CN113267852A

CN113267852A - Optical module device manufacturing method and optical module device

Info

Publication number: CN113267852A
Application number: CN201911412395.5A
Authority: CN
Inventors: 郑汉标
Original assignee: Xunyun Electronic Technology Zhongshan Co ltd
Current assignee: Xunyun Electronic Technology Zhongshan Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2021-08-17

Abstract

An optical module device manufacturing method and an optical module device. An optical module device includes a substrate printed circuit electronic element mounting section active device and a lens. The printed circuit is formed on the substrate; an electronic component mounting part disposed on the substrate, the electronic component mounting part including a groove; the active device comprises a laser or a light detector and is arranged in the groove. A lens is disposed on the active device. The grooved ceramic liner structure is used for accommodating an active device which is easy to generate heat, and the heat-conducting glue is reused to fill a gap between the active device and the groove, so that the heat-conducting efficiency is effectively improved.

Description

Optical module device manufacturing method and optical module device

Technical Field

The present disclosure relates to the field of optical fiber communication technologies, and more particularly, to a method for manufacturing an optical module device and an optical module device.

Background

Optical fiber communication networks have the characteristics of low transmission loss, high data security, excellent anti-interference performance, and very large bandwidth, and are the main information communication methods in the modern, wherein an Optical Transceiver (Optical Transceiver) for receiving Optical signals from the Optical fiber network and converting the Optical signals into electrical signals for transmission, and/or converting the electrical signals into Optical signals for transmission outside through the Optical fiber network is one of the most important basic components in the Optical fiber communication technology.

An optical module device in an optical transceiver has a laser to provide a light source, however, the laser generates a large amount of heat during operation, and the heat-conducting property of a circuit board is weak, so that the heat dissipation requirement cannot be met.

Disclosure of Invention

In view of this, in an embodiment of the present application, a slotted pad structure is used to accommodate an active device that easily generates heat to solve the problem of heat dissipation.

An embodiment of the present application discloses an optical module device, including a substrate; a printed circuit formed on the substrate; an electronic component mounting part disposed on the substrate, wherein the electronic component mounting part includes a groove; the active device comprises a laser or a light detector and is arranged in the groove; and a lens disposed on the active device.

Another embodiment of the present application discloses a method for manufacturing an optical module device, including: providing a substrate; forming a printed circuit on the substrate; providing an electronic component mounting part, wherein the electronic component mounting part comprises a groove; arranging an active device in the groove, wherein the active device comprises a laser or a light detector; disposing a lens on said active device; and bonding the electronic component mounting part having the active device to the substrate.

According to an embodiment of the present application, when the active device is in the recess, a top of the active device is flush with a top of the recess.

According to an embodiment of the present invention, the active device further includes a monitor and an amplifier, and the active devices are electrically connected to each other through a printed circuit.

According to an embodiment of the present application, a gap between the active device and the groove is filled with a thermal conductive paste.

According to an embodiment of the present application, the electronic component mounting portion is a ceramic pad.

According to the embodiment of the application, the grooved liner structure is used for accommodating the active device which is easy to generate heat, and the heat-conducting glue is used for filling the gap between the active device and the groove, so that the heat-conducting efficiency is effectively improved. In addition, the semi-finished product formed by assembling the substrate of the electronic element and the semi-finished product of the electronic element mounting part assembled with the active device are packaged separately, so that modular production is formed, and the assembly efficiency is effectively improved.

Drawings

Fig. 1 is a perspective view of an optical module device according to an embodiment of the present application.

Fig. 2 shows a side view of an optical module apparatus according to an embodiment of the present application.

Fig. 3 is a perspective view of an electronic component mounting section according to an embodiment of the present application.

Fig. 4 is a flowchart illustrating operations for forming a blank 30A according to an embodiment of the present application.

Fig. 5 is a flowchart illustrating operations for forming a blank 30B according to an embodiment of the present disclosure.

Fig. 6 is a flowchart illustrating an operation of a method of fabricating an optical module device according to an embodiment of the present application.

