CN113348559A - OLED display panel, manufacturing method thereof and terminal equipment - Google Patents

OLED display panel, manufacturing method thereof and terminal equipment Download PDF

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Publication number
CN113348559A
CN113348559A CN201980079826.2A CN201980079826A CN113348559A CN 113348559 A CN113348559 A CN 113348559A CN 201980079826 A CN201980079826 A CN 201980079826A CN 113348559 A CN113348559 A CN 113348559A
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layer
retaining wall
oled display
pixel defining
region
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Chinese (zh)
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蔡武卫
罗浩俊
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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Abstract

The application discloses an OLED display panel, a manufacturing method thereof and terminal equipment. The OLED display panel (1) comprises a display area (3) and a non-display area (2), and comprises a substrate (100), an OLED display element layer (200) and an encapsulation layer (300) which are sequentially stacked; in the non-display area (2), the OLED display element layer (200) comprises a first retaining wall (10), a second retaining wall (20) and a filling layer (30), wherein the first retaining wall (10) is close to the display area (3) relative to the second retaining wall (20), and a first area (X) where the first retaining wall (10) is located is lower than a second area (Y) where the second retaining wall (20) is located; the filling layer (30) is arranged between the first retaining wall (10) and the second retaining wall (20). In the OLED display panel (1) of the embodiment of the application, the fracture risk of the metal routing formed on the packaging layer (300) later can be reduced.

Description

OLED display panel, manufacturing method thereof and terminal equipment Technical Field
The application relates to the technical field of display, in particular to an OLED display panel, a manufacturing method thereof and terminal equipment.
Background
Touch display screens are applied to more and more electronic products, such as smart phones, notebook computers and the like. In order to pursue an aesthetic appearance and an excellent user experience, the bezel width of the touch screen of these electronic products is required to be as narrow as possible.
However, when the conventional touch display screen pursues a narrow frame, because the frame is narrow, the surface of the functional layer of the non-display area corresponding to the frame has a large step, and metal wires from the display area to the non-display area on the display screen are very easy to break at the part of the non-display area, thereby causing failure of the touch screen.
Disclosure of Invention
The application provides an OLED display panel, a manufacturing method thereof and terminal equipment.
One embodiment of the present application provides an OLED display panel including a display region and a non-display region, and including a substrate, an OLED display element layer, and an encapsulation layer, which are sequentially stacked;
in the non-display area, the OLED display element layer comprises a first retaining wall, a second retaining wall and a filling layer, wherein the first retaining wall, the second retaining wall and the filling layer are adjacent to the packaging layer, the first retaining wall is closer to the display area relative to the second retaining wall, and a first area where the first retaining wall is located is lower than a second area where the second retaining wall is located; the filling layer is arranged between the first retaining wall and the second retaining wall.
Another embodiment of the present application provides a terminal device including the OLED display panel described above.
Yet another embodiment of the present application provides a method of manufacturing an OLED display panel including a display region and a non-display region, and including a substrate, an OLED display element layer, and an encapsulation layer, which are sequentially stacked, the method including the steps of:
forming the OLED display element layer on the substrate, so that a first retaining wall and a second retaining wall are formed in the non-display area, and a filling layer is formed between the first retaining wall and the second retaining wall, wherein the first retaining wall is closer to the display area relative to the second retaining wall, and a first area where the first retaining wall is located is lower than a second area where the second retaining wall is located;
and forming an encapsulation layer on the OLED display element layer, wherein the first retaining wall, the second retaining wall and the filling layer are covered by the encapsulation layer.
In the OLED display panel according to the embodiment of the present application, the filling layer is disposed between at least the first retaining wall and the second retaining wall of the non-display region, so that the fluctuation of the shape of the upper surface of the first retaining wall to the second retaining wall in the OLED display device layer is reduced, and a flat encapsulation layer can be formed above the first retaining wall and the second retaining wall, thereby reducing the risk of breaking the metal wiring formed on the encapsulation layer in the subsequent process.
