CN113314864A - Electronic device - Google Patents
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- CN113314864A CN113314864A CN202110541608.5A CN202110541608A CN113314864A CN 113314864 A CN113314864 A CN 113314864A CN 202110541608 A CN202110541608 A CN 202110541608A CN 113314864 A CN113314864 A CN 113314864A
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- China
- Prior art keywords
- main board
- terminal
- card
- upper cover
- electronic device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The application discloses an electronic device, which comprises a main board upper cover, a main board, a first card seat terminal, a first metal shell and a second card seat; first cassette terminal and first metal casing all locate on the mainboard upper cover, and first metal casing supports between mainboard and mainboard upper cover, first cassette terminal appears in the surface of mainboard upper cover towards the mainboard, the mainboard is located to the second cassette, the second cassette includes second cassette terminal, first cassette terminal and second cassette terminal set up relatively, and form card installation space between first cassette terminal and the second cassette terminal, this kind of mode of setting makes mainboard upper cover, first metal casing and first cassette terminal integration together, the structure of using the cassette subassembly as independent memory cell among the correlation technique has been abandoned, the multiplexing to mainboard upper cover has been realized, and then make electronic equipment further frivolous, miniaturization.
Description
Technical Field
The present application relates to the field of communication devices, and more particularly, to an electronic device.
Background
For electronic devices such as mobile phones, miniaturization, lightness and thinness are the development trend in the future, and for example, mobile phones are equipped with card holders for storing smart cards such as SIM cards and TF cards. In the related art, the two card socket housings are usually fastened to each other to form an independent storage unit disposed in the electronic device, but the thickness of the card socket housing cannot be further reduced in this structure, which will affect the development of further thinning and miniaturization of the electronic device on which the card socket assembly is mounted.
Disclosure of Invention
The invention provides electronic equipment, which aims to solve the problem that a card seat assembly limits the electronic equipment to be further developed to be light, thin and small.
In one aspect, the present application discloses an electronic device, including a motherboard upper cover, a motherboard, a first card socket terminal, a first metal housing, and a second card socket; the first card seat terminal and the first metal shell are arranged on the main board upper cover, the first metal shell is supported between the main board and the main board upper cover, the first card seat terminal is exposed on the surface of the main board upper cover facing the main board, the second card seat is arranged on the main board, the second card seat comprises a second card seat terminal, the first card seat terminal and the second card seat terminal are arranged oppositely, and a card mounting space is formed between the first card seat terminal and the second card seat terminal.
The invention has the following beneficial effects:
this application is through optimizing the electronic equipment structure, specifically for all directly locating the mainboard upper cover with first metal casing and first cassette terminal, this kind of mode mainboard upper cover that sets up, first metal casing and first cassette terminal are integrated together, have abandoned the storage structure as independent memory cell with the cassette subassembly, have realized the multiplexing to the mainboard upper cover, and then make further frivolousization, miniaturization of electronic equipment.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic illustration showing the first card socket terminal, the first metal sub-housing and the second metal sub-housing being disassembled from the main board upper cover according to the first embodiment of the present invention;
FIG. 2 is an assembled block diagram of FIG. 1 as disclosed in the first embodiment of the present invention;
FIG. 3 is a schematic illustration showing the detachment of the detection terminal, the rotation shaft, the first driving lever and the second driving lever in the upper cover of the motherboard according to the first embodiment of the present invention;
FIG. 4 is an assembled block diagram of FIG. 3 as disclosed in the first embodiment of the present invention;
fig. 5 is a schematic view of an overall structure of the second card holder and the main board according to the first embodiment of the present invention;
FIG. 6 is a schematic illustration showing a motherboard upper cover and a motherboard being disassembled according to a first embodiment of the present invention;
FIG. 7 is an assembled block diagram of FIG. 6 as disclosed in the first embodiment of the present invention;
FIG. 8 is an exploded view of FIG. 7 in accordance with the first embodiment of the present invention;
fig. 9 is a diagram illustrating a structure of a second card socket according to a second embodiment of the present invention;
fig. 10 is a schematic diagram of a first card socket, a second card socket and a motherboard according to a second embodiment of the disclosure;
fig. 11 is a diagram of an overall front structure of the first card socket, the second card socket and the main board according to the second embodiment of the present invention;
FIG. 12 is a rear view of the structure of FIG. 11 in accordance with the second embodiment of the present invention;
fig. 13 is an exploded view of fig. 11 as disclosed in a second embodiment of the present invention.
