CN113333168A - Air purification device and method - Google Patents
Air purification device and method Download PDFInfo
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- CN113333168A CN113333168A CN202110543373.3A CN202110543373A CN113333168A CN 113333168 A CN113333168 A CN 113333168A CN 202110543373 A CN202110543373 A CN 202110543373A CN 113333168 A CN113333168 A CN 113333168A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C11/00—Separation by high-voltage electrical fields, not provided for in other groups of this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C3/00—Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
- B03C3/34—Constructional details or accessories or operation thereof
- B03C3/74—Cleaning the electrodes
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- Electrostatic Separation (AREA)
Abstract
The invention discloses an air purification device and method, comprising the following steps: the body, polarization module and adsorption module, polarization module are used for the polarization lotus of dirty air, include: the corona wire and the conductive plate are arranged in parallel; the adsorption module is used for the absorption purification of dirty air, includes: the semiconductor device comprises a plurality of semiconductor plastic sheets and a semiconductor plastic sheet, wherein the semiconductor plastic sheets are arranged at intervals by insulating supports, and the semiconductor plastic sheet has a resistivity of 106‑1010Omega/cm of an integrally formed semiconductor plastic structure with uniform resistivity. The following effects are achieved: (1) the voltage is stable, the generated ozone is less, and the air purification and dust removal effects are good; (2) the semiconductor plastic sheet with the same resistivity formed in one step is used, the process is simple, and the product with a complex structure can be processed; (3) the corrosion resistance is good, and the service life is long; (4) secondary processing is not needed, waste is less, and delivery is rapid; (5) the production loss is small, the production cost is reduced, and the industrial popularization is facilitated. (6) And the spark discharge is avoided.
Description
Technical Field
The invention relates to an application of a semiconductor material in the field of air purification, in particular to an air purification device and an air purification method.
Background
A small amount of free electrons and ions exist in the air, under the action of an electric field generated by a polarization section and a dust collecting electrode in an air purification device, after voltage is loaded on a tungsten wire of the polarization section, air molecules near the tungsten wire can be polarized (ionized), polarized charged polar particles can be attached to dust particles flowing through the air, the dust particles are charged (charged), and when the charged dust particles flow through an adsorption section, the charged dust particles are adsorbed to a pole piece with opposite electric polarities under the action of the electric field force, so that the adsorption and purification process is completed.
The adsorption module used by the electrostatic purifier in the industry at present is a parallel polar plate made of metal, needs high voltage and is easy to generate ozone and generate discharge ignition phenomenon; or the conducting material (including conducting plastic, metal or other materials) is coated with insulating material or sprayed with electrically insulating material to form a sandwich structure of the multilayer composite material, because the voltage of the conducting material can act on air after penetrating through the coated insulating layer, the required voltage is higher, the stability of a high-voltage power supply is greatly influenced, and in addition, the sandwich structure of the multilayer composite material has the defect that the insulating layer is easily damaged by water during water cleaning, the insulating layer permeates into the conducting layer and the multilayer composite material fails. Furthermore, the sandwich structure is prone to delamination over time, and the insulating layer is more prone to aging under the influence of high voltage, affecting the lifetime and increasing the risk of cleaning damage.
Therefore, how to develop an air purification device and method becomes a technical problem to be solved urgently.
Disclosure of Invention
The invention provides an air purification device and method, and aims to solve the technical problems that stable voltage, low ozone, good dust removal effect and no ignition discharge cannot be realized.
In order to solve the above technical problem, the present invention discloses an air purification device, comprising: the body still includes: a polarization module and an adsorption module, wherein,
the polarization module is used for polarization charge of dust-laden air, and comprises: the corona wire and the conductive plate are arranged in parallel;
the adsorption module is used for the adsorption and purification of dust-containing air, and comprises: the semiconductor device comprises a plurality of semiconductor plastic sheets and a semiconductor plastic sheet, wherein the semiconductor plastic sheets are arranged at intervals by insulating supports, and the semiconductor plastic sheet has the resistivity of 106-1010Omega/cm of an integrally formed semiconductor plastic structure with uniform resistivity.