By reducing the width of the first retaining wall and the second retaining wall and reducing the gap width between the first retaining wall and the second retaining wall, the OLED touch display screen can have a narrower frame, however, the smaller the gap width between the first retaining wall and the second retaining wall is, the larger the fluctuation of the upper surface between the first retaining wall and the second retaining wall in the OLED display element layer is, the larger the fluctuation of the surface of the encapsulation layer above the OLED touch display element layer is, and the electrode lead on the surface of the encapsulation layer is easily broken. This application is through setting up the filling layer between first barricade and second barricade, when touch panel sets up on this encapsulation layer, can greatly reduced the cracked risk of touch panel's that sets up electrode lead wire on the corresponding position of encapsulation layer, from this, can reduce first barricade, second barricade and the width in clearance between first barricade and the second barricade to realize that OLED touch display screen has narrower frame, give the user experience that extremely sends.
Drawings
In order to more clearly explain the technical solutions of the present application, the drawings needed to be used in the embodiments are briefly introduced below, and it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope of protection of the present application.
Fig. 1 shows an overall schematic view of an OLED display panel.
Fig. 2 illustrates an exemplary cross-sectional view a-a' in the non-display area of the OLED display panel of fig. 1.
FIG. 3 illustrates another exemplary cross-sectional view A-A' in the non-display area of the OLED display panel of FIG. 1.
Fig. 4 shows an exemplary schematic top view of the encapsulation layer of region B of fig. 1.
FIG. 5 illustrates yet another exemplary cross-sectional view A-A' in the non-display area of the OLED display panel of FIG. 1.
Fig. 6 illustrates a further exemplary cross-sectional view a-a' in the non-display area of the OLED display panel of fig. 1.
Fig. 7 shows another exemplary top view schematic diagram of the encapsulation layer of region B of fig. 1.
Fig. 8A to 8I are schematic views illustrating a method of manufacturing an OLED display panel according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
Hereinafter, the terms "including", "having", and their derivatives, which may be used in various embodiments of the present application, are intended to indicate only specific features, numbers, steps, operations, elements, components, or combinations of the foregoing, and should not be construed as first excluding the existence of, or adding to, one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the present application belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments.
Fig. 1 illustrates an exemplary OLED display panel provided in an embodiment of the present application. The OLED display panel 1 includes a non-display area 2 and a display area 3. The non-display area 2 corresponds to a bezel area of the OLED display panel 1. The technical scheme of the application can be suitable for OLED touch screens, AMOLED touch screens, PMOLED touch screens and the like.
Fig. 2 shows a schematic cross-sectional view a-a' in the non-display region 2 of the OLED display panel shown in fig. 1. The OLED display panel 1 includes a substrate 100, an OLED display element layer 200, and an encapsulation layer 300, which are sequentially stacked. The substrate 100 may be, for example, a rigid substrate or a flexible substrate. The flexible substrate can adopt high molecular polymer, metal thin sheet and ultra-thin glass. The encapsulation layer 300 is used to ensure good sealing performance with respect to the OLED display element layer 200, and reduce contact between the OLED display element layer 200 and oxygen and moisture in the external environment as much as possible. The structure of the OLED display element layer 200 in the display region 3 will not be described in detail here.
In the non-display region 2, the OLED display element layer 200 includes a first barrier wall 10 adjacent to the encapsulation layer 300, a second barrier wall 20, and a filling layer 30. In other words, the OLED display device layer 200 is provided with the first retaining wall 10, the second retaining wall 20 and the filling layer 30 on a side close to the encapsulation layer 300. The first retaining wall 10 is closer to the display area 3 than the second retaining wall 20. The first area X where the first retaining wall 10 is located is lower than the second area Y where the second retaining wall 20 is located, in other words, the surface where the bottom of the first retaining wall 10 is located is lower than the surface where the bottom of the second retaining wall 20 is located. A filling layer 30 is disposed between the first retaining wall 10 and the second retaining wall 20. The filling layer 30 includes a first portion corresponding to the first region X and a second portion corresponding to the second region Y, and the first portion and the second portion form an inclined transition surface therebetween.
The extending direction of each retaining wall is parallel to the edge of the display screen, namely, the retaining walls are parallel to each other. Although only the first and second areas X and Y adjacent to each other are shown in fig. 2, it is apparent that the non-display area 2 may include other areas than the first and second areas X and Y, and the same applies to other embodiments.