Description of the main elements

Optical module device 10

Substrate 12

Printed circuit 14

Active devices

16, 24A, 24B, 24C

Glasses 18

Electronic component mounting part 20

Grooves

22A, 22B, 22C

Semi-finished products 30A, 30B

Step flows S11-S13, S21-S25, S31-S32

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

To facilitate an understanding and an enabling description of the present application, those of ordinary skill in the art will understand that the present application provides many applicable inventive concepts that can be embodied in a wide variety of specific forms. Those of skill in the art may now appreciate that the invention may be practiced with other structural, logical, and electrical changes without departing from the spirit and scope of the present invention.

The present specification provides various examples to illustrate the technical features of various embodiments of the present application. The arrangement of the elements in the embodiments is for illustration and not for limiting the invention. And the reference numbers in the embodiments are repeated to simplify the description, and do not indicate any relationship between the different embodiments. Wherein like reference numerals are used throughout the drawings and the description to refer to the same or like elements. The illustrations of the present specification are in simplified form and are not drawn to precise scale. For clarity and ease of description, directional terms (e.g., top, bottom, up, down, and diagonal) are used with respect to the accompanying drawings. The following description is intended to illustrate but not limit the scope of the invention, unless otherwise indicated by the scope of the claims appended hereto.

Further, in describing some embodiments of the present application, the specification may have presented the method and/or process of the present application as a particular sequence of steps. However, the methods and procedures are not limited to the particular sequence of steps described, as such may not necessarily be performed in the particular sequence of steps described. One skilled in the art will recognize that other sequences are possible. Therefore, the particular order of the steps set forth in the specification is not intended to limit the scope of the claims. Moreover, the claimed methods and/or processes are not limited by the illustrated ordering of steps, and one skilled in the art will appreciate that adjusting the ordering does not depart from the spirit and scope of the present invention.

Fig. 1 is a perspective view of an optical module device according to an embodiment of the present application. Fig. 2 shows a side view of an optical module apparatus according to an embodiment of the present application. An optical module apparatus 10 according to an embodiment of the present application includes a substrate 12, a printed circuit 14, a Component Mounting Block (CMB) 20, an active device 16, and a lens 18. According to one embodiment of the present application, the substrate 12 can be made of various materials, such as silicon, polymer, and ceramic materials. The substrate 12 has a pre-designed interconnect structure, a printed circuit 14 formed by screen printing, and related electronic components, and the electronic component mounting portion 20 is also disposed on the substrate 10. The printed circuit 14 includes circuit components necessary for implementing the optical signal transmitting or receiving function, which are well known to those skilled in the art and will not be described herein for brevity. A lens 18 is disposed on the active device 16. According to one embodiment of the present application, the lens 18 is a condenser lens, and the light beam emitted from the laser is coupled (Coupling) to an optical fiber via the condenser lens, and then transmitted to another optical receiver (not shown) via the optical fiber. According to other embodiments of the present application, the lens 18 can also optionally include a collimating lens for redirecting the beam, e.g., for conversion to a parallel beam.

Fig. 3 is a perspective view of an electronic component mounting section according to an embodiment of the present application. According to one embodiment of the present application, the electronic component mounting portion 20 can be a ceramic liner. The electronic component mounting part 20 includes

recesses

22A, 22B, 22C.

Active devices

24A, 24B, 24C are attached to the bottom of the

grooves

22A, 22B, 22C by glue or an adhesive layer, respectively. According to an embodiment of the present disclosure, the glue or the adhesive layer may include Polyimide (PI), Polyethylene Terephthalate (PET), Teflon (Teflon), Liquid Crystal Polymer (LCP), Polyethylene (PE), Polypropylene (PP), Polystyrene (PS), Polyvinyl Chloride (PVC), Nylon (Nylon or Polyamides), polymethyl methacrylate (PMMA), ABS plastic (acrylic-Polyurethane-Styrene), phenol resin (Phenolic Resins), Epoxy resin (Epoxy), Polyester (Polyester), Silicone rubber (Silicone), Polyurethane (PU), polyamide-imide (paim), or a combination thereof, as long as the adhesive material has the above characteristics.

