CN113337076B - Bakelite flour material for manufacturing commutator - Google Patents

Bakelite flour material for manufacturing commutator Download PDF

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CN113337076B
CN113337076B CN202110513886.XA CN202110513886A CN113337076B CN 113337076 B CN113337076 B CN 113337076B CN 202110513886 A CN202110513886 A CN 202110513886A CN 113337076 B CN113337076 B CN 113337076B
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parts
phenolic resin
polyether polyurethane
bakelite
powder material
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CN113337076A (en
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陈阿陆
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Ruian City Hengfeng Electro Mechanical Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16—Fibres; Fibrils

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  • Health & Medical Sciences (AREA)
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  • Medicinal Chemistry (AREA)
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Abstract

The application relates to the technical field of molding powder, and particularly discloses a bakelite powder material for manufacturing a commutator, which is prepared from the following raw materials in parts by weight: 40-60 parts of polyether polyurethane modified phenolic resin, 20-30 parts of bamboo powder, 10-20 parts of filler, 5-15 parts of vinyl triamine, 2-6 parts of organic tin stabilizer and 1-3 parts of color master batch. The bakelite powder material has excellent impact resistance and shrinkage resistance.

Description

Bakelite powder material for manufacturing commutator
Technical Field
The application relates to the technical field of molding powder, in particular to bakelite powder for manufacturing a commutator.
Background
Bakelite powder, also called bakelite, is phenolic plastic prepared by mixing various raw materials including phenolic resin, wood powder, filler and additives, wherein the phenolic resin has excellent insulativity, high temperature resistance, corrosion resistance, low smoke, low toxicity and cohesiveness, so the bakelite powder material has good electrical insulation performance and high temperature resistance, and is widely used for manufacturing electronic and electric appliances such as commutators, daily industrial products, automobile parts and the like.
In view of the above-mentioned related technologies, the inventors believe that although the phenolic resin has the above-mentioned excellent properties, the bakelite powder material prepared from the phenolic resin as a raw material has the defect of weak impact resistance due to its hard material and poor toughness.
Disclosure of Invention
In order to enhance the shock resistance of the bakelite powder material, the application provides the bakelite powder material for manufacturing the commutator.
The application provides an bakelite powder material for commutator preparation adopts following technical scheme:
the bakelite powder material for manufacturing the commutator is prepared from the following raw materials in parts by weight: 40-60 parts of polyether polyurethane modified phenolic resin, 20-30 parts of bamboo powder, 10-20 parts of filler, 5-15 parts of vinyl triamine, 2-6 parts of organic tin stabilizer and 1-3 parts of color master batch.
By adopting the technical scheme, as the polyether polyurethane modified phenolic resin is adopted, the polyether polyurethane molecule consists of the aromatic diisocyanate chain segment and the polyether chain segment which are alternately arranged, the aromatic diisocyanate chain segment is a rigid short chain segment, has certain crystallinity and can generate transverse cross-linking, and does not deform under the action of stress, so that the polyether polyurethane fiber has certain rigidity; the polyether chain segment is a soft long chain segment, does not have crystallinity, and is easy to deform under the action of stress, so that the polyether polyurethane has good tensile property; therefore, the polyether polyurethane is added with the polyether segment on the basis of the polyurethane, so that the phenolic resin has more excellent tensile toughness, and the polyether polyurethane is selected as a phenolic resin modifier, so that the toughness of the phenolic resin is favorably and obviously improved, and the impact resistance of the phenolic resin is improved, and therefore, the effect of obviously improving the impact resistance of the bakelite powder material is obtained.
Preferably, the preparation method of the polyether polyurethane modified phenolic resin comprises the following steps: 1) Heating phenolic resin to a molten state, crushing polyether polyurethane, adding the crushed polyether polyurethane into the phenolic resin molten liquid, and uniformly stirring; 2) Adding silicon dioxide powder and sodium lignosulphonate powder into the molten liquid, and stirring and mixing uniformly; 3) And extruding and molding the mixed molten liquid to obtain the polyether polyurethane modified phenolic resin.
By adopting the technical scheme, the silicon dioxide has good anti-shrinkage performance, and the silicon dioxide is added in the process of preparing the modified phenolic resin, so that the anti-shrinkage performance of the phenolic resin is favorably improved, and the anti-shrinkage performance of electronic devices such as a commutator and the like prepared by using the bakelite powder material is improved.
