CN113261392A

CN113261392A - Electric connection assembly, electronic equipment and preparation method of electric connection assembly

Info

Publication number: CN113261392A
Application number: CN201980073397.8A
Authority: CN
Inventors: 雷晓华; 张瑶
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2019-03-21
Filing date: 2019-03-21
Publication date: 2021-08-13
Also published as: WO2020186517A1

Abstract

The invention provides an electrical connection assembly (10), an electronic device (1) and a preparation method of the electrical connection assembly (10). The electric connection assembly (10) comprises a flexible substrate (100), a stretchable conductive layer (200), an elastic conductive adhesive layer (300) and a flexible circuit board (400) which are sequentially stacked, wherein the stretchable conductive layer (200) is electrically connected with the flexible circuit board (400) through the elastic conductive adhesive layer (300), the electric connection assembly (10) further comprises non-solid conductive adhesive (500), and the non-solid conductive adhesive (500) is used for repairing cracks generated in the stretching process of the stretchable conductive layer (200), so that the electric connection assembly (10) can be ensured to maintain a stable electric connection relation.

Description

Electric connection assembly, electronic equipment and preparation method of electric connection assembly

Technical Field

The invention relates to the technical field of electronics, in particular to an electric connection assembly, electronic equipment and a preparation method of the electric connection assembly.

Background

In order to electrically connect two electronic devices, in the related art, a hard connection manner, such as wire bonding, conductive adhesive bonding or plugging, is generally adopted. However, for flexible electronic devices, due to different stretching rates of different parts of the electronic device, stretching asynchronism occurs at the time, which easily causes cracks in the stretchable conductive layer, thereby causing a problem of electrical connection failure.

Disclosure of Invention

The embodiment of the invention provides an electric connection assembly, which comprises a flexible substrate, a stretchable conductive layer, an elastic conductive adhesive layer and a flexible circuit board, wherein the flexible substrate, the stretchable conductive layer, the elastic conductive adhesive layer and the flexible circuit board are sequentially stacked, the stretchable conductive layer and the flexible circuit board are electrically connected through the elastic conductive adhesive layer, the electric connection assembly further comprises non-solid conductive adhesive, and the non-solid conductive adhesive is used for repairing cracks generated in the stretching process of the stretchable conductive layer.

The electric connection assembly provided by the embodiment of the invention comprises a flexible substrate, a stretchable conductive layer, an elastic conductive adhesive layer and a flexible circuit board which are sequentially stacked, wherein the stretchable conductive layer is electrically connected with the flexible circuit board through the elastic conductive adhesive layer, the electric connection assembly also comprises non-solid conductive adhesive, when the stretchable conductive layer is subjected to tensile force, the stretchable conductive layer can generate stretching deformation, when the tensile force is large or the duration of the tensile force is long, the stretchable conductive layer can generate cracks, and the non-solid conductive adhesive has the characteristics of static thickening and shear thinning. When the film is left to stand, the viscosity is high and the fluidity is low, and when the film is pressed or stretched, the viscosity is low and the fluidity is increased. When the stretchable conductive layer cracks, the viscosity of the non-solid conductive adhesive is reduced, the fluidity is increased, the non-solid conductive adhesive can flow into the cracks of the stretchable conductive layer, the non-solid conductive adhesive can be filled into the cracks of the stretchable conductive layer after being cured, the cracks generated in the stretching process of the stretchable conductive layer can be repaired, the problem that the stretchable conductive layer is failed in electric connection due to stretching can be solved, and the electric connection assembly can be ensured to maintain a stable electric connection relation.

An embodiment of the present invention further provides an electronic device, which includes the electrical connection assembly according to any of the above embodiments.

The embodiment of the invention also provides a preparation method of the electric connection assembly, which comprises the following steps:

providing a flexible substrate;

forming a stretchable conductive layer covering the flexible substrate;

forming a non-solid conductive adhesive and an elastic conductive adhesive layer which cover the stretchable conductive layer, wherein the stretchable conductive layer and the elastic conductive adhesive layer are electrically connected, and the non-solid conductive adhesive is used for repairing cracks generated in the stretching process of the stretchable conductive layer;

and forming a flexible circuit board covering the elastic conductive adhesive layer, wherein the elastic conductive adhesive layer is electrically connected with the flexible circuit board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a first electrical connection assembly according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a second electrical connection assembly according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a third electrical connection assembly according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a fourth electrical connection assembly according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a fifth electrical connection assembly according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a sixth electrical connection assembly according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a seventh electrical connection assembly according to an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of an eighth electrical connection assembly according to an embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a ninth electrical connection assembly according to an embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a tenth electrical connection assembly according to an embodiment of the present invention.

Fig. 11 is a schematic structural diagram of a first electronic device according to an embodiment of the present invention.

Fig. 12 is a method for manufacturing a first electrical connection assembly according to an embodiment of the present invention.