Further, the electric connection device is electrically connected with the semiconductor plastic sheets, the electric polarities of the two adjacent semiconductor plastic sheets are opposite, and the electric connection devices are connected in parallel on the same side with the same polarity.
Furthermore, odd-numbered pieces of the semiconductor plastic pieces are grounded in parallel, even-numbered pieces of the semiconductor plastic pieces are connected in parallel with a direct-current high-voltage power supply, when the direct-current high-voltage power supply applies voltage to the polarization module and the even-numbered semiconductor plastic pieces of the adsorption module respectively, an electric field is generated between the even-numbered pieces and the odd-numbered pieces of the semiconductor plastic pieces, air particles charged by the polarization module are adsorbed onto the semiconductor plastic pieces under the action of the electric field force, and the purpose of air purification is achieved.
Furthermore, the semiconductor plastic sheets are arranged at intervals in a rectangular structure or a ring structure, and the distance between every two adjacent semiconductor plastic sheets is 0.5-5 mm.
Further, the semiconductor plastic sheet is prepared by mixing resin serving as a base material and a conductive additive through a plastic molding process; the substrate comprises: PP, ABS, PC, PA, PPE; the conductive additive includes: conductive carbon black, metal powder, carbon fiber, nano-scale conductive microfiber.
Further, the thickness of the semiconductor plastic sheet is 0.15 mm-1.5 mm; the width of the semiconductor plastic sheet is 8 mm-120 mm.
Further, the air purification device is an air purifier and an air conditioner.
The invention also provides an air purification method, which comprises the following steps:
enabling the dust-containing air to pass through a polarization module which is provided with a corona wire and a conductive plate in parallel, and enabling the dust-containing air to be polarized and charged under the action of a high-voltage electric field;
the polarized charged dust-containing air is provided with a resistivity of 10 at intervals6-1010An adsorption module of a uniform semiconductor plastic sheet of omega/cm;
the charged dust in the air is adsorbed on the semiconductor plastic sheet under the action of the electric field, so that the dust removal and purification of the air are realized.
Further, the method also comprises the following steps;
and when the direct-current high-voltage power supply applies voltage to the even semiconductor plastic sheets of the polarization module and the adsorption module respectively, an electric field is generated between the even semiconductor plastic sheets and the odd semiconductor plastic sheets, air particles charged by the polarization module are adsorbed onto the semiconductor plastic sheets under the action of the electric field force, and finally the aim of purifying air is achieved.
Further, the method also comprises the following steps:
the direct-current high-voltage power supply applies direct-current high voltage of 6000 volts to 7000 volts to the polarization module and applies direct-current high voltage of 2000 volts to 4000 volts to the adsorption module.
Compared with the prior art, the air purification device and the method provided by the invention achieve the following effects:
(1) the adsorption module needs low adsorption voltage, so the voltage is stable, the generated ozone is less, and the air purification and dust removal effects are good;
(2) the adsorption module uses a once-formed semiconductor plastic sheet with the same resistivity, the process is simple, and a product with a complex structure can be processed;
(3) the adsorption module has good corrosion resistance and long service life, and the uniform semiconductor plastic ensures the feasibility and convenience of cleaning and is convenient for repeated use;
(4) secondary processing is not needed, waste is less, and delivery is rapid;
(5) the production loss is small, the production cost is reduced, and the industrial popularization is facilitated.
(6) In view of the characteristics of semiconductor materials, the adsorption module can not be ignited and discharged after being applied with voltage, and is safe even if being accidentally touched, so that the safety problem of electrostatic (such as metal electrostatic) civil products is solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a perspective view of an air cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a perspective view of an air cleaning device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an adsorption module of an air purification apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an adsorption module of an air purification apparatus according to an embodiment of the present invention.
Detailed Description
As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, and a person skilled in the art can solve the technical problem within a certain error range to substantially achieve the technical effect. The following description is of the preferred embodiment for carrying out the invention, and is made for the purpose of illustrating the general principles of the invention and not for the purpose of limiting the scope of the invention. The scope of the present invention is defined by the appended claims.
