CN113337874A - Non-toxic nickel-free electroplating device for copper-tin alloy for electroplating and operation process - Google Patents
Non-toxic nickel-free electroplating device for copper-tin alloy for electroplating and operation process Download PDFInfo
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- CN113337874A CN113337874A CN202110614622.3A CN202110614622A CN113337874A CN 113337874 A CN113337874 A CN 113337874A CN 202110614622 A CN202110614622 A CN 202110614622A CN 113337874 A CN113337874 A CN 113337874A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
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Abstract
The invention discloses a copper-tin alloy nickel-free electroplating device for non-toxic electroplating, which comprises a box body and a clamping mechanism arranged inside the box body, wherein the box body comprises a hanging mechanism and a stirring mechanism which are arranged on the inner wall of the box body, a positive plate arranged at the bottom of the box body and an electromagnetic plate arranged on the inner wall of the box body, the inner wall of the box body is also provided with a wall groove, in the electroplating process, a rotating disc is used for driving a rotating drum to rotate, stirring blades on the surface of the rotating drum can enable electroplating solution to continuously flow, the state of the electroplating solution is uniformly distributed, bubbles staying on the surface of a workpiece to be plated can be reduced, the invention also discloses an operation process of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating, an electric push rod is used for lifting a baffle plate, a leakage hole can leak out, the electroplating solution in the box body can flow into the clamping plate and contact with plating metal, and the entering amount of the electroplating solution can be controlled by changing the leakage hole, the electroplating speed is controlled, and the electroplating quality is indirectly improved.
Description
Technical Field
The invention relates to the technical field of non-toxic electroplating, in particular to a copper-tin alloy nickel-free electroplating device for non-toxic electroplating and an operation process thereof.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to play roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing attractiveness and the like, wherein in order to reduce the toxicity of nickel to human bodies, a method of replacing a nickel plating layer with copper-tin alloy is adopted, namely nickel-free electroplating and non-toxic electroplating.
At present electroplating device in the use, the plating solution is in the state of stewing for a long time, can make the plating solution state distribute inhomogeneously to can make the surface of waiting to plate the work piece have the bubble to stay, influence electroplating quality, secondly, in electroplating process, the plating solution with wait to plate the work piece and have the insufficient phenomenon of contact, thereby lead to appearing the insufficient phenomenon of local electroplating, and in electroplating process, its speed is difficult to control, also can influence whole electroplating's quality.
Aiming at the problems, the prior device is improved, and a copper-tin alloy nickel-free electroplating device for non-toxic electroplating and an operation process are provided.
Disclosure of Invention
The invention aims to provide a copper-tin alloy nickel-free electroplating device for non-toxic electroplating and an operation process thereof, and solves the problems that bubbles exist on the surface of a workpiece to be plated, electroplating is insufficient and the electroplating speed is difficult to control in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a non-toxic copper-tin alloy nickel-free electroplating device for electroplating comprises a box body and a clamping mechanism arranged inside the box body, wherein the box body comprises a hanging mechanism and a stirring mechanism which are arranged on the inner wall of the box body, a positive plate arranged at the bottom of the box body and an electromagnetic plate arranged on the inner wall of the box body;
the stirring mechanism comprises a rotating disc arranged on the inner wall of the box body, a rotating drum arranged at one end of the rotating disc and a rotating rod arranged inside the rotating drum, wherein a rotating ring is arranged on the outer surface of the rotating rod, and a vertical plate is fixedly arranged on the outer surface of the rotating ring.
Further, press from both sides and get the mechanism and press from both sides the board and set up the baffle of getting the board both sides pressing from both sides including setting up at the inside clamp of box, fixed mounting has T type strip on the surface of baffle, presss from both sides the both sides of getting the board and has seted up T type groove, presss from both sides the board of getting and passes through T type groove and T type strip swing joint.
