CN113301764B - Cabinet, immersed liquid cooling system and immersed liquid cooling method - Google Patents
Cabinet, immersed liquid cooling system and immersed liquid cooling method Download PDFInfo
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- CN113301764B CN113301764B CN202010614239.3A CN202010614239A CN113301764B CN 113301764 B CN113301764 B CN 113301764B CN 202010614239 A CN202010614239 A CN 202010614239A CN 113301764 B CN113301764 B CN 113301764B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses rack, submergence liquid cooling system, submergence liquid cooling method based on data center, wherein the rack includes: the liquid inlet and the liquid outlet are formed in the bottom of the cabinet body; the cabinet body is provided with an accommodating space; the liquid inlet is arranged at the bottom of the cabinet body and is positioned between the guide plate and the bottom; the liquid outlet is positioned in the top area of the cabinet body; the guide plate is positioned above the liquid inlet, and the plate surface of the guide plate covers the bottom of the cabinet body; the flow guide channel arranged on the flow guide plate is used for leading liquid entering the space between the flow guide plate and the bottom of the cabinet body through the liquid inlet, uniformly guiding the liquid into the accommodating space between the upper part of the flow guide plate and the top of the cabinet body and forming a whole flow field, and refrigerating the cooling device placed in the accommodating space by the liquid in the accommodating space, and discharging the liquid through the liquid outlet when the liquid level reaches the liquid outlet. The problems of low heat dissipation efficiency of the cooling device caused by larger difference of liquid temperature in different areas and higher local temperature due to disorder of the flow field can be avoided.
Description
Technical Field
The application relates to the technical field of computers, in particular to a cabinet, an immersed liquid cooling system and an immersed liquid cooling method based on a data center.
Background
With the rapid development of big data cloud computing, the world is more interconnected, human life is more convenient, more and more data are generated behind the cloud computing, and the data are rapidly growing beyond imagination; the International data corporation (IDC: international Data Corporation) made statistics and predictions that the global data ring would increase from 33ZB (Zeta byte) in 2018 to 175ZB in 2025. The data grows exponentially, requiring more and more computational power to analyze and process.
Cloud computing centralizes computing resources to form a high-density computing unit cluster similar to a data center so as to improve the data processing capability, the data center must raise the heat density while improving the data processing capability, and huge energy consumption challenges are correspondingly brought to the data center supporting stable operation of equipment such as computing service and the like.
Because equipment such as computing service of the data center can enable the data center to be in a high-risk state of abnormal downtime under the condition of high heat, the whole data center is in paralysis due to the abnormal downtime.
In the prior art, the computing service equipment is soaked in the cooling liquid in a submerged cooling mode to refrigerate the computing service equipment, however, when the computing service equipment is refrigerated and radiated in the prior art, the flow direction of the cooling liquid is limited only by the space of the cabinet and the surface environment flowing into the cabinet, so that the phenomenon of local overtemperature caused by the confusion of the flow field of the local cooling liquid can be caused.
Disclosure of Invention
The application provides a rack to solve among the prior art the internal temperature inequality of cabinet and cause the problem that radiating efficiency is low.
The application provides a cabinet, including: the liquid inlet and the liquid outlet are formed in the bottom of the cabinet body;
the cabinet body is provided with an accommodating space capable of accommodating a cooling device which needs to be cooled; the liquid inlet is arranged at the bottom of the cabinet body and is positioned between the guide plate and the bottom; the liquid outlet is positioned in the top area of the cabinet body; the guide plate is positioned above the liquid inlet, and the plate surface of the guide plate covers the bottom of the cabinet body; the flow guide channel arranged on the flow guide plate can uniformly guide liquid entering the space between the flow guide plate and the bottom of the cabinet body through the liquid inlet, the liquid is uniformly guided into the accommodating space between the upper part of the flow guide plate and the top of the cabinet body and forms a whole flow field, the cooling device placed in the accommodating space is refrigerated by the liquid in the accommodating space, and when the liquid level reaches the liquid outlet, the liquid is discharged through the liquid outlet.
