CN113310584A - Intelligent passive wireless RFID-LoRa temperature measurement method and system suitable for power equipment monitoring - Google Patents

Intelligent passive wireless RFID-LoRa temperature measurement method and system suitable for power equipment monitoring Download PDF

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Publication number
CN113310584A
CN113310584A CN202110472681.1A CN202110472681A CN113310584A CN 113310584 A CN113310584 A CN 113310584A CN 202110472681 A CN202110472681 A CN 202110472681A CN 113310584 A CN113310584 A CN 113310584A
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China
Prior art keywords
module
rfid
lora
data
mcu
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CN202110472681.1A
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Inventor
马春雷
谢荣斌
罗勇
薛静
张霖
杨超
丁健
申强
杜帆
王颖舒
孙军
李诗勇
王瑞果
李帮胜
靳斌
陈实
刘波
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Guizhou Power Grid Co Ltd
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Guizhou Power Grid Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02Means for indicating or recording specially adapted for thermometers
    • G01K1/024Means for indicating or recording specially adapted for thermometers for remote indication
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10297Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves arrangements for handling protocols designed for non-contact record carriers such as RFIDs NFCs, e.g. ISO/IEC 14443 and 18092
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04WWIRELESS COMMUNICATION NETWORKS
    • H04W4/00Services specially adapted for wireless communication networks; Facilities therefor
    • H04W4/30Services specially adapted for particular environments, situations or purposes
    • H04W4/38Services specially adapted for particular environments, situations or purposes for collecting sensor information
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04WWIRELESS COMMUNICATION NETWORKS
    • H04W84/00Network topologies
    • H04W84/18Self-organising networks, e.g. ad-hoc networks or sensor networks

Abstract

The invention provides an intelligent passive wireless RFID-LoRa temperature measurement method and system suitable for power equipment monitoring. Realize wireless ad hoc network through the loRa module, realize low-power consumption, long distance transmission, overcome RFID and be difficult to be applied to the application environment that wiring is difficult, span is long-range far away.

Description

Intelligent passive wireless RFID-LoRa temperature measurement method and system suitable for power equipment monitoring
Technical Field
The invention relates to the technical field of Internet of things, in particular to an intelligent passive wireless RFID-LoRa temperature measurement method and system suitable for power equipment monitoring.
Background
In the power equipment, the switch cabinet is of a closed structure, and the internal temperature of the equipment cannot be measured by an external means. At present, temperature measurement is carried out by measuring the size and wavelength of self-radiated infrared energy on the surface of an object, and the infrared energy is difficult to directly measure under a closed structure of a switch cabinet, so that the infrared measurement is not suitable for measuring the internal temperature of the switch cabinet. The optical fiber temperature measurement reversely deduces the temperature through the change of the state quantity of light such as amplitude, phase, frequency, polarization and the like, thereby obtaining the corresponding optical fiber environment temperature. The optical fiber temperature measurement technology has higher threshold, strict arrangement design and complex system structure. In a closed structure of a switch cabinet, the arrangement design of optical fibers is difficult, and a complex optical fiber system is difficult to arrange in a narrow space. The fiber grating can be desensitized at high temperature, the insulation characteristic is reduced after dust deposition, the structure is fragile and easy to break, and the danger of creepage exists, so that the switch cabinet is damaged by primary and secondary electrical isolation.
Disclosure of Invention
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. In this section, as well as in the abstract and the title of the invention of this application, simplifications or omissions may be made to avoid obscuring the purpose of the section, the abstract and the title, and such simplifications or omissions are not intended to limit the scope of the invention.
The invention is provided in view of the above and/or the existing problems in the intelligent passive wireless RFID-LoRa temperature measurement method and system for monitoring the power equipment.
The problem to be solved by the invention is therefore how to overcome the distance transmission problem of RFID.