The first bank 10 may include a first pixel defining layer 11 and a first photo spacer 12 disposed on the first pixel defining layer 11. The second blocking wall 20 may include a second pixel defining layer 21 and a second photo spacer 22 disposed on the second pixel defining layer 21. The filling layer 30 between the first barrier wall 10 and the second barrier wall 20 is located between each pixel defining layer and each photo spacer. The height of the first portion of the filling layer 30 is higher than the height of the first pixel defining layer 11 at the first region X, and the height of the second portion of the filling layer 30 is higher than the height of the second pixel defining layer 21 at the second region Y.
As an illustrative example, as shown in fig. 3, the OLED display element layer 200 may further include an insulating layer 210, a source-drain layer 220, a planarization layer 230, and a pixel electrode layer 240 laminated on the substrate 100. The first retaining wall 10 includes a pixel electrode layer 240, a source drain layer 220 and an insulating layer 210 in sequence below. The second barrier wall 20 sequentially includes a pixel electrode layer 240, a planarization layer 230, a source drain layer 220 and an insulating layer 210. A portion of the second barrier wall 20 is directly stacked on the pixel electrode layer 240, and another portion is directly stacked on the planarization layer 230.
As shown in fig. 2 and 3, if the filling layer 30 is not provided, the upper surface of the OLED display device layer 200 in the region from the first wall 10 to the second wall 20 has a large undulation. By providing a filling layer 30 between the first retaining wall 10 and the second retaining wall 20, the undulation of the upper surface is significantly reduced. Although the top surface of the filling layer 30 is not completely horizontal as shown in the figure, there is a slight step, but the slight step does not affect the subsequent processes. The filling layer 30 is preferably formed using an organic photoresist. The organic photoresist is preferably at least one of polymethyl methacrylate and polyimide.
As shown in fig. 3, in the first region X, a third pixel defining layer 41 and a cathode 50 may be further included. The third pixel defining layer 41 and the cathode electrode 50 may be formed on the pixel electrode layer 240.
Fig. 4 shows an exemplary schematic top view of the encapsulation layer of region B of fig. 1. The OLED display panel 1 may further include a touch function layer having touch electrode leads disposed on the encapsulation layer 300, and the electrode leads may be disposed on the encapsulation layer 300 and cross the respective dam and filling layers 30 in a plan view. As shown in fig. 4, a plurality of touch electrode leads 70 may be disposed on the package layer 300, or other metal traces may be disposed. A first barrier wall 10 formed by a first photosensitive spacer 12 and a first pixel definition layer 11 is arranged below the packaging layer 300; a second barrier 20 composed of a second photo spacer 22 and a second pixel defining layer 21 is also provided. The touch electrode lead 70 is led from the display area 3 to the non-display area 2, and passes through the region corresponding to the third pixel defining layer 41, the first barrier wall 10, the filling layer 30 and the second barrier wall 20 on the encapsulation layer 300 of the non-display area 2. In a top view, the touch electrode lead 70 crosses the first wall 10 and the second wall 20, for example, vertically.
Due to the filling layer 30, the fluctuation of the upper surface of the region from the first wall 10 to the second wall 20 in the OLED display device layer 200 is significantly reduced, and therefore, even though the widths of the first wall 10 and the second wall 20 and the gap width between the walls are reduced, the corresponding position of the encapsulation layer 300 between the first wall 10 and the second wall 20 is not prone to have a large step, and thus, the continuous touch electrode lead 70 is easily formed at the corresponding position on the encapsulation layer 300 without the occurrence of a wire break.
In a preferred embodiment, as shown in fig. 5, the non-display area 2 further includes a third retaining wall 40, the third retaining wall 40 is located in the first area X and the third retaining wall 40 is closer to the display area 3 than the first retaining wall 10. The third bank 40 may define a layer 41 for the third pixel. The filling layer 30 may be further disposed between the first retaining wall 10 and the third retaining wall 40, that is, between the first pixel defining layer 11 and the third pixel defining layer 41, so as to reduce the fluctuation range of the upper surface of the region from the first retaining wall 10 to the third retaining wall 40 in the OLED display element layer 200, thereby improving the flatness of the encapsulation layer 300 at the corresponding position and reducing the risk of wire breakage of the metal trace at the corresponding position.