The present invention will be described in further detail below with reference to the accompanying drawings, but the present invention is not limited thereto.
Example 1
As shown in fig. 1 to 4, the present embodiment provides an air cleaning device including: the body, its characterized in that still includes: a polarization module 100 and an adsorption module 200, wherein,
the polarization module 100 is used for polarization charge of dust-containing air, and comprises: a corona wire 101 and a conductive plate 102 arranged in parallel;
the adsorption module 200 is used for adsorbing and purifying dust-containing air, and comprises: the semiconductor device comprises a plurality of semiconductor plastic sheets 204 and semiconductor plastic sheets 201, wherein the semiconductor plastic sheets 201 are arranged at intervals by insulating supports 202, and the semiconductor plastic sheets 201 have the resistivity of 106-1010Omega/cm of an integrally formed semiconductor plastic structure with uniform resistivity.
Preferably, the connecting device 204 is electrically connected to the semiconductor plastic sheets 201, two adjacent semiconductor plastic sheets 201 have opposite electric polarities, and the same polarity is connected in parallel by the connecting device 204 on the same side.
Preferably, odd-numbered semiconductor plastic sheets 201 are grounded in parallel, even-numbered semiconductor plastic sheets 201 are connected in parallel to a direct-current high-voltage power supply, when the direct-current high-voltage power supply applies voltage to the even-numbered semiconductor plastic sheets 201 of the polarization module 100 and the adsorption module 200, an electric field is generated between the even-numbered semiconductor plastic sheets 201 and the odd-numbered semiconductor plastic sheets, and charged air particles of the polarization module 100 are adsorbed onto the semiconductor plastic sheets 201 under the action of the electric field force, so that the purpose of air purification is achieved.
Preferably, the semiconductor plastic sheets 201 are arranged at intervals in a rectangular structure or a ring structure, and the distance between two adjacent sheets is 0.5mm to 5 mm.
Preferably, the semiconductor plastic sheet 201 is made by mixing resin as a base material and a conductive additive through a plastic molding process; the substrate comprises: PP, ABS, PC, PA, PPE; the conductive additive includes: conductive carbon black, metal powder, carbon fiber, nano-scale conductive microfiber.
Preferably, the thickness of the semiconductor plastic sheet 201 is 0.15mm to 1.5 mm; the width of the semiconductor plastic sheet 201 is 8 mm-120 mm. Preferably, the air purification device is an air purifier or an air conditioner.
Example 2
As shown in fig. 1 to 4, the present embodiment provides an air cleaning device including: the body still includes: a polarization module 100 and an adsorption module 200, wherein,
the polarization module 100 is used for polarization charge of dust-containing air, and comprises: a corona wire 101 and a conductive plate 102 arranged in parallel;
the adsorption module 200 is used for adsorbing and purifying dust-containing air, and comprises: the semiconductor device comprises a plurality of semiconductor plastic sheets 204 and semiconductor plastic sheets 201, wherein the semiconductor plastic sheets 201 are arranged at intervals by insulating supports 202, and the semiconductor plastic sheets 201 have the resistivity of 106-1010Omega/cm of an integrally formed semiconductor plastic structure with uniform resistivity.
Specifically, the polarization module 100 is used for electrically polarizing the air flowing through, so as to electrically charge (charge) dust particles in the air, and the polarization module 100 is disposed at the front end of the air flow direction and is combined with the adsorption module 200 in series. The polarization module 100 includes corona wires 101 and conductive plates 102, the corona wires 101 and the conductive plates 102 are arranged in parallel at a certain interval, all the corona wires 101 are one pole, and all the conductive plates 102 are the other corresponding pole. The corona wire 101 may be a tungsten wire, and the conductive plate 102 may be a metal plate or a conductive plastic plate.
