CN113271041B - Compressor refrigeration waste heat recovery system and working method thereof - Google Patents
Compressor refrigeration waste heat recovery system and working method thereof Download PDFInfo
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- CN113271041B CN113271041B CN202110821765.1A CN202110821765A CN113271041B CN 113271041 B CN113271041 B CN 113271041B CN 202110821765 A CN202110821765 A CN 202110821765A CN 113271041 B CN113271041 B CN 113271041B
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- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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Abstract
The invention relates to a compressor refrigeration waste heat recovery system and a working method thereof, and belongs to the technical field of energy recycling. The compressor comprises a shell, wherein the top of the shell is provided with an air inlet used for inputting waste heat of the compressor, and the bottom of the shell is provided with an air outlet; the inside of shell is from last to installing a plurality of electricity shifter mechanisms that parallel parallels down, is formed with the clearance between two adjacent electricity shifter mechanisms, and every electricity shifter mechanism all hugs closely the setting with the inner wall of shell, and electricity shifter mechanism is including wallboard between semiconductor thermoelectric generation and set up in the inside transfer line of wallboard between semiconductor thermoelectric generation, and the both ends of transfer line are mouth of pipe and lower mouth of pipe respectively, go up mouth of pipe and lower mouth of pipe and set up in wallboard length direction's intermediate position between semiconductor thermoelectric generation. The compressor refrigeration waste heat recovery system provided by the invention can be used for fully utilizing the heat energy of the waste hot gas of the compressor, converting the heat energy in the waste hot gas into electric energy, changing waste into valuable and avoiding the waste of energy.
Description
Technical Field
The invention relates to a compressor refrigeration waste heat recovery system and a working method thereof, and belongs to the technical field of energy recycling.
Background
The conventional compressor transfers heat to refrigerate by a heat pump, and generates a large amount of waste heat. If the waste heat is directly discharged, the energy is wasted. The prior art discloses a patent document with application number 201120062787.6, named as a compressor refrigeration waste heat recovery system for kitchen equipment, which describes that in order to realize waste heat generated by refrigeration of the compressor, a condenser is connected to one end of the compressor, a semiconductor refrigeration system is mounted on the condenser, and heat released by refrigeration of the compressor is collected through a cold end of the semiconductor refrigeration system and transferred to a hot end of the semiconductor refrigeration system, so that low-temperature waste heat is converted into a high-temperature heat source for recycling. However, the semiconductor refrigeration system is not well fixed on the condenser to collect waste heat, and cannot fully recycle the waste heat generated by the compressor, and the semiconductor refrigeration system is not flexible in installation and use.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, one object of the present invention is to provide a compressor refrigeration waste heat recovery system and an operating method thereof, which can make full use of the heat energy of the compressor waste hot gas, convert the heat energy in the waste hot gas into electric energy, change waste into valuable, and avoid the waste of energy.
The invention provides a compressor refrigeration waste heat recovery system, which comprises a shell, wherein the top of the shell is provided with an air inlet for inputting compressor waste heat, and the bottom of the shell is provided with an air outlet;
the semiconductor thermoelectric generation room wall plate is characterized in that a plurality of electric conversion mechanisms are parallelly arranged in the shell from top to bottom, a gap is formed between every two adjacent electric conversion mechanisms, each electric conversion mechanism is tightly attached to the inner wall of the shell and comprises a semiconductor thermoelectric generation room wall plate and a liquid conveying pipe arranged in the semiconductor thermoelectric generation room wall plate, the two ends of the liquid conveying pipe are respectively provided with an upper pipe opening and a lower pipe opening, the upper pipe opening and the lower pipe opening are arranged in the middle of the semiconductor thermoelectric generation room wall plate in the length direction and are symmetrically distributed along the geometric center of the semiconductor thermoelectric generation room wall plate, and a plurality of second exhaust holes are formed in the right side, located at the lower pipe opening, of the surface of the semiconductor thermoelectric generation room wall plate in a penetrating mode;
in any two adjacent electric conversion mechanisms, an upper pipe orifice in the lower electric conversion mechanism and a lower pipe orifice in the upper electric conversion mechanism are coaxially arranged and connected;
still including setting up in the outside coolant liquid bin of shell, the coolant liquid bin has the pump module through the pipe connection, the output of pump module is connected with the feed liquor pipe, the one end of feed liquor pipe is passed the shell after and is connected with the lower mouth of pipe in the electricity shifter of bottommost, the top of shell is equipped with the fluid-discharge tube, the fluid-discharge tube passes the shell after and is connected with the last mouth of pipe in the electricity shifter of topmost, the other end of fluid-discharge tube is connected with outside hydrothermal solution treatment case.