As shown in fig. 3, taking active device 24A as an example, when active device 24A is disposed in recess 22A, the top of active device 24A is flush with the top of recess 22A. According to embodiments of the present application, the active device 24A may be a laser, the active device 24B may be a photodetector, and the active device 24C may include other electronic components such as a monitor, a laser controller, and an amplifier. The active devices are electrically connected through a steel mesh and a printed circuit (not shown) formed by a printing process. The laser is the light source. In optical communication systems, light emitting diodes or laser diodes are generally used as light sources. According to an embodiment of the present application, the Laser may include one or more Vertical Cavity Surface Emitting Laser diodes (VCSELs), or Surface Emitting Laser diodes, and the VCSELs form an array and are driven by the driving chip to emit optical signals. In other embodiments, other components that can be used as a light source, such as a light Emitting Diode (led), an Edge Emitting Laser Diode (EELD), or a Distributed Feedback Laser (DFB), can also be used. In addition, as shown in fig. 3, the gap between the active device 24A and the groove 22A is filled with a thermal conductive paste. Similarly, the gaps between the active device 24B and the groove 22B and between the active device 24C and the groove 22C are also filled with the thermal conductive paste. According to one embodiment of the present application, the thermally conductive adhesive may be silver adhesive or solder paste, and the photodetector may be a PIN Photodiode or an Avalanche Photodiode (APD) for converting an optical beam coupled by the lens 18 into an electrical signal.

After the

active devices

24A, 24B, 24C and the lens 18 are mounted to the electronic device mount 20, the electronic device mount 20 is then assembled to the substrate 12, and the

active devices

24A, 24B, 24C on the electronic device mount 20 are electrically connected to the printed circuit 14 on the substrate 12 via a Wire bonding process.

Fig. 4 is a flowchart illustrating operations for forming a blank 30A according to an embodiment of the present application. Referring to fig. 1, first, a surface-mount technology (SMT) is used to mount a related electronic component (SMD) (e.g., a resistor, a capacitor, a crystal, a resistor, etc.) on a substrate 12 (step S11), and a printed circuit 14 is formed by screen printing to electrically connect the related electronic component (step S12). In other embodiments, a via-hole technology (Through-hole technology) can also be used to mount the relevant electronic element on substrate 12. The substrate 12 may be made of various materials such as silicon, polymer, and ceramic materials. The substrate 12 has a printed circuit 14 formed by screen printing and related electronic components. After steps S11 and S12, the semi-finished product 30A may be completed (step S13).

Fig. 5 is a flowchart illustrating operations for forming a blank 30B according to an embodiment of the present disclosure. Referring to fig. 1-3, in step S21, an electronic component mounting part 20 is provided, the electronic component mounting part 20 including

recesses

22A, 22B. According to one embodiment of the present application, the electronic component mounting portion 20 can be a ceramic liner. Next, the

active devices

24A, 24B, 24C are attached to the bottoms of the

grooves

22A, 22B, 22C by glue or an adhesive layer, respectively (step S22). According to an embodiment of the present disclosure, the glue or the adhesive layer may include Polyimide (PI), Polyethylene Terephthalate (PET), Teflon (Teflon), Liquid Crystal Polymer (LCP), Polyethylene (PE), Polypropylene (PP), Polystyrene (PS), Polyvinyl Chloride (PVC), Nylon (Nylon or Polyamides), polymethyl methacrylate (PMMA), ABS plastic (acrylic-Polyurethane-Styrene), phenol resin (Phenolic Resins), Epoxy resin (Epoxy), Polyester (Polyester), Silicone rubber (Silicone), Polyurethane (PU), polyamide-imide (paim), or a combination thereof, as long as the adhesive material has the above characteristics. In step S22, a step of baking and filling gaps between the active device 24A and the groove 22A, between the active device 24B and the groove 22B, and between the active device 24C and the groove 22C with a thermal conductive paste is further included.

Next, lines of steel mesh and printing process are used to form printed circuits (step S23), which can conduct the circuit between the active devices. Next, the lens 18 is placed over the

active devices

24A, 24B, and 24C (step S24), and in step S24, an optical alignment procedure is further included, wherein a positioning portion is first disposed on the substrate 12 to assist the initial alignment of the active Device 24A (laser) and the lens 18, at this time, UV glue is applied between the lens 18 and the substrate 12, and in order to improve the positioning accuracy, the alignment can be performed by a Charge Coupled Device (CCD) camera, and after the lens 18 is positioned, the UV glue is irradiated with ultraviolet light to cure the UV glue. A complete optical path is completed by coupling the optics to the active device 24A (laser) and the active device 24B (photodetector) through an optical alignment procedure. After steps S21, S22, S23, and S24, the semi-finished product 30B may be completed (S25).

Fig. 6 is a flowchart illustrating an operation of a method of fabricating an optical module device according to an embodiment of the present application. Referring to fig. 1, in step S31, the semi-finished product 30A and the semi-finished product 30B are assembled together by glue, and then the

active devices

24A, 24B, and 24C on the electronic component mounting portion 20 are electrically connected to the printed circuit 14 on the substrate 12 by a Wire bonding (step S32), thereby completing the optical module device according to an embodiment of the present application. It should be noted that the order of completing the semi-finished products 30A (steps S11-S13) and 30B (steps S21-S25) is not fixed, and those skilled in the art may first complete the semi-finished products 30A and then complete the semi-finished products 30B, or may first complete the semi-finished products 30B and then complete the semi-finished products 30A, and finally perform steps S31 and S32 to complete the optical module device according to an embodiment of the present application.

According to the embodiment of the application, the grooved ceramic liner structure is used for accommodating the active device which is easy to generate heat, and the heat-conducting glue is used for filling the gap between the active device and the groove, so that the heat-conducting efficiency is effectively improved. In addition, the semi-finished product 30A formed by assembling the substrate of the electronic element and the semi-finished product 30B assembled with the electronic element mounting part of the active device are packaged separately, so that modular production is formed, and the assembly efficiency is effectively improved.

It will be apparent to those skilled in the art that other changes and modifications can be made in the invention and its practical application based on the combination of the inventive concept of the present application without departing from the scope of the invention as defined in the appended claims.

Claims

1. A light module device, comprising:

a substrate;

a printed circuit formed on the substrate;

an electronic component mounting part disposed on the substrate, wherein the electronic component mounting part includes a groove;

the active device comprises a laser or a light detector and is arranged in the groove; and

and the lens is arranged on the active device.

2. A light module device as claimed in claim 1, characterized in that the top of said active device is flush with the top of said recess when said active device is in said recess.

3. The optical module apparatus of claim 1, wherein the active devices further comprise a monitor and an amplifier, and the active devices are electrically connected through a printed circuit.

4. A light module device as claimed in claim 1, characterized in that the gap between the active component and the recess is filled with a thermally conductive glue.

5. An optical module device according to claim 1, wherein the electronic component mounting part is a ceramic spacer.

6. A method for manufacturing an optical module device, comprising:

providing a substrate;

forming a printed circuit on the substrate;

providing an electronic component mounting part, wherein the electronic component mounting part comprises a groove;

arranging an active device in the groove, wherein the active device comprises a laser or a light detector;

disposing a lens on said active device; and

and bonding the electronic component mounting part having the active device to the substrate.

7. A method of manufacturing an optical module device as claimed in claim 6, wherein the top of said active device is flush with the top of said recess when said active device is in said recess.

8. The method of claim 6, wherein the active devices further comprise a monitor and an amplifier, and the active devices are electrically connected through a printed circuit.

9. The method for manufacturing an optical module apparatus as claimed in claim 6, wherein a gap between the active device and the recess is filled with a thermally conductive paste.

10. The method for manufacturing an optical module device according to claim 6, wherein the electronic component mounting part is a ceramic spacer.