Because the silicon dioxide is an inorganic material, the sodium lignosulfonate is added for improving the dispersibility and compatibility of the silicon dioxide in the organic molten liquid, so that the stability of the prepared polyether polyurethane modified phenolic resin is ensured.
Preferably, polyacrylate fibers are further added in the step 2).
By adopting the technical scheme, the polyacrylate fiber is a synthetic fiber spun by a complex formed by polyacrylate and metal, has good toughness and unique metal impact resistance, is favorable for further improving the impact resistance toughness of the phenolic resin by adding the polyacrylate fiber in the process of preparing the modified phenolic resin, improves the defect that the polyacrylate fiber is easy to agglomerate in organic molten liquid by adding sodium lignosulfonate, has a certain synergistic effect, and is favorable for enhancing the stability of the polyether polyurethane modified phenolic resin.
Preferably, the preparation method of the polyacrylate fiber comprises the following steps: 1) Dissolving polyacrylate in ethyl acetate, and stirring uniformly; 2) Uniformly mixing the LCP emulsion and the polyacrylate dissolving solution, and extruding into strips; 3) Spinning the strips to obtain the polyacrylate fibers.
By adopting the technical scheme, the LCP has a structure of wholly aromatic polyester and copolyester, so that the polyacrylate fiber has good high temperature resistance, impact resistance and dimensional stability, and the LCP is added in the process of preparing the polyacrylate fiber, so that the impact resistance and shrinkage resistance of the polyacrylate are improved, and the impact resistance and shrinkage resistance of electronic devices such as commutators and the like prepared from the bakelite powder are improved.
Preferably, the bakelite powder material further comprises polyoxymethylene.
By adopting the technical scheme, the polyformaldehyde analysis structure contains more ether bonds and has good compatibility with inorganic materials, and because the bakelite powder material contains a large amount of bamboo wood powder, the added polyformaldehyde plays a bridging role in improving the compatibility between the inorganic raw materials and the organic raw materials in the bakelite powder material. In addition, the polyformaldehyde also has a good reinforcing effect, and the strength performance of the bakelite powder material is favorably improved.
Preferably, the filler comprises the following components in parts by weight: 15 to 25 portions of asbestos, 10 to 18 portions of mica powder, 8 to 16 portions of hydrated lime, 12 to 20 portions of magnesium hydroxide and 7 to 13 portions of fly ash.
By adopting the technical scheme, the asbestos and the mica powder have excellent high tensile strength, chemical and thermal erosion resistance and electrical insulation; magnesium hydroxide has good flame retardancy; the raw materials are mixed to prepare the filler, which is beneficial to improving the electrical insulation property, tensile strength and other properties of the bakelite powder material. .
Preferably, the filler further comprises titanium gypsum.
By adopting the technical scheme, the titanium gypsum, the fly ash and the hydrated lime react to generate the ettringite which has certain expansibility, and the ettringite is filled between gaps of raw materials at the initial stage of preparing the bakelite powder material, so that the stability of the bakelite powder material is improved due to the expansibility, and the anti-shrinkage property of the bakelite powder material is improved.
In summary, the present application has the following beneficial effects:
1. because this application adopts polyether polyurethane modified phenolic resin, and polyether polyurethane adds the polyether section on polyurethane's basis, makes it have more excellent tensile toughness, chooses polyether polyurethane as the phenolic resin modifier for use, is favorable to showing the toughness that promotes phenolic resin to promote phenolic resin's shock resistance, consequently, obtain the effect that bakelite powder material shock resistance is showing and promotes.
2. According to the application, silicon dioxide is added in the process of preparing the polyether polyurethane modified phenolic resin, and the silicon dioxide has good anti-shrinkage performance, so that the anti-shrinkage performance of the phenolic resin is favorably improved, and the anti-shrinkage performance of electronic devices such as a commutator and the like prepared by using bakelite powder materials is improved.
3. According to the application, the polyacrylate fiber is added in the process of preparing the polyether polyurethane modified phenolic resin, so that the impact toughness of the phenolic resin is further favorably improved, the defect that the polyacrylate fiber is easy to agglomerate in an organic molten liquid is overcome due to the addition of the sodium lignosulfonate, and the polyacrylate fiber and the organic molten liquid have a certain synergistic effect and are favorable for enhancing the stability of the polyether polyurethane modified phenolic resin.
4. LCP is added to this application at the in-process of preparation polyacrylate fibre, is favorable to promoting polyacrylate's shock resistance and anti shrink nature to promote the shock resistance and the anti shrink nature of electronic devices such as commutator by the preparation of bakelite powder material.