Furthermore, press from both sides and get the board and including setting up pressing from both sides the double-layered groove of getting on the board surface, set up the wearing groove in double-layered groove both sides, set up at the electric putter of pressing from both sides inslot portion and set up the extension bar in electric putter one end, be provided with the sleeve pipe on the surface of extension bar, be provided with the quarter butt on the sheathed tube surface, the extension bar passes through electric putter and wears groove swing joint, the both ends of extension bar are connected with the baffle.
Further, press from both sides and get mechanism still including setting up and pressing from both sides draw-in groove on getting the board surface, set up the recess inside the draw-in groove and set up the fender subassembly inside the draw-in groove, the fender subassembly include with recess swing joint's dog, set up the small opening on the dog surface, fixed mounting is at the lug at dog both ends and sets up the tensile pipe in the dog upper end, the one end fixed mounting of tensile pipe has the electromagnetism sheet metal, the dog passes through lug and recess swing joint.
Further, hang and get mechanism including setting up at the inside removal subassembly of wall groove, set up the slat on the removal subassembly surface and run through the montant of setting in the slat inside, be provided with the magnetic ring on the surface of montant, the one end of montant is provided with the curved bar of deformation, the montant and the negative pole electric connection of external power.
Furthermore, the slat includes the mounting hole of seting up on the slat surface, sets up the clamp plate and set up the telescopic link in clamp plate one end in the mounting hole inside, and the montant passes through mounting hole and slat swing joint, and the montant passes through the magnetic ring and is connected with the clamp plate magnetism, and the slat is the component that a magnetic material made.
Furthermore, the slat still includes the butt joint hole of seting up in slat one side and sets up the hinge at the slat upper surface, and the slat is connected with the removal subassembly through the hinge, and the removal subassembly includes the movable block that is connected with the hinge and sets up the extension spring in the movable block is inside, and the movable block is connected with the butt joint hole through extension spring, and the movable block is connected with the lifter that sets up in the wall inslot portion.
Furthermore, the outer surface of the rotary drum is provided with a surface groove, a supporting rod and stirring blades are arranged inside the surface groove, and the stirring blades are connected with the surface groove through the supporting rod.
Furthermore, the upper surface of the positive plate is provided with an electric connecting rod, the clamping plate and the positive plate are arranged in the same vertical plane, and the electric connecting rod is connected with the positive electrode of an external power supply.
The invention provides another technical scheme that: the operation process of the copper-tin alloy nickel-free electroplating device for nontoxic electroplating comprises the following steps:
s1, placing the workpiece to be plated at the joint of the vertical rod and the deformation bent rod, clamping the workpiece to be plated by using the deformation capacity of the deformation bent rod, simultaneously switching on a power supply, simultaneously placing the plating metal into the clamping plate, ensuring that the bottom of the plating metal is connected with the power connection rod, and simultaneously switching on the power supply;
s2: electroplating solution is injected into the box body, the baffle plate is lifted by the electric push rod, the leakage hole can be leaked, and the electroplating solution in the box body can flow into the clamping plate and contact with the plating metal, so that the electroplating process is realized;
s3: in the electroplating process, the batten can slowly move downwards until the batten moves to the electromagnetic plate, a power supply of the electromagnetic plate is switched on to be magnetized, and the batten can make swinging motion by utilizing the principle that the opposite polarities of magnetism attract each other and the like polarities repel each other;
s4: simultaneously in electroplating process, utilize the rolling disc to drive the rotary drum rotatory, the stirring blade on its surface can make the continuous flow of plating solution, makes the state distribution of plating solution even, and the bull stick also can drive the riser and move simultaneously, also can make the state distribution of plating solution even, so far, accomplishes all operating procedure.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides a non-toxic copper-tin alloy nickel-free electroplating device for electroplating and an operation process, wherein a stirring mechanism is arranged on the inner wall of a box body, a rotating disc is arranged on the inner wall of the box body, a rotating drum is arranged at one end of the rotating disc, a rotating rod is arranged inside the rotating drum, a rotating ring is arranged on the outer surface of the rotating rod, a vertical plate is fixedly arranged on the outer surface of the rotating ring, a surface groove is formed on the outer surface of the rotating drum, a supporting rod and stirring blades are arranged inside the surface groove, the stirring blades are connected with the surface groove through the supporting rod, the rotating disc is used for driving the rotating drum to rotate in the electroplating process, the stirring blades on the surface of the rotating drum can enable electroplating solution to continuously flow, the state distribution of the electroplating solution is uniform, meanwhile, the rotating rod can also drive the vertical plate to move, the state distribution of the electroplating solution is uniform, and bubbles staying on the surface of a workpiece to be plated can be reduced, the plating quality is improved indirectly.