In order to solve the technical problems, the invention provides the following technical scheme: an intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring power equipment comprises the following steps,
acquiring terminal data, transmitting data up and down and controlling and sending instructions through an RFID module;
the data uplink and downlink transmission is carried out through the LoRa module, the self-networking of the RFID system and the effective remote transmission of the data are carried out in a star-shaped and point-to-point mode, the data transmission of the system is carried out through the LoRa module, and the remote transmission distance is increased through the cooperation of a gateway;
and the MCU module is used for controlling the working state, task allocation and data transmission of the system.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring the power equipment, the method comprises the following steps:
starting a system, initializing the system and realizing default configuration of three modules;
after initialization, the MCU judges tasks, and when detecting that a detection task exists, the MCU enters a working state;
the MCU sends an instruction to the RFID module, and the module is awakened to enable the module to enter a working state;
after receiving the MCU control instruction, the RFID module sends a temperature reading instruction and sends the temperature reading instruction of the electronic tag in a downlink manner;
the RFID electronic tag performs data acquisition after receiving an instruction of the RFID module, triggers the temperature sensing circuit, the digital-to-analog conversion circuit and the data storage chip through the energy collected by the radio frequency energy collecting circuit, and returns data in an uplink manner after data acquisition is performed;
the RFID module receives the tag data, decodes the tag data and transmits the decoded tag data to the MCU module;
the MCU module carries out data processing, storage and state evaluation, and after the state evaluation, when the over-temperature and over-heat condition occurs and the preset value range is within the range, the MCU module invokes the LoRa module to wake up the LoRa module;
the LoRa module enters a transmission mode and performs wireless data transmission on the upper computer through a transparent transmission mode and a point-to-point transmission mode;
and after receiving the LoRa uplink data, the upper computer processes the data and carries out state abnormity early warning.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring the power equipment, the method comprises the following steps: the RFID module comprises an RFID communication interface, a radio frequency antenna, an RFID control circuit and an RFID power system.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring the power equipment, the method comprises the following steps: the loRa module includes loRa communication chip, serial module and host computer communication interface.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring the power equipment, the method comprises the following steps: the MCU module comprises a single chip microcomputer control chip, a keying module, a display module, a power supply module and a communication interface.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring the power equipment, the method comprises the following steps: the MCU module designs a unified serial port data format through module functions, adopts systematic data transmission to exchange for unification, realizes the functional cooperation between each module, connects RFID module and LoRa module through the MCU module, adopts control system to arrange transmission time sequence and operating condition.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring the power equipment, the method comprises the following steps: selecting the radio frequency distance and the radio frequency between 800MHz and 1100 MHz;
a chip integrated system with an electronic tag and a reader separated is built, and the electronic tag is integrated with a temperature sensing circuit, a digital-to-analog conversion circuit, a data storage chip and a radio frequency energy collecting circuit;
the temperature sensing circuit adopts an IC integrated chip, and measures the environmental temperature data of the reaction tag through the influence of a digital chip on the electrical characteristics of a CMOS electronic element; the storage chip stores data measured by the temperature chip in an off-line mode, the digital-to-analog conversion circuit converts analog quantity measured by the temperature sensing circuit into corresponding data quantity, the data storage chip is matched for storing digital signals, and electromagnetic waves emitted by the RFID reader are induced and rectified to supply energy to the electronic tag;
the electronic tag adopts a tuning fork type and binding band type design, combines a temperature chip and a radio frequency technology, and realizes a miniaturized temperature measurement terminal with high integration level.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring the power equipment, the method comprises the following steps: the data transmission adopts an LoRa frequency band within the working frequency band range of 398MHz-525MHz, the transmitting power represents 20dBm, and the receiving sensitivity is-138 dBm;
the LoRa module sends electromagnetic waves through an antenna, an SMA antenna is adopted, and the packaging adopts a DIP packaging mode which comprises a transmitting state, a receiving state and a dormant state;
the data interface adopts a UART interface, the bit rate adopts 1200bps-115200bps, the module is connected with the MCU to carry out data transmission communication through a TTL level serial port, and a pin triggers a low level to send data to the serial port.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement system suitable for power equipment monitoring, the system comprises: the system comprises an RFID module, an MCU module and a LoRa module;
the RFID module comprises an RFID communication interface, a radio frequency antenna, an RFID control circuit and an RFID power system;
the MCU module comprises a singlechip control chip, a keying module, a display module, a power supply module and a communication interface;
the loRa module includes loRa communication chip, serial module, host computer communication interface.