In a more preferred embodiment, as shown in fig. 6, a third retaining wall 40 is further included in the non-display area 2, which is different from the embodiment of fig. 5: the third blocking wall 40 includes a third pixel defining layer 41 and a third photo spacer 42 disposed on the third pixel defining layer 41. Therefore, the height of the filling layer 30 between the first wall 10 and the third wall 40 and the height between the first wall 10 and the second wall 20 can be substantially the same, so that the variation range of the upper surface undulations of the region of the first wall 10 to the third wall 40 and the region of the first wall 10 to the second wall 20 can be substantially ignored, thereby further improving the flatness of the encapsulating layer 300 at the corresponding position.
As shown in fig. 5 and 6, the OLED display element layer 200 may further include an insulating layer 210, a source-drain layer 220, a planarization layer 230, and a pixel electrode layer 240 laminated on the substrate 100. The third retaining wall 40 sequentially includes a pixel electrode layer 240, a source drain layer 220 and an insulating layer 210 thereunder. As shown in fig. 7, the touch electrode lead 70 disposed on the package layer 300 is led from the display area 3 to the non-display area 2, and passes through each retaining wall and the corresponding region of the filling layer between the retaining walls on the package layer 300 of the non-display area 2. In a top view, the touch electrode leads 70 intersect each of the barriers, for example, may intersect vertically.
The OLED display panel can be applied to various terminal devices, such as smart phones, tablet computers, notebook computers and the like.
Embodiments of the present application provide a method of manufacturing an OLED display panel including a display region and a non-display region, and including a substrate, an OLED display element layer, and an encapsulation layer, which are sequentially stacked, the method including the steps of:
step S100: and forming an OLED display element layer on the substrate, so that a first retaining wall and a second retaining wall are formed in the non-display area, and a filling layer is formed between the first retaining wall and the second retaining wall, wherein the first retaining wall is closer to the display area relative to the second retaining wall, and a first area where the first retaining wall is located is lower than a second area where the second retaining wall is located. After the OLED display element layer is formed, the first retaining wall and the second retaining wall are located on the side far away from the substrate in the OLED display element layer.
Step S200: and forming an encapsulation layer on the OLED display element layer, wherein the first retaining wall, the second retaining wall and the filling layer are covered by the encapsulation layer.
In one exemplary embodiment, the manufacturing method includes the steps of:
as shown in fig. 8A, in step S110, an insulating layer 210 is formed on the substrate 100.
As shown in fig. 8B, in step S120, a source-drain layer 220 is formed on the insulating layer 210.
As shown in fig. 8C, in step S130, a planarization layer 230 is formed on the source-drain layer 220 and the insulating layer 210 on the second region Y side.
As shown in fig. 8D, in step S140, a pixel electrode layer 240 is formed on the planarization layer 230 and on the source-drain layer 220 on the first region X side.
In step S150, a first barrier wall 10 is formed on the pixel electrode layer 240 in the first region X, a second barrier wall 20 is formed in the second region Y, a portion of the bottom of the second barrier wall 20 is disposed on the pixel electrode layer 240, and another portion of the bottom is disposed on the planarization layer 230.
For example, as shown in fig. 8E, in step S151, a pixel defining layer is formed, in which the first pixel defining layer 11 is formed in the first region X, the second pixel defining layer 21 is formed in the second region Y, a part of the bottom of the second pixel defining layer 21 is disposed on the pixel electrode layer 240, and another part of the bottom of the second pixel defining layer 21 is disposed on the planarization layer 230.
As shown in fig. 8F, in step S152, a photosensitive spacer is formed, wherein the first photosensitive spacer 12 is formed on the first pixel defining layer 11, and the second photosensitive spacer 22 is formed on the second pixel defining layer 21.
As shown in fig. 8G, in step S153, a filling layer is formed, wherein a filling layer 30 is formed between the first bank 10 formed by the first pixel defining layer 11 and the first photo spacers 12 and the second bank 20 formed by the second pixel defining layer 21 and the second photo spacers 22. The formed filling layer 30 includes a first portion corresponding to the first region X and a second portion corresponding to the second region Y, and the first portion and the second portion form an inclined transition surface therebetween. The height of the first portion of the filling layer 30 is higher than the height of the first pixel defining layer 11 at the first region X, and the height of the second portion of the filling layer 30 is higher than the height of the second pixel defining layer 21 at the second region Y. The filling layer 30 may be formed by spraying an organic photoresist between the first retaining wall 10 and the second retaining wall 20. The spray coating process may be, for example, a low-temperature organic resist ink jet printing process (ink-jet printing), and the dropping amount of the organic resist may be precisely controlled by applying a pulse voltage to a piezoelectric transducer on a nozzle. Moreover, the low-temperature organic photoresist ink-jet process can accurately limit the position of the organic photoresist, and has short processing time and low cost.
As shown in fig. 8H, in step S200, an encapsulation layer 300 is formed on the OLED display element layer 200.
In the above process, the filling layer 30 is formed between the first retaining wall 10 and the second retaining wall 20, so that a large offset existing between the top of the second retaining wall 20 and the surface of the pixel electrode layer 240 in the first region X and an offset existing between the top of the first retaining wall 10 and the surface of the pixel electrode layer 240 in the first region X are substantially eliminated, and the fluctuation of the upper surfaces of the first retaining wall 10 and the second retaining wall 20 in the OLED display device layer is small, so that the corresponding position on the encapsulation layer 300 is relatively flat, and the risk of metal trace breakage in the subsequent process is greatly reduced.
As an exemplary embodiment of the manufacturing method of the present application, the method further includes step S300: a touch function layer is formed on the encapsulation layer 300 such that the touch electrode leads 70 of the touch function layer are disposed on the encapsulation layer 300 and cross the respective dam and filling layers 30 in a plan view, as shown in fig. 8I and 4, in which only the touch electrode leads 70 of the touch function layer are shown.
As another exemplary embodiment of the manufacturing method of the present application, in step S100, a third retaining wall 40 is further formed, and a filling layer 30 is also formed between the first retaining wall 10 and the third retaining wall 40, where the third retaining wall 40 is closer to the display area than the first retaining wall 10; in step S200, when the encapsulating layer 300 is formed, the third retaining wall 40 and the filling layer 30 between the first retaining wall 10 and the third retaining wall 40 are also covered by the encapsulating layer 300. The third bank 40 may be constituted only by the third pixel defining layer 41 as shown in fig. 5, in which case the third pixel defining layer 41 is also formed on the right side of the first pixel defining layer 11 in step S151 shown in fig. 8E; the third bank 40 may also be constituted by the third pixel defining layer 41 and the third photosensitive spacer 42, as shown in fig. 6, in which case, in step S151 shown in fig. 8E, the third pixel defining layer 41 is also formed on the right side of the first pixel defining layer 11, and in the subsequent step S152, the third photosensitive spacer 42 is also formed on the third pixel defining layer 41.
As shown in fig. 5, when the third bank 40 is the third pixel defining layer 41, in the step S151, the third pixel defining layer 41 is further formed in the first region X, and the third pixel defining layer 41 is closer to the display region 3 than the first bank 10; then, in step 153, the filling layer 30 is also formed between the third bank 40 formed by the third pixel defining layer 41 and the first pixel defining layer 11. The filling layer 30 may be formed by spraying an organic photoresist between the first barrier wall 10 and the second barrier wall 20 using the above-mentioned spraying process, and specifically, an excess amount of the organic photoresist is sprayed between the first barrier wall 10 and the second barrier wall 20 so that the organic photoresist overflows the first barrier wall 10, thereby forming the filling layer 30 between the first pixel defining layer 11 and the third pixel defining layer 41.
As shown in fig. 6, when the third wall 40 includes the third pixel defining layer 41 and the third photo spacers 42, in step S151, the third pixel defining layer 41 is further formed in the first region X, and the third pixel defining layer is closer to the display region than the first wall; in the above step S152, the third photosensitive spacer 42 is also formed on the third pixel defining layer 41; then, in step 153, the filling layer 30 is also formed between the first bank 10 formed by the first pixel defining layer 11 and the first photosensitive spacer 12 and the third bank 40 formed by the third pixel defining layer 41 and the third photosensitive spacer 42. Similarly, an excess amount of organic photoresist may be sprayed between the first retaining wall 10 and the second retaining wall 20, so that the organic photoresist overflows the first retaining wall 10, thereby forming the filling layer 30 between the first retaining wall 10 and the third retaining wall 40.
In addition, an excessive amount of organic photoresist may be sprayed between the first retaining wall 10 and the third retaining wall 40, so that the organic photoresist overflows the first retaining wall 10, and the filling layer 30 is formed between the first retaining wall 10 and the third retaining wall 40 and between the first retaining wall 10 and the second retaining wall 20. In this case, the third banks 40 may have a height slightly higher than that of the first banks 10, for example, the third pixel defining layer 41 and/or the third photo spacers 42 may be made higher than the corresponding parts of the first banks 10 by a predetermined value.
In addition, as shown in fig. 5 and 6, after the third bank 40 is formed, the cathode 50 may be formed on the first region X before or after the filling layer 30 is formed. A portion of the cathode 50 is formed on the third bank 40, and another portion is formed on the pixel electrode layer 240 closer to the display region 3 than the third bank 40.
The method for preparing the OELD display panel does not need additional complex process procedures, and the organic filling layer is sprayed between the retaining walls, so that the surface fluctuation of the area where the retaining walls are located is reduced, the subsequent process procedures are facilitated, and the method can be used for hard or flexible display panels.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application.

Claims (22)

  1. An OLED display panel comprises a display area and a non-display area, and comprises a substrate, an OLED display element layer and an encapsulation layer which are sequentially stacked, wherein in the non-display area, the OLED display element layer comprises a first retaining wall, a second retaining wall and a filling layer, wherein the first retaining wall is close to the display area relative to the second retaining wall, and a first area where the first retaining wall is located is lower than a second area where the second retaining wall is located; the filling layer is arranged between the first retaining wall and the second retaining wall.
  2. The OLED display panel of claim 1, wherein the fill layer comprises a first portion corresponding to the first region and a second portion corresponding to the second region, and wherein the first portion and the second portion form an angled transition therebetween.
  3. The OLED display panel of claim 1, further comprising a touch functional layer disposed on the encapsulation layer and having touch electrode leads disposed on the encapsulation layer and crossing the respective dam walls and the filling layer in a plan view.
  4. The OLED display panel of claim 1, wherein each of the barriers comprises a pixel defining layer and a photo spacer disposed on the pixel defining layer.
  5. The OLED display panel of claim 4, wherein the filling layer comprises a first portion corresponding to the first region and a second portion corresponding to the second region, and wherein an inclined transition surface is formed between the first portion and the second portion;
    the first portion has a height higher than a height of the pixel defining layer at the first region, and the second portion has a height higher than a height of the pixel defining layer at the second region.
  6. The OLED display panel of claim 1, wherein the fill layer is formed of an organic photoresist.
  7. The OLED display panel according to claim 1, wherein the OLED display element layer further includes an insulating layer, a source drain layer, a planarization layer, and a pixel electrode layer laminated on the substrate;
    the pixel electrode layer, the source drain electrode layer and the insulating layer are sequentially arranged below the first retaining wall;
    the pixel electrode layer, the flat layer, the source drain layer and the insulating layer are sequentially arranged below the second barrier, one part of the second barrier is directly laminated on the pixel electrode layer, and the other part of the second barrier is directly laminated on the flat layer.
  8. The OLED display panel of claim 1, wherein in the non-display region, the OLED display element layer further comprises a third dam adjacent to the encapsulation layer, the third dam being located in the first region and closer to the display region than the first dam; the filling layer is further arranged between the first retaining wall and the third retaining wall.
  9. The OLED display panel of claim 8, wherein the first dam comprises a first pixel defining layer and a first photo spacer disposed on the first pixel defining layer; the third retaining wall is a third pixel defining layer; and a filling layer between the first retaining wall and the third retaining wall is arranged between the first pixel definition layer and the third pixel definition layer.
  10. The OLED display panel according to claim 9, wherein the OLED display element layer further includes an insulating layer, a source drain layer, a planarization layer, and a pixel electrode layer laminated on the substrate;
    the pixel electrode layer, the source drain electrode layer and the insulating layer are sequentially arranged below the third barrier wall.
  11. A terminal device, characterized by comprising an OLED display panel according to any one of claims 1 to 10.
  12. A method of manufacturing an OLED display panel including a display region and a non-display region, and including a substrate, an OLED display element layer, and an encapsulation layer, which are sequentially stacked, the method comprising the steps of:
    forming the OLED display element layer on the substrate, so that a first retaining wall and a second retaining wall are formed in the non-display area, and a filling layer is formed between the first retaining wall and the second retaining wall, wherein the first retaining wall is closer to the display area relative to the second retaining wall, and a first area where the first retaining wall is located is lower than a second area where the second retaining wall is located;
    and forming an encapsulation layer on the OLED display element layer, wherein the first retaining wall, the second retaining wall and the filling layer are covered by the encapsulation layer.
  13. The method of manufacturing an OLED display panel according to claim 12, wherein the filling layer is formed to include a first portion corresponding to the first region and a second portion corresponding to the second region, and an inclined transition surface is formed between the first portion and the second portion.
  14. The method of manufacturing an OLED display panel according to claim 12, further comprising:
    and forming a touch control functional layer on the packaging layer, so that a touch control electrode lead of the touch control functional layer is arranged on the packaging layer and is crossed with each retaining wall and the filling layer in a overlooking state.
  15. The method according to claim 12, wherein a third wall is further formed when the OLED display element layer is formed on the substrate, and a filling layer is also formed between the first wall and the third wall, wherein the third wall is closer to the display region than the first wall;
    when the packaging layer is formed, the third retaining wall and the filling layer between the first retaining wall and the third retaining wall are also covered by the packaging layer.
  16. The method of manufacturing an OLED display panel according to claim 12, wherein forming the OLED display element layer on the substrate includes:
    forming a pixel defining layer, wherein a first pixel defining layer is formed in the first region and a second pixel defining layer is formed in the second region;
    forming a photosensitive spacer, wherein a first photosensitive spacer is formed on the first pixel defining layer and a second photosensitive spacer is formed on the second pixel defining layer;
    and forming a filling layer, wherein the filling layer is formed between the first retaining wall formed by the first pixel defining layer and the first photosensitive spacer and the second retaining wall formed by the second pixel defining layer and the second photosensitive spacer.
  17. The method of manufacturing an OLED display panel according to claim 16,
    the formed filling layer comprises a first part corresponding to the first area and a second part corresponding to the second area, and an inclined transition surface is formed between the first part and the second part;
    the first portion has a height higher than that of the pixel defining layer of the OLED display element layer in a first region, and the second portion has a height higher than that of the pixel defining layer of the OLED display element layer in a second region.
  18. The method of manufacturing an OLED display panel according to claim 16,
    when the pixel defining layer is formed, a third pixel defining layer is further formed in the first area, and the third pixel defining layer is closer to the display area relative to the first retaining wall;
    when the filling layer is formed, the filling layer is also formed between the first pixel defining layer and a third barrier wall formed by the third pixel defining layer.
  19. The method of manufacturing an OLED display panel according to claim 16,
    when the pixel defining layer is formed, a third pixel defining layer is further formed in the first area, and the third pixel defining layer is closer to the display area relative to the first retaining wall;
    when forming a photosensitive spacer, forming a third photosensitive spacer on the third pixel defining layer;
    when the filling layer is formed, the filling layer is also formed between the first retaining wall formed by the first pixel defining layer and the first photosensitive spacer and the third retaining wall formed by the third pixel defining layer and the third photosensitive spacer.
  20. The method of manufacturing an OLED display panel according to claim 12, wherein the filling layer is formed of an organic photoresist.
  21. The method of manufacturing an OLED display panel according to claim 12, wherein the filling layer is formed by a spray coating process.
  22. The method of manufacturing an OLED display panel according to claim 12, wherein forming the OLED display element layer on the substrate includes:
    forming an insulating layer on the substrate;
    forming a source drain layer on the insulating layer;
    forming a flat layer on the source drain layer and the insulating layer on the second region side;
    forming a pixel electrode layer on the planarization layer and on the source drain layer on the first region side;
    the first retaining wall is formed on the pixel electrode layer in the first area, the second retaining wall is formed in the second area, wherein one part of the bottom of the second retaining wall is located on the pixel electrode layer, and the other part of the bottom is located on the flat layer.
CN201980079826.2A 2019-06-26 2019-06-26 OLED display panel, manufacturing method thereof and terminal equipment Pending CN113348559A (en)

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