CN113301474A

CN113301474A - Head-wearing earphone

Info

Publication number: CN113301474A
Application number: CN202110731496.XA
Authority: CN
Inventors: 向前锋; 李虎
Original assignee: Dongguan Edifier Technology Co ltd
Current assignee: Dongguan Edifier Technology Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2021-08-24

Abstract

The invention discloses a headset, which comprises an arc-shaped head band, wherein the end part of the head band is connected with an earmuff, the earmuff comprises an earshell, a loudspeaker is arranged in the earshell, a plurality of air conduction microphones are arranged on the earshell, and a bone conduction chip is arranged on one side surface of the earshell facing to ears. Through having introduced the bone conduction chip in headphone, the bone conduction chip adopts the bone conduction mode, combines the air conduction microphone to fall the processing of making an uproar to the sound signal of gathering, can obtain more clear sound signal, reduces the harmful effects of external environment noise, guarantees speech quality.

Description

Head-wearing earphone

Technical Field

The invention relates to the technical field of head-wearing earmuffs, in particular to a head-wearing earphone.

Background

The headset is worn on the head and mainly consists of four parts: the head band, control sound production unit, ear muff and lead wire. The function of the head band is to fix the left and right sounding units, which are placed on both sides of the head, and the structure and the connection mode of the head band and the units determine the pressure of the head band and the ear muffs on the head, which affects the wearing comfort of the earphone.

The ear muff is the part of the head contacting with the sound producing unit, and is very important for the moving coil earphone, and the function of the ear muff is to reflect the low frequency back and ensure the reproduction of the low frequency. Earmuffs generally come in two types, one of which is called Supra-aural (Supra-aural) and the other of which is cup-shaped and surrounds the ear, called circumaural (circumaural). The earmuffs are soft and comfortable as much as possible, the insides of the earmuffs are generally filled with sponge, and the outsides of the earmuffs are covered with leather or flannelette. The material used for the ear muffs absorbs medium and high frequencies, which keeps the ear at a distance from the diaphragm and forms a chamber between the earphone and the head. The large-scale ear-surrounding type earmuffs have large internal space, and sound can act on auricles to form better space feeling.

Head-mounted earphone adopts the air conduction microphone generally, and the transmission sound definition is not high, has the noise, and general bone conduction chip sets up on the earphone of in-ear usually, how to fall the noise processing to the acoustic signal of gathering in head-mounted earphone, obtains more clear acoustic signal, reduces the harmful effects of external environment noise, guarantees that speech quality is the technical problem that will solve at present.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a headphone for reducing noise.

The invention provides a headset, which comprises an arc-shaped head band, wherein the end part of the head band is connected with an earmuff, the earmuff comprises an earshell, a loudspeaker is arranged in the earshell, a plurality of air conduction microphones are arranged on the earshell, and a bone conduction chip is arranged on one side surface of the earshell facing to ears.

Further, the earlap includes one end open-ended loudspeaker antechamber, be equipped with in the loudspeaker antechamber loudspeaker, the opening part in loudspeaker antechamber is equipped with the edge of inside extension, be equipped with a plurality of elastic support piece on the edge, elastic support piece is last to be equipped with the bone conduction chip, elastic support piece's all sides cladding has comfortable layer.

Furthermore, a plurality of the elastic supporting pieces are arranged at intervals.

Further, the earmuffs comprise a first earmuff and a second earmuff, the first earmuff is connected with one end of the headband, the second earmuff is connected with the other end of the headband, and the elastic supporting member is arranged on the first earmuff and/or the second earmuff.

Further, elastic support piece includes the support, be equipped with the cell body of an opening towards the ear in the support, be equipped with the spring in the cell body, the upper end of spring is followed expose in the cell body, the cover is equipped with the spring cap on the spring, be equipped with on the spring cap bone conduction chip.

Furthermore, the air conduction microphone comprises a first air conduction microphone arranged in the middle of the front cavity of the loudspeaker and a second air conduction microphone arranged at the top of the outer side of the earmuff.

Furthermore, a third air conduction microphone is arranged at the bottom of the outer side of the ear shell.

Further, the comfortable layer is made of sponge or silica gel

Further, the periphery of the comfort layer is wrapped with an earmuff skin.

Furthermore, the earmuff leather is made of leather, mesh or silica gel.