Description of reference numerals:
100-a first clamping seat,
110-a first mounting plate,
120-a first card socket terminal, 121-a first electric connection part, 122-a first electric connection elastic sheet,
130-first metal shell, 131-first metal sub-shell, 132-first metal sub-shell, 133-first connection end, 134-second connection end,
140-a detection terminal,
150-rotating shaft,
160-a first driving rod,
170-second driving rod,
200-a second clamping seat,
210-metal reinforcing shell, 211-third connecting end,
220-second card socket terminal, 221-second electric connection part, 222-second electric connection elastic sheet,
230-a second carrier plate,
300-a main board,
310-a holding space,
400-an upper cover of the main board,
401-third supporting part, 402-first supporting part, 403-second supporting part, 404-heat dissipation hole,
500-memory card.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The electronic device disclosed in the present application may be a smart phone, a video camera, etc., and in the related art, the electronic device with such a structure generally needs to be provided with a card socket assembly to store a memory card, so as to store related data required by the electronic device, such as a SIM card stored in the smart phone, etc. However, the overall thickness of the card-holder assembly will limit further reduction of the electronic device, so the present application realizes further reduction of the overall thickness of the electronic device by optimizing the electronic device and the card-holder assembly in the electronic device, which will be described in detail below.
Fig. 1 to 8 are first embodiments of thinning of an electronic device in the present application, in this example, structure optimization of mutual adaptation is mainly performed on a card seat assembly in the related art and a component for fixing the card seat assembly in the electronic device, so as to integrate them into a whole, and further implement thinning of the electronic device, and the specific setting manner is:
the electronic device may include a main board upper cover 400, a first card socket terminal 120 and a first metal housing 130, where the main board upper cover 400 is a mounting base of some components in the present application, and specifically, the first card socket terminal 120 and the first metal housing 130 may be both disposed on the main board upper cover 400, so that the first card socket terminal 120, the first metal housing 130 and the main board upper cover 400 form an integral structure.
The electronic device further includes a second card socket 200 and a main board 300, wherein the main board 300 is a mounting base for some parts in the electronic device, and specifically, the second card socket 200 may be disposed on the main board 300, so that the second card socket 200 and the main board 300 form another integral structure of the electronic device.
The two integral structures can be combined into a whole, and specifically, the first card socket terminal 120, the first metal shell 130 and the main board top cover 400 are integrated, and the second card socket 200 and the main board 300 are integrated and then mounted on the main board top cover 400. The first metal housing 130 is supported between the main board 300 and the main board top cover 400, and the first socket terminal 120 is exposed on a surface of the main board top cover 400 facing the main board 300.
Meanwhile, the second card socket 200 may include a second socket terminal 220. The first card holder terminal 120 and the second card holder terminal 220 are disposed opposite to each other, and a card mounting space is formed between the first card holder terminal 120 and the second card holder terminal 220. The card installation space can be used for storing the storage card 500, and the first card socket terminal 120 and the second card socket terminal 220 are connected with the two opposite sides of the storage card 500 through contact, so that the electronic equipment can input and output data to and from the storage card 500.
It can be seen that in the above embodiment, instead of installing the card socket assembly as an independent storage unit of the memory card 500 in the electronic device in the related art, the first card socket terminal 120 and the first metal housing 130 are integrated with the motherboard upper cover 400, and the second card socket 200 and the motherboard 300 are also integrated with the motherboard upper cover 400, so that the overall integration level is improved, and the electronic device is further thinned and thinned.
Furthermore, the first card socket terminal 120 and the first metal housing 130 can be both injection-molded on the main board upper cover 400 to ensure the overall firmness, and of course, the connection among the first card socket terminal 120, the first metal housing 130 and the main board upper cover 400 can also be performed by welding, integral setting, riveting and the like, which will not be described in detail herein.