Fig. 13 is a schematic structural diagram corresponding to step S100 in fig. 12.

Fig. 14 is a schematic structural diagram corresponding to step S200 in fig. 12.

Fig. 15 is a schematic structural diagram corresponding to step S300 in fig. 12.

Fig. 16 is a schematic diagram of a non-solid conductive adhesive of fig. 12.

Fig. 17 is a schematic structural diagram corresponding to step S400 in fig. 12.

Fig. 18 is a method of making a second electrical connection assembly according to an embodiment of the present invention.

Fig. 19 is a schematic structural diagram corresponding to step S310 in fig. 18.

Fig. 20 is a schematic structural diagram corresponding to step S320 in fig. 18.

Fig. 21 is a method of making a third electrical connection assembly provided by an embodiment of the invention.

Fig. 22 is a schematic structural diagram corresponding to step S330 in fig. 21.

Fig. 23 is a schematic structural diagram corresponding to step S340 in fig. 21.

Fig. 24 is a schematic structural diagram corresponding to step S350 in fig. 21.

Fig. 25 is a method of making a fourth electrical connection assembly provided by an embodiment of the invention.

Fig. 26 is a schematic structural diagram corresponding to step S360 in fig. 25.

Fig. 27 is a schematic structural diagram corresponding to step S370 in fig. 25.

Fig. 28 is a schematic structural diagram corresponding to step S380 in fig. 25.

Fig. 29 illustrates a fifth method for manufacturing an electrical connection assembly according to an embodiment of the present invention.

Fig. 30 is a schematic structural diagram corresponding to step S301 in fig. 29.

Fig. 31 is a schematic structural diagram corresponding to step S302 in fig. 29.

Fig. 32 is a schematic structural diagram corresponding to step S303 in fig. 29.

Fig. 33 is a method of making a sixth electrical connection assembly according to an embodiment of the invention.

Fig. 34 is a schematic structural diagram corresponding to step S250 in fig. 33.

Fig. 35 is a method for manufacturing a seventh electrical connection assembly according to an embodiment of the present invention.

Fig. 36 is a schematic structural diagram corresponding to step S270 in fig. 35.

Fig. 37 is a method for making an eighth electrical connection assembly provided by an embodiment of the invention.

Fig. 38 is a schematic structural diagram corresponding to step S500 in fig. 37.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a first electrical connection assembly according to an embodiment of the present invention. The electrical connection assembly 10 comprises a flexible substrate 100, a stretchable conductive layer 200, an elastic conductive adhesive layer 300 and a flexible circuit board 400 which are sequentially stacked, wherein the stretchable conductive layer 200 is electrically connected with the flexible circuit board 400 through the elastic conductive adhesive layer 300, the electrical connection assembly 10 further comprises a non-solid conductive adhesive 500, and the non-solid conductive adhesive 500 is used for repairing cracks generated in the stretching process of the stretchable conductive layer 200.

The flexible substrate 100 may be an elastic substrate, such as a high-elongation silicone rubber. The stretchable conductive layer 200 may be prepared from liquid silicone silver powder conductive ink. The elastic conductive adhesive layer 300 is a conductive adhesive, such as a liquid organic silicon silver powder conductive adhesive or a room temperature vulcanized organic silicon conductive adhesive, the elastic conductive adhesive layer 300 has high elasticity, conductivity and high adhesiveness, and can be a liquid organic silicon silver powder conductive adhesive or a room temperature vulcanized organic silicon conductive adhesive, and the elastic conductive adhesive layer 300 is arranged around the non-solid conductive adhesive 500. Specifically, the elastic conductive adhesive layer 300 may form the elastic conductive adhesive layer 320 into the center and the edge of the bonding region of the electrical connection assembly 10 by dispensing, printing, transferring, and the like. The non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as an organic silicon conductive silicone grease, a conductive gel, a liquid metal, or the like. Or a partial mixture thereof with the elastic conductive adhesive layer 300. The non-solid conductive adhesive 500 is flowable after stretching and is highly viscous when left standing. When the non-solid conductive adhesive 500 is stretched, it may flow into cracks formed on the surface of the stretchable conductive layer 200, thereby repairing the cracks formed on the surface of the stretchable conductive layer 200. When the non-solid conductive paste 500 is not stretched, the non-solid conductive paste 500 has a greater viscosity, thereby closely adhering the stretchable conductive layer 200 and the flexible circuit board 400 such that the stretchable conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship.

The flexible printed circuit board 400 is also called a "flexible board", and is a flexible printed circuit board with high reliability and excellent performance, which is made of a polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.