2. The invention provides a copper-tin alloy nickel-free electroplating device for non-toxic electroplating and an operation process, wherein a moving component is arranged inside a wall groove, a batten is arranged on the outer surface of the moving component, a vertical rod penetrates through the inside of the batten, a magnetic ring is arranged on the outer surface of the vertical rod, one end of the vertical rod is provided with a deformation bent rod, the vertical rod is electrically connected with a negative electrode of an external power supply, an installation hole is arranged on the outer surface of the batten, a pressing plate is arranged inside the installation hole, one end of the pressing plate is provided with a telescopic rod, the vertical rod is movably connected with the batten through the installation hole, the vertical rod is magnetically connected with the pressing plate through the magnetic ring, the batten is a component made of a magnetic material, one side of the batten is provided with a butt joint hole, the upper surface of the batten is connected with the moving component through a hinge, one end of the hinge is connected with a moving block, and an extension spring is arranged inside the moving block, the movable block is connected with the butt joint hole through an extension spring, the movable block is connected with a lifting rod arranged inside the wall groove, in the electroplating process, the batten can slowly move downwards, when the movable block moves to the electromagnetic plate, the power supply of the electromagnetic plate is switched on, magnetism is attached to the electromagnetic plate, the principle that like poles repel each other due to attraction of opposite magnetism is utilized, the batten can be made to swing, the contact area between a workpiece to be plated and electroplating liquid at the joint of the vertical rod and the deformation bent rod is increased, the electroplating liquid is fully contacted with the surface of the workpiece to be plated, the electroplating quality is improved, and the phenomenon that local electroplating cannot be performed is prevented.
3. The invention provides a copper-tin alloy nickel-free electroplating device for nontoxic electroplating and an operation process, wherein a clamping plate is arranged in a box body, baffle plates are arranged on two sides of the clamping plate, T-shaped strips are fixedly arranged on the outer surface of the baffle plates, T-shaped grooves are formed on two sides of the clamping plate, the clamping plate is movably connected with the T-shaped strips through the T-shaped grooves, a clamping groove is formed in the outer surface of the clamping plate, through grooves are formed in two sides of the clamping groove, an electric push rod is arranged in the clamping groove, an extension rod is arranged at one end of the electric push rod, a sleeve is arranged on the outer surface of the extension rod, a short rod is arranged on the outer surface of the sleeve, the extension rod is movably connected with the through grooves through the electric push rod, two ends of the extension rod are connected with the baffle plates, a clamping groove is formed in the outer surface of the clamping plate, a groove is formed in the clamping groove, a blocking component is arranged in the clamping groove, and a stop block is arranged in the groove, be provided with the small opening on the surface of dog, the both ends of dog are provided with the lug, the upper end of dog is provided with tensile pipe, the one end fixed mounting of tensile pipe has the electromagnetism sheet metal, the dog passes through lug and recess swing joint, utilize electric putter to rise the baffle, the small opening then can spill, the plating solution in the box then can flow into the clamp board, contact with cladding material metal, the quantity that spills through changing the small opening can be so that the entering amount of plating solution, make electroplating speed become controllable, the indirectness has improved electroplating quality.