Further, the first metal housing 130 may include a first metal sub-housing 131 and a second metal sub-housing 132. The first metal sub-housing 131 and the second metal sub-housing 132 are respectively disposed on two sides of the first card socket terminal 120, and are both supported between the main board 300 and the main board upper cover 400, so as to achieve a more stable supporting and fixing effect. Meanwhile, the arrangement enables the first card socket terminal 120, the first metal sub-housing 131 and the second metal sub-housing 132 to share the same stacking height in the main board upper cover 400, which is more beneficial to realizing the thinning of the electronic device.
For a specific structure of the first and second metal sub-housings 131 and 132, the first and second connection ends 133 and 134 may be respectively disposed at two opposite sides of the first metal sub-housing 131. The second connection end 134 may be a basic connection plate formed by bending, and the first connection end 133 may be a connection plate extending away from the second connection end 134.
The first metal sub-housing 131 may be connected to the main board 300 through the first connection end 133, for example, the first connection end 133 is connected to the main board 300 by a Surface Mount Technology (SMT) or is connected to the main board 300 by a DIP package. The first metal sub-housing 131 can be connected to the main board top cover 400 through the second connection end 134, for example, the second connection end 134 is connected to the main board top cover 400 by injection molding.
Similarly, the first connection end 133 and the second connection end 134 are respectively disposed on two opposite sides of the second metal sub-shell 132, the second metal sub-shell 132 is connected to the motherboard 300 through the first connection end 133, and the second metal sub-shell 132 is connected to the motherboard top cover 400 through the second connection end 134, which is not described in detail herein.
More specifically, the first socket terminal 120 may include a plurality of first electrical connection springs 122. The plurality of first electrical connection elastic pieces 122 are distributed in an array, the plurality of first electrical connection elastic pieces 122 protrude towards the motherboard 300, and the first electrical connection elastic pieces 122 are used for electrically connecting with the memory card 500 so as to perform data transmission on the memory card 500. Meanwhile, a heat dissipation hole 404 is formed in a region of the motherboard upper cover 400 opposite to the first electrical connection elastic piece 122 to dissipate heat of the first card socket terminal 120.
Similarly, the second socket terminal 220 may also include a plurality of second electrical connection resilient pieces 222. The plurality of second electrical connection elastic pieces 222 are distributed in an array, and the plurality of second electrical connection elastic pieces 222 correspond to the plurality of first electrical connection elastic pieces 122 one by one, and the plurality of second electrical connection elastic pieces 222 protrude toward the direction of the motherboard upper cover 400 so as to be electrically connected with the memory card 500, which is not described in detail herein.
More specifically, the main board cover 400 is provided with a first supporting portion 402 and a second supporting portion 403 protruding toward one side of the main board 300. The first card socket terminal 120 is located between the first support part 402 and the second support part 403, the first metal sub-housing 131 is located between the first card socket terminal 120 and the first support part 402, and the second metal sub-housing 132 is located between the first card socket terminal 120 and the second support part 403.
The above structure enables the first supporting portion 402 and the second supporting portion 403 to be supported and arranged between the main board 300 and the main board upper cover 400, for example, the first supporting portion 402 and the second supporting portion 403 are both supporting board structures and are both convexly arranged on the main board upper cover 400. Thus, the arrangement of the first supporting portion 402 and the second supporting portion 403, in cooperation with the arrangement of the first metal sub-housing 131 and the second metal sub-housing 132, can form a more stable supporting effect between the motherboard upper cover 400 and the motherboard 300, and better control the distance between the motherboard upper cover 400 and the motherboard 300, so that the memory card 500 can be plugged in the card installation space, and good contact between the memory card 500 and the first card-socket terminal 120 and the second card-socket terminal 220 can be ensured.
Furthermore, the side surface of the first supporting portion 402 and the side surface of the first metal sub-housing 131 can be attached to each other, and similarly, the side surface of the second supporting portion 403 and the side surface of the second metal sub-housing 132 can be attached to each other, so that the supporting effect can be better ensured.
Furthermore, in order to facilitate data transmission to the memory card 500, the first socket terminal 120 is provided with a first electrical connection portion 121, and the second socket terminal 220 is provided with a second electrical connection portion 221, wherein the first socket terminal 120 is electrically connected to the motherboard 300 through the first electrical connection portion 121, and the second socket terminal 220 is electrically connected to the motherboard 300 through the second electrical connection portion 221.