Preferably, the bottom four corners of each semiconductor thermoelectric generation room wallboard is fixedly connected with a cushion block, the top four corners are provided with second limit grooves matched with the cushion blocks, and any two adjacent semiconductor thermoelectric generation rooms wallboard are connected in the second limit grooves in an inserting mode through the cushion blocks.
Preferably, the inside bottom of shell is provided with the support frame, and the first exhaust hole that is linked together with the gas vent is seted up at the middle part of support frame, and first spacing groove has all been seted up to the top four corners department of support frame, and the cushion that the wallboard connected through it between the semiconductor thermoelectric generation of bottommost inserts to first spacing groove and supports on the support frame.
Preferably, the equal fixedly connected with threaded rod in top both sides of support frame, the top threaded connection of threaded rod has the bolt, all sets up two through-holes with threaded rod looks adaptation on the face of wallboard between every semiconductor thermoelectric generation, and all electricity conversion mechanisms all cup joint on the threaded rod through the through-hole.
Preferably, the upper pipe orifice and the lower pipe orifice at the joint of any two adjacent infusion pipes are connected to form an S pipe, two baffles which are distributed up and down are fixedly connected at the corners of at least two S pipes in all the S pipes, and a resistance bead is arranged in the area between the two baffles.
The invention also provides a working method of the compressor refrigeration waste heat recovery system, which comprises the following steps: waste heat of a compressor is communicated with an air inlet, a pump assembly is started to discharge cooling liquid in a cooling liquid storage tank into a liquid conveying pipe of the bottommost electric conversion mechanism from a liquid inlet pipe, the cooling liquid sequentially passes through channels formed by the liquid conveying pipes in the electric conversion mechanisms and is finally discharged to the outside through a liquid discharging pipe; the waste hot gas enters the shell from the air inlet and is discharged to the next layer through the second exhaust holes in each layer of the electric conversion mechanism, the temperature difference is formed between the high temperature of the waste hot gas and the low temperature of the cooling liquid in the process that the waste hot gas passes through the gap between two adjacent layers of the electric conversion mechanisms, heat exchange is carried out through the semiconductor thermoelectric power generation room wall plate to form electric energy output, and the waste hot gas is discharged to the outside through the first exhaust holes and the exhaust holes after being cooled by the contact of the cooling liquid.
The beneficial effects of the invention are as follows: the refrigeration waste heat recovery system fully utilizes the heat energy of the waste hot gas of the compressor, the heat energy passes through the gaps of the plurality of electric conversion mechanisms, the temperature difference is formed between the high temperature of the waste hot gas and the low temperature of the cooling liquid, the semiconductor thermoelectric power generation inter-wall plate on the electric conversion mechanisms performs heat exchange to form electric energy, the refrigeration waste heat recovery system can convert the heat energy in the waste hot gas into the electric energy, the waste is changed into valuable, and the waste of energy is avoided. The electric conversion mechanism is convenient to install, the installation quantity can be adjusted adaptively according to actual conditions, and the flexibility of the system in use is improved. In addition, the place that links to each other at two transfer lines in this system is formed with the S pipe, the corner of S pipe is equipped with the resistance pearl, liquid can receive the hindrance of resistance pearl when passing through the transfer line, because of the coolant liquid can produce the heat exchange with waste heat when flowing, the temperature of coolant liquid self also can rise, its liquid viscosity can sharply reduce, the resistance also can diminish when contacting with the resistance pearl, consequently, the speed control range that liquid passes through the transfer line increases, the coolant liquid is after the heat absorption, the velocity of flow grow, make the liquid after the heat absorption flow out fast, make new coolant liquid can get into more fast, and then can promote the speed of heat exchange.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic three-dimensional structure diagram of a refrigeration waste heat recovery system of a compressor according to the present invention;
FIG. 2 is a schematic diagram of a three-dimensional cross-sectional structure of a compressor refrigeration waste heat recovery system according to the present invention;
FIG. 3 is a schematic view of the interior of the housing of the present invention;
FIG. 4 is a schematic structural view of the stand of the present invention;
FIG. 5 is a schematic structural view of an electrical switching mechanism according to the present invention;
FIG. 6 is a partial schematic front sectional view of the infusion tube of the present invention;
FIG. 7 is a schematic view of the position of the baffle and the resistance bead of the present invention.
In the figure: 1. a housing; 2. an air inlet; 3. an exhaust port; 4. a liquid discharge pipe; 5. a coolant storage tank; 6. a pump assembly; 7. a liquid inlet pipe; 8. a support frame; 9. a first exhaust port; 10. a first limit groove; 11. a threaded rod; 12. a bolt; 13. an electrical switching mechanism; 14. a semiconductor thermoelectric generation room wall plate; 15. a transfusion tube; 151. an upper pipe orifice; 152. a lower pipe orifice; 16. cushion blocks; 17. a second limit groove; 18. a through hole; 19. a second vent hole; 20. a baffle plate; 21. a resistance bead.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1 to 5, the present embodiment discloses a compressor refrigeration waste heat recovery system, which includes a housing 1, wherein an air inlet 2 for inputting compressor waste heat is opened at the top of the housing 1, and an air outlet 3 is formed at the bottom of the housing. A plurality of electric conversion mechanisms 13 are parallelly installed in the shell 1 from top to bottom, a gap is formed between every two adjacent electric conversion mechanisms 13, each electric conversion mechanism 13 is tightly attached to the inner wall of the shell 1, each electric conversion mechanism 13 comprises a semiconductor thermoelectric generation room wall plate 14 and an infusion tube 15 arranged in the semiconductor thermoelectric generation room wall plate 14, the diameter of the infusion tube 15 is larger than the thickness of the semiconductor thermoelectric generation room wall plate 14, two ends of the infusion tube 15 are respectively provided with an upper tube opening 151 and a lower tube opening 152, the upper tube opening 151 and the lower tube opening 152 are arranged in the middle of the semiconductor thermoelectric generation room wall plate 14 in the length direction, the upper pipe orifice 151 and the lower pipe orifice 152 are symmetrically distributed along the geometric center of the semiconductor thermoelectric generation room wall plate 14, and a plurality of second exhaust holes 19 are formed in the plate surface of the semiconductor thermoelectric generation room wall plate 14 and positioned on the right side of the lower pipe orifice 152 in a penetrating manner; in any adjacent two of the electric conversion mechanisms 13, the upper pipe opening 151 in the electric conversion mechanism 13 located below and the lower pipe opening 152 in the electric conversion mechanism 13 located above are coaxially disposed and connected.
A cooling liquid storage box 5 is arranged outside the shell 1, the cooling liquid storage box 5 is connected with a pump assembly 6 through a pipeline, the output end of the pump assembly 6 is connected with a liquid inlet pipe 7, one end of the liquid inlet pipe 7 penetrates through the shell 1 and then is connected with a lower pipe orifice 152 in the bottommost electric conversion mechanism 13 through a quick assembling head, the top end of the shell 1 is provided with a liquid discharge pipe 4, the liquid discharge pipe 4 penetrates through the shell 1 and then is connected with an upper pipe orifice 151 in the topmost electric conversion mechanism 13 through the quick assembling head, the other end of the liquid discharge pipe 4 is connected with an external hot liquid treatment box, cooling liquid is discharged into a liquid conveying pipe 15 of the bottommost electric conversion mechanism 13 from the liquid inlet pipe 7, the cooling liquid sequentially passes through a channel formed by the liquid conveying pipes 15 in the multilayer electric conversion mechanism 13, waste hot gas passes through a gap formed by every two adjacent layers of electric conversion mechanisms 13, and the temperature difference formed by the high temperature of the waste hot gas and the low temperature of the cooling liquid, the semiconductor thermoelectric generation room wall plate 14 exchanges heat, and the semiconductor thermoelectric generation room wall plate 14 outputs electric energy.
All fixedly connected with cushion 16 in the bottom four corners department of wallboard 14 between every semiconductor thermoelectric generation, second spacing groove 17 with 16 looks adaptations is all seted up in top four corners department, wallboard 14 passes through cushion 16 and pegs graft in second spacing groove 17 between arbitrary two adjacent semiconductor thermoelectric generation, the height of cushion 16 is the clearance that forms between wallboard 14 between adjacent two-layer semiconductor thermoelectric generation promptly, and electricity converting mechanism 13 adopts above-mentioned direction to support each other and connects, can conveniently adjust the inside electric quantity of converting mechanism 13 of shell 1 according to the in service behavior.