As a preferred scheme of the intelligent passive wireless RFID-LoRa temperature measurement system suitable for power equipment monitoring, the system comprises: the singlechip control chip is connected with the keying module, the display module, the power supply module and the communication interface;
the communication interface is connected with the upper computer communication interface, and the LoRa communication chip is connected with the upper computer communication interface;
and the RFID communication interface is connected with the MCU module.
The invention has the beneficial effects that: the invention provides an intelligent passive wireless RFID-LoRa temperature measurement method and system suitable for power equipment monitoring. Realize wireless ad hoc network through the loRa module, realize low-power consumption, long distance transmission, overcome RFID and be difficult to be applied to the application environment that wiring is difficult, span is long-range far away.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise. Wherein:
FIG. 1 is a flow chart of an intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring;
FIG. 2 is a graph of RF distance versus RF frequency;
fig. 3 is a structure diagram of an intelligent passive wireless RFID-LoRa temperature measurement system suitable for monitoring power equipment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, specific embodiments accompanied with figures are described in detail below, and it is apparent that the described embodiments are a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making creative efforts based on the embodiments of the present invention, shall fall within the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Furthermore, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
The present invention will be described in detail with reference to the drawings, wherein the cross-sectional views illustrating the structure of the device are not enlarged partially in general scale for convenience of illustration, and the drawings are only exemplary and should not be construed as limiting the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Meanwhile, in the description of the present invention, it should be noted that the terms "upper, lower, inner and outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation and operate, and thus, cannot be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The terms "mounted, connected and connected" in the present invention are to be understood broadly, unless otherwise explicitly specified or limited, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1 to 3, a first embodiment of the present invention provides an intelligent passive wireless RFID-LoRa temperature measurement method suitable for monitoring power equipment, including the following steps:
acquiring terminal data, transmitting data up and down and controlling and sending instructions through an RFID module;
the data uplink and downlink transmission is carried out through the LoRa module, the self-networking of the RFID system and the effective remote transmission of the data are carried out in a star-shaped and point-to-point mode, the data transmission of the system is carried out through the LoRa module, and the remote transmission distance is increased through the cooperation of a gateway;
and the MCU module is used for controlling the working state, task allocation and data transmission of the system.
Based on the above, the system in this embodiment is constructed by building three modules and connecting the modules in an interactive manner.
According to fig. 2, the relationship between the radio frequency distance and the radio frequency exhibits a hump characteristic at 800MHz to 1100 MHz. The read distance of the radio frequency is optimal when the frequency is 915 MHz. In the permitted frequency band, the radio frequency distance, the radio frequency power consumption and the penetration effect are comprehensively considered, and the RFID transmission frequency with the power range of 860MHz-920MHz is selected to be most economical and efficient.
After a proper frequency band is selected, a special chip integrated system with an electronic tag and a reader separated is adopted for building the radio frequency module, and the electronic tag is integrated with a temperature sensing circuit, a digital-to-analog conversion circuit, a data storage chip and a radio frequency energy collecting circuit. The temperature sensing circuit adopts an IC integrated chip, and the digital chip measures the environmental temperature data of the reaction tag through the influence of temperature on the electrical characteristics of the CMOS electronic element; the storage chip stores data measured by the temperature chip in an off-line mode, the digital-to-analog conversion circuit converts analog quantity measured by the temperature sensing circuit into corresponding data quantity, and the data storage chip is matched to store digital signals. The radio frequency collection circuit is a circuit for realizing uplink and downlink data transmission, instruction control and energy collection in the RFID system, and supplies energy to the electronic tag by inducing and rectifying electromagnetic waves emitted by the RFID reader.
The electronic tag adopts a tuning fork type and binding band type design, combines a temperature chip and a radio frequency technology, and realizes a miniaturized temperature measurement terminal with high integration level.
The selection scheme of the LoRa module is as follows: the data transmission adopts an LoRa unlicensed frequency band within a working frequency band range of 398MHz-525MHz, the transmitting power represents 20dBm, the receiving sensitivity is-138 dBm, and the data transmission of 3500 meters can be realized in the transmission distance under the clear and open environment.
The LoRa module needs to send electromagnetic waves through an antenna, an SMA antenna is adopted, and a DIP packaging mode is adopted for packaging. The working state is divided into three selectable states, namely a transmitting state, a receiving state and a dormant state.
