CN113264776B - Compact europium tantalum oxynitride ceramic and preparation method thereof - Google Patents

Compact europium tantalum oxynitride ceramic and preparation method thereof Download PDF

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CN113264776B
CN113264776B CN202110742069.1A CN202110742069A CN113264776B CN 113264776 B CN113264776 B CN 113264776B CN 202110742069 A CN202110742069 A CN 202110742069A CN 113264776 B CN113264776 B CN 113264776B
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tantalum oxynitride
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李端
李俊生
曾良
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National University of Defense Technology
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Abstract

The invention discloses a compact europium tantalum oxynitride ceramic and a preparation method thereof, wherein the preparation method comprises the steps of uniformly mixing europium tantalum oxynitride ceramic powder with ethanol, carrying out ball milling, drying and sieving to obtain pre-sintered powder, carrying out discharge plasma sintering on the pre-sintered powder under the conditions of pressurization and vacuum or pressurization and protective atmosphere, wherein the sintering temperature is 1350-1450 ℃, naturally cooling to obtain a ceramic primary sintered body, carrying out secondary sintering on the ceramic primary sintered body under the conditions of ammonia atmosphere and mechanical pressure, and cooling to obtain the compact europium tantalum oxynitride ceramic. The preparation method of the invention has short time, and the prepared compact europium tantalum oxynitride ceramic has high density, high purity and wide application prospect.