In some embodiments, the diversion channel includes an outlet and an inlet, the inlet being opposite the cabinet bottom and the outlet being opposite the cabinet top.
In some embodiments, the baffle channel is a plurality of through holes running perpendicular to the baffle plate surface.
In some embodiments, at least one parameter of the position and size of the through holes is such that the flow field of the liquid entering between the top of the cabinet and the baffle through the baffle is uniform.
In some embodiments, the baffle is integrally formed with the bottom of the cabinet; or, the guide plate and the bottom of the cabinet body are of a matched detachable split structure.
In some embodiments, when the deflector is in a detachable split structure, the deflector comprises at least two deflectors, and the deflectors can be assembled with the bottom of the cabinet in a matching way.
In some embodiments, further comprising: and the liquid collecting container is used for collecting the heated liquid in the top area of the accommodating space, and conveying the collected liquid to the heat exchange unit for heat treatment through the liquid outlet, and the treated liquid returns to the liquid inlet through a pipeline.
In some embodiments, the liquid collecting container is disposed on both sides in the widthwise direction of the cabinet.
In some embodiments, the liquid inlet is disposed in the width direction of the cabinet body, and is located at two sides of the bottom of the cabinet body.
In some embodiments, the liquid outlet is disposed in the width direction of the cabinet body, and is located at two sides of the top area of the cabinet body, where the distance between the top of the cabinet body and the deflector is greater than or equal to the height of the object cooling device.
The application provides an immersion liquid cooling system, including: the liquid cooling machine comprises a liquid cooling cabinet, a heat exchange unit, a pipeline and a liquid circulating pump;
the liquid inlet and the liquid outlet of the liquid cooling cabinet are connected with the circulating pump and the heat exchange unit through the pipelines; the cooling liquid enters the liquid inlet through the pipeline, enters between the bottom of the liquid cooling cabinet and the guide plate arranged above the bottom through the liquid inlet, is uniformly guided to the position between the upper part of the guide plate and the top of the liquid cooling cabinet through the guide channel on the guide plate to form an integral flow field, cools the built-in computer service equipment, and circulates the heated cooling liquid to the heat exchange unit through the liquid circulation pump, and the processed liquid circulates to the liquid inlet through the pipeline to enter the liquid cooling cabinet again to refrigerate the computer service equipment.
In some embodiments, further comprising:
and the liquid collecting container is used for collecting the heated cooling liquid in the liquid cooling cabinet and conveying the collected cooling liquid to the heat exchange unit through the liquid outlet and the pipeline by the liquid circulating pump.
The application also provides an immersion liquid cooling method based on the data center, which comprises the following steps:
cooling liquid enters between the bottom of the liquid cooling cabinet and the guide plate through the liquid inlet;
the flow guide plate uniformly guides the cooling liquid into an accommodating space between the top of the liquid cooling cabinet and the flow guide plate through a flow guide channel, and a uniform whole-surface flow field is formed on the periphery of data center IT equipment placed in the accommodating space;
after the heat of the IT equipment of the data center is absorbed by the cooling liquid, the heated cooling liquid is discharged through a liquid outlet at the top of the liquid cooling cabinet;
the discharged cooling liquid is subjected to heat exchange treatment and is circularly guided into the accommodating space between the top of the liquid cooling cabinet and the guide plate again, and heat dissipation treatment is continuously carried out on the IT equipment.
In some embodiments, further comprising:
the heated cooling liquid is collected in a liquid collecting container;
and the liquid collecting container conveys the heated cooling liquid to the heat exchange unit through the liquid outlet for heat exchange treatment.