The data interface adopts a universal UART interface, and the bit rate adopts 1200bps-115200 bps. The module is connected with the MCU for data transmission communication through a TTL level serial port, low level is triggered through the pin to send data to the serial port, and after the data are sent, the pin is pulled high.
Further, after the module is built, the interactive connection of the system is used as a main control unit through the MCU, and the switching of the working state of the system and the realization of the task function are carried out.
Based on the above, the specific flow of the whole process is as follows:
and after the system is started, initializing the system to realize default configuration of the three modules. After initialization, the MCU judges tasks, and when detecting that a detection task exists, the MCU enters a working state. And the MCU sends an instruction to the RFID module, and wakes up the module to enable the module to enter a working state. And after receiving the MCU control instruction, the RFID module sends a temperature reading instruction and sends the temperature reading instruction of the electronic tag in a downlink manner. The RFID electronic tag performs data acquisition after receiving an instruction of the RFID module, triggers the temperature sensing circuit, the digital-to-analog conversion circuit and the data storage chip through the energy collected by the radio frequency energy collecting circuit, and returns data in an uplink mode after data acquisition is performed. And the RFID module receives the label data, decodes the label data and transmits the decoded label data to the MCU module. The MCU module carries out data processing, storage, state aassessment, and after the state aassessment, when the overheated condition of overtemperature and the within range of default appear, the MCU module mobilizes the loRa module, awakens the loRa module up. The LoRa module enters a transmission mode, and wireless data transmission is carried out on the upper computer through a transparent transmission mode and a point-to-point transmission mode. And after receiving LoRa uplink data, the upper computer performs next data processing, stores key important high-value data and performs state anomaly early warning, and the maximum abnormal state early warning can reach 3500 m.
Example 2
Referring to fig. 1 to 3, a second embodiment of the present invention provides an intelligent passive wireless RFID-LoRa temperature measurement system suitable for monitoring power equipment, including: the system comprises an RFID module, an MCU module and a LoRa module;
the RFID module comprises an RFID communication interface, a radio frequency antenna, an RFID control circuit and an RFID power system;
the MCU module comprises a singlechip control chip, a keying module, a display module, a power supply module and a communication interface;
the loRa module includes loRa communication chip, serial module, host computer communication interface.
Based on the above, the singlechip control chip is connected with the keying module, the display module, the power module and the communication interface; the communication interface is connected with the communication interface of the upper computer, and the LoRa communication chip is connected with the communication interface of the upper computer; and the RFID communication interface is connected with the MCU module.
Based on the above, the specific flow of the whole process is as follows:
starting a system, initializing the system and realizing default configuration of three modules;
after initialization, the MCU judges tasks, and when detecting that a detection task exists, the MCU enters a working state;
the MCU sends an instruction to the RFID module, and the module is awakened to enable the module to enter a working state;
after receiving the MCU control instruction, the RFID module sends a temperature reading instruction and sends the temperature reading instruction of the electronic tag in a downlink manner;
the RFID electronic tag performs data acquisition after receiving an instruction of the RFID module, triggers the temperature sensing circuit, the digital-to-analog conversion circuit and the data storage chip through the energy collected by the radio frequency energy collecting circuit, and returns data in an uplink manner after data acquisition is performed;
the RFID module receives the tag data, decodes the tag data and transmits the decoded tag data to the MCU module;
the MCU module carries out data processing, storage and state evaluation, and after the state evaluation, when the over-temperature and over-heat condition occurs and the preset value range is within the range, the MCU module invokes the LoRa module to wake up the LoRa module;
the LoRa module enters a transmission mode and performs wireless data transmission on the upper computer through a transparent transmission mode and a point-to-point transmission mode;
and after receiving the LoRa uplink data, the upper computer processes the data and carries out state abnormity early warning.
Compared with the traditional RFID system, the RFID-LoRa system provided by the embodiment achieves the purpose of measuring long-distance wireless transmission of the temperature of the narrow severe environment of the electrical equipment through modular design and LoRa.
As shown in the following table, the present embodiment also provides a data comparison table for temperature measurement by using the intelligent passive wireless RFID-LoRa temperature measurement system and method suitable for monitoring power equipment, and for traditional temperature measurement.