In the present embodiment, the stretchable conductive layer 200 is electrically connected to the flexible circuit board 400 through the elastic conductive adhesive layer 300. Due to the difference in the stretching rates of the stretchable conductive layer 200, the elastic conductive adhesive layer 300 and the flexible printed circuit board 400, the three layers will exhibit different deformation amounts when being stretched, thereby resulting in an asynchronous stretching effect. In this process, when the stretchable conductive layer 200 is stretched and the magnitude of the stretching force is greater than a certain threshold value or the stretching duration is greater than a predetermined length, the stretchable conductive layer 200 may crack. When a crack occurs, the cross-sectional area of the stretchable conductive layer 200 decreases, which may cause a sudden increase in the resistance of the stretchable conductive layer 200, and further may cause a decrease in the current passing through the stretchable conductive layer 200, which may be detrimental to the transmission of electrical signals from the stretchable conductive layer 200. And in the process, the stretchable conductive layer 200 may be pulled apart, the electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 is broken, and the signal transmission through the flexible circuit board 400 is blocked. In order to solve the problem, the technical means of the invention is to cover the stretchable conductive layer 200 with the non-solid conductive adhesive 500, and the non-solid conductive adhesive 500 has the characteristics of static thickening and shear thinning. When the film is left to stand, the viscosity is high and the fluidity is low, and when the film is pressed or stretched, the viscosity is low and the fluidity is increased. When the stretchable conductive layer 200 is stretched to form a crack, the viscosity of the non-solid conductive adhesive 500 is reduced, the fluidity of the non-solid conductive adhesive 500 is increased, and the non-solid conductive adhesive 500 can flow into the crack of the stretchable conductive layer 200, and then the cured non-solid conductive adhesive is filled in the crack of the stretchable conductive layer 200 to repair the crack. Since the non-solid conductive adhesive 500 has conductive properties, the problem of electrical connection failure of the stretchable conductive layer 200 can be avoided, thereby ensuring that the electrical connection assembly 10 maintains a stable electrical connection relationship.

The electrical connection assembly 10 provided by the embodiment of the invention comprises a flexible substrate 100, a stretchable conductive layer 200, an elastic conductive adhesive layer 300 and a flexible circuit board 400 which are sequentially stacked, wherein the stretchable conductive layer 200 is electrically connected with the flexible circuit board 400 through the elastic conductive adhesive layer 300, the electrical connection assembly 10 further comprises a non-solid conductive adhesive 500, when the stretchable conductive layer 200 is subjected to a tensile force, the stretchable conductive layer 200 can be subjected to tensile deformation, when the tensile force is large or the duration of the tensile force is long, cracks can be generated in the stretchable conductive layer 200, and the non-solid conductive adhesive 500 has the characteristics of static thickening and shear thinning. When the film is left to stand, the viscosity is high and the fluidity is low, and when the film is pressed or stretched, the viscosity is low and the fluidity is increased. When the stretchable conductive layer 200 cracks, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity increases, and thus the non-solid conductive adhesive can flow into the cracks of the stretchable conductive layer 200, and the non-solid conductive adhesive 500 can be filled in the cracks of the stretchable conductive layer 200 after being cured, so that the cracks generated in the stretching process of the stretchable conductive layer 200 can be repaired, the problem of electrical connection failure of the stretchable conductive layer 200 due to stretching can be avoided, and the electrical connection assembly 10 can be ensured to maintain a stable electrical connection relationship.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a second electrical connection assembly according to an embodiment of the present invention. The structure of the second electrical connection element is substantially the same as that of the first electrical connection element, except that the elastic conductive adhesive layer 300 has a receiving groove 300a at a side adjacent to the stretchable conductive layer 200, and the non-solid conductive adhesive 500 is received in the receiving groove 300 a.

Specifically, in the present embodiment, the opening of the receiving groove 300a faces the stretchable conductive layer 200. The non-solid conductive adhesive 500 is disposed in the receiving groove 300a and directly contacts the stretchable conductive layer 200. The stretchable conductive layer 200 is electrically connected to the elastic conductive adhesive layer 300 through the non-solid conductive adhesive 500 at a position corresponding to the receiving slot 300a, and the other position of the stretchable conductive layer 200 is directly electrically connected to the elastic conductive adhesive layer 300. When the stretchable conductive layer 200, the elastic conductive adhesive layer 300 and the flexible circuit board 400 are stretched, the stretchable conductive layer 200, the elastic conductive adhesive layer 300 and the flexible circuit board 400 have different stretching rates, and the three exhibit different deformation amounts when being stretched, thereby resulting in an asynchronous stretching effect. In this process, when the stretchable conductive layer 200 is stretched and the magnitude of the stretching force is greater than a certain threshold or the duration of the stretching force is greater than a predetermined time, the stretchable conductive layer 200 may crack. When a crack occurs, the cross-sectional area of the stretchable conductive layer 200 decreases, which may cause a sudden increase in the resistance of the stretchable conductive layer 200, and further may cause a decrease in the current passing through the stretchable conductive layer 200, which may be detrimental to the transmission of electrical signals from the stretchable conductive layer 200. And in the process, the stretchable conductive layer 200 may be pulled apart, the electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 is broken, and the signal transmission through the