Compared with the prior art, the application has the following advantages:
the utility model provides a pair of rack, can get into the liquid between cabinet body bottom and the guide plate below through the water conservancy diversion passageway on the guide plate that the cabinet body is inside to be set up, in even water conservancy diversion to the accommodation space between cabinet body top and the guide plate top for cooling device periphery in the accommodation space forms even whole face flow field, guarantees that cooling device can be in under the equal environment of temperature, through in the accommodation space liquid is to placing cooling device in the accommodation space refrigerates, and when the liquid level arrives the liquid outlet is with liquid pass through the liquid outlet is discharged, thereby can avoid because the liquid temperature that the flow field is chaotic and lead to is great in different regional differences, and local temperature is higher and causes the problem that cooling device radiating efficiency is low.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a cabinet provided herein;
FIG. 2 is a schematic diagram of an embodiment of an immersion liquid cooling system provided herein;
FIG. 3 is a flow chart of an embodiment of an immersion liquid cooling method based on a data center provided herein.
Symbol description:
the cabinet body 101, the accommodating space 102, the guide plate 103, the guide channel 104, the liquid inlet 105, the liquid outlet 106, the liquid collecting container 107, the cooling device 108, the heated liquid 109, the liquid 1010 and the gap 1011; liquid cooling cabinet 201, liquid circulation pump 202, heat exchange unit 203, pipeline 204.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other ways than those herein described and similar generalizations can be made by those skilled in the art without departing from the spirit of the application and the application is therefore not limited to the specific embodiments disclosed below.
The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The manner of description used in this application and in the appended claims is for example: "a", "a" and "a" etc. are not limited in number or order, but are used to distinguish the same type of information from each other.
Based on the description in the background art, when the heat dissipation treatment is performed on the computing service device, such as the server, in the prior art, the server is immersed in the cooling liquid, and the heat emitted by the server is taken away by the cooling liquid, so that the server can be ensured to operate in a normal temperature range, and abnormal faults caused by higher temperature of the server are avoided. However, at least more than two servers can be placed in the existing submerged cooling cabinet, and at this time, the cooling liquid flowing into the cabinet has a condition of disordered flow field of partial area liquid, so that the temperature of the partial area is too high. Therefore, in view of the problem, the application provides a cabinet, which can ensure that after cooling liquid enters the cabinet, uniform flow fields can be formed at different area positions in the cabinet. In the following, a detailed description of a cabinet provided in the present application will be described, referring to fig. 1, fig. 1 is a schematic structural diagram of a cabinet embodiment provided in the present application, where the cabinet embodiment includes:
the cabinet body 101, the liquid outlet 106, the liquid inlet 105 and the baffle 103 arranged at the bottom of the cabinet body. The cabinet body is internally provided with an accommodating space 102 which can accommodate a cooling device needing cooling; the liquid inlet 105 is arranged at the bottom of the cabinet 101 and is positioned between the guide plate 103 and the bottom of the cabinet 101; the liquid outlet 106 is positioned in the top area of the cabinet 101; the guide plate 103 is positioned above the liquid inlet 105, and the plate surface of the guide plate 103 covers the bottom of the cabinet 101; the flow guide channel 104 arranged on the flow guide plate 103 can uniformly guide the liquid 1010 entering between the flow guide plate 103 and the bottom of the cabinet body 101 through the liquid inlet 105 into the accommodating space 102 between the upper side of the flow guide plate 103 and the top of the cabinet body 101 to form an integral flow field, the liquid 1010 in the accommodating space 102 is used for refrigerating the cooling device placed in the accommodating space, and when the liquid level reaches the liquid outlet 106, the liquid 1010 is discharged through the liquid outlet.
In this embodiment, the baffle 103 and the bottom of the cabinet 101 may be disposed in a parallel covering manner, and of course, the specific manner in which the baffle 103 is disposed may be determined according to the actual use environment structure, for example, the structure of the cabinet or the structure of the cooling device or the cooling requirement. The present embodiment is mainly illustrated in a parallel arrangement.
It should be noted that, when the cabinet provided in the application is applied in an immersion liquid cooling scenario, the cabinet body 101 may be the cabinet body 101 of an immersion liquid cooling cabinet, and a device that needs to dissipate heat, such as a server, may be placed in an accommodating space in the cabinet body 101. The coolant liquid passes through the inlet enters into the bottom of the cabinet body, the rethread the even water conservancy diversion of water conservancy diversion passageway on the water conservancy diversion board reaches the water conservancy diversion board top, thereby can form even flow field between the water conservancy diversion board with cabinet body top, right the server refrigerates, and the coolant liquid after being heated can discharge through the liquid outlet, thereby can guarantee form even flow field all the time in the cabinet and carry out refrigeration treatment to the server, avoid because coolant liquid flow to chaotic and make form chaotic flow field in the accommodation space, lead to local regional high temperature in the accommodation space reduces the refrigeration efficiency of server.