The invention has the beneficial effects that: the embodiment of the invention provides a headset, which comprises an arc-shaped head band, wherein the end part of the head band is connected with an earmuff, the earmuff comprises an earshell, a loudspeaker is arranged in the earshell, a plurality of air conduction microphones are arranged on the earshell, and a bone conduction chip is arranged on one side surface of the earshell facing to ears. Through having introduced the osteoacusis chip in headphone, the osteoacusis chip adopts the osteoacusis mode, combines the air conduction microphone to fall the processing of making an uproar to the sound signal of gathering, can obtain more clear sound signal, reduces the harmful effects of external environment noise, guarantees speech quality, improves the pickup effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a headset according to an embodiment of the present invention.

In the figure: 1. a headband; 2. ear muffs; 20. a first earmuff; 21. a second earmuff; 3. an earshell; 30. a horn front cavity; 31. an edge; 301. a first air conduction microphone; 302. a second air conduction microphone; 303. a third air conduction microphone; 4. a bone conduction chip; 5. an elastic support member; 50. a support; 51. a spring cap; 6. a comfort layer.

Detailed Description

The embodiment of the invention provides a headset which is used for reducing noise and improving sound pickup effect.

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

Example (b):

referring to fig. 1, fig. 1 is a schematic view of an overall structure of a headphone, and as shown in fig. 1, the headphone includes an arc-shaped headband 1, an end portion of the headband 1 is connected to an earmuff 2, the earmuff 2 includes an earmuff 3, a speaker is disposed in the earmuff 3, a plurality of air conduction microphones are disposed on the earmuff 3, and a bone conduction chip 4 is disposed on a side surface of the earmuff 3 facing ears.

In a specific embodiment, as shown in fig. 1, a bone conduction chip 4 is introduced into the headset, the bone conduction chip adopts a bone conduction mode, the air conduction microphone adopts an air conduction mode, and noise reduction processing is performed by combining sound signals acquired by bone conduction and air conduction, so that a clearer sound signal can be obtained, adverse effects of external environment noise are reduced, and the communication quality is ensured.

The working principle is as follows: the aim of noise reduction is achieved by fusing the sound picked up by bone conduction with air conduction MIC.

Further, earlap 3 includes one end open-ended loudspeaker antechamber 30, be equipped with in loudspeaker antechamber 30 loudspeaker, the opening part of loudspeaker antechamber 30 is equipped with edge 31 of inside extension, be equipped with a plurality of elastic support piece 5 on edge 31, be equipped with on elastic support piece 5 bone conduction chip 4, the week side cladding of elastic support piece 5 has comfortable layer 6.

In specific embodiment, this structure is through fixing bone conduction chip 4 on elastic support element 5's up end, elastic support element 5 is elastically flexible, the cladding has comfortable layer 6 in elastic support element 5's week side, bone conduction chip 4 is fixed and is played better shock attenuation effect and with the good contact of human body through the flexible coupling on elastic material, when the people wears two sets, compress through comfortable layer 6 and elastic support element 5, carry out fine laminating with the people's face and play better shock attenuation effect.

Further, a plurality of the elastic supporting members 5 are arranged at intervals.

In the specific embodiment, the number and position of the elastic supporting members 5 can be adjusted at will, without limitation.

Further, the ear cups 2 comprise a first ear cup 20 and a second ear cup 21, the first ear cup 20 is connected to one end of the headband 1, the second ear cup 21 is connected to the other end of the headband 1, and the elastic supporting member 5 is disposed on the first ear cup 20 and/or the second ear cup 2.

In a specific embodiment, the ear cup 2 comprises a first ear cup 20 and a second ear cup 21, and the bone conduction chip 4 is arranged on the first ear cup 20 and the second ear cup 21; alternatively, the bone conduction chip 4 is disposed on the first ear cup 20 or the bone conduction chip 4 is disposed on the second ear cup 21. The bone conduction of the present embodiment is not limited to the placement of the left and right ears, and can be combined.

Further, elastic support piece 5 includes support 50, be equipped with a cell body of opening towards the ear in the support 50, be equipped with the spring in the cell body, the upper end of spring is followed expose in the cell body, the cover is equipped with spring cap 51 on the spring, be equipped with on the spring cap 51 bone conduction chip 4.