As shown in fig. 2 to 4, a supporting frame 8 is disposed at the bottom end of the inside of the housing 1, a first exhaust hole 9 communicated with the exhaust port 3 is formed in the middle of the supporting frame 8, waste heat at the bottom of the housing 1 sequentially passes through the exhaust port 3 and the first exhaust hole 9 and enters a gap formed by the electric conversion mechanism 13, first limiting grooves 10 are formed in four corners of the top end of the supporting frame 8, and a bottommost semiconductor thermoelectric generation room wall plate 14 is inserted into the first limiting grooves 10 through a cushion block 16 connected to the bottommost semiconductor thermoelectric generation room wall plate and supported on the supporting frame 8.
In order to promote the stability of all electricity shifter 13 in shell 1, this application is at the equal fixedly connected with threaded rod 11 in the top both sides of support frame 8, the top threaded connection of threaded rod 11 has bolt 12, all offer two through-holes 18 with 11 looks adaptations of threaded rod on the face of wallboard 14 between every semiconductor thermoelectric generation, all electricity shifter 13 all cup joint on threaded rod 11 through-hole 18, when installing a plurality of electricity shifter 13, earlier put the top at support frame 8 through threaded rod 11 through-hole 18 first electricity shifter 13, and with the corresponding first spacing groove 10 of inserting of cushion 16. Before placing the second electric conversion mechanism 13, the second electric conversion mechanism 13 is rotated 180 degrees, then the second electric conversion mechanism 13 passes through the threaded rod 11 through the through hole 18, is placed at the top end of the first electric conversion mechanism 13, and the cushion block 16 of the second electric conversion mechanism 13 is correspondingly inserted into the second limit groove 17 of the first electric conversion mechanism 13, and simultaneously, the lower pipe orifice 152 of the second electric conversion mechanism 13 is connected and communicated with the upper pipe orifice 151 of the first electric conversion mechanism 13. The third electric conversion mechanism 13 is not rotated by 180 degrees when it is placed. The fourth electrical switch mechanism 13 is positioned, rotated 180 degrees and the installation steps described above are repeated. After the plurality of electric conversion mechanisms 13 are placed in the above steps, the bolts 12 are tightened to fix the plurality of electric conversion mechanisms 13.
As a preferred embodiment, as shown in fig. 6 and 7, an upper pipe orifice 151 and a lower pipe orifice 152 at the joint of any two adjacent infusion tubes 15 are connected to form an S-tube, at least two baffles 20 distributed up and down are fixedly connected to the corners of the S-tube among all the S-tubes, a resistance bead 21 is arranged in the area between the two baffles 20, the surface of the resistance bead 21 has a certain roughness, whether the resistance bead 21 is arranged at the corner of each S-tube or not is selected according to the actual situation, and the resistance beads 21 are preferably arranged at the corners of 2-3S-tubes in the system. When the pump unit 6 causes the coolant to flow from the upper port 151 of the lower electric conversion mechanism 13 to the lower port 152 of the upper electric conversion mechanism 13 (see fig. 6), and the resistive beads 21 are provided at the corners of the S-tube, the liquid is hindered by the resistive beads 21 when passing through the liquid delivery tube 15.
When the temperature of coolant liquid is lower, liquid viscosity is big, and resistance when contacting with resistance pearl 2 is also great, and liquid can drive resistance pearl 2 upward movement together, can reduce the velocity of flow of coolant liquid under the effect of resistance pearl 2 this moment, makes the heat of the absorption waste heat gas that the coolant liquid can be better.
Because of the coolant liquid can produce heat exchange with waste heat when flowing, the temperature of coolant liquid self also can rise, leads to the high temperature of waste hot gas and the temperature difference that the low temperature of coolant liquid formed to diminish, carries out heat exchange through wallboard 14 between the semiconductor thermoelectric generation, and wallboard 14 output capacity between the semiconductor thermoelectric generation descends. At this moment, because coolant temperature risees, liquid viscidity can sharply reduce, and the resistance also can be little when contacting with resistance pearl 21, and the frictional force between resistance pearl 21 and the coolant is not enough to drive resistance pearl 2 upward movement together, and the coolant that the temperature risees this moment can be faster through resistance pearl 21, makes the lower coolant of temperature can replenish fast in transfer line 15 to improve the efficiency of the output electric energy of this device.
Comparing the resistance bead 21 in the infusion tube 15 with the absence of the resistance bead 21 in the infusion tube 15, the infusion tube 15 with the resistance bead 21 will have a wider range of speed adjustment of the liquid passing through the infusion tube 15 due to the change of the viscosity of the liquid under the same water pressure.
The invention provides a compressor refrigeration waste heat recovery system, which has the working principle that: waste heat of the compressor is communicated with the air inlet 2, the pump assembly 6 is started to discharge the cooling liquid in the cooling liquid storage tank 5 from the liquid inlet pipe 7 to the liquid conveying pipe 15 of the bottommost electric conversion mechanism 13, the cooling liquid sequentially passes through a channel formed by the liquid conveying pipes 15 in the plurality of electric conversion mechanisms 13, and finally the cooling liquid is discharged to the outside through the liquid discharging pipe 4; the waste heat gas enters the shell 1 from the air inlet 2, is discharged to the next layer through the second exhaust holes 19 on each layer of the electric conversion mechanisms 13, because the two adjacent electric conversion mechanisms 13 rotate 180 degrees relative to each other when being installed, the waste heat gas flows in an S shape through the gaps between the two adjacent electric conversion mechanisms 13 under the influence of the positions of the second exhaust holes 19 on each layer, the contact area and the contact time of the waste heat gas and the cooling liquid can be fully ensured, the temperature difference is formed between the high temperature of the waste heat gas and the low temperature of the cooling liquid when the waste heat gas passes through the gaps between the two adjacent electric conversion mechanisms 13, heat exchange is carried out through the semiconductor thermoelectric power generation room wall plate 14 to form electric energy output, and the waste heat gas is discharged to the outside through the first exhaust holes 9 and the exhaust holes 3 after being cooled by the contact of the cooling liquid.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (6)
1. The utility model provides a compressor refrigeration waste heat recovery system, including shell (1), air inlet (2) that are used for inputing the compressor waste heat are seted up at the top of shell (1), the bottom is formed with gas vent (3) its characterized in that, the inside of shell (1) is from last to installing a plurality of electricity converting mechanism (13) that parallel extremely down, be formed with the clearance between two adjacent electricity converting mechanism (13), every electricity converting mechanism (13) all hugs closely the setting with the inner wall of shell (1), electricity converting mechanism (13) are including wallboard (14) between the semiconductor thermoelectric generation and set up in inside transfer line (15) of wallboard (14) between the semiconductor thermoelectric generation, the both ends of transfer line (15) are upper tube mouth (151) and lower tube mouth (152) respectively, upper tube mouth (151) and lower tube mouth (152) set up in the intermediate position of wallboard (14) length direction between the semiconductor thermoelectric generation, the upper pipe orifice (151) and the lower pipe orifice (152) are symmetrically distributed along the geometric center of the semiconductor thermoelectric generation room wall plate (14), and a plurality of second exhaust holes (19) are formed in the plate surface of the semiconductor thermoelectric generation room wall plate (14) and are positioned on the right side of the lower pipe orifice (152) in a penetrating mode;
in any two adjacent electric conversion mechanisms (13), an upper pipe orifice (151) in the lower electric conversion mechanism (13) and a lower pipe orifice (152) in the upper electric conversion mechanism (13) are coaxially arranged and connected;
still including setting up in outside coolant liquid bin (5) of shell (1), coolant liquid bin (5) have pump assembly (6) through the pipe connection, the output of pump assembly (6) is connected with feed liquor pipe (7), the one end of feed liquor pipe (7) is passed shell (1) after and is connected with lower mouth of pipe (152) in bottommost electricity converting mechanism (13), the top of shell (1) is equipped with fluid-discharge tube (4), fluid-discharge tube (4) are passed shell (1) after and are connected with last mouth of pipe (151) in topmost electricity converting mechanism (13), the other end of fluid-discharge tube (4) is connected with outside hydrothermal solution processing case.
2. The compressor refrigeration waste heat recovery system according to claim 1, wherein the four corners of the bottom end of each semiconductor thermoelectric generation room wall plate (14) are fixedly connected with a cushion block (16), the four corners of the top end of each semiconductor thermoelectric generation room wall plate are respectively provided with a second limiting groove (17) matched with the cushion block (16), and any two adjacent semiconductor thermoelectric generation room wall plates (14) are inserted into the second limiting grooves (17) through the cushion blocks (16).
3. The compressor refrigeration waste heat recovery system according to claim 2, wherein a support frame (8) is arranged at the bottom end of the interior of the shell (1), a first exhaust hole (9) communicated with the exhaust port (3) is formed in the middle of the support frame (8), first limit grooves (10) are formed in four corners of the top end of the support frame (8), and the semiconductor thermoelectric generation room wall plate (14) at the bottommost is inserted into the first limit grooves (10) through cushion blocks (16) connected to the semiconductor thermoelectric generation room wall plate and supported on the support frame (8).
4. The compressor refrigeration waste heat recovery system according to claim 3, wherein threaded rods (11) are fixedly connected to two sides of the top end of the support frame (8), bolts (12) are connected to the top of the threaded rods (11) in a threaded manner, two through holes (18) matched with the threaded rods (11) are formed in the surface of each semiconductor thermoelectric generation compartment wall plate (14), and all the electricity conversion mechanisms (13) are sleeved on the threaded rods (11) through the through holes (18).
5. The compressor refrigeration waste heat recovery system according to any one of claims 1 to 4, wherein an upper pipe orifice (151) and a lower pipe orifice (152) at the joint of any two adjacent liquid conveying pipes (15) are connected to form an S pipe, two baffles (20) which are distributed up and down are fixedly connected to the corners of at least two S pipes in all the S pipes, and a resistance bead (21) is arranged in the area between the two baffles (20).
6. A method of operating a compressor refrigeration waste heat recovery system as set forth in claim 5, characterized by the steps of: waste heat of a compressor is communicated with an air inlet (2), a pump assembly (6) is started to discharge cooling liquid in a cooling liquid storage tank (5) into a liquid conveying pipe (15) of a bottommost electric conversion mechanism (13) from a liquid inlet pipe (7), the cooling liquid sequentially passes through channels formed by the liquid conveying pipes (15) in the electric conversion mechanisms (13), and finally the cooling liquid is discharged to the outside through a liquid discharging pipe (4); waste hot gas enters the shell (1) from the air inlet (2) and is discharged to the next layer through the second exhaust holes (19) on each layer of the electric conversion mechanism (13), when the waste hot gas passes through a gap between two adjacent layers of the electric conversion mechanisms (13), the high temperature of the waste hot gas and the low temperature of cooling liquid form a temperature difference, heat exchange is carried out through the semiconductor thermoelectric generation room wall plate (14) to form electric energy output, and the waste hot gas is discharged to the outside through the first exhaust holes (9) and the exhaust holes (3) after being cooled by contact of the cooling liquid.
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| JP3711751B2 (en) * | 1998-06-29 | 2005-11-02 | 富士電機システムズ株式会社 | Atmospheric gas purification equipment for air cooling |
| CN1920435A (en) * | 2005-08-28 | 2007-02-28 | 李万浩 | Heat converter with electricity generation and storage function |
| CN101267014A (en) * | 2007-03-12 | 2008-09-17 | 五邑大学 | A temperature difference semiconductor module with cooling and heating and temperature difference power generation function |
| CN101520255A (en) * | 2009-03-30 | 2009-09-02 | 黄光智 | Air conditioner after parking of automobile |
| CN202043062U (en) * | 2011-03-04 | 2011-11-16 | 福建省厦门第六中学 | Air-conditioning waste heat recovery electricity generation device |
| DE102012207612B4 (en) * | 2012-05-08 | 2016-09-29 | Eberspächer Exhaust Technology GmbH & Co. KG | heat exchangers |
| CN103758617B (en) * | 2014-02-10 | 2016-01-06 | 中国科学院上海硅酸盐研究所 | A kind of thermoelectric generation device for vehicle |
| CN108023505A (en) * | 2017-12-20 | 2018-05-11 | 华南理工大学 | Pipe-row's formula thermoelectric generator |
| CN208139911U (en) * | 2018-02-09 | 2018-11-23 | 乌鲁木齐智源易通智能科技有限公司 | The cold and hot company of circulation and stress cold equipment waste heat is for device |
| CN210111882U (en) * | 2019-04-28 | 2020-02-21 | 广东工业大学 | Thermoelectric generator based on household appliance waste heat utilization |
| CN110986635B (en) * | 2019-12-06 | 2020-08-18 | 西安科技大学 | Mine double-heat-source comprehensive heat recovery device and device structure optimization method |
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Denomination of invention: Compressor refrigeration waste heat recovery system and its working method Effective date of registration: 20230216 Granted publication date: 20210914 Pledgee: Postal Savings Bank of China Limited Yantai Penglai District sub branch Pledgor: NEW SANHE (YANTAI) FOODS CO.,LTD. Registration number: Y2023980032743 |