Description

Compact europium tantalum oxynitride ceramic and preparation method thereof
Technical Field
The invention relates to the technical field of preparation of high-performance dielectric ceramic materials, in particular to compact europium-tantalum oxynitride ceramic and a preparation method thereof.
Background
With the continuous development of material science, people have an increasing demand for novel perovskite functional materials having functional characteristics such as dielectric/electronic, magnetic, photocatalytic and energy conversion applications. Rare earth perovskite oxynitrides have become a material of significant international interest in recent years, and they can combine the advantages of transition group metal nitrides/oxides, have better environmental (air, acid/base, etc.) stability than nitrides, and have a smaller band gap than oxides. As a novel perovskite material, the perovskite europium tantalum oxynitride has higher dielectric constant and unique magnetic property, and has wide application prospect in the directions of nontoxic dyes, dielectrics, giant magnetoresistance materials, photocatalytic hydrogen production and the like.
The rare earth perovskite oxynitride has excellent multifunctionality and is in various fieldsHas potential application prospect, however, one important problem encountered in practical research and application is the difficulty of obtaining well-sintered compact materials, such as LaTiO in the literature2The dielectric constant of N is measured on a thin film prepared by chemical or physical vapor deposition techniques, and the measurement results are controversial. Because the use performance (such as dielectric property) of the ceramic material in application and factors such as the interface and porosity of the ceramic material are closely related, the systematic research on the densification process of the perovskite oxynitride ceramic is very important in order to make experimental measurement more convincing and further promote the application of the perovskite oxynitride ceramic. Common sintering modes of perovskite oxynitride include hot-pressing sintering, hot isostatic pressing sintering and pressureless sintering. Hot-pressing and sintering: a sintering method wherein a mold is filled with dried ceramic powder, and pressure and heat are simultaneously applied from a uniaxial direction to simultaneously complete molding and sintering. And (3) hot isostatic pressing sintering: the ceramic powder, the green body or the pre-sintered body can reach sintering densification through the combined action of high temperature and high pressure gas with uniform directions. Pressureless sintering: under the condition of no external pressure, a blank body with a certain shape is placed under the condition of a certain temperature and atmosphere to be changed into a solidified compact block body with a compact, stable volume and certain performance through a physical and chemical process, the densification process is completed through bonding among powder particles during pressureless sintering, and the reduction of the surface free energy of pores is the main driving force of the pressureless sintering. Zhang et al uses SrCO3Or La2O3SrTaO is used as sintering aid2N and 5 wt.% of sintering aid are mixed, then are subjected to cold isostatic pressing under the pressure of 150MPa, then are sintered for 3h at 1400 ℃ and are annealed for 12h at 1000 ℃ in ammonia gas, and a ceramic wafer sample with reliable dielectric properties and the relative density of which is higher than 90% is obtained. The method has long sintering time and high temperature, so the development of a short-time method for sintering to obtain the europium-tantalum-oxynitride ceramic with high density, high purity and high dielectric constant is urgently needed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the compact europium tantalum oxynitride ceramic with high density, high purity and short preparation time and the preparation method thereof.
In order to solve the technical problems, the invention adopts the following technical scheme:
a preparation method of compact europium tantalum oxynitride ceramic comprises the following steps:
s1, uniformly mixing the europium tantalum oxynitride ceramic powder with ethanol, performing ball milling, drying and sieving to obtain pre-sintered powder;
s2, performing spark plasma sintering on the pre-sintered powder obtained in the step S1 under the conditions of pressurization and vacuum or pressurization and protective atmosphere, wherein the pressurization is realized by applying 90-150 MPa, the sintering temperature of the spark plasma sintering is 1350-1450 ℃, the heating rate is 100-500 ℃/min, the sintering temperature is kept for 0-10 min, and then the ceramic primary sintered body is obtained by natural cooling;
and S3, carrying out secondary sintering on the ceramic primary sintered body obtained in the step S2 under the conditions of ammonia gas atmosphere and no mechanical pressure, wherein the sintering temperature is 1370-1600 ℃, the sintering temperature is required to be higher than that in the step S2, the heating rate is 1-50 ℃/min, the sintering heat preservation time is 1-120 min, and then cooling to obtain the compact europium tantalum oxynitride ceramic.
In the above preparation method of the compact europium tantalum oxynitride ceramic, preferably, in step S1, the ball milling tank used for ball milling is made of polyurethane, alumina or zirconia, the ball milling beads used for ball milling are made of polyurethane, alumina or zirconia, the ball milling time is 1h to 12h, the drying temperature is 50 ℃ to 300 ℃, the drying time is 1h to 24h, and the mesh number of the sieve is 1000 meshes to 10000 meshes.
In the above method for preparing the dense europium tantalum oxynitride ceramic, preferably, in step S1, the ball milling time is 1h to 6h, the drying temperature is 80 ℃ to 240 ℃, the drying time is 3h to 18h, and the mesh number of the sieve is 2000 meshes to 8000 meshes.
In the above preparation method of the dense europium tantalum oxynitride ceramic, preferably, in step S1, the ball milling time is 2h to 4h, the drying temperature is 80 ℃ to 150 ℃, the drying time is 6h to 12h, and the mesh number of the sieve is 3000 meshes to 6000 meshes.
In the above method for preparing the dense europium tantalum oxynitride ceramic, preferably, in step S2, the protective atmosphere is one or more of nitrogen, helium and argon.
In the above preparation method of the dense europium tantalum oxynitride ceramic, preferably, in step S3, the temperature rise rate of the secondary sintering is 20 ℃/min to 40 ℃/min, the sintering temperature is 1400 ℃ to 1500 ℃, and the holding time is 1min to 50 min.
In the above method for preparing a dense europium tantalum oxynitride ceramic, preferably, in step S3, the cooling rate is 1 ℃/min to 200 ℃/min.
In the above method for producing a dense europium tantalum oxynitride ceramic, it is more preferable that the cooling rate in step S3 is 5 ℃/min to 100 ℃/min.
As a general inventive concept, the present invention also provides a dense europium tantalum oxynitride ceramic prepared by the above preparation method.
In the present invention, the method for preparing the raw material europium tantalum oxynitride ceramic powder used in step S1 includes the following steps:
(1) uniformly mixing 3g of europium oxide powder, 3.75g of tantalum pentoxide powder and 5.45g of urea, dissolving in 50mL of absolute ethanol, and performing ball milling to obtain mixed slurry;
(2) fully drying the mixed slurry to obtain mixed precursor powder;
(3) placing the mixed precursor powder in a crucible, and calcining at 1100 ℃ in a protective atmosphere to obtain EuTa (O, N)3Oxynitride nanopowders.
Compared with the prior art, the invention has the advantages that:
the method adopts two steps to sinter the oxynitride in a synergic manner, wherein the first step adopts pressurization and discharge plasma for preliminary sintering, so that on one hand, preliminary densification can be achieved, and the density of the product is improved as much as possible, on the other hand, the method can keep the open porosity of the material by combining with specific technological parameters of temperature, pressure and heat preservation time, so that the proportion of the open porosity of the material to the total porosity is the highest, thereby facilitating the entry of ammonia gas during secondary sintering, and the method is cooperated with the second step, and the second step adopts a conventional sintering furnace for secondary sintering in the ammonia gas atmosphere, so that the oxynitride decomposed in the discharge plasma sintering recovers the stoichiometric ratio, most of the residual porosity is eliminated, and the density and the purity of the product are further improved.
The method adopts the spark plasma sintering method for primary densification, greatly shortens the time and reduces the sintering temperature compared with the traditional sintering method, and can simultaneously inhibit the decomposition of oxynitride in the aspects of thermodynamics and kinetics.
Drawings
FIG. 1 is an optical photograph of a europium tantalum oxynitride ceramic obtained in example 1 of the present invention.
FIG. 2 is an XRD spectrum of a europium tantalum oxynitride ceramic obtained in example 1 of the present invention.
FIG. 3 is an SEM photograph of a europium tantalum oxynitride ceramic obtained in example 1 of the present invention.
Detailed Description
The invention is further described below with reference to the drawings and specific preferred embodiments of the description, without thereby limiting the scope of protection of the invention. The starting materials and equipment used in the following examples are commercially available.
Example 1:
the preparation method of the compact europium tantalum oxynitride ceramic comprises the following steps:
s1, uniformly mixing 5g of europium tantalum oxynitride ceramic powder with 20mL of absolute ethyl alcohol, ball-milling for 4h in a polyurethane ball-milling tank by using polyurethane ball-milling beads, drying for 8h at 100 ℃, and then sieving by a 5000-mesh sieve to obtain pre-sintered powder;
s2, putting 3g of the pre-sintered powder obtained in the step S1 into a graphite die with the diameter of phi 12mm, and performing initial sintering in spark plasma sintering equipment, wherein the process conditions are as follows: the mechanical pressure is 140MPa, the atmosphere is nitrogen, the heating rate is 400 ℃/min, the sintering temperature is 1400 ℃, the heat preservation time is 1min, and the ceramic primary sintered body is obtained after natural cooling;
s3, placing the ceramic primary sintered body obtained in the step S2 into a tube furnace, and carrying out secondary sintering under the conditions of ammonia gas atmosphere and no mechanical pressure, wherein the sintering process conditions are as follows: the heating rate is 20 ℃/min, the sintering temperature is 1450 ℃, the heat preservation time is 60min, and the cooling rate is 30 ℃/min. And cooling to obtain the compact europium tantalum oxynitride ceramic plate.
In this embodiment, the preparation process of the europium tantalum oxynitride ceramic powder is as follows:
(1) uniformly mixing 3g of europium oxide powder, 3.75g of tantalum pentoxide powder and 5.45g of urea, dissolving in 50mL of absolute ethanol, and performing ball milling to obtain mixed slurry;
(2) fully drying the mixed slurry to obtain mixed precursor powder;
(3) placing the mixed precursor powder in a crucible, and calcining at 1100 ℃ in a protective atmosphere to obtain EuTa (O, N)3Oxynitride nanopowders.
The upper and lower surfaces of the compact europium tantalum oxynitride ceramic plate prepared in the embodiment were polished, and the optical photograph thereof is shown in fig. 1, the color thereof is dark brown, which is similar to the oxynitride ceramic powder, and the phase composition and the microstructure thereof are respectively shown in fig. 2 and fig. 3. As can be seen from FIGS. 2 and 3, EuTa (O, N) prepared in this example3The oxynitride ceramic is almost pure phase with a dense microstructure with a grain size of about 300 nm. The ceramic sheet obtained had a density of 94.13% (bulk/theoretical density, EuTa (O, N)3Has a theoretical density of 9.41g/cm3) The closed cell ratio was 5.54%.
Comparative example 1:
a method of making a europium tantalum oxynitride ceramic substantially as described in example 1, except that:
in step S2, instead of using spark plasma sintering equipment for initial sintering, a conventional pressureless sintering furnace is used, the heating rate is 30 ℃/min, the sintering temperature is 1400 ℃, and the heat preservation time is 1 min.
EuTa (O, N) prepared in this comparative example3The density of the oxynitride ceramic plate is 49.87%, the closed porosity is 11.33%, and the composition of the phase is EuTa (O, N)3、EuTaO4、Ta3N5And Eu5Ta4O15. As can be seen, the comparative product has significantly lower relative density and purity than example 1, and has high closed cell ratio. The ceramic primary sintered body is low in density, high in porosity and large in pore size due to the adoption of the traditional pressureless primary sintering mode, so that the ceramic primary sintered body is difficult to densify during secondary sintering, and the decomposition of oxynitride is accelerated dynamically due to the slow temperature rise rate of the traditional primary sintering.
Comparative example 2:
a method of producing a europium tantalum oxynitride ceramic substantially as described in example 1, except that:
in step S2, the sintering temperature of the discharge plasma is 1600 ℃, and the heat preservation time is 15 min.
EuTaO prepared in this comparative example2The composition of the N oxynitride ceramic wafer is EuTa (O, N)3、Eu5Ta4O15And the like, because the initial sintering increases the sintering temperature and the holding time, the oxynitride decomposition is accelerated in terms of thermodynamics and kinetics, and the sample decomposition is severe.
Comparative example 3:
a preparation method of europium tantalum oxynitride ceramic is different from that of example 1 in that: and step S3 is omitted, namely, directly carrying out discharge plasma sintering on the oxynitride, wherein the mechanical pressure is 140MPa, the atmosphere is nitrogen, the heating rate is 400 ℃/min, the sintering temperature is 1400 ℃, the heat preservation time is 1min, and naturally cooling to obtain the ceramic sintered body.
EuTa (O, N) prepared in this comparative example3The oxynitride ceramic sheet had a relative density of 89.79%, a closed porosity of 9.71%, and a phase composition of EuTa (O, N)3、EuTaO4、Ta3N5And Eu5Ta4O15. It can be seen that the comparative product has a lower purity than example 1. This is because the spark plasma sintering method using high pressure, rapid temperature rise and increased sintering temperature can rapidly densify oxynitride to some extent, but since the decomposition temperature is lower than the sintering temperature, the decomposition of the product is severe and the stoichiometric ratio cannot be recovered.
Example 2:
a method of making a dense europium tantalum oxynitride ceramic of the present invention is substantially the same as example 1 except that: in step S2, the sintering temperature of the discharge plasma is 1400 ℃, and the heat preservation time is 10 min. Upon detection, EuTaO prepared in this example2The density of the N oxynitride ceramic plate is 96.57%, and the closed porosity is 3.14%.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make numerous possible variations and modifications to the present invention, or modify equivalent embodiments to equivalent variations, without departing from the scope of the invention, using the teachings disclosed above. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention should fall within the protection scope of the technical scheme of the present invention, unless the technical spirit of the present invention departs from the content of the technical scheme of the present invention.

Claims (9)

1. A preparation method of compact europium tantalum oxynitride ceramic is characterized by comprising the following steps:
s1, uniformly mixing the europium tantalum oxynitride ceramic powder with ethanol, performing ball milling, drying and sieving to obtain pre-sintered powder;
s2, performing spark plasma sintering on the pre-sintered powder obtained in the step S1 under the conditions of pressurization and vacuum or pressurization and protective atmosphere, wherein the pressurization is realized by applying 90-150 MPa, the sintering temperature of the spark plasma sintering is 1350-1450 ℃, the heating rate is 100-500 ℃/min, the sintering temperature is kept for 0-10 min, and then the ceramic primary sintered body is obtained by natural cooling;
and S3, carrying out secondary sintering on the ceramic primary sintered body obtained in the step S2 under the conditions of ammonia gas atmosphere and no mechanical pressure, wherein the sintering temperature is 1370-1600 ℃, the sintering temperature is required to be higher than that in the step S2, the heating rate is 1-50 ℃/min, the sintering heat preservation time is 1-120 min, and then cooling to obtain the compact europium tantalum oxynitride ceramic.
2. The method of claim 1, wherein in step S1, the ball milling pot is made of polyurethane, alumina or zirconia, the ball milling beads are made of polyurethane, alumina or zirconia, the ball milling time is 1h to 12h, the drying temperature is 50 ℃ to 300 ℃, the drying time is 1h to 24h, and the mesh number is 1000 meshes to 10000 meshes.
3. The method of claim 1, wherein the ball milling time is 1 to 6 hours, the drying temperature is 80 to 240 ℃, the drying time is 3 to 18 hours, and the mesh number is 2000 to 8000 in step S1.
4. The method of claim 1, wherein the ball milling time is 2 to 4 hours, the drying temperature is 80 to 150 ℃, the drying time is 6 to 12 hours, and the mesh number is 3000 to 6000 in step S1.
5. The method according to any one of claims 1 to 4, wherein the protective atmosphere in step S2 is one or more selected from the group consisting of nitrogen, helium, and argon.
6. The method of manufacturing a dense europium tantalum oxynitride ceramic according to any one of claims 1 to 4, wherein in step S3, the temperature rise rate of the secondary sintering is 20 ℃/min to 40 ℃/min, the sintering temperature is 1400 ℃ to 1500 ℃, and the holding time is 1min to 50 min.
7. The method for producing a dense europium tantalum oxynitride ceramic according to any one of claims 1 to 4, wherein the temperature-decreasing cooling rate in step S3 is 1-200 ℃/min.
8. The method of claim 7, wherein the cooling rate in step S3 is 5 ℃/min to 100 ℃/min.
9. A dense europium tantalum oxynitride ceramic obtained by the preparation method according to any one of claims 1 to 8.
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