Specifically, the first electrical connection portion 121 and the second electrical connection portion 221 may be both pins, and the first electrical connection portion 121 or the second electrical connection portion 221 is plugged onto the motherboard 300 in a DIP package manner; or an electrical connection sheet is arranged on the motherboard 300, the first electrical connection portion 121 and the second electrical connection portion 221 are arranged in a lead structure, and the patch is welded on the motherboard 300 in an SMT mounting mode. Thus, the main board 300 can transmit electric energy to the first card socket terminal 120 and the second card socket terminal 220 respectively while being used as the mounting base of the second card socket 200, and the function multiplexing of the main board 300 is realized.
It should be noted that the main board top cover 400 may adopt an insulating plastic board structure, which is convenient for the first card socket terminal 120 and the first metal housing 130 to be connected to each other by injection molding, and meanwhile, the first card socket terminal 120 and the first metal housing 130 can be isolated from each other to prevent short circuit.
More specifically, the motherboard upper cover 400 may be provided with a third supporting portion 401, the third supporting portion 401 is convexly disposed on a side of the motherboard upper cover 400 facing the motherboard 300, the third supporting portion 401 may be a supporting plate convexly disposed on the motherboard upper cover 400 and located between the first supporting portion 402 and the second supporting portion 403, and an area surrounded by the third supporting portion 401, the first supporting portion 402 and the second supporting portion 403 may be used for disposing the first socket terminal 120 and the first metal housing 130.
Specifically, one end of the first electrical connection portion 121 is located on the first socket terminal 120, and the other end passes through the third supporting portion 401 and is electrically connected to the main board 300. For the first electrical connection portion 121 of the pin structure or the lead structure, the third support portion 401 can provide a package and support for the first electrical connection portion 121, prevent the first electrical connection portion 121 from being in contact with other components and parts, and also prevent the first electrical connection portion 121 from being warped, deflected and other abnormalities, thereby ensuring effective connection between the first electrical connection portion 121 and the motherboard 300.
Fig. 9 to 13 are second embodiments of thinning of an electronic device in the present application, in which the electronic device may include a first card socket 100, a second card socket 200 and a main board 300, where the first card socket 100 includes a first mounting plate 110, a first card socket terminal 120 and a first metal housing 130.
The first mounting plate 110 may be a plastic insulating plate and is a mounting base for the first card socket terminal 120 and the first metal housing 130, specifically, the first metal housing 130 has a top wall and a peripheral wall disposed along an edge of the top wall, and the first mounting plate 110 and the first card socket terminal 120 are both disposed in the first metal housing 130. The first mounting plate 110 is located between the first socket terminal 120 and the top wall of the first metal housing 130, two opposite sides of the first mounting plate 110 are respectively connected with the top walls of the first socket terminal 120 and the first metal housing 130 by injection molding, and the peripheral wall of the first metal housing 130 surrounds the first mounting plate 110 and the first socket terminal 120. In this way, through the cover structure of the first metal housing 130, the mask protection of the first card socket terminal 120 and the first mounting plate 110 is achieved, and the overall structural strength of the first card socket 100 is ensured.
The main board 300 may be provided with a receiving space 310 as a mounting base of the second card socket 200. A portion of the second cartridge 200 is disposed within the receiving space 310. The receiving space 310 has an opening through which at least a portion of the second socket terminal 220 protrudes from a surface of the main board 300 facing the main board cover 400.
The side of the peripheral wall of the first metal housing 130 away from the top wall is connected to the main board 300, and the peripheral wall of the first metal housing 130 surrounds the second card socket 200, and the second socket terminal 220 and the first socket terminal 120 are oppositely disposed, so as to form a card installation space therebetween.
The whole of the first card socket 100, the second card socket 200 and the main board 300 is a card socket assembly, which realizes storage of the storage card 500 and is disposed in the electronic device, wherein one side of the top wall of the first metal housing 130, which faces away from the second card socket 200, is connected to the main board upper cover 400 by injection molding.