The adsorption module 200 is formed by arranging semiconductor plastic sheets 201 at intervals, odd-numbered sheets are connected in parallel and grounded, even-numbered sheets are connected in parallel and connected with a direct-current high-voltage power supply, when the direct-current high-voltage power supply applies voltage to the even-numbered semiconductor plastic sheets 201 of the polarization module 100 and the adsorption module 200 respectively, an electric field is generated between the even-numbered sheets and the odd-numbered sheets of the semiconductor plastic sheets 201, air particles charged by the polarization module 100 are adsorbed onto the semiconductor plastic sheets 201 under the action of the electric field force, and finally the purpose of purifying air is achieved. The direct-current high-voltage power supply module applies direct-current high voltage of 6000 volts to 7000 volts to the polarization module 100 and applies direct-current high voltage of 2000 volts to 4000 volts to the adsorption module 200.
The adsorption module 200 includes a semiconductor plastic sheet 201, an insulating support 202, a connector 204, and a frame 203.
The semiconductor plastic sheet 201 has a resistivity of 106-1010The semiconductor plastic structure with uniform resistivity is integrally formed by an omega/cm plastic forming process, and the semiconductor plastic structure with uniform resistivity is integrally formed by a plastic forming process and has the same resistivity. Specifically, the resistivity of each of the semiconductor plastic sheets 201 may be 106、107、108、109、1010Omega/cm, etc. Compared with other conductive materials or composite materials, the semiconductor plastic sheet 201 can be processed and molded at one time, and is simple in processing technology and convenient for batch production; and the main components can be recycled, and the expensive demoulding treatment is not needed for the coating or the conducting layer plated with the metal layer, so that the recycling problem is thoroughly solved.
The semiconductor plastic sheet 201 is a functional polymer material which is processed by a plastic processing method (for example, extrusion) by mixing a resin as a base material and a conductive additive. It can achieve a large variation from insulator to semiconductor to conductor. Compared with the traditional material, the material has the characteristics of light weight, easy molding, adjustable resistivity and the like. The substrate of the semiconductor plastic may include: PP, ABS, PC, PA, PPE, etc.; conductive additives include, but are not limited to: conductive carbon black, metal powder, carbon fiber, nano-scale conductive microfiber, and the like. Semiconductor plastics combine the electrical conductivity of metals (i.e., a certain voltage is applied across the material through which current flows) with the various properties of plastics (i.e., the material molecules are composed of many small, recurring structural units). In addition, when the same high voltage is loaded, the discharge ignition phenomenon can occur on the surface of the metal or the conductive plastic, and the metal or the conductive plastic is safe even if accidentally touched, so that the safety problem of electrostatic (such as metal static) civil products is solved. This is not the case for semiconductor plastic surfaces.
The thickness of the semiconductor plastic sheet 201 is 0.15 mm-1.5 mm, and the width is 8 mm-120 mm. Specifically, the thickness of the semiconductor plastic sheet 201 may be 0.15mm, 0.2mm, 0.22mm, 0.25mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc.; the width of the semiconductor plastic sheet 201 may be 8mm, 10mm, 20mm, 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm, 100mm, 110mm, 120mm, etc.; the length of the semiconductor plastic sheet 201 is not specifically limited herein, and may be determined according to the product requirement in actual production.
As shown in fig. 3 and 4, the semiconductor plastic sheets 201 may be arranged at intervals in a rectangular structure or a ring structure, the ring structure includes a circular ring structure and a spiral ring structure, the distance between two adjacent sheets is 0.5mm to 5mm, and preferably, the distance between the semiconductor plastic sheets 201 is 1mm to 4 mm. Specifically, the distance between two adjacent semiconductor plastic sheets 201 with the same resistivity may be 0.5mm, 1mm, 2mm, 2.2mm, 2.5mm, 2.8mm, 3mm, 3.5mm, 4mm, 5mm or other values. In practical application, the distance between the semiconductor plastic sheets 201 with the same resistivity can be 2mm, so that high purification efficiency is ensured, and wind resistance is reduced.
Specifically, as shown in fig. 3, the semiconductor plastic sheets 201 may be arranged in a rectangular structure, and are sequentially stacked to form a rectangular arrangement, each two sheets are in a group, the distance between the two sheets is 0.5-5mm, the two sheets are stacked, the middle is separated by an insulating support 202, and the group is stacked continuously, and the distance is kept the same until the thickness required by the product is reached.
