CN113298215A - RFID label anti-transfer method using random capacitor - Google Patents

RFID label anti-transfer method using random capacitor Download PDF

Info

Publication number
CN113298215A
CN113298215A CN202110546858.8A CN202110546858A CN113298215A CN 113298215 A CN113298215 A CN 113298215A CN 202110546858 A CN202110546858 A CN 202110546858A CN 113298215 A CN113298215 A CN 113298215A
Authority
CN
China
Prior art keywords
metal film
capacitance
capacitor
chip
rfid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110546858.8A
Other languages
Chinese (zh)
Inventor
帅谊鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huada Hengxin Technology Co ltd
Original Assignee
Huada Hengxin Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huada Hengxin Technology Co ltd filed Critical Huada Hengxin Technology Co ltd
Priority to CN202110546858.8A priority Critical patent/CN113298215A/en
Publication of CN113298215A publication Critical patent/CN113298215A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Burglar Alarm Systems (AREA)

Abstract

The invention provides a method for preventing an RFID label from being transferred by using a random capacitor, which comprises the following steps: arranging at least one capacitor plate on top metal in the chip; arranging a metal film parallel to the top metal on the upper plane of the packaging salient point of the chip; the chip and the tag antenna are packaged together to form an RFID tag, and the capacitor plate and the metal film form an initialization capacitor. According to the method, whether the RFID label is reused or not is verified through the fact that the capacitance of the capacitor plate and the metal film is different from the initialization capacitance after the RFID label is reused, and anti-counterfeiting is achieved.

Description

RFID label anti-transfer method using random capacitor
Technical Field
The invention relates to the technical field of electronic tag anti-counterfeiting, in particular to a method for preventing a random capacitor RFID tag from being transferred.
Background
The RFID technology is commonly used for anti-counterfeiting of valuables, and in the prior art, a chip or a label can be taken down from a packaged antenna without damage by a certain technical means; and then the label is used after being packaged for the second time by a counterfeiter for counterfeiting, so that how to realize the anti-counterfeiting of the label is always the research direction.
In recent years, anti-counterfeiting research is becoming mature, for example, CN202010373859.2 proposes a fragile anti-counterfeiting label which is convenient to remove, an easy-to-tear structure is assembled on the lower surface of the anti-counterfeiting label body, and auxiliary tearing pieces are assembled at the left and right ends of the anti-counterfeiting label body, but after the label is torn, a complete chip can be obtained, and then the chip can be packaged and still use an RFID label; CN202010432963.4 also provides a developments changeable colour two-dimensional code antifalsification label, and the customs sets up protective frame, temperature sensing discoloration layer, anti-fake information layer outside the label body, and protective frame can carry out quick joint and dismantle, anti-fake information layer contains multiple anti-fake information, realizes carrying out effectual protection to the label body, and nevertheless this kind of label manufacture process is loaded down with trivial details, and the cost is great, and the volume of label is great, should not use on some precious meticulous commodities.
Disclosure of Invention
In view of the above, an object of the present invention is to provide an anti-transfer method for an RFID tag using a random capacitor, which can be used to verify whether the tag is forged or used for a second time.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a method for preventing the transfer of an RFID label by using a random capacitor comprises the following steps:
arranging at least one capacitor plate on top metal in the chip;
arranging a metal film parallel to the top metal on the upper plane of the packaging salient point of the chip;
the chip and the tag antenna are packaged together to form an RFID tag, and the capacitor plate and the metal film form an initialization capacitor.
Further, the metal film has wrinkles and/or the metal film is made with random cuts.
Further, the chip and the tag antenna are packaged together to form an RFID tag, and the step of forming an initialization capacitor by the capacitor plate and the metal film comprises:
attaching the packaged RFID label to an object, and reading the initialized capacitance between the capacitance polar plate and the metal film by using a first charging voltage and a first comparison voltage;
the first charging voltage and the first comparison voltage are stored with the corresponding initialization capacitors.
Further, the first charging voltage and the first comparison voltage both use a preset voltage sequence.
Further, still include:
after the RFID label is transferred, the surface shape of the metal film of the re-packaged RFID label is changed, and/or the distance between the metal film and a capacitance plate is changed, and/or the capacitance value of the capacitance plate and the metal film is changed due to the change of anisotropic conductive adhesive in the antenna package of the chip and the label;
reading the capacitance of the re-packaged RFID tag;
and comparing the read capacitance with the initialized capacitance, and if the capacitance value changes beyond a preset confidence range, transferring the RFID tag.
Further, the repackaging of the RFID tag read capacitance includes:
reading the stored first charging voltage and the first comparison voltage;
and reading the capacitance of the repackaged RFID label by using the first charging voltage and the first comparison voltage.
Further, the capacitance between the metal film and the capacitor plate is:
Figure RE-GDA0003127260190000031
wherein epsilon0The dielectric constant in vacuum, epsilon is a dielectric coefficient, S is the area of the metal film opposite to the capacitor plate, and d is the distance between the metal film and the capacitor plate.
Further, the material of the packaging bump is gold or copper.
Furthermore, three capacitor plates are arranged on the top metal layer of the RFID chip body.
Further, the first charging voltage and the first comparison voltage and the corresponding initialization capacitor are stored in a chip and/or uploaded and stored in a server.
The invention has the beneficial effects that: the anti-transfer method of the RFID tag using the random capacitor is provided, the random capacitor is arranged in a chip, the initial random capacitor generated after the antenna is packaged is recorded in the chip, and the state of the random capacitor is recorded and locked when the tag is legally issued; when the chip is packaged for the second time, the state of the random capacitor is changed, so that the RFID chip is protected from being reused, and anti-counterfeiting is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive exercise.
FIG. 1 is a cross-sectional view of an RFID tag provided by an embodiment;
fig. 2 is a top view of an embodiment of an RFID tag.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The examples are given for the purpose of better illustration of the invention, but the invention is not limited to the examples. Therefore, those skilled in the art should make insubstantial modifications and adaptations to the embodiments of the present invention in light of the above teachings and remain within the scope of the invention.
Example 1
The embodiment provides a method for preventing an RFID tag from being transferred by using a random capacitor, which comprises the following steps:
s1: arranging at least one capacitor plate on top metal in the chip;
s2: arranging a metal film parallel to the top metal on the upper plane of the packaging salient point of the chip;
s3: the chip and the tag antenna are packaged together to form the RFID tag, and the capacitor plate and the metal film form an initialization capacitor.
In this embodiment, the chip obtained in step S1 and step S2 is packaged with a tag antenna to form an RFID tag structure diagram, referring to fig. 1 and fig. 2, at least one capacitor plate is disposed on the top metal 5 of the RFID chip body 8, three capacitor plates are disposed in fig. 1 and fig. 2, or any other number of capacitor plates, and the metal film 7 parallel to the top metal 5 is disposed on the upper plane of the packaging bump 4 of the RFID chip body 8; the metal film 7 and the capacitor plate form a random capacitor 6, and the passivation layer 3 of the RFID chip body 8 is a medium between the capacitors 6, such as C1, C2, and C3 shown in fig. 1 and 2; wherein, the capacitance value between the metal film 7 and the capacitor plate is:
Figure RE-GDA0003127260190000051
wherein epsilon0The dielectric constant in vacuum, epsilon is a dielectric coefficient, S is the area of the metal film opposite to the capacitor plate, and d is the distance between the metal film 7 and the capacitor lower plate;
preferably, the metal film 7 provided in this embodiment has a wrinkle or a random cut so that the capacitance value has randomness, and the plurality of curves on the metal film 7 are random knifes, and the capacitance value can be changed by one or more of the following ways: the distance between the metal film 7 and the lower electrode plate of the capacitor is changed, the surface shape of the metal film 7 is changed (such as a pattern cutter of the metal film 7, random die cutting of the metal film 7, different folds of the metal film 7 and the like), the right alignment of the metal film and the capacitor electrode plate is changed, the shape structure of the passivation layer 3 is changed, and the like.
Further, the tag antenna 1 and the RFID chip with the random capacitance are packaged together through the anisotropic conductive adhesive 2 by the packaging salient points 4, and the electric connection salient points in the packaging salient points 4 are communicated with the antenna 1 through the anisotropic conductive adhesive 2; the material of the package bumps 4 in this embodiment is gold or copper, and 4 package bumps 4 may be provided, but other numbers may also be used.
In this embodiment, the metal film 7 is disposed above the passivation layer 3 and the anisotropic conductive adhesive 2 and is parallel to the top metal 5, and the capacitance value in the tag changes with the thickness d of the passivation layer 3 and the anisotropic conductive adhesive 2 after curing (i.e., the distance d between the metal film 7 and the capacitor plate), the dielectric coefficient of the medium of the anisotropic conductive adhesive 2 after curing being epsilon, and the area S of the opposite metal plate (i.e., the area of the opposite metal film and the capacitor plate); when the RFID label with the random capacitor is transferred, the anisotropic conductive adhesive 2 is cleaned or corroded by the cleaning solution special for the conductive adhesive, and then when the RFID chip with the random capacitor is packaged again, the capacitor is changed due to the change of the distance between the metal film 7 and the lower electrode plate of the capacitor, the surface shape of the metal film 7 and the facing area of the metal film and the capacitor electrode plate, and the comparison detection label is transferred.
Further, in the present embodiment, the step S3 specifically includes: after the RFID label with the random capacitor is adhered to an article to be protected, sending an instruction to a chip in the RFID label with the random capacitor to measure and store a capacitance value;
in one embodiment, a packaged RFID tag with a random capacitor is attached to an article to be protected, at this time, a random wrinkle is formed in the metal film 7, and the value of the random capacitor 6 of the RFID chip is determined, the capacitance value is measured and recorded by using a chip instruction, and an initialization capacitor between a capacitor plate and the metal film 7 is read by setting a first charging voltage and a first comparison voltage; and the first charging voltage, the first comparison voltage and the corresponding initialized capacitor are recorded in a chip built-in memory, and can be recorded at a server end of the anti-counterfeiting system.
Preferably, the first charging voltage V usedcmodCan be divided into multiple steps corresponding to a predetermined voltage sequence, e.g. represented by 2bit numbers (00, 01, 10, 11 represent different V's, respectively)cmodVoltage value);
first comparison voltage VrefDivided into multiple steps, corresponding to a predetermined voltage sequence, e.g. represented by 2bit numbers (00, 01, 10, 11 for different V's, respectively)refVoltage value);
when the RFID chip measures the random capacitance, different V can be artificially or randomly selectedcmodAnd VrefSequence, selection of different charging and comparison voltages resulting in the same number of random capacitors 6The value results in different digitized discharge times, which further increases the safety and the non-reproducibility of the overall system.
S4: after the chip in the RFID label with the random capacitor is transferred, the chip is packaged again to cause the surface shape of the metal film to change, and the distance between the metal film and the capacitor lower polar plate is changed by the conductive adhesive used for packaging again;
in the step, after the RFID tag is transferred, the surface shape of the metal film of the re-packaged RFID tag is changed, and/or the distance between the metal film and a capacitor plate is changed, and/or the capacitance value of the capacitor plate and the metal film is changed due to the change of anisotropic conductive adhesive in the antenna packaging of the chip and the tag; the method specifically comprises the following steps: the shape and surface condition of the corresponding metal film 7 of one capacitor plate can affect epsilon, S and d, and the epsilon and d can be affected by the recoated anisotropic conductive adhesive 2 after the label is transferred or packaged again; therefore, the random capacitance value is difficult to be completely consistent with the capacitance value during the first packaging during the second packaging, and whether the label is transferred or not can be judged according to the random capacitance value;
s5: reading the capacitance of the re-packaged RFID tag;
in the step, an instruction is sent to the chip again to measure the capacitance value, and the stored first charging voltage and the stored first comparison voltage are read; the repackaged RFID tag read capacitance is read using a first charging voltage and a first comparison voltage.
S6: and comparing the read capacitor with the initialized capacitor, and judging whether the RFID label is transferred.
The anti-counterfeiting method in the embodiment can be specifically divided into a label initialization process and a label verification process; the method specifically comprises the following steps:
during initialization: after the RFID tag obtained in the step S3 is stably attached to an object, a card reader randomly selects a charging voltage Vc1 and a comparison voltage Vr1, a detection capacitance value instruction is sent to the RFID tag, the RFID chip completes digital calibration of a random capacitor 6(C1, C2 and C3) according to the instruction, the calibrated value and Vc1 and Vr1 are recorded in a chip-specific storage area, and the capacitor calibrated value and Vc1 and Vr1 can also be stored in the card reader.
And (3) during verification: the card reader reads Vc1 and Vr1 recorded in the chip, sends a corresponding verification instruction, the chip completes measurement of random capacitance according to the instruction, the measurement is compared with a capacitance calibration value in a special storage area of the chip, a tolerance value can be preset for the stored capacitance during verification, and if the capacitance value changes within the tolerance range, the label chip is considered not to be transferred or repackaged; if the capacitance value is changed, the tag chip is considered to be reused; the comparison of the capacitance values can be done automatically inside the chip, returning a signal to the reader. Or the capacitance value is transmitted back to the card reader, and the card reader end finishes the labeling of the capacitance value.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A method for preventing the RFID label from being transferred by using a random capacitor is characterized by comprising the following steps:
arranging at least one capacitor plate on top metal in the chip;
arranging a metal film parallel to the top metal on the upper plane of the packaging salient point of the chip;
the chip and the tag antenna are packaged together to form an RFID tag, and the capacitor plate and the metal film form an initialization capacitor.
2. The method of claim 1, wherein the metal film has wrinkles and/or the metal film is randomly notched.
3. The method of claim 1, wherein the chip is packaged with a tag antenna to form an RFID tag, and wherein the step of forming an initialization capacitor with the metal film comprises:
attaching the packaged RFID label to an object, and reading the initialized capacitance between the capacitance polar plate and the metal film by using a first charging voltage and a first comparison voltage;
the first charging voltage and the first comparison voltage are stored with the corresponding initialization capacitors.
4. The method of claim 3, wherein the first charging voltage and the first comparison voltage each use a preset voltage sequence.
5. The method of claims 1-4, further comprising:
after the RFID label is transferred, the surface shape of the metal film of the re-packaged RFID label is changed, and/or the distance between the metal film and a capacitance plate is changed, and/or the capacitance value of the capacitance plate and the metal film is changed due to the change of anisotropic conductive adhesive in the antenna package of the chip and the label;
reading the capacitance of the re-packaged RFID tag;
and comparing the read capacitance with the initialized capacitance, and if the capacitance value changes beyond a preset confidence range, transferring the RFID tag.
6. The method of claim 5, wherein reading the capacitance of the repackaged RFID tag comprises:
reading the stored first charging voltage and the first comparison voltage;
and reading the capacitance of the repackaged RFID label by using the first charging voltage and the first comparison voltage.
7. The method of claim 1, wherein the capacitance between the metal film and the capacitor plate is:
Figure FDA0003073823940000021
wherein epsilon0The dielectric constant in vacuum, epsilon is a dielectric coefficient, S is the area of the metal film opposite to the capacitor plate, and d is the distance between the metal film and the capacitor plate.
8. The method of claim 1, wherein the material of the package bump is gold or copper.
9. The method of claim 1, wherein three capacitive plates are disposed on a top metal layer of the RFID chip body.
10. The method according to claim 3, wherein the first charging voltage and the first comparison voltage and the corresponding initialization capacitor are stored in an on-chip memory and/or uploaded and stored in a server side.
CN202110546858.8A 2021-05-19 2021-05-19 RFID label anti-transfer method using random capacitor Pending CN113298215A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110546858.8A CN113298215A (en) 2021-05-19 2021-05-19 RFID label anti-transfer method using random capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110546858.8A CN113298215A (en) 2021-05-19 2021-05-19 RFID label anti-transfer method using random capacitor

Publications (1)

Publication Number Publication Date
CN113298215A true CN113298215A (en) 2021-08-24

Family

ID=77322832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110546858.8A Pending CN113298215A (en) 2021-05-19 2021-05-19 RFID label anti-transfer method using random capacitor

Country Status (1)

Country Link
CN (1) CN113298215A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1679208A (en) * 2002-07-25 2005-10-05 Fci公司 Capacitive antenna and method for making same
CN104978598A (en) * 2015-07-02 2015-10-14 上海坤锐电子科技有限公司 Active radio-frequency identification tag with anti-transfer function
CN105913108A (en) * 2016-04-11 2016-08-31 江苏凯路威电子科技有限公司 RFID chip transfer preventing method, anti-transfer RFID chip and anti-transfer RFID chip circuit
CN109492737A (en) * 2018-12-27 2019-03-19 上海天臣防伪技术股份有限公司 RFID chip, RFID electronic label, commodity
CN210942909U (en) * 2019-07-11 2020-07-07 成都普什信息自动化有限公司 RFID tag, and commodity package using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1679208A (en) * 2002-07-25 2005-10-05 Fci公司 Capacitive antenna and method for making same
CN104978598A (en) * 2015-07-02 2015-10-14 上海坤锐电子科技有限公司 Active radio-frequency identification tag with anti-transfer function
CN105913108A (en) * 2016-04-11 2016-08-31 江苏凯路威电子科技有限公司 RFID chip transfer preventing method, anti-transfer RFID chip and anti-transfer RFID chip circuit
CN109492737A (en) * 2018-12-27 2019-03-19 上海天臣防伪技术股份有限公司 RFID chip, RFID electronic label, commodity
CN210942909U (en) * 2019-07-11 2020-07-07 成都普什信息自动化有限公司 RFID tag, and commodity package using the same

Similar Documents

Publication Publication Date Title
EP1060457B1 (en) Electronic device with disposable chip and method for making same
CN101001792B (en) Seal with IC tag and method of attaching the same
EP1509876B8 (en) Method and device for protecting text for reading
US20060261950A1 (en) Smart radio frequency identification (RFID) items
AU3022600A (en) Transponder and injection-moulded part and method for their production
EP1858704B8 (en) Method of providing a packaging laminate with an identification code, method of identifying a package, and package with identification code
US8584961B2 (en) Marking verification system
CN102982365B (en) The manufacture method of transponder label and transponder label
EP1817722A2 (en) Radio frequency identification (rfid) tag for an item having a conductive layer included or attached
ES2438791T3 (en) Data storage support with transponder
CN101443796A (en) Label incorporating an RF anti-theft antenna and a UHF RFID transponder
US7598876B2 (en) Method for manufacturing a RFID electronic tag
KR20020063907A (en) Goods label
US20100084473A1 (en) Radio Frequency Identification Tag for the Metal Product with High Thermal Resistance and the Fabricating Method Thereof
CN113298215A (en) RFID label anti-transfer method using random capacitor
US20110102153A1 (en) Document including an integrated microcircuit device and a method of detecting an attack on the physical integrity of the document
CN210734956U (en) Implant package box of preventing falsifying detection function NFC label
KR20120029633A (en) A sealing device for packages to prevent counterfeit
CN118333085A (en) Recyclable radio frequency identification transponder part and method for producing the same
CN113298216A (en) RFID chip and label with random capacitor
CN215400432U (en) Anti-punching safety bottle
CN210691368U (en) RFID (radio frequency identification) anti-counterfeit label for packaging box
WO2012131143A1 (en) Radio-frequency identification tag with activation portion
WO2012131144A1 (en) Radio-frequency identification tag with securing portion
JP2005157485A (en) Non-contact type communication response object

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination