CN113341349A - Switch cabinet contact monitoring method - Google Patents
Switch cabinet contact monitoring method Download PDFInfo
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- CN113341349A CN113341349A CN202110802511.5A CN202110802511A CN113341349A CN 113341349 A CN113341349 A CN 113341349A CN 202110802511 A CN202110802511 A CN 202110802511A CN 113341349 A CN113341349 A CN 113341349A
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 238000005259 measurement Methods 0.000 claims abstract description 8
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 abstract description 5
- 238000013021 overheating Methods 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B11/00—Switchgear having carriage withdrawable for isolation
- H02B11/02—Details
- H02B11/04—Isolating-contacts, e.g. mountings or shieldings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B11/00—Switchgear having carriage withdrawable for isolation
- H02B11/02—Details
- H02B11/10—Indicating electrical condition of gear; Arrangement of test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Gas-Insulated Switchgears (AREA)
Abstract
The invention discloses a switch cabinet contact monitoring method, and relates to the technical field of electricity safety. The switch cabinet contact monitoring method comprises the following steps: acquiring real-time current of a current-carrying loop in the switch cabinet and ambient temperature in the switch cabinet; calculating to obtain the theoretical temperature of the joint of the contact and the copper bar according to the real-time current and the environmental temperature; acquiring the actually measured temperature of the joint of the contact and the copper bar; and comparing the actual measurement temperature with the theoretical temperature, and if the actual measurement temperature is greater than the theoretical temperature, judging that the contact between the contact and the copper bar is poor. Compared with the prior art, the switch cabinet contact monitoring method provided by the invention has the advantages that the actually acquired measured temperature is compared with the calculated theoretical temperature, so that whether the contact between the contact and the copper bar is poor or not can be monitored, the overheating and current-carrying faults are avoided, and the safety is high.
Description
Technical Field
The invention relates to the technical field of electricity safety, in particular to a switch cabinet contact monitoring method.
Background
The switch cabinet is important power equipment, plays a role in receiving and distributing electric energy in a power system, and is a mainstream metal closed handcart switch cabinet with convenient operation and maintenance and small occupied area due to the development of a high-voltage circuit breaker. At present, along with the promotion of intellectuality and miniaturized research, cubical switchboard inner structure is compacter, inner space is more narrow and small, but so, because the cubical switchboard directly undertakes user's load, and the thermal diffusivity is poor, so the cubical switchboard causes overheated easily under the condition of inside part (for example contact and copper bar) contact failure to lead to the current-carrying trouble, cause the incident even.
In view of this, it is important to design a method for monitoring a contact of a switchgear capable of monitoring whether the contact is bad, especially in the application of the switchgear.
Disclosure of Invention
The invention aims to provide a switch cabinet contact monitoring method which can monitor whether contact between a contact and a copper bar is poor or not, avoid overheating and current-carrying faults and has high safety.
The invention is realized by adopting the following technical scheme.
A contact monitoring method of a switch cabinet is used for monitoring whether contact failure exists between a contact of the switch cabinet and a copper bar, and comprises the following steps: acquiring real-time current of a current-carrying loop in the switch cabinet and ambient temperature in the switch cabinet; calculating to obtain the theoretical temperature of the joint of the contact and the copper bar according to the real-time current and the environmental temperature; acquiring the actually measured temperature of the joint of the contact and the copper bar; and comparing the actual measurement temperature with the theoretical temperature, and if the actual measurement temperature is greater than the theoretical temperature, judging that the contact between the contact and the copper bar is poor.
Optionally, the step of obtaining a real-time current of a current-carrying loop in the switchgear and an ambient temperature inside the switchgear includes: acquiring real-time current of a current-carrying loop measured by an ammeter; the ambient temperature inside the switchgear measured by the thermometer is acquired.
Optionally, the step of calculating the theoretical temperature of the joint of the contact and the copper bar according to the real-time current and the ambient temperature includes: calculating a temperature rise coefficient according to the real-time current; calculating to obtain a standard temperature according to the real-time current; and calculating to obtain the theoretical temperature according to the temperature rise coefficient, the standard temperature and the ambient temperature.
Optionally, the step of calculating the temperature rise coefficient according to the real-time current includes: calculating to obtain a temperature rise coefficient by using a first calculation formula; wherein the first calculation formula is: -0.0004I + 1.0283; in the formula, k is a temperature rise coefficient, and I is a real-time current.
Optionally, the step of calculating the standard temperature from the real-time current comprises: and calculating the standard temperature by using a second calculation formula: wherein the second calculation formula is: t1 ═ 0.0957I-9.1113; wherein T1 is standard temperature and I is real-time current.
Optionally, the step of calculating the theoretical temperature according to the temperature rise coefficient, the standard temperature and the ambient temperature includes: and calculating to obtain theoretical temperature by using a third calculation formula: wherein the third calculation formula is: t3 ═ k × T2+ T1; in the formula, T3 is theoretical temperature, k is temperature rise coefficient, T2 is ambient temperature, and T1 is standard temperature.
Alternatively, the theoretical temperature ranges from 60 degrees celsius to 110 degrees celsius.
Optionally, the step of obtaining the measured temperature of the joint of the contact and the copper bar includes: and scanning the top end of the contact box for accommodating the contact and the copper bar by using the infrared camera to obtain the actually measured temperature.
Optionally, in the case that the measured temperature is greater than the theoretical temperature, the switch cabinet contact monitoring method further includes: and sending an alarm to warn the user that the temperature of the contact is abnormal.
Optionally, in the case that the measured temperature is greater than the theoretical temperature, the switch cabinet contact monitoring method further includes: and displaying the actually measured temperature, and judging the contact condition between the contact and the copper bar according to the actually measured temperature.
The switch cabinet contact monitoring method provided by the invention has the following beneficial effects:
the invention provides a switch cabinet contact monitoring method, which is used for acquiring real-time current of a current-carrying loop in a switch cabinet and ambient temperature in the switch cabinet; calculating to obtain the theoretical temperature of the joint of the contact and the copper bar according to the real-time current and the environmental temperature; acquiring the actually measured temperature of the joint of the contact and the copper bar; and comparing the actual measurement temperature with the theoretical temperature, and if the actual measurement temperature is greater than the theoretical temperature, judging that the contact between the contact and the copper bar is poor. Compared with the prior art, the switch cabinet contact monitoring method provided by the invention has the advantages that the actually acquired measured temperature is compared with the calculated theoretical temperature, so that whether the contact between the contact and the copper bar is poor or not can be monitored, the overheating and current-carrying faults are avoided, and the safety is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a switch cabinet to which the switch cabinet contact monitoring method according to the embodiment of the present invention is applied;
fig. 2 is a block diagram of steps of a method for monitoring a contact of a switch cabinet according to an embodiment of the present invention.
Icon: 100-a switch cabinet; 110-a contact; 120-contact box; 121-top end; 130-copper bar.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "inside", "outside", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally put in use of products of the present invention, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.
Referring to fig. 1 and fig. 2, an embodiment of the invention provides a method for monitoring a contact of a switch cabinet, which is used for monitoring whether a contact failure occurs in the switch cabinet 100. Whether it can monitor contact failure between contact 110 and the copper bar 130, avoid arousing overheated and current-carrying trouble, the security is strong.
It should be noted that the switch cabinet contact monitoring method is applied to the switch cabinet 100, and the switch cabinet 100 includes the contact 110, the contact box 120 and the copper bar 130. Wherein, the contact 110 is installed in the contact box 120, the copper bar 130 stretches into the contact box 120 and is connected with the contact 110, the copper bar 130 is arranged on one side of the contact 110 close to the top end 121 of the contact box 120 and is attached to the top end 121 of the contact box 120, therefore, the temperature of the top end 121 of the contact box 120 is approximately the same as the temperature of the joint of the contact 110 and the copper bar 130.
In this embodiment, the switch cabinet 100 is a storage switch cabinet, and has a compact internal structure and a small occupied space, and a temperature sensor cannot be embedded in the switch cabinet 100 to measure the temperature at the junction of the contact 110 and the copper bar 130, so that the temperature of the top end 121 of the contact box 120 is measured by using an infrared camera to penetrate through the shell of the switch cabinet 100 and to scan and measure the temperature of the top end 121 of the contact box 120, where the temperature is the temperature at the junction of the contact 110 and the copper bar 130, that is, the real temperature.
The switch cabinet contact monitoring method comprises the following steps:
step S110: real-time current of the current-carrying loop in the switchgear 100 and the ambient temperature inside the switchgear 100 are obtained.
Specifically, step S110 includes two steps, which are respectively:
step S111: and acquiring the real-time current of the current-carrying loop measured by the ammeter.
In the switch cabinet 100, the contact 110 is connected with a copper bar 130 and other components to form a current-carrying loop, and electric charges flow in the current-carrying loop to form a real-time current. In step S111, the current meter can measure the real-time current, and the current meter can also send the real-time current to the controller so that the controller can analyze and process the real-time current.
Step S112: the ambient temperature inside the switchgear 100 measured by the thermometer is acquired.
Since the outside temperatures are different in different seasons, the ambient temperature in the switch cabinet 100 is also different. In step S112, the thermometer can measure the ambient temperature, and the thermometer can also send the ambient temperature to the controller so that the controller can analyze and process the ambient temperature.
Step S120: and calculating the theoretical temperature of the joint of the contact 110 and the copper bar 130 according to the real-time current and the ambient temperature.
Specifically, step S120 includes three steps, which are respectively:
step S121: and calculating the temperature rise coefficient according to the real-time current.
In step S121, the temperature rise coefficient is calculated by using a first calculation formula, where the first calculation formula is: -0.0004I + 1.0283; in the formula, k is a temperature rise coefficient, I is real-time current, and the unit of the real-time current is ampere (A). It can be seen that the temperature rise coefficient decreases with increasing real-time current.
Step S122: and calculating to obtain the standard temperature according to the real-time current.
In step S122, the standard temperature is calculated by using a second calculation formula, where the second calculation formula is: t1 ═ 0.0957I-9.1113; in the formula, T1 is a standard temperature, the standard temperature is given in degrees centigrade (° c), I is a real-time current, and the real-time current is given in amperes (a). It can be seen that the standard temperature increases with increasing real-time current.
Further, the standard temperature is explained, when the ambient temperature is 0 ℃, if the contact 110 and the copper bar 130 are completely conducted, the temperature at the connection position of the contact 110 and the copper bar 130 is increased to a certain value, and the certain value is the standard temperature.
Step S123: and calculating to obtain the theoretical temperature according to the temperature rise coefficient, the standard temperature and the ambient temperature.
In step S123, the standard temperature is calculated by using a second calculation formula, where the third calculation formula is: t3 ═ k × T2+ T1; in the formula, T3 is theoretical temperature, the unit of the theoretical temperature is centigrade (DEG C), k is temperature rise coefficient, T2 is ambient temperature, the unit of the ambient temperature is centigrade (DEG C), T1 is standard temperature, and the unit of the standard temperature is centigrade (DEG C).
Further, the environmental temperature measured in the step S112, the temperature rise coefficient calculated in the step S121, and the standard temperature calculated in the step S122 are substituted into a third calculation formula to obtain the theoretical temperature at the connection position of the contact 110 and the copper bar 130.
It should be noted that in step S120, the controller is used to calculate the temperature rise coefficient and the standard temperature respectively, and then the controller is used to calculate the theoretical temperature according to the ambient temperature, the temperature rise coefficient and the standard temperature, so as to determine whether the contact 110 is in poor contact with the copper bar 130 subsequently.
In this embodiment, the specific value of the theoretical temperature needs to be determined according to the real-time current and the ambient temperature. Specifically, the theoretical temperature ranges from 60 degrees celsius to 110 degrees celsius.
Step S130: and acquiring the measured temperature of the joint of the contact 110 and the copper bar 130.
It should be noted that the infrared camera is used to scan the top end 121 of the contact box 120 for accommodating the contact 110 and the copper bar 130 through the shell of the switch cabinet 100, so as to obtain an actually measured temperature, which is the temperature of the top end 121 of the contact box 120 and also the temperature of the connection position of the contact 110 and the copper bar 130. In step S130, the infrared camera can measure the measured temperature, and the infrared camera can also send the measured temperature to the controller, so that the controller can analyze and process the measured temperature.
Step S140: and comparing the measured temperature with the theoretical temperature, and if the measured temperature is greater than the theoretical temperature, judging that the contact between the contact 110 and the copper bar 130 is poor.
In step S140, the controller compares the measured temperature with the theoretical temperature. Under the condition that the actually measured temperature is less than or equal to the theoretical temperature, the contact between the contact 110 and the copper bar 130 is judged to be good, at the moment, no action is needed to be made, and the monitoring state is continuously kept. When the measured temperature is higher than the theoretical temperature, the contact between the contact 110 and the copper bar 130 is judged to be poor, and an alarm is given at the moment to warn a user that the temperature of the contact 110 is abnormal and remind the user to overhaul the switch cabinet 100; and the measured temperature is displayed, the contact condition between the contact 110 and the copper bar 130 is judged according to the measured temperature, if the difference value between the measured temperature and the theoretical temperature is too large, the contact condition between the contact 110 and the copper bar 130 is judged to be very bad, the overheating condition is serious, and safety accidents are easily caused.
According to the switch cabinet contact monitoring method provided by the embodiment of the invention, the real-time current of a current-carrying loop in the switch cabinet 100 and the environment temperature in the switch cabinet 100 are obtained; calculating the theoretical temperature of the joint of the contact 110 and the copper bar 130 according to the real-time current and the environmental temperature; acquiring the actually measured temperature of the joint of the contact 110 and the copper bar 130; and comparing the measured temperature with the theoretical temperature, and if the measured temperature is greater than the theoretical temperature, judging that the contact between the contact 110 and the copper bar 130 is poor. Compared with the prior art, the switch cabinet contact monitoring method provided by the invention has the advantages that the actually acquired measured temperature is compared with the calculated theoretical temperature, so that whether the contact between the contact 110 and the copper bar 130 is poor or not can be monitored, the overheating and current-carrying faults are avoided, and the safety is high.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A contact monitoring method for a switch cabinet is used for monitoring whether contact failure exists between a contact of the switch cabinet and a copper bar, and is characterized by comprising the following steps:
acquiring real-time current of a current-carrying loop in the switch cabinet and ambient temperature in the switch cabinet;
calculating to obtain the theoretical temperature of the joint of the contact and the copper bar according to the real-time current and the environment temperature;
acquiring the actually measured temperature of the joint of the contact and the copper bar;
and comparing the actual measurement temperature with the theoretical temperature, and if the actual measurement temperature is greater than the theoretical temperature, judging that the contact between the contact and the copper bar is poor.
2. The switchgear contact monitoring method of claim 1, wherein the step of obtaining real-time current in a current carrying loop in the switchgear and ambient temperature inside the switchgear comprises:
obtaining the real-time current of the current-carrying loop measured by an ammeter;
acquiring the ambient temperature in the switch cabinet measured by a thermometer.
3. The switchgear contact monitoring method according to claim 1, wherein the step of calculating the theoretical temperature of the junction between the contact and the copper bar according to the real-time current and the ambient temperature comprises:
calculating a temperature rise coefficient according to the real-time current;
calculating to obtain a standard temperature according to the real-time current;
and calculating the theoretical temperature according to the temperature rise coefficient, the standard temperature and the environment temperature.
4. The switchgear contact monitoring method according to claim 3, wherein the step of calculating a temperature rise coefficient from the real-time current comprises:
calculating the temperature rise coefficient by using a first calculation formula;
wherein the first calculation formula is:
k＝-0.0004I+1.0283；
in the formula, k is the temperature rise coefficient, and I is the real-time current.
5. The switchgear contact monitoring method of claim 3, wherein the step of calculating a standard temperature from the real-time current comprises:
and calculating the standard temperature by using a second calculation formula:
wherein the second calculation formula is:
T1＝0.0957I-9.1113；
wherein T1 is the standard temperature and I is the real-time current.
6. The switchgear contact monitoring method of claim 3, wherein said step of calculating said theoretical temperature from said temperature rise coefficient, said standard temperature, and said ambient temperature comprises:
and calculating the theoretical temperature by using a third calculation formula:
wherein the third calculation formula is:
T3＝k*T2+T1；
wherein T3 is the theoretical temperature, k is the temperature rise coefficient, T2 is the ambient temperature, and T1 is the standard temperature.
7. The switchgear contact monitoring method according to claim 1, wherein the theoretical temperature is in a range of 60 degrees celsius to 110 degrees celsius.
8. The switchgear contact monitoring method according to claim 1, wherein the step of obtaining the measured temperature at the junction of the contact and the copper bar comprises:
and scanning the top end of a contact box for containing the contact and the copper bar by utilizing an infrared camera so as to obtain the actually measured temperature.
9. The switchgear contact monitoring method according to claim 1, wherein in case the measured temperature is greater than the theoretical temperature, the switchgear contact monitoring method further comprises:
and sending an alarm to warn a user that the temperature of the contact is abnormal.
10. The switchgear contact monitoring method according to claim 1, wherein in case the measured temperature is greater than the theoretical temperature, the switchgear contact monitoring method further comprises:
and displaying the measured temperature, and judging the contact condition between the contact and the copper bar according to the measured temperature.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110802511.5A CN113341349B (en) | 2021-07-15 | 2021-07-15 | Switch cabinet contact monitoring method |
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| CN202110802511.5A CN113341349B (en) | 2021-07-15 | 2021-07-15 | Switch cabinet contact monitoring method |
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| CN113341349A true CN113341349A (en) | 2021-09-03 |
| CN113341349B CN113341349B (en) | 2022-06-21 |
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| CN113959566A (en) * | 2021-10-22 | 2022-01-21 | 南水北调东线江苏水源有限责任公司 | Complex working condition temperature measuring method and device |
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| CN113341349B (en) | 2022-06-21 |
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