The semiconductor plastic sheet 201 may also be a strip-shaped structure, and is configured as an annular structure, such as a concentric circular ring-shaped or spiral annular structure (as shown in fig. 4), and the distance between two adjacent layers is uniformly set to be 0.5mm to 5mm, and the two adjacent layers are arranged and molded until the required size is reached.
In practical applications, the polarization module 100 for a circular purification module may be formed by bending a conductive plastic (or other flexible conductive material) sheet into circular rings with different diameters, and the adjacent circular rings are inserted and spaced by insulating plastic mesh plastic rings (with tungsten wires wound around the rings). The whole body is supported by a cross or a Chinese character 'mi' (or other types) to control the equal spacing and the insulation of the rings. The conducting wires on the supports are respectively connected with the conductive plastic sheets and the tungsten filaments, so that all the tungsten filaments are equipotential, and all the plastic sheets are equipotential. After the power is applied, an electric field is formed between the corona wire 101 and the conductive plastic sheet, and air is polarized and charged when passing through the electric field.
Based on the characteristics of the semiconductor plastic, the conductive performance of the semiconductor plastic sheet 201 of the adsorption module 200 is between the conductive plastic and the insulator, so the distance between the semiconductor plastic sheets 201 of the adsorption module 200 arranged at odd-even intervals can be much smaller than the electrode distance in the prior art, the phenomenon of voltage breakdown caused by small distance can not occur under the applied voltage, and the phenomenon of discharge can not occur when the semiconductor plastic sheets 201 arranged at odd-even intervals are in short circuit. Is safe even if accidentally touched, and eliminates the safety problem of electrostatic (e.g., metal static) consumer products. Therefore, the space between the odd-even pieces is smaller, the number of the adsorption pieces is increased, and the adsorption area is increased.
The insulating support 202 is a comb-shaped structure made of an insulating material or an insulating jelly-like structure. Specifically, the sectional area of the comb-shaped structure needle is from (1.5 mm-3 mm) × (1.5 mm-3 mm), the length of the needle is from 10 mm-50 mm, the thickness of the comb back part is from 1.5 mm-3 mm, and the height is not limited. The insulating support member 202 may also be made of a jelly including a hot melt adhesive, which is extruded between two adjacent conductive plastic sheets through hot melting, and forms a uniform support structure after cooling.
The connecting device 204 is electrically connected with the semiconductor plastic sheet 201, the semiconductor plastic sheets 201 with the same resistivity are arranged in pairs at intervals, two adjacent semiconductor plastic sheets 201 are opposite in electric polarity, and the same polarity is connected in parallel by the connecting device 204 on the same side. The connecting device 204 may be a conductive wire, a conductive pin, a conductive sheet, a conductive column, etc. formed by metal or other conductive substances, and the connecting device 204 is used for conducting and connecting the semiconductor plastic sheet 201 with the same polarity. Of course, the convex portions of the semiconductor plastic sheet 201 with the same polarity may be bent and then fused together by fusing. And after all the protrusions with the same polarity are arranged in the insulating cover, the conductive adhesive can be poured to realize electric connection. The two methods can also be combined, namely pouring conductive adhesive or inserting conductive wires, sheets, needles, rollers and the like after the convex parts with the same polarity are put into the insulating protective frame. The groove-shaped connecting device 204 can also be formed by injection molding of a conductive material (such as conductive plastic or metal), the protrusions with the same polarity are inserted into the tooth grooves to realize electric connection, and the conductive glue can be injected to strengthen the reliable conduction.
The frame 203 is used to provide structural support, insulation protection, and external electrical connection ports for the adsorption module 200, and may be formed by enclosing a U-shaped frame formed by U-shaped extrusion (but not limited thereto), and the enclosing direction is perpendicular to the air flowing direction.
The air purification device of this embodiment can be equipment such as air purifier, air conditioner.