In this embodiment, the flow guiding channel may be a hole, where the length of the hole is the thickness of the flow guiding plate, one end of the flow guiding channel is an inlet, and the other end of the flow guiding channel is an outlet, and the inlet is opposite to the bottom of the cabinet body and is used for guiding the liquid between the bottom of the cabinet body and the flow guiding plate into the flow guiding channel. The outlet is opposite to the top of the cabinet body and is used for guiding the liquid in the guiding channel into the accommodating space between the upper part of the guiding plate and the top of the cabinet body. In this embodiment, the flow guiding channel may be a through hole perpendicular to the surface of the flow guiding plate, and the length of the through hole is equal to the thickness of the flow guiding plate. A plurality of through holes can be distributed on the flow guide plate to ensure the uniformity of the flow field. The diameter size and shape of the through hole can be set according to actual requirements, for example: a plurality of through holes with different shapes and the same size are arranged on the guide plate; or a plurality of through holes with different shapes and sizes are arranged; or a plurality of through holes with the same shape and size are arranged; or a plurality of through holes with the same shape and different sizes are arranged, for example: the through holes may be any combination of round holes, square holes, hexagonal holes, etc., or only one of them. Therefore, the shape and the size of the through hole can be uniform based on meeting the requirement of uniform flow at different positions in the accommodating space, so that uniform flow field is achieved, and the specific setting mode is not limited.
It should be noted that, the cabinet provided by the application leads liquid from between the guide plate and the bottom of the cabinet body to between the top of the cabinet body and the upper part of the guide plate through the guide channel on the guide plate, so as to form a uniform flow field. The flow field can be understood as that liquid is filled in the accommodating space, and the liquid entering from the liquid inlet can be uniformly guided into the accommodating space from the bottom of the cabinet body through the guide plate, so that the flow field of the contact area of the liquid and the server can be ensured to be uniform when the liquid reaches the server. In other words, the flow guide plate can be used for carrying out flow guide distribution on the liquid and uniformly distributing the liquid to the server area, so that a uniform flow field is formed in the server area, and uniform refrigeration of the server is ensured. For example: in the application scenario of the embodiment, the through holes in the area opposite to the server can be set to be the same in size and shape, so that the liquid around the server can be uniformly coated on the server, a uniform flow field is formed around the server, and uniform heat dissipation of the server is ensured.
As can be seen from fig. 1, the baffle 103 is matched with the bottom edge of the cabinet 101, and a gap 1011 is provided between the baffle and the bottom edge of the cabinet, so that the liquid inlet 105 is used for introducing the liquid 1010 into the gap 1011 between the bottom of the cabinet and the baffle, and therefore, the baffle 103 can be integrated with the cabinet 101 or be a detachable split structure capable of being installed in a matched manner. Of course, the baffle 103 may include at least two baffles when in a detachable split structure, and the baffles may be assembled with the bottom of the cabinet body in a matching manner, so that an integral baffle located at the bottom of the cabinet body is formed after the assembly, and the detachable split structure is convenient for maintenance or cleaning in the cabinet body.
In this embodiment, the inlet is located the guide plate with between the cabinet body bottom plate, the height that forms the space between guide plate and the cabinet body bottom plate can be equal to or greater than the height of inlet, in order to be convenient for quick to inject liquid in the accommodation space, the inlet can set up the both sides of cabinet body width direction.
In order to improve the uniformity of the liquid entering between the guide plate and the bottom plate of the cabinet body through the liquid inlet, in this embodiment, the liquid inlet may be disposed in a middle area of the width of the bottom plate of the cabinet body.