Drawings
FIG. 1 is a schematic view of the overall structure of a copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention;
FIG. 2 is a schematic view of the overall internal structure of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention;
FIG. 3 is a schematic structural view of a clamping mechanism of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention;
FIG. 4 is a partial structural schematic view of a clamping mechanism of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention;
FIG. 5 is a schematic structural diagram of a stirring mechanism of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention;
FIG. 6 is a schematic structural view of a hanging mechanism of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention;
FIG. 7 is a schematic structural view of a blocking assembly of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention;
FIG. 8 is a schematic view of the connection structure of the moving assembly and the stopper of the copper-tin alloy nickel-free electroplating device for non-toxic electroplating according to the present invention.
In the figure: 1. a box body; 2. a gripping mechanism; 21. a baffle plate; 211. t-shaped strips; 22. clamping the plate; 221. a T-shaped groove; 222. a clamping groove; 223. penetrating a groove; 224. an electric push rod; 225. lengthening a rod; 226. a sleeve; 227. a short bar; 23. a card slot; 24. a groove; 25. a blocking assembly; 251. a stopper; 252. a leak hole; 253. a bump; 254. stretching the tube; 255. an electromagnetic sheet; 3. a hanging mechanism; 31. laths; 311. mounting holes; 312. pressing a plate; 313. a telescopic rod; 314. a butt joint hole; 315. a hinge; 32. a moving assembly; 321. a moving block; 322. an extension spring; 33. a vertical rod; 331. a deformation bent rod is arranged; 332. a magnetic ring; 4. a stirring mechanism; 41. a rotating drum; 42. rotating the disc; 43. a surface groove; 431. a strut; 432. agitating the blades; 44. a rotating rod; 45. rotating the ring; 451. a vertical plate; 5. a positive plate; 51. connecting a power rod; 6. an electromagnetic plate; 7. and (4) wall grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 2 and 5, a non-toxic copper-tin alloy nickel-free electroplating device for electroplating comprises a box body 1 and a clamping mechanism 2 arranged inside the box body 1, wherein the box body 1 comprises a hanging mechanism 3 and a stirring mechanism 4 which are arranged on the inner wall of the box body 1, a positive plate 5 arranged at the bottom of the box body 1 and an electromagnetic plate 6 arranged on the inner wall of the box body 1, a wall groove 7 is further formed on the inner wall of the box body 1, the hanging mechanism 3 and the stirring mechanism 4 are arranged in different vertical planes, the stirring mechanism 4 comprises a rotating disc 42 arranged on the inner wall of the box body 1, a rotating drum 41 arranged at one end of the rotating disc 42 and a rotating rod 44 arranged inside the rotating drum 41, a rotating ring 45 is arranged on the outer surface of the rotating rod 44, a vertical plate 451 is fixedly arranged on the outer surface of the rotating ring 45, a surface groove 43 is formed on the outer surface of the rotating drum 41, a support rod 431 and a stirring blade 432 are arranged inside the surface groove 43, stirring blade 432 is connected with surface groove 43 through branch 431, the upper surface of positive plate 5 is provided with electric pole 51, press from both sides and get board 22 and positive plate 5 and set up in same vertical plane, electric pole 51 is connected with the positive pole of external power supply, in electroplating process, it is rotatory to utilize rolling disc 42 to drive rotary drum 41, its surperficial stirring blade 432 can make the continuous flow of plating solution, make the state distribution of plating solution even, the while bull stick 44 also can drive riser 451 and move, also can make the state distribution of plating solution even, can reduce the bubble that stops on treating the plating work piece surface, the indirectness has improved electroplating quality.