Example 3
Based on the basis of embodiment 1 and embodiment 2, the present embodiment provides an air purification method, including the steps of:
enabling dust-containing air to pass through a polarization module 100 which is provided with a corona wire 101 and a conductive plate 102 in parallel, and enabling the dust-containing air to be polarized and charged under the action of a high-voltage electric field;
the polarized charged dust-containing air is provided with a resistivity of 10 at intervals6-1010 An adsorption module 200 of a uniform semiconductor plastic sheet 201 of Ω/cm;
the charged dust in the air is adsorbed to the semiconductor plastic sheet 201 under the action of the electric field, so that the dust removal and purification of the air are realized.
The odd number pieces of the semiconductor plastic pieces 201 are grounded in parallel, the even number pieces are connected in parallel to a direct-current high-voltage power supply, when the direct-current high-voltage power supply applies voltage to the even number pieces of the semiconductor plastic pieces 201 of the polarization module 100 and the adsorption module 200 respectively, an electric field is generated between the even number pieces and the odd number pieces of the semiconductor plastic pieces 201, air particles charged by the polarization module 100 are adsorbed onto the semiconductor plastic pieces 201 under the action of the electric field force, and finally the purpose of purifying air is achieved. Specifically, the semiconductor plastic sheets 201 are electrically connected with the connecting device 204, the semiconductor plastic sheets 201 are arranged in pairs at intervals, the electric polarities of the adjacent two sheets are opposite, and the same polarity is connected in parallel by the connecting device 204 on the same side.
The direct-current high-voltage power supply applies direct-current high voltage of 6000 volts to 7000 volts to the polarization module 100 and applies direct-current high voltage of 2000 volts to 4000 volts to the adsorption module 200. Specifically, the high-voltage electric field is set to 6000 v to 7000 v, and may be set to 6000 v, 6500 v, 6800 v, 7000 v, or the like. The voltage of the sorption module 200 is set to 2000 volts to 4000 volts. Specifically, 2000 volts, 2500 volts, 2800 volts, 3000 volts, 4000 volts, and the like may be set.
Arranging the semiconductor plastic sheets 201 into a rectangular structure or an annular structure (the annular structure comprises a circular ring structure and a spiral ring structure), setting the distance between two adjacent sheets to be 0.5-5mm, and separating the two adjacent sheets by an insulating support 202; the insulating support 202 is a comb-shaped structure made of an insulating material or an insulating jelly.
Setting the resistivity of the semiconductor plastic sheet 201 to 106-1010Omega/cm, the resistivity of each of the semiconductor plastic sheets 201 may be 106、107、108、109、1010Omega/cm, etc. The semiconductor plastic sheet 201 is: the semiconductor plastic structure is an integrally formed uniform semiconductor plastic structure which is formed by mixing resin serving as a base material and a conductive additive through a plastic forming process, and is integrally formed by the plastic forming process and has the same resistivity. The substrate comprises: PP, ABS, PC, PA, PPE; the conductive additive includes: conductive carbon black, metal powder, carbon fiber, nano-scale conductive microfiber.
Setting the thickness of the semiconductor plastic sheet 201 to be 0.15 mm-1.5 mm; the width of the semiconductor plastic sheet 201 is set to 8mm to 120 mm. Specifically, the thickness of the semiconductor plastic sheet 201 may be 0.15mm, 0.2mm, 0.22mm, 0.25mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc.; the width of the semiconductor plastic sheet 201 may be 8mm, 10mm, 20mm, 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm, 100mm, 110mm, 120mm, etc.; the length of the semiconductor plastic sheet 201 is not specifically limited herein, and may be determined according to the product requirement in actual production.
Compared with the prior art, the air purification device and the method provided by the invention achieve the following effects:
(1) the adsorption module needs low adsorption voltage, so the voltage is stable, the generated ozone is less, and the air purification and dust removal effects are good;
(2) the adsorption module uses a once-formed semiconductor plastic sheet with the same resistivity, the process is simple, and a product with a complex structure can be processed;
(3) the adsorption module has good corrosion resistance and long service life, and the uniform semiconductor plastic ensures the feasibility and convenience of cleaning and is convenient for repeated use;
(4) secondary processing is not needed, waste is less, and delivery is rapid;
(5) the production loss is small, the production cost is reduced, and the industrial popularization is facilitated.
(6) In view of the characteristics of semiconductor materials, the adsorption module can not be ignited and discharged after being applied with voltage, and is safe even if being accidentally touched, so that the safety problem of electrostatic (such as metal electrostatic) civil products is solved.
The foregoing description shows and describes several preferred embodiments of the invention, but as aforementioned, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An air purification device comprising: the body, its characterized in that still includes: a polarization module and an adsorption module, wherein,
the polarization module is used for polarization charge of dust-laden air, and comprises: the corona wire and the conductive plate are arranged in parallel;
the adsorption module is used for the adsorption and purification of dust-containing air, and comprises: the semiconductor device comprises a plurality of semiconductor plastic sheets and a semiconductor plastic sheet, wherein the semiconductor plastic sheets are arranged at intervals by insulating supports, and the semiconductor plastic sheet has the resistivity of 106-1010Omega/cm of an integrally formed semiconductor plastic structure with uniform resistivity.
2. The air purification apparatus of claim 1, wherein the electrical connection device is electrically connected to the semiconductor plastic sheets, two adjacent semiconductor plastic sheets have opposite electrical polarities, and the same polarity is connected in parallel by the electrical connection device on the same side.
3. The air purification device of claim 2, wherein odd-numbered pieces of the semiconductor plastic pieces are grounded in parallel, even-numbered pieces of the semiconductor plastic pieces are connected in parallel to a direct-current high-voltage power supply, when the direct-current high-voltage power supply applies voltages to the even-numbered semiconductor plastic pieces of the polarization module and the adsorption module respectively, an electric field is generated between the even-numbered pieces and the odd-numbered pieces of the semiconductor plastic pieces, and air particles charged by the polarization module are adsorbed onto the semiconductor plastic pieces under the action of the electric field force, so that the purpose of air purification is achieved.
4. The air purification device of claim 1, wherein the semiconductor plastic sheets are arranged at intervals in a rectangular structure or a ring structure, and the distance between two adjacent semiconductor plastic sheets is 0.5 mm-5 mm.
5. The air cleaning device according to claim 1, wherein the semiconductor plastic sheet is made by mixing a resin as a base material and a conductive additive through a plastic molding process; the substrate comprises: PP, ABS, PC, PA, PPE; the conductive additive includes: conductive carbon black, metal powder, carbon fiber, nano-scale conductive microfiber.
6. The air purification device of claim 1, wherein the semiconductor plastic sheet has a thickness of 0.15mm to 1.5 mm; the width of the semiconductor plastic sheet is 8 mm-120 mm.
7. The air purification apparatus according to claim 1, wherein the air purification apparatus is an air purifier, an air conditioner.
8. An air purification method, characterized by comprising the steps of:
enabling the dust-containing air to pass through a polarization module which is provided with a corona wire and a conductive plate in parallel, and enabling the dust-containing air to be polarized and charged under the action of a high-voltage electric field;
the polarized charged dust-containing air is provided with a resistivity of 10 at intervals6-1010An adsorption module of a uniform semiconductor plastic sheet of omega/cm;
the charged dust in the air is adsorbed on the semiconductor plastic sheet under the action of the electric field, so that the dust removal and purification of the air are realized.
9. The air purification method according to claim 8, further comprising the steps of;
and when the direct-current high-voltage power supply applies voltage to the even semiconductor plastic sheets of the polarization module and the adsorption module respectively, an electric field is generated between the even semiconductor plastic sheets and the odd semiconductor plastic sheets, air particles charged by the polarization module are adsorbed onto the semiconductor plastic sheets under the action of the electric field force, and finally the aim of purifying air is achieved.
10. The air purification method according to claim 9, further comprising the steps of:
the direct-current high-voltage power supply applies direct-current high voltage of 6000 volts to 7000 volts to the polarization module and applies direct-current high voltage of 2000 volts to 4000 volts to the adsorption module.
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| CN202110543373.3A CN113333168A (en) | 2021-05-19 | 2021-05-19 | Air purification device and method |
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| CN202110543373.3A CN113333168A (en) | 2021-05-19 | 2021-05-19 | Air purification device and method |
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