5. This application still adds polyformaldehyde in the bakelite powder material, and polyformaldehyde plays the bridging effect to promoting the compatibility between inorganic raw materials and the organic raw materials in the bakelite powder material. In addition, the polyformaldehyde also has a good reinforcing effect, and the strength performance of the bakelite powder material is favorably improved.
6. Titanium gypsum is added into the bakelite powder material, and the titanium gypsum reacts with fly ash and hydrated lime to generate ettringite, and at the initial stage of preparing the bakelite powder material, the ettringite is filled between the gaps of the raw materials, so that the stability of the bakelite powder material is improved due to the expansibility of the calciphylite material, and the anti-shrinkage performance of the bakelite powder material is improved, and electronic devices such as commutators prepared by taking the bakelite powder material as the raw material also have good anti-shrinkage performance.
Detailed Description
The present application will be described in further detail with reference to examples.
Examples
Example 1
The bakelite powder material for manufacturing the commutator is prepared from the following raw materials in parts by weight: 40 parts of polyether polyurethane modified phenolic resin, 20 parts of bamboo powder, 10 parts of filler, 5 parts of vinyl triamine, 2 parts of organic tin stabilizer and 1 part of color master batch.
The preparation method of the polyether polyurethane modified phenolic resin comprises the following steps: 1) Heating phenolic resin to a molten state, crushing polyether polyurethane, and adding the crushed polyether polyurethane into the phenolic resin molten liquid, wherein the mass ratio of the polyether polyurethane to the phenolic resin is 1:5, stirring uniformly; 2) Adding silicon dioxide powder and sodium lignosulfonate powder into the molten liquid, wherein the mass ratio of the silicon dioxide powder to the sodium lignosulfonate to the polyether polyurethane is 0.54:0.15:1.2, stirring and mixing uniformly; 3) And extruding and molding the mixed molten liquid to obtain the polyether polyurethane modified phenolic resin.
The filler comprises the following components in parts by weight: 15 parts of asbestos, 10 parts of mica powder, 8 parts of hydrated lime, 12 parts of magnesium hydroxide and 7 parts of fly ash.
Example 2
The bakelite powder material for manufacturing the commutator is prepared from the following raw materials in parts by weight: 50 parts of polyether polyurethane modified phenolic resin, 25 parts of bamboo wood powder, 15 parts of filler, 10 parts of vinyl triamine, 4 parts of organic tin stabilizer and 2 parts of color master batch.
The preparation method of the polyether polyurethane modified phenolic resin comprises the following steps: 1) Heating phenolic resin to a molten state, crushing polyether polyurethane, and adding the crushed polyether polyurethane into phenolic resin molten liquid, wherein the mass ratio of the polyether polyurethane to the phenolic resin is 1:5, stirring uniformly; 2) Adding silicon dioxide powder and sodium lignosulfonate powder into the molten liquid, wherein the mass ratio of the silicon dioxide powder to the sodium lignosulfonate to the polyether polyurethane is 0.54:0.15:1.2, stirring and mixing uniformly; 3) And extruding and molding the mixed molten liquid to obtain the polyether polyurethane modified phenolic resin.
The filler comprises the following components in parts by weight: 15 parts of asbestos, 10 parts of mica powder, 8 parts of hydrated lime, 12 parts of magnesium hydroxide and 7 parts of fly ash.
Example 3
The bakelite powder material for manufacturing the commutator is prepared from the following raw materials in parts by weight: 60 parts of polyether polyurethane modified phenolic resin, 30 parts of bamboo wood powder, 20 parts of filler, 15 parts of vinyl triamine, 6 parts of organic tin stabilizer and 3 parts of color master batch.
The preparation method of the polyether polyurethane modified phenolic resin comprises the following steps: 1) Heating phenolic resin to a molten state, crushing polyether polyurethane, and adding the crushed polyether polyurethane into phenolic resin molten liquid, wherein the mass ratio of the polyether polyurethane to the phenolic resin is 1:5, stirring uniformly; 2) Adding silicon dioxide powder and sodium lignosulfonate powder into the molten liquid, wherein the mass ratio of the silicon dioxide powder to the sodium lignosulfonate to the polyether polyurethane is 0.54:0.15:1.2, stirring and mixing uniformly; 3) And extruding and molding the mixed molten liquid to obtain the polyether polyurethane modified phenolic resin.