In this structure, the accommodating space 310 is disposed on the main board 300, so that the second card socket 200 and the main board 300 share the same stacking height, and the card socket assembly formed by the first card socket 100, the second card socket 200 and the main board 300 is thinned, thereby achieving the light weight, thin weight and small size of the electronic device.
More specifically, the accommodating space 310 may be an accommodating groove formed in the main board 300, a notch of the accommodating groove is an opening, and the second card holder 200 is embedded in the main board 300 from the side where the notch is located. The main plate 300 with such a structure can have a better strength while achieving a common stacking height with the second card holder 200.
The accommodating space 310 may also be an accommodating through hole penetrating through the thickness direction of the motherboard 300, the hole of the accommodating through hole facing the motherboard upper cover 400 is an opening, and the second card socket 200 is installed in the motherboard 300 from the side where the opening is located.
For a specific structure of the second cartridge 200, the second cartridge 200 may further include a metal reinforcing shell 210 and a second carrier plate 230. The metal reinforcing shell 210 is fixed on the main board 300, the metal reinforcing shell 210 faces the main board top cover 400, and the second carrier board 230 and the second socket terminal 220 are sequentially stacked on one side of the metal reinforcing shell 210 facing the main board top cover 400. The metal reinforcing case 210 is provided to increase the overall structural strength of the second card socket 200, thereby increasing the connection stability of the second card socket 200 to the main board 300, the second carrier board 230 is the mounting base of the metal reinforcing case 210 and the second card socket terminal 220, and the second carrier board 230 is made of an insulating plastic material, thereby preventing the metal reinforcing case 210 and the second card socket terminal 220 from short-circuiting.
More specifically, the metal reinforcing shell 210 is located outside the accommodating space 310 and on a side of the motherboard 300 facing away from the motherboard top cover 400, the second socket terminal 220 and the second carrier board 230 are both located in the accommodating space 310, the metal reinforcing shell 210 may be provided with a third connecting end 211, and the third connecting end 211 is of a pin structure and is connected to the motherboard 300 by welding or the like.
Comparing the two embodiments, it can be seen that, in the first embodiment, by discarding the structure of the card socket assembly, specifically, by omitting the use of the first mounting plate 110, and by keeping the manner of the first metal housing 130 and the first card socket terminal 120, the overall structure of the first card socket 100 is discarded, and at the same time, the first metal housing 130 of the overall structure is disassembled into the split structure formed by the first metal sub-housing 131 and the second metal sub-housing 132, and the first metal sub-housing 131, the second metal sub-housing 132 and the first card socket terminal 120 are integrally mounted on the motherboard upper cover 400, so that the thickness of the electronic device is reduced, and the electronic device is light, thin and small.
In the second embodiment, the structure of the card socket assembly as an independent storage unit is reserved, and on the premise of reserving the whole structure of the first card socket 100, the accommodating space 310 is arranged on the main board 300 to locate the second card socket 200 in the accommodating space 310, so that the main board 300 and the second card socket 200 share the same stacking height, the whole thickness of the card socket assembly is reduced, and the electronic device is light, thin and small.
The two embodiments realize the structural optimization of different parts, the different optimization modes can be respectively applied, and the thickness reduction of the electronic equipment can be realized. In a more specific implementation, the structural optimization modes of the two embodiments can also be applied to the same electronic device, so that a third embodiment for thinning the electronic device is formed.
Specifically, a third embodiment of the electronic device thinning may be that, on the basis of the structure of the first embodiment, by providing the accommodating space 310 on the main board 300 and providing the second card socket 200 in the accommodating space 310, the thickness of the electronic device is further reduced; or the third embodiment may be based on the structure of the second embodiment, by discarding the whole structure of the first card socket 100 and canceling the arrangement of the first mounting plate 110, and by integrally arranging the first card socket terminal 120 and the first metal housing 130 on the main board upper cover 400, the thickness of the electronic device may be further reduced. It can be seen that the third embodiment has the advantages of the first and second embodiments, and can further realize the thickness reduction of the electronic device.
With the above-described three embodiments, the storage of the memory card 500 is realized, so that a card eject mechanism can be added to the electronic device, and specifically, the card eject mechanism is disposed in the card installation space and includes the rotating shaft 150, the first driving lever 160 and the second driving lever 170.
The card installation space has a card insertion opening, which is a pull-out end of the memory card 500. The rotation shaft 150 is disposed on a side of the card installation space away from the card insertion opening, and the memory card 500 can enter the card installation space through the card insertion opening. The first driving lever 160 is provided with a coupling hole through which the first driving lever 160 is rotatably coupled to the rotation shaft 150.
The second driving rod 170 is slidably disposed on the first metal housing 130, for example, on the peripheral wall of the first metal housing 130, or on the first metal sub-housing 131, or on the second metal sub-housing 132. The first driving lever 160 has a first rotation end and a second rotation end with a connection hole therebetween, and the second driving lever 170 may contact the first rotation end.
When the memory card 500 needs to be taken out of the card installation space, the second driving rod 170 can slide relative to the first metal shell 130, and in this case, the second driving rod 170 pushes the first rotating end to move, so that the first driving rod 160 rotates, and the second rotating end rotates around the rotating shaft 150 along with the second driving rod 170, so that the second rotating end generates a pushing force towards the card insertion opening to the memory card 500, and the memory card 500 can exit from the card installation space through the card insertion opening.
Furthermore, the electronic device may further include a detection terminal 140, the detection terminal 140 is disposed in the card installation space and located on a side of the card installation space away from the card insertion opening, and the detection terminal 140 may be a pressure sensor, a distance sensor, or the like, and is configured to detect whether the memory card 500 is located in the card installation space.
The electronic device disclosed by the embodiment of the application can be a mobile phone, a tablet computer, an electronic book reader, a wearable device and the like, and the embodiment of the application does not limit the specific type of the electronic device.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. An electronic device, comprising a main board upper cover (400), a main board (300), a first card socket terminal (120), a first metal housing (130) and a second card socket (200);
the first cassette terminal (120) and the first metal housing (130) are both disposed on the motherboard upper cover (400), the first metal housing (130) is supported between the motherboard (300) and the motherboard upper cover (400), the first cassette terminal (120) is exposed on a surface of the motherboard upper cover (400) facing the motherboard (300),
the second card holder (200) is disposed on the main board (300), the second card holder (200) includes a second card holder terminal (220), the first card holder terminal (120) and the second card holder terminal (220) are disposed opposite to each other, and a card mounting space is formed between the first card holder terminal (120) and the second card holder terminal (220).
2. The electronic device of claim 1, wherein the first cartridge terminal (120) and the first metal housing (130) are each injection molded on the motherboard upper cover (400).
3. The electronic device according to claim 1, wherein the main board (300) is provided with a receiving space (310), a portion of the second socket (200) is provided in the receiving space (310), the receiving space (310) has an opening, and at least a portion of the second socket terminal (220) protrudes from a surface of the main board (300) facing the main board upper cover (400) through the opening.
4. The electronic device according to claim 3, wherein the receiving space (310) is a receiving slot opened on the main board (300), and a notch of the receiving slot is the opening; alternatively, the first and second electrodes may be,
the accommodating space (310) is an accommodating through hole penetrating through the thickness direction of the main board (300), and an orifice of the accommodating through hole facing the main board upper cover (400) is the opening.
5. The electronic device of claim 1, wherein the first metal housing (130) comprises a first metal sub-housing (131) and a second metal sub-housing (132), and the first metal sub-housing (131) and the second metal sub-housing (132) are respectively disposed on two sides of the first socket terminal (120) and are both supported between the main board (300) and the main board upper cover (400).
6. The electronic device according to claim 1, wherein the first socket terminal (120) comprises a plurality of first electrically connecting resilient pieces (122), the plurality of first electrically connecting resilient pieces (122) are distributed in an array, the plurality of first electrically connecting resilient pieces (122) protrude in a direction toward the motherboard (300), and a heat dissipation hole (404) is formed in a region of the motherboard upper cover (400) opposite to the first electrically connecting resilient pieces (122).
7. The electronic device of claim 5, wherein: a first supporting part (402) and a second supporting part (403) are convexly arranged on one side of the main board upper cover (400) facing the main board (300),
the first cassette terminal (120) is located between the first support portion (402) and the second support portion (403), the first metal sub-housing (131) is disposed between the first cassette terminal (120) and the first support portion (402), and the second metal sub-housing (132) is disposed between the first cassette terminal (120) and the second support portion (403).