Figure BDA0003045964600000081
As is apparent from the comparison in the table, the accuracy of the measurement performed by the method and the system provided by the embodiment is obviously higher than that of the conventional method.
It should be recognized that embodiments of the present invention can be realized and implemented by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer readable memory. The methods may be implemented in a computer program using standard programming techniques, including a non-transitory computer-readable storage medium configured with the computer program, where the storage medium so configured causes a computer to operate in a specific and predefined manner, according to the methods and figures described in the detailed description. Each program may be implemented in a high level procedural or object oriented programming language to communicate with a computer system. However, the program(s) can be implemented in assembly or machine language, if desired. In any case, the language may be a compiled or interpreted language. Furthermore, the program can be run on a programmed application specific integrated circuit for this purpose.
Further, the operations of processes described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The processes described herein (or variations and/or combinations thereof) may be performed under the control of one or more computer systems configured with executable instructions, and may be implemented as code (e.g., executable instructions, one or more computer programs, or one or more applications) collectively executed on one or more processors, by hardware, or combinations thereof. The computer program includes a plurality of instructions executable by one or more processors.
Further, the method may be implemented in any type of computing platform operatively connected to a suitable interface, including but not limited to a personal computer, mini computer, mainframe, workstation, networked or distributed computing environment, separate or integrated computer platform, or in communication with a charged particle tool or other imaging device, and the like. Aspects of the invention may be embodied in machine-readable code stored on a non-transitory storage medium or device, whether removable or integrated into a computing platform, such as a hard disk, optically read and/or write storage medium, RAM, ROM, or the like, such that it may be read by a programmable computer, which when read by the storage medium or device, is operative to configure and operate the computer to perform the procedures described herein. Further, the machine-readable code, or portions thereof, may be transmitted over a wired or wireless network. The invention described herein includes these and other different types of non-transitory computer-readable storage media when such media include instructions or programs that implement the steps described above in conjunction with a microprocessor or other data processor. The invention also includes the computer itself when programmed according to the methods and techniques described herein. A computer program can be applied to input data to perform the functions described herein to transform the input data to generate output data that is stored to non-volatile memory. The output information may also be applied to one or more output devices, such as a display. In a preferred embodiment of the invention, the transformed data represents physical and tangible objects, including particular visual depictions of physical and tangible objects produced on a display.
As used in this application, the terms "component," "module," "system," and the like are intended to refer to a computer-related entity, either hardware, firmware, a combination of hardware and software, or software in execution. For example, a component may be, but is not limited to being: a process running on a processor, an object, an executable, a thread of execution, a program, and/or a computer. By way of example, both an application running on a computing device and the computing device can be a component. One or more components can reside within a process and/or thread of execution and a component can be localized on one computer and/or distributed between two or more computers. In addition, these components can execute from various computer readable media having various data structures thereon. The components may communicate by way of local and/or remote processes such as in accordance with a signal having one or more data packets (e.g., data from one component interacting with another component in a local system, distributed system, and/or across a network such as the internet with other systems by way of the signal).
It should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.

Claims (10)

1. The utility model provides an intelligent passive wireless RFID-loRa temperature measurement method suitable for power equipment monitoring which characterized in that: comprises the following steps of (a) carrying out,
acquiring terminal data, transmitting data up and down and controlling and sending instructions through an RFID module;
the data uplink and downlink transmission is carried out through the LoRa module, the self-networking of the RFID system and the effective remote transmission of the data are carried out in a star-shaped and point-to-point mode, the data transmission of the system is carried out through the LoRa module, and the remote transmission distance is increased through the cooperation of a gateway;
and the MCU module is used for controlling the working state, task allocation and data transmission of the system.
2. The intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring of claim 1, characterized in that:
starting a system, initializing the system and realizing default configuration of three modules;
after initialization, the MCU judges tasks, and when detecting that a detection task exists, the MCU enters a working state;
the MCU sends an instruction to the RFID module, and the module is awakened to enable the module to enter a working state;
after receiving the MCU control instruction, the RFID module sends a temperature reading instruction and sends the temperature reading instruction of the electronic tag in a downlink manner;
the RFID electronic tag performs data acquisition after receiving an instruction of the RFID module, triggers the temperature sensing circuit, the digital-to-analog conversion circuit and the data storage chip through the energy collected by the radio frequency energy collecting circuit, and returns data in an uplink manner after data acquisition is performed;
the RFID module receives the tag data, decodes the tag data and transmits the decoded tag data to the MCU module;
the MCU module carries out data processing, storage and state evaluation, and after the state evaluation, when the over-temperature and over-heat condition occurs and the preset value range is within the range, the MCU module invokes the LoRa module to wake up the LoRa module;
the LoRa module enters a transmission mode and performs wireless data transmission on the upper computer through a transparent transmission mode and a point-to-point transmission mode;
and after receiving the LoRa uplink data, the upper computer processes the data and carries out state abnormity early warning.
3. The intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring of claim 2, characterized in that: the RFID module comprises an RFID communication interface, a radio frequency antenna, an RFID control circuit and an RFID power system.
4. The intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring of claim 3, characterized in that: the loRa module includes loRa communication chip, serial module and host computer communication interface.
5. The intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring of claim 4, characterized in that: the MCU module comprises a single chip microcomputer control chip, a keying module, a display module, a power supply module and a communication interface.
6. The intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring of claim 5, characterized in that: the MCU module designs a unified serial port data format through module functions, adopts systematic data transmission to exchange for unification, realizes the functional cooperation between each module, connects RFID module and LoRa module through the MCU module, adopts control system to arrange transmission time sequence and operating condition.
7. The intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring of claim 6, characterized in that: selecting the radio frequency distance and the radio frequency between 800MHz and 1100 MHz;
a chip integrated system with an electronic tag and a reader separated is built, and the electronic tag is integrated with a temperature sensing circuit, a digital-to-analog conversion circuit, a data storage chip and a radio frequency energy collecting circuit;
the temperature sensing circuit adopts an IC integrated chip, and measures the environmental temperature data of the reaction tag through the influence of a digital chip on the electrical characteristics of a CMOS electronic element; the storage chip stores data measured by the temperature chip in an off-line mode, the digital-to-analog conversion circuit converts analog quantity measured by the temperature sensing circuit into corresponding data quantity, the data storage chip is matched for storing digital signals, and electromagnetic waves emitted by the RFID reader are induced and rectified to supply energy to the electronic tag;
the electronic tag adopts a tuning fork type and binding band type design, combines a temperature chip and a radio frequency technology, and realizes a miniaturized temperature measurement terminal with high integration level.
8. The intelligent passive wireless RFID-LoRa temperature measurement method suitable for power equipment monitoring of claim 7, characterized in that: the data transmission adopts an LoRa frequency band within the working frequency band range of 398MHz-525MHz, the transmitting power represents 20dBm, and the receiving sensitivity is-138 dBm;
the LoRa module sends electromagnetic waves through an antenna, an SMA antenna is adopted, and the packaging adopts a DIP packaging mode which comprises a transmitting state, a receiving state and a dormant state;
the data interface adopts a UART interface, the bit rate adopts 1200bps-115200bps, the module is connected with the MCU to carry out data transmission communication through a TTL level serial port, and a pin triggers a low level to send data to the serial port.
9. The utility model provides a passive wireless RFID-loRa temperature measurement system of intelligence suitable for power equipment monitoring which characterized in that: the system comprises an RFID module, an MCU module and a LoRa module;
the RFID module comprises an RFID communication interface, a radio frequency antenna, an RFID control circuit and an RFID power system;
the MCU module comprises a singlechip control chip, a keying module, a display module, a power supply module and a communication interface;
the loRa module includes loRa communication chip, serial module, host computer communication interface.
10. The utility model provides a passive wireless RFID-loRa temperature measurement system of intelligence suitable for power equipment monitoring which characterized in that: the singlechip control chip is connected with the keying module, the display module, the power supply module and the communication interface;
the communication interface is connected with the upper computer communication interface, and the LoRa communication chip is connected with the upper computer communication interface;
and the RFID communication interface is connected with the MCU module.
CN202110472681.1A 2021-04-29 2021-04-29 Intelligent passive wireless RFID-LoRa temperature measurement method and system suitable for power equipment monitoring Pending CN113310584A (en)

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