Correspondingly, the liquid outlets can also be arranged at two sides of the width direction of the cabinet body, so that heated liquid 109 positioned at the top of the cabinet body can be rapidly drained to the outside of the cabinet body for corresponding heat exchange treatment. The position of the liquid outlet can be determined according to the height of the server in the accommodating space, namely, the liquid outlet is set so that the server can be immersed by the liquid, therefore, the position of the liquid outlet can be greater than or equal to the height of the server in the accommodating space, namely: the liquid outlet is arranged on the width direction of the cabinet body and is positioned on two sides of the top area of the cabinet body, wherein the distance between the top of the cabinet body and the guide plate is larger than or equal to the height of the cooling device.
In order to improve the collection of the heated cooling liquid at the top of the cabinet body, a liquid collecting container for collecting the heated cooling liquid may be arranged at the top of the cabinet body, and the liquid outlet may be used for conveying the heated cooling liquid at the top of the cabinet body from the liquid collecting container to the heat exchange unit, where the cooling liquid after heat treatment returns to the liquid inlet through a pipeline, and a specific process will be described in the following immersion liquid cooling system embodiments. Only the structure of the cabinet embodiments of the present application will be described herein.
The liquid collecting containers 107 may be respectively disposed at both sides of the top width direction of the cabinet and communicate with the liquid outlet and the accommodating space 102. To ensure that heated liquid 109 (heated coolant) can be quickly collected by the liquid collecting container 107, the bottom of the liquid collecting container 107 is lower than the upper limit value of the height of the coolant in the accommodating space 102 or lower than the upper limit value of the height of the cooling device 108 in the accommodating space 102; in order to facilitate the collected cooling liquid to flow out of the liquid collecting container 107 quickly, the liquid outlet 106 may be disposed at the bottom of the liquid collecting container 107, so as to increase the heat treatment speed of the heated cooling liquid.
Above-mentioned rack embodiment that this application provided can be through the water conservancy diversion passageway on the guide plate with the even water conservancy diversion of liquid in the accommodation space between cabinet body top and the guide plate top for accommodation space cooling device periphery forms even whole face flow field, guarantees that cooling device can be in under the equal environment of temperature, combines concrete application scenario, and cooling device periphery forms even whole face flow field, and the coolant liquid temperature is equal, avoids because the coolant liquid temperature difference that the flow field is chaotic and lead to is great, and local temperature is higher and causes the problem that cooling device radiating efficiency is low.
The foregoing describes an embodiment of a cabinet provided in the present application, and correspondingly, the present application further discloses an embodiment of an immersion liquid cooling system, and fig. 2 is a schematic structural diagram of an embodiment of an immersion liquid cooling system provided in the present application, with reference to fig. 2 in conjunction with fig. 1. The system embodiment comprises:
a liquid cooling cabinet 201, a liquid circulation pump 202, a heat exchange unit 203 and a pipeline 204;
the liquid inlet 105 and the liquid outlet 106 of the liquid cooling cabinet 201 are connected with the liquid circulation pump 202 and the heat exchange unit 203 through the pipeline 204; the cooling liquid is conveyed to the liquid inlet 105 through the pipeline 204, enters between the bottom of the liquid cooling cabinet 201 and the guide plate 103 arranged above the bottom of the liquid cooling cabinet 201 through the liquid inlet 105, is uniformly guided to the position between the upper part of the guide plate and the top of the liquid cooling cabinet through the guide channel on the guide plate, forms an integral flow field, cools the built-in computer service equipment, and flows to the top of the liquid cooling cabinet, then enters the pipeline through the liquid outlet, and circulates to the heat exchange unit through the liquid circulation pump for heat exchange treatment, and the treated cooling liquid is circularly conveyed to the liquid inlet through the pipeline, enters again between the bottom of the liquid cooling cabinet and the guide plate through the liquid inlet, is guided to the accommodating space between the upper part of the guide plate and the top of the liquid cooling cabinet through the guide channel, and then cools the computer service equipment, thus realizing the cooling function of the computer service equipment in a reciprocating way, and further realizing the cooling function of cooling the computer service equipment.
In order to enable the heated cooling liquid to be quickly conveyed into the heat exchange unit for heat exchange treatment, the cooling liquid with a low temperature can be quickly provided in the accommodating space, and in the embodiment, the heat exchange device further comprises: the liquid collecting container is communicated with the liquid outlet and the accommodating space, collects heated cooling liquid and discharges the collected cooling liquid through the liquid outlet by the liquid circulating pump, and the cooling liquid is conveyed to the heat exchange unit for heat exchange treatment by the pipeline. The specific layout manner of the liquid collecting container can refer to the description of the embodiment of the cabinet body, and the description is not repeated here.
In the embodiment of the immersion liquid cooling system, a plurality of computer service devices can be placed in the liquid cooling cabinet, the bottom of each computer server is in contact with the guide plate, guide channels or guide through holes are uniformly distributed on the periphery of the computer server, cooling liquid entering through the liquid inlet can be uniformly guided into the accommodating space through the guide through holes, and a whole and uniform flow field is formed in the computer service device area, so that the periphery of the computer service device can be covered and immersed by cooling liquid with the same temperature, and the problem that the local position temperature in the accommodating space is overhigh due to uneven flow field caused by disordered flow of the cooling liquid is avoided. The cooling liquid absorbs the heat of the computing service equipment and then is concentrated in the top area of the liquid cooling cabinet, the cooling liquid with higher temperature after being heated can be collected by the liquid collecting container, the cooling liquid with higher temperature in the liquid collecting container is conveyed to the heat exchange unit through the liquid outlet to be subjected to heat exchange treatment, the cooling liquid after cooling is obtained, the cooling liquid is conveyed to the liquid inlet again through the pipeline and flows into the space between the bottom of the liquid cooling cabinet and the guide plate, the cooling liquid is guided into the accommodating space again through the guide through hole to refrigerate the computing service equipment, the cooling liquid is repeatedly circulated, the cooling liquid in the accommodating space can be in a low-temperature state, the periphery of the computing service equipment can be ensured to be in a uniform flow field, the refrigerating efficiency of an immersed liquid cooling system is improved, and the normal operation of the computing service equipment is ensured.
The foregoing is a description of an embodiment of an immersion liquid cooling system provided in the present application, and the description process may be combined with the description of the foregoing cabinet embodiment, which is not repeated herein.
It should be noted that, the immersion liquid cooling system in this embodiment may be applied to a large-scale data processing scenario such as a data center and an edge computing system, so as to ensure normal operation of the data center or the edge computing system.
Based on the above, the application further provides an immersion liquid cooling method based on the data center, and the immersion liquid cooling system is adopted in the method, so that the specific content can be understood by combining the immersion liquid cooling system provided by the application. As shown in fig. 3, fig. 3 is a flowchart of an embodiment of an immersion liquid cooling method based on a data center, where the embodiment of the method includes:
step S301: cooling liquid enters between the bottom of the liquid cooling cabinet and the guide plate through the liquid inlet;
step S302: the flow guide plate uniformly guides the cooling liquid into an accommodating space between the top of the liquid cooling cabinet and the flow guide plate through a flow guide channel, and a uniform whole-surface flow field is formed on the periphery of data center IT equipment placed in the accommodating space;
step S303: after the heat of the IT equipment of the data center is absorbed by the cooling liquid, the heated cooling liquid is discharged through a liquid outlet at the top of the liquid cooling cabinet;
step S304: the discharged cooling liquid is subjected to heat exchange treatment and is circularly guided into the accommodating space between the top of the liquid cooling cabinet and the guide plate again, and heat dissipation treatment is continuously carried out on the IT equipment.
In this embodiment, the method may further include:
the heated cooling liquid is collected in a liquid collecting container;
and the liquid collecting container conveys the heated cooling liquid to the heat exchange unit through the liquid outlet for heat exchange treatment.
The cooling liquid after heat exchange treatment is circulated to the liquid inlet again, enters between the bottom of the liquid cooling cabinet and the guide plate, is guided to the accommodating space between the top of the liquid cooling cabinet and the guide plate through the guide channel, and continuously carries out heat dissipation treatment on the IT equipment of the data center, so that the cooling liquid around the IT equipment of the data center has uniform temperature, and local overtemperature caused by local cooling liquid flow field confusion caused by flow direction confusion in the cooling liquid entering accommodating space is avoided, and the heat dissipation efficiency of the IT equipment is further reduced, and the energy consumption is high.
It can be understood that the immersion liquid cooling system and the immersion liquid cooling method can be adopted in the application scene of the data center or the application scene of cluster data service such as super calculation and edge calculation, so that hardware equipment can be in a good heat dissipation environment, powerful protection is provided for data processing service, and the problem of higher energy consumption caused by a large-scale computing processing center can be reduced.
In one typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include volatile memory in a computer-readable medium, random Access Memory (RAM) and/or nonvolatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of computer-readable media.
1. Computer readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of storage media for a computer include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium, which can be used to store information that can be accessed by a computing device. Computer readable media, as defined herein, does not include non-transitory computer readable media (transmission media), such as modulated data signals and carrier waves.
2. It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
While the preferred embodiment has been described, it is not intended to limit the invention thereto, and any person skilled in the art may make variations and modifications without departing from the spirit and scope of the present invention, so that the scope of the present invention shall be defined by the claims of the present application.
Claims (11)
1. A cabinet, comprising: the liquid inlet and the liquid outlet are formed in the bottom of the cabinet body;
the cabinet body is provided with an accommodating space capable of accommodating a cooling device which needs to be cooled; the liquid inlet is arranged at the bottom of the cabinet body and is positioned between the guide plate and the bottom; the liquid outlet is positioned in the top area of the cabinet body; the guide plate is positioned above the liquid inlet, and the plate surface of the guide plate covers the bottom of the cabinet body; the flow guide channel arranged on the flow guide plate can uniformly guide the liquid entering between the flow guide plate and the bottom of the cabinet body through the liquid inlet into the accommodating space between the upper part of the flow guide plate and the top of the cabinet body and form a whole-surface flow field, refrigerating the cooling device placed in the accommodating space through the liquid in the accommodating space, and discharging the liquid through the liquid outlet when the liquid level reaches the liquid outlet;
further comprises: the liquid collecting containers are arranged on two sides of the top width direction of the cabinet body and are used for collecting heated liquid in the top area of the accommodating space, and the collected liquid is conveyed to the heat exchange unit for heat treatment through the liquid outlet arranged at the bottom of the liquid collecting container, and the treated liquid returns to the liquid inlet through a pipeline; the bottom of the liquid collecting container is lower than the upper limit value of the height of the cooling liquid in the accommodating space or lower than the upper limit value of the height of the cooling device in the accommodating space.
2. The cabinet of claim 1, wherein the flow-directing channel comprises an outlet and an inlet, the inlet being opposite the cabinet bottom and the outlet being opposite the cabinet top.
3. The cabinet of claim 1, wherein the baffle channel is a plurality of through holes disposed perpendicular to the baffle plate surface.
4. The cabinet of claim 3, wherein at least one of a position and a size of the through holes is such that a flow field of the liquid through the baffle into the space between the top of the cabinet and the baffle is uniform.
5. The cabinet of claim 1, wherein the baffle is integrally formed with the bottom of the cabinet; or, the guide plate and the bottom of the cabinet body are of a matched detachable split structure.
6. The cabinet of claim 5, wherein the baffle comprises at least two baffles when the baffle is in a detachable split structure, wherein the baffles can be assembled with the bottom of the cabinet in a matching manner.
7. The cabinet according to claim 1, wherein the liquid collecting containers are provided on both sides in a widthwise direction of the cabinet body.
8. The cabinet of claim 1, wherein the liquid inlet is disposed in a width direction of the cabinet body and is disposed at two sides of a bottom of the cabinet body.
9. The cabinet of claim 1, wherein the liquid outlet is disposed in a width direction of the cabinet body and is located at two sides of a top area of the cabinet body where a distance between the top of the cabinet body and the deflector is greater than or equal to a height of the cooling device.
10. An immersion liquid cooling system, comprising: the liquid cooling machine comprises a liquid cooling cabinet, a heat exchange unit, a pipeline and a liquid circulating pump;
the liquid inlet and the liquid outlet of the liquid cooling cabinet are connected with the liquid circulating pump and the heat exchange unit through the pipelines; the cooling liquid enters the liquid inlet through the pipeline, enters between the bottom of the liquid cooling cabinet and the guide plate arranged above the bottom through the liquid inlet, is uniformly guided to a whole flow field formed between the upper part of the guide plate and the top of the liquid cooling cabinet through a guide channel on the guide plate, cools the built-in computer service equipment, and the heated cooling liquid enters the pipeline through the liquid outlet and circulates to the heat exchange unit through the liquid circulating pump for heat exchange treatment, and the treated liquid circulates to the liquid inlet through the pipeline and enters the liquid cooling cabinet again for refrigerating the computer service equipment;
further comprises: the liquid collecting containers are arranged on two sides of the top width direction of the cabinet body, collect liquid heated in the top area of the accommodating space, convey the collected liquid to the heat exchange unit for heat treatment through the liquid outlet arranged at the bottom of the liquid collecting container, and return the treated liquid to the liquid inlet through a pipeline; the bottom of the liquid collecting container is lower than the upper limit value of the height of the cooling liquid in the accommodating space or lower than the upper limit value of the height of the cooling device in the accommodating space, and the accommodating space is a space which can accommodate the cooling device which needs cooling on the cabinet body.
11. An immersion liquid cooling method based on a data center, comprising:
cooling liquid enters between the bottom of the liquid cooling cabinet and the guide plate through the liquid inlet;
the flow guide plate uniformly guides the cooling liquid into an accommodating space between the top of the liquid cooling cabinet and the flow guide plate through a flow guide channel, and a uniform whole-surface flow field is formed on the periphery of data center IT equipment placed in the accommodating space;
after the heat of the IT equipment of the data center is absorbed by the cooling liquid, the heated cooling liquid is discharged through a liquid outlet at the top of the liquid cooling cabinet;
the discharged cooling liquid is subjected to heat exchange treatment and is circularly guided into an accommodating space between the top of the liquid cooling cabinet and the guide plate again, and heat dissipation treatment is continuously carried out on the IT equipment;
further comprises: the heated cooling liquid is collected and arranged in liquid collecting containers at two sides of the width direction of the top of the cabinet body; the liquid collecting container conveys the heated cooling liquid to the heat exchange unit for heat exchange treatment through the liquid outlet arranged at the bottom of the liquid collecting container; the bottom of the liquid collecting container is lower than the upper limit value of the height of the cooling liquid in the accommodating space or lower than the upper limit value of the height of the cooling device in the accommodating space.
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| CN113473823B (en) * | 2021-09-02 | 2021-11-19 | 深圳比特微电子科技有限公司 | Single-phase immersion type liquid cooling cabinet |
| CN114901037B (en) * | 2022-04-29 | 2023-11-17 | 苏州浪潮智能科技有限公司 | Immersed liquid cooling device and liquid cooling method thereof |
| CN115500008A (en) * | 2022-08-30 | 2022-12-20 | 超聚变数字技术有限公司 | Computing node and computing equipment |
| CN115361852A (en) * | 2022-09-26 | 2022-11-18 | 西安易朴通讯技术有限公司 | Liquid cooling cabinet |
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| CN105487624A (en) * | 2014-10-10 | 2016-04-13 | 汤金菊 | High-density server liquid immersion cooling cabinet |
| CN104284536B (en) * | 2014-10-28 | 2017-06-06 | 深圳绿色云图科技有限公司 | Server cabinet and the stack of cabinets with it and liquid-immersed cooling server system |
| CN108882652B (en) * | 2018-08-21 | 2019-07-09 | 葛俊 | Liquid-immersed cooling machine cabinet, system and the maintaining method of high density server |
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