Referring to fig. 3, 4 and 7, the clamping mechanism 2 includes a clamping plate 22 disposed inside the box body 1 and a blocking plate 21 disposed on both sides of the clamping plate 22, a T-shaped strip 211 is fixedly mounted on an outer surface of the blocking plate 21, T-shaped grooves 221 are disposed on both sides of the clamping plate 22, the clamping plate 22 is movably connected to the T-shaped strip 211 through the T-shaped grooves 221, the clamping plate 22 includes a clamping groove 222 disposed on an outer surface of the clamping plate 22, through grooves 223 disposed on both sides of the clamping groove 222, an electric push rod 224 disposed inside the clamping groove 222 and an extension bar 225 disposed at one end of the electric push rod 224, a sleeve 226 is disposed on an outer surface of the extension bar 225, a short rod 227 is disposed on an outer surface of the sleeve 226, the extension bar 225 is movably connected to the through the electric push rod 224 and the through groove 223, both ends of the extension bar 225 are connected to the blocking plate 21, the clamping mechanism 2 further includes a clamping groove 23 disposed on an outer surface of the clamping plate 22, a groove 24 disposed inside of the clamping groove 23 and a blocking assembly 25 disposed inside the clamping groove 23, the blocking assembly 25 comprises a block 251 movably connected with the groove 24, a leak hole 252 formed in the outer surface of the block 251, a lug 253 fixedly installed at two ends of the block 251 and a stretching pipe 254 arranged at the upper end of the block 251, an electromagnetic thin plate 255 is fixedly installed at one end of the stretching pipe 254, the block 251 is movably connected with the groove 24 through the lug 253, the electric push rod 224 is utilized to lift the block 21, the leak hole 252 can be leaked, electroplating solution in the box body 1 can flow into the clamping plate 22 and is in contact with the plating metal, the amount of the electroplating solution entering can be enabled by changing the amount of the leaked leak hole 252, the electroplating speed is enabled to be controllable, and the electroplating quality is indirectly improved.
Referring to fig. 6 and 8, the hanging mechanism 3 includes a moving component 32 disposed inside the wall slot 7, a slat 31 disposed on an outer surface of the moving component 32 and a vertical rod 33 penetrating the slat 31, a magnetic ring 332 is disposed on an outer surface of the vertical rod 33, a deformable bent rod 331 is disposed at one end of the vertical rod 33, the vertical rod 33 is electrically connected to a negative electrode of an external power source, the slat 31 includes a mounting hole 311 formed on an outer surface of the slat 31, a pressing plate 312 disposed inside the mounting hole 311 and a telescopic rod 313 disposed at one end of the pressing plate 312, the vertical rod 33 is movably connected to the slat 31 through the mounting hole 311, the vertical rod 33 is magnetically connected to the pressing plate 312 through the magnetic ring 332, the slat 31 is a member made of a magnetic material, the slat 31 further includes a butt hole 314 formed on one side of the slat 31 and a hinge 315 disposed on an upper surface of the slat 31, the slat 31 is connected to the, the movable assembly 32 comprises a movable block 321 connected with the hinge 315 and an extension spring 322 arranged inside the movable block 321, the movable block 321 is connected with the butt joint hole 314 through the extension spring 322, the movable block 321 is connected with a lifting rod arranged inside the wall groove 7, in the electroplating process, the batten 31 can slowly move downwards, until the batten 6 is moved, the power supply of the electromagnet plate 6 is switched on, the batten 31 is made to be magnetic, the swinging motion of the batten 31 can be realized by utilizing the principle that magnetic opposite poles attract each other and magnetic poles repel each other, the contact area between a workpiece to be plated at the joint of the vertical rod 33 and the deformation bent rod 331 and an electroplating solution is increased, the electroplating solution is made to be fully contacted with the surface of the workpiece to be plated, the electroplating quality is improved, and the phenomenon that local electroplating cannot be performed is prevented.
To further better illustrate the above examples, the present invention also provides an embodiment of a process for operating a copper-tin alloy nickel-free electroplating apparatus for non-toxic electroplating, comprising the steps of:
firstly, a workpiece to be plated is placed at the joint of the vertical rod 33 and the deformation bent rod 331, the workpiece to be plated is clamped by using the deformation capacity of the deformation bent rod 331, a power supply is switched on, and meanwhile, plating metal is placed in the clamping plate 22 to ensure that the bottom of the plating metal is connected with the power connection rod 51 and the power supply is switched on;
step two: electroplating solution is injected into the box body 1, the baffle plate 21 is lifted by the electric push rod 224, the leakage hole 252 leaks, and the electroplating solution in the box body 1 flows into the clamping plate 22 and contacts with the plating metal to realize the electroplating process;
step three: in the electroplating process, the lath 31 can slowly move downwards until the lath moves to the position of the electromagnetic plate 6, the power supply of the electromagnetic plate 6 is switched on to be attached with magnetism, and the lath 31 can make swinging motion by utilizing the principle that the opposite magnetism attracts each other and the like magnetism repels each other;
step four: meanwhile, in the electroplating process, the rotating disc 42 is used for driving the rotating drum 41 to rotate, the stirring blades 432 on the surface of the rotating disc can enable the electroplating solution to continuously flow, so that the state distribution of the electroplating solution is uniform, meanwhile, the rotating rod 44 can drive the vertical plate 451 to move, and the state distribution of the electroplating solution can also be uniform, so that all the operation steps are completed.
In summary, the following steps: the invention provides a non-toxic copper-tin alloy nickel-free electroplating device for electroplating and an operation process, which comprises a box body 1 and a clamping mechanism 2 arranged inside the box body 1, wherein the box body 1 comprises a hanging mechanism 3 and a stirring mechanism 4 which are arranged on the inner wall of the box body 1, a positive plate 5 arranged at the bottom of the box body 1 and an electromagnetic plate 6 arranged on the inner wall of the box body 1, the inner wall of the box body 1 is also provided with a wall groove 7, the hanging mechanism 3 and the stirring mechanism 4 are arranged in different vertical planes, wherein the inner wall of the box body 1 is provided with a rotating disc 42, one end of the rotating disc 42 is provided with a rotating drum 41, the inside of the rotating drum 41 is provided with a rotating rod 44, the outer surface of the rotating rod 44 is provided with a rotating ring 45, the outer surface of the rotating ring 45 is fixedly provided with a vertical plate 451, the outer surface of the rotating drum 41 is provided with a surface groove 43, the inside of the surface groove 43 is provided with a supporting rod 431 and a stirring blade 432, the stirring blades 432 are connected with the surface groove 43 through the supporting rod 431, in the electroplating process, the rotating disc 42 is utilized to drive the rotating drum 41 to rotate, the stirring blades 432 on the surface can enable the electroplating solution to continuously flow, the state of the electroplating solution is uniformly distributed, meanwhile, the rotating rod 44 can also drive the vertical plate 451 to move, the state of the electroplating solution is uniformly distributed, bubbles staying on the surface of a workpiece to be plated can be reduced, the electroplating quality is indirectly improved, secondly, the moving component 32 is arranged inside the wall groove 7, the strip plate 31 is arranged on the outer surface of the moving component 32, the vertical rod 33 is arranged inside the strip plate 31 in a penetrating manner, the magnetic ring 332 is arranged on the outer surface of the vertical rod 33, the deformation bent rod 331 is arranged at one end of the vertical rod 33, the vertical rod 33 is electrically connected with the negative electrode of an external power supply, the mounting hole 311 is arranged on the outer surface of the strip plate 31, and the pressing plate 312 is arranged inside the mounting hole 311, one end of the pressing plate 312 is provided with an expansion link 313, the vertical rod 33 is movably connected with the slat 31 through a mounting hole 311, the vertical rod 33 is magnetically connected with the pressing plate 312 through a magnetic ring 332, the slat 31 is a component made of a magnetic material, one side of the slat 31 is provided with a butt hole 314, the upper surface of the slat 31 is provided with a hinge 315, the slat 31 is connected with the moving component 32 through the hinge 315, one end of the hinge 315 is connected with a moving block 321, an extension spring 322 is arranged inside the moving block 321, the moving block 321 is connected with the butt hole 314 through the extension spring 322, the moving block 321 is connected with a lifting rod arranged inside the wall groove 7, during the electroplating process, the slat 31 can slowly move downwards, until the power supply of the electromagnetic plate 6 is switched on and the magnetic plate is magnetized, and the swinging motion of the slat 31 can be realized by utilizing the principle that the like poles and the like poles are attracted by opposite magnetism, the contact area between the workpiece to be plated and the electroplating solution at the joint of the vertical rod 33 and the deformation bent rod 331 is increased, so that the electroplating solution is fully contacted with the surface of the workpiece to be plated, the electroplating quality is improved, and the phenomenon that local electroplating cannot be performed is prevented.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. The utility model provides a nontoxic is electroplated and is electroplated device with nickel-free of copper tin alloy, includes box (1) and sets up and gets mechanism (2) in the inside clamp of box (1), its characterized in that: the box body (1) comprises a hanging mechanism (3) and a stirring mechanism (4) which are arranged on the inner wall of the box body (1), a positive plate (5) which is arranged at the bottom of the box body (1) and an electromagnetic plate (6) which is arranged on the inner wall of the box body (1), the inner wall of the box body (1) is also provided with a wall groove (7), and the hanging mechanism (3) and the stirring mechanism (4) are arranged in different vertical planes;
the stirring mechanism (4) comprises a rotating disc (42) arranged on the inner wall of the box body (1), a rotating drum (41) arranged at one end of the rotating disc (42) and a rotating rod (44) arranged inside the rotating drum (41), wherein a rotating ring (45) is arranged on the outer surface of the rotating rod (44), and a vertical plate (451) is fixedly arranged on the outer surface of the rotating ring (45).
2. The non-toxic copper-tin alloy nickel-free electroplating device as set forth in claim 1, wherein: the clamping mechanism (2) comprises a clamping plate (22) arranged inside the box body (1) and baffle plates (21) arranged on two sides of the clamping plate (22), T-shaped strips (211) are fixedly arranged on the outer surface of the baffle plates (21), T-shaped grooves (221) are formed in two sides of the clamping plate (22), and the clamping plate (22) is movably connected with the T-shaped strips (211) through the T-shaped grooves (221).
3. The non-toxic copper-tin alloy nickel-free electroplating device for electroplating as claimed in claim 2, wherein: the clamping plate (22) comprises a clamping groove (222) formed in the outer surface of the clamping plate (22), through grooves (223) formed in two sides of the clamping groove (222), an electric push rod (224) arranged inside the clamping groove (222) and an extension rod (225) arranged at one end of the electric push rod (224), a sleeve (226) is arranged on the outer surface of the extension rod (225), a short rod (227) is arranged on the outer surface of the sleeve (226), the extension rod (225) is movably connected with the through grooves (223) through the electric push rod (224), and two ends of the extension rod (225) are connected with a baffle (21).
4. The non-toxic copper-tin alloy nickel-free electroplating device as set forth in claim 1, wherein: the clamping mechanism (2) further comprises a clamping groove (23) formed in the outer surface of the clamping plate (22), a groove (24) formed in the clamping groove (23) and a blocking assembly (25) arranged in the clamping groove (23), the blocking assembly (25) comprises a stop block (251) movably connected with the groove (24), a leakage hole (252) formed in the outer surface of the stop block (251), a convex block (253) fixedly installed at two ends of the stop block (251) and a stretching tube (254) arranged at the upper end of the stop block (251), an electromagnetic thin plate (255) is fixedly installed at one end of the stretching tube (254), and the stop block (251) is movably connected with the groove (24) through the convex block (253).
5. The non-toxic copper-tin alloy nickel-free electroplating device as set forth in claim 1, wherein: the hanging mechanism (3) comprises a moving component (32) arranged inside a wall groove (7), a ribbon board (31) arranged on the outer surface of the moving component (32) and a vertical rod (33) penetrating through the moving component (31), a magnetic ring (332) is arranged on the outer surface of the vertical rod (33), a deformation bent rod (331) is arranged at one end of the vertical rod (33), and the vertical rod (33) is electrically connected with a negative electrode of an external power supply.
6. The non-toxic copper-tin alloy nickel-free electroplating device for electroplating according to claim 5, wherein: the batten (31) comprises a mounting hole (311) formed in the outer surface of the batten (31), a pressing plate (312) arranged in the mounting hole (311) and an expansion rod (313) arranged at one end of the pressing plate (312), the vertical rod (33) is movably connected with the batten (31) through the mounting hole (311), the vertical rod (33) is magnetically connected with the pressing plate (312) through a magnetic ring (332), and the batten (31) is a component made of a magnetic material.
7. The non-toxic copper-tin alloy nickel-free electroplating device for electroplating according to claim 5, wherein: the batten (31) further comprises a butt joint hole (314) formed in one side of the batten (31) and a hinge (315) arranged on the upper surface of the batten (31), the batten (31) is connected with the moving assembly (32) through the hinge (315), the moving assembly (32) comprises a moving block (321) connected with the hinge (315) and an extension spring (322) arranged inside the moving block (321), the moving block (321) is connected with the butt joint hole (314) through the extension spring (322), and the moving block (321) is connected with a lifting rod arranged inside the wall groove (7).
8. The non-toxic copper-tin alloy nickel-free electroplating device as set forth in claim 1, wherein: a surface groove (43) is formed in the outer surface of the rotary drum (41), a support rod (431) and a stirring blade (432) are arranged inside the surface groove (43), and the stirring blade (432) is connected with the surface groove (43) through the support rod (431).
9. The non-toxic copper-tin alloy nickel-free electroplating device as set forth in claim 1, wherein: the upper surface of the positive plate (5) is provided with an electric connecting rod (51), the clamping plate (22) and the positive plate (5) are arranged in the same vertical plane, and the electric connecting rod (51) is connected with the positive electrode of an external power supply.
10. A process for operating a non-toxic copper-tin alloy nickel-free electroplating apparatus for electroplating according to any of claims 1 to 9, wherein: the method comprises the following steps:
s1, placing the workpiece to be plated at the joint of the vertical rod (33) and the deformation bent rod (331), clamping the workpiece to be plated by utilizing the deformation capacity of the deformation bent rod (331), simultaneously switching on a power supply, simultaneously placing the plating metal into the clamping plate (22), ensuring that the bottom of the plating metal is connected with the power connection rod (51), and simultaneously switching on the power supply;
s2: electroplating solution is injected into the box body (1), the baffle plate (21) is lifted by the electric push rod (224), the leakage hole (252) is leaked, and the electroplating solution in the box body (1) flows into the clamping plate (22) and contacts with the plating metal to realize the electroplating process;
s3: in the electroplating process, the lath (31) can slowly move downwards until the lath moves to the position of the electromagnetic plate (6), the power supply of the electromagnetic plate (6) is switched on to be attached with magnetism, and the lath (31) can make swinging motion by utilizing the principle that the opposite magnetism attracts each other and the like magnetism repels each other;
s4: meanwhile, in the electroplating process, the rotating disc (42) is used for driving the rotating drum (41) to rotate, the stirring blades (432) on the surface of the rotating disc can enable the electroplating solution to continuously flow, so that the state of the electroplating solution is uniformly distributed, meanwhile, the rotating rod (44) can drive the vertical plate (451) to move, the state of the electroplating solution is also uniformly distributed, and all the operation steps are completed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110614622.3A CN113337874A (en) | 2021-06-02 | 2021-06-02 | Non-toxic nickel-free electroplating device for copper-tin alloy for electroplating and operation process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110614622.3A CN113337874A (en) | 2021-06-02 | 2021-06-02 | Non-toxic nickel-free electroplating device for copper-tin alloy for electroplating and operation process |
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Application publication date: 20210903 |