim 2, wherein the two sets of the rotating plates (523) are both arranged to rotate upwards, and the two sets of the rotating plates (523) rotate alternately along with the up-and-down movement of the mounting seat b (522).

4. The LED lamp chip processing table of the high-light-efficiency low-heat-resistance high-power LED outdoor lamp as claimed in claim 3, wherein the power assembly (524) comprises a power mechanism a (5241) driving the mounting seat b (522) to move up and down and a power mechanism b (5242) dynamically connecting the moving plate (3) and the power mechanism a (5241).

5. The LED lamp chip processing table of the high-light-efficiency low-heat-resistance high-power LED outdoor lamp is characterized in that the power mechanism a (5241) comprises a fixed frame (52411) fixedly arranged below the mounting seat b (522), a rotating seat (52412) coaxially and rotatably arranged on the feeding channel (51), and a screw rod driving assembly (52413) for dynamically connecting the fixed frame (52411) and the rotating seat (52412).

6. The LED lamp chip processing table of the high-luminous-efficiency low-thermal-resistance high-power LED outdoor lamp of claim 5, wherein the power mechanism b (5242) comprises a moving column (52421) which is elastically and slidably arranged on the welding seat (2) up and down and can be abutted against the moving plate (3), a contact plate (52422) which is arranged at the bottom of the moving column (52421) and is provided with an inclined opening, and a gear-rack transmission assembly (52423) which is in power connection with the contact plate (52422) and the rotating seat (52412).

7. The LED lamp chip processing table with high luminous efficiency and low thermal resistance for the high-power LED outdoor lamp of claim 2, wherein the feeding assembly (53) further comprises a vertical rod (534) fixedly installed on the rotating plate (523) above, a sliding sleeve (535) which is sleeved on the vertical rod (534) and used for installing the material containing bowl (531), a limiting plate a (536) fixedly installed on the outer side of the sliding sleeve (535), and a limiting plate b (537) fixedly installed in the feeding channel (51) and capable of abutting against the limiting plate a (536).

8. The chip processing table for the LED lamp of the high-light-efficiency low-heat-resistance high-power LED outdoor lamp as claimed in claim 7, wherein the stirring mechanism (532) comprises a rotating frame (5321) rotatably mounted in the material containing bowl (531), a plurality of groups of bumps (5322) arranged on the rotating frame (5321), a rotating sleeve (5323) fixedly connected with the rotating frame (5321) and arranged in the sliding sleeve (535), a spiral groove (5324) and a linear groove (5327) which are arranged in the rotating sleeve (5323) and are in up-down transition connection, a limiting rod (5325) fixedly mounted at the top end of the vertical rod (534) and can be inserted into the rotating sleeve (5323), and a guide rod (5326) fixedly mounted on the side surface of the limiting rod (5325) and can move along the spiral groove (5324).

9. The LED lamp chip processing table of claim 8, wherein the feeding mechanism (533) comprises a sealing plate (5331) rotatably mounted on the top of the rotating sleeve (5323) and capable of controlling the rotating sleeve (5323) to open and close, a gear transmission assembly (5332) driving the sealing plate (5331) to rotate, a channel a (5333) vertically arranged in the limiting rod (5325) and communicating the rotating sleeve (5323) with the sliding sleeve (535), a channel b (5334) arranged in the side wall of the sliding sleeve (535) and the limiting plate a (536), a channel c (5335) arranged in the limiting plate b (537) and capable of communicating with the channel b (5334), and a docking unit (5336) controlling the on and off of the channel b (5334) and the channel c (5335).

10. The chip processing table for the LED lamp of the high-light-efficiency low-heat-resistance high-power LED outdoor lamp according to claim 9, the butting unit (5336) is characterized by comprising a sleeve a (53361) which is arranged on the limit plate a (536) and communicated with the channel b (5334), a baffle plate (53362) which is arranged in the sleeve a (53361) in a vertically elastic sliding manner and used for controlling the on-off of the sleeve a (53361), a sleeve b (53363) which is arranged on the limit plate b (537) and communicated with the channel c (5335), a sealing cover (53364) which is elastically sleeved at the bottom of the sleeve b (53363) along the axial direction of the sleeve b (53363) and can be in interference with the baffle plate (53362), a through hole a (53365) which is formed in the side edge of the sealing cover (53364), and a through hole b (53367) which is formed in the side wall of the sleeve b (53363) and can be communicated with the through hole a (53365).