The filler comprises the following components in parts by weight: 15 parts of asbestos, 10 parts of mica powder, 8 parts of slaked lime, 12 parts of magnesium hydroxide and 7 parts of fly ash.
Example 4, this example differs from example 2 in that:
the filler comprises the following components in parts by weight: 20 parts of asbestos, 14 parts of mica powder, 12 parts of hydrated lime, 16 parts of magnesium hydroxide and 10 parts of fly ash.
Example 5, this example differs from example 2 in that:
the filler comprises the following components in parts by weight: 25 parts of asbestos, 18 parts of mica powder, 16 parts of slaked lime, 20 parts of magnesium hydroxide and 13 parts of fly ash.
Example 6, this example differs from example 2 in that:
the preparation method of the polyether polyurethane modified phenolic resin comprises the following steps: 1) Heating phenolic resin to a molten state, crushing polyether polyurethane, and adding the crushed polyether polyurethane into phenolic resin molten liquid, wherein the mass ratio of the polyether polyurethane to the phenolic resin is 1:5, stirring uniformly; 2) Adding silicon dioxide powder, polyacrylate fiber and sodium lignosulfonate powder into the molten liquid, wherein the mass ratio of the silicon dioxide powder to the polyacrylate fiber to the sodium lignosulfonate to the polyether polyurethane is 0.54:0.67:0.15:1.2, stirring and mixing uniformly; 3) And extruding and molding the mixed molten liquid to obtain the polyether polyurethane modified phenolic resin.
The preparation method of the polyacrylate fiber comprises the following steps: 1) Dissolving polyacrylate in ethyl acetate, wherein the mass ratio of the polyacrylate to the ethyl acetate is 1; 2) Uniformly mixing the LCP emulsion and the polyacrylate dissolving solution, wherein the mass ratio of the LCP emulsion to the polyacrylate is 0.4; 3) Spinning the strips to obtain the polyacrylate fibers.
Example 7, this example differs from example 6 in that:
the bakelite powder material also comprises 6 parts of polyformaldehyde.
Example 8, this example differs from example 7 in that:
the filler also comprises 16 parts of titanium gypsum.
Comparative examples
Comparative example 1, this comparative example differs from example 2 in that:
the preparation method of the polyether polyurethane modified phenolic resin comprises the following steps: 1) Heating phenolic resin to a molten state, crushing polyether polyurethane, and adding the crushed polyether polyurethane into phenolic resin molten liquid, wherein the mass ratio of the polyether polyurethane to the phenolic resin is 1:5, stirring uniformly; 2) And extruding and molding the mixed molten liquid to obtain the polyether polyurethane modified phenolic resin.
Comparative example 2, this comparative example differs from example 6 in that:
no LCP was added during the preparation of the polyacrylate fibers.
Comparative example
Comparative example 1
The bakelite powder material for manufacturing the commutator is prepared from the following raw materials in parts by weight: 50 parts of phenolic resin, 25 parts of bamboo wood powder, 15 parts of filler, 10 parts of vinyl triamine, 4 parts of organic tin stabilizer and 2 parts of color master batch.
The filler comprises the following components in parts by weight: 20 parts of asbestos, 14 parts of mica powder, 12 parts of hydrated lime, 16 parts of magnesium hydroxide and 10 parts of fly ash.
Performance test
The bakelite powder materials of examples 1 to 8, comparative examples 1 to 2 and comparative example 1 were sampled, respectively, and the samples were tested for impact resistance and shrinkage resistance, and the test results are reported in table 1.
TABLE 1-test data for various properties of Bakelite powder materials
Figure BDA0003061328070000091
It can be seen from the combination of examples 1 to 3 and table 1 that the raw materials of the bakelite powder material are controlled within a proper range, and the bakelite powder material has excellent impact resistance and shrinkage resistance.
It can be seen from the combination of examples 1 to 3 and comparative example 1 and table 1 that the modification of the phenolic resin with the polyether polyurethane has a significant improvement effect on the improvement of the impact toughness and the shrinkage resistance of the bakelite powder material, because the polyether polyurethane is embedded in the analytical structure, and the polyether chain segment is a soft long chain segment, has no crystallinity, is easy to deform under the action of stress, and enables the polyether polyurethane to have good tensile properties.
In combination with examples 2, 4 and 5 and table 1, it can be seen that the amount of other raw materials except for the filler is not changed, and the change of the amount of each component of the filler also affects the impact resistance and the shrinkage resistance of the bakelite powder, and the amount of the filler in example 4 is the best in the three groups of examples 2, 4 and 5.
By combining examples 2 and 4 and comparative example 1 and table 1, it can be seen that the impact resistance and shrinkage resistance of the bakelite powder material are reduced to some extent without adding silica and sodium lignosulfonate in the process of preparing the polyether polyurethane modified phenolic resin, which indicates that the bakelite powder material and the bakelite powder material have certain promotion effects on the improvement performance.
It can be seen by combining example 4 and example 6 and table 1 that the impact resistance and shrinkage resistance of the bakelite powder material are significantly improved by adding the polyacrylate fiber in the process of preparing the polyether polyurethane modified phenolic resin, because the polyacrylate fiber is a synthetic fiber spun by a complex formed by polyacrylate and metal, and has good toughness and unique metal impact resistance, and the polyacrylate fiber and the polyether polyurethane modified phenolic resin have good synergistic effect and have promotion effect on the improvement of the performance of the bakelite powder material.
It can be seen from the combination of examples 4 and 6 and comparative example 2 and table 1 that the addition of LCP in the preparation of polyacrylate fiber has a certain promoting effect on the improvement of impact resistance and shrinkage resistance of bakelite powder material, because LCP has a structure of wholly aromatic polyester and copolyester, and thus has good high temperature resistance, impact resistance and dimensional stability.
It can be seen from the combination of examples 6 and 7 and table 1 that the shrinkage resistance and impact resistance of the bakelite powder material can be improved to a certain extent by adding polyformaldehyde into the bakelite powder material.
It can be seen from the combination of examples 7 and 8 and table 1 that the impact resistance and shrinkage resistance of the bakelite powder material are improved by adding the titanium gypsum into the filler, which indicates that the titanium gypsum reacts with the fly ash and the hydrated lime to generate ettringite, and the ettringite is filled in gaps of raw materials in the initial stage of preparing the bakelite powder material, so that the shrinkage resistance of the bakelite powder material is improved due to the expansibility of the ettringite.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.

Claims (6)

1. The bakelite powder material for manufacturing the commutator is characterized in that: the feed is prepared from the following raw materials in parts by weight: 40-60 parts of polyether polyurethane modified phenolic resin, 20-30 parts of bamboo powder, 10-20 parts of filler, 5-15 parts of vinyl triamine, 2-6 parts of organic tin stabilizer and 1-3 parts of color master batch;
the preparation method of the polyether polyurethane modified phenolic resin comprises the following steps: 1) Heating phenolic resin to a molten state, crushing polyether polyurethane, adding the crushed polyether polyurethane into the phenolic resin molten liquid, and uniformly stirring; 2) Adding silicon dioxide powder and sodium lignosulphonate powder into the molten liquid, and stirring and mixing uniformly; 3) And extruding and molding the mixed molten liquid to obtain the polyether polyurethane modified phenolic resin.
2. The bakelite powder material for manufacturing the commutator according to claim 1, which is characterized in that: polyacrylate fibers are also added in the step 2).
3. The bakelite powder for commutator manufacture according to claim 2, characterized in that: the preparation method of the polyacrylate fiber comprises the following steps: 1) Dissolving polyacrylate in ethyl acetate, and stirring uniformly; 2) Mixing LCP emulsion and polyacrylate solution uniformly, and extruding into strips; 3) Spinning the strips to obtain the polyacrylate fibers.
4. The bakelite powder material for manufacturing the commutator according to claim 1, which is characterized in that: the bakelite powder material also comprises polyoxymethylene.
5. The bakelite powder for commutator manufacture according to claim 1, characterized in that: the filler comprises the following components in parts by weight: 15 to 25 portions of asbestos, 10 to 18 portions of mica powder, 8 to 16 portions of hydrated lime, 12 to 20 portions of magnesium hydroxide and 7 to 13 portions of fly ash.
6. The bakelite powder for commutator manufacture according to claim 5, wherein: the filler also includes titanium gypsum.
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JP5226294B2 (en) * 2007-12-25 2013-07-03 帝人化成株式会社 Polycarbonate resin composition
CN103804851B (en) * 2014-02-17 2015-09-02 广西信和新合成材料有限公司 Commutator injection molding phenolaldehyde moulding compound
CN105314998B (en) * 2014-07-29 2017-07-11 金承黎 A kind of entringite colloid is thermal insulation mortar of template and preparation method thereof
CN105036140B (en) * 2015-06-29 2017-05-24 安徽确成硅化学有限公司 Method for reducing viscosity of silicon dioxide slurry
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