8. An electronic device according to claim 1, characterized in that the first cartridge terminal (120) is provided with a first electrical connection (121), the second cartridge terminal (220) is provided with a second electrical connection (221),
the first socket terminal (120) is electrically connected to the main board (300) through the first electrical connection portion (121), and the second socket terminal (220) is electrically connected to the main board (300) through the second electrical connection portion (221).
9. The electronic device of claim 1, further comprising a memory card (500), a hinge (150), a first actuator lever (160), and a second actuator lever (170),
the card installation space is provided with an insertion opening, the rotating shaft (150) is arranged on one side of the card installation space far away from the insertion opening, the storage card (500) can enter the card installation space through the insertion opening, the first driving rod (160) is provided with a connecting hole, the first driving rod (160) is rotationally connected with the rotating shaft (150) through the connecting hole,
the second driving lever (170) is slidably disposed at the first metal housing (130), the first driving lever (160) has a first rotation end and a second rotation end, the connection hole is located between the first rotation end and the second rotation end, the second driving lever (170) is contactable with the first rotation end,
under the condition that the second driving rod (170) slides relative to the first metal shell (130), the second rotating end can rotate around the rotating shaft (150) along with the second driving rod (170), and the memory card (500) can be withdrawn from the card installation space through the card slot.
10. The electronic device of claim 1, wherein the second cartridge (200) further comprises a metal reinforcing shell (210) and a second carrier plate (230),
the metal reinforcing shell (210) is fixed on the main board (300) and faces the main board upper cover (400), and the second carrier board (230) and the second cassette terminal (220) are sequentially stacked on one side, facing the main board upper cover (400), of the metal reinforcing shell (210).
Priority Applications (1)
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| CN202110541608.5A CN113314864B (en) | 2021-05-18 | 2021-05-18 | Electronic device |
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| CN202110541608.5A CN113314864B (en) | 2021-05-18 | 2021-05-18 | Electronic device |
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| Publication Number | Publication Date |
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| CN113314864A true CN113314864A (en) | 2021-08-27 |
| CN113314864B CN113314864B (en) | 2023-01-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421198A (en) * | 2021-12-28 | 2022-04-29 | Oppo广东移动通信有限公司 | Card seat assembly and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040161976A1 (en) * | 2003-02-14 | 2004-08-19 | Ipson Lee | Memory card socket with drawer-type cartridge seat |
| US20160087358A1 (en) * | 2014-09-22 | 2016-03-24 | Samsung Electronics Co., Ltd. | Card connector and electronic device including the same |
| CN109638493A (en) * | 2018-12-17 | 2019-04-16 | 昆山惠乐精密工业有限公司 | All-in-One deck |
| CN112421321A (en) * | 2020-11-30 | 2021-02-26 | 维沃移动通信有限公司 | Card seat device and electronic equipment |
| CN212908173U (en) * | 2020-07-23 | 2021-04-06 | 鸿日达科技股份有限公司 | Miniaturized stromatolite cassette |
-
2021
- 2021-05-18 CN CN202110541608.5A patent/CN113314864B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040161976A1 (en) * | 2003-02-14 | 2004-08-19 | Ipson Lee | Memory card socket with drawer-type cartridge seat |
| US20160087358A1 (en) * | 2014-09-22 | 2016-03-24 | Samsung Electronics Co., Ltd. | Card connector and electronic device including the same |
| CN109638493A (en) * | 2018-12-17 | 2019-04-16 | 昆山惠乐精密工业有限公司 | All-in-One deck |
| CN212908173U (en) * | 2020-07-23 | 2021-04-06 | 鸿日达科技股份有限公司 | Miniaturized stromatolite cassette |
| CN112421321A (en) * | 2020-11-30 | 2021-02-26 | 维沃移动通信有限公司 | Card seat device and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421198A (en) * | 2021-12-28 | 2022-04-29 | Oppo广东移动通信有限公司 | Card seat assembly and electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN113314864B (en) | 2023-01-13 |
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