In a specific embodiment, the elastic support 5 comprises a bracket 50, a spring cap 51 is arranged on the spring by arranging the spring in the groove, and the bone conduction chip 4 is arranged on the spring cap 51.

Further, the air conduction microphone comprises a first air conduction microphone 301 arranged in the middle of the horn front cavity 30, and a second air conduction microphone 302 arranged at the top of the outer side of the ear shell 3.

In a specific embodiment, the microphones include a first air conduction microphone 301 and a second air conduction microphone 302, the first air conduction microphone 301 is disposed in the middle of the front speaker cavity 30, and the second air conduction microphone 302 is disposed on the top of the outer side of the ear shell 3.

Further, a third air conduction microphone 303 is arranged at the bottom of the outer side of the ear shell 3.

In a specific embodiment, a third air conduction microphone 303 is provided on the outside bottom of the ear shell 3, the air conduction microphone is not limited to single and dual microphones and various combinations.

Further, the comfort layer 6 is sponge or silica gel.

In a specific embodiment, the comfort layer 6 is a sponge or a silica gel, and different soft and elastic materials can be used, which are not limited to sponge, silica gel, etc.

Further, the outer periphery of the comfort layer 6 is covered with an ear cover skin 7.

In a particular embodiment, in order to improve comfort, the outer circumference of the comfort layer 6 is covered with an ear cover skin 7.

Furthermore, the earmuff skin 7 is made of leather, mesh or silica gel.

In a specific embodiment, the ear sheath 7 may be made of leather, mesh, or silica gel.

In summary, the embodiment of the present invention provides a headset, which includes an arc-shaped headband, wherein an end of the headband is connected to an earmuff, the earmuff includes an earmuff, a speaker is disposed in the earmuff, a plurality of air conduction microphones are disposed on the earmuff, and a bone conduction chip is disposed on a side surface of the earmuff facing ears. Through having introduced the bone conduction chip in headphone, the bone conduction chip adopts the bone conduction mode, combines the air conduction microphone to fall the processing of making an uproar to the sound signal of gathering, can obtain more clear sound signal, reduces the harmful effects of external environment noise, guarantees speech quality.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a headphone, its characterized in that, is including being curved bandeau (1), the tip and the ear muff (2) of bandeau (1) are connected, ear muff (2) are including earlap (3), be equipped with loudspeaker in earlap (3), be equipped with a plurality of air conduction microphones on earlap (3), earlap (3) are equipped with bone conduction chip (4) towards one side of ear.

2. The headset according to claim 1, wherein the earmuff (3) comprises a speaker front cavity (30) with an opening at one end, the speaker is arranged in the speaker front cavity (30), an edge (31) extending inwards is arranged at the opening of the speaker front cavity (30), a plurality of elastic supporting members (5) are arranged on the edge (31), the bone conduction chip (4) is arranged on the elastic supporting members (5), and a comfort layer (6) is wrapped around the elastic supporting members (5).

3. A headphone as claimed in claim 2, characterized in that several of the elastic supports (5) are arranged at intervals.

4. Headset according to claim 1, characterized in that the ear cups (2) comprise a first ear cup (20) and a second ear cup (21), the first ear cup (20) being connected to one end of the headband (1), the second ear cup (21) being connected to the other end of the headband (1), the elastic support (5) being provided on the first ear cup (20) and/or the second ear cup (2).

5. The headphone as claimed in claim 2, wherein the elastic support member (5) comprises a support (50), a groove body with an opening facing the ear is arranged in the support (50), a spring is arranged in the groove body, the upper end of the spring is exposed out of the groove body, a spring cap (51) is sleeved on the spring, and the bone conduction chip (4) is arranged on the spring cap (51).

6. A headphone as claimed in claim 2, characterized in that the air conduction microphones comprise a first air conduction microphone (301) arranged in the middle of the horn front cavity (30) and a second air conduction microphone (302) arranged on the outside top of the ear shell (3).

7. A headphone as claimed in claim 6, characterized in that a third air conduction microphone (303) is arranged on the outside bottom of the ear shell (3).

8. The headset according to claim 2, characterized in that the comfort layer (6) is a sponge or a silicone.

9. Headset according to claim 8, characterized in that the outer circumference of the comfort layer (6) is covered with an earmuff skin (7).

10. The headset according to claim 9, wherein the earmuff skin (7) is made of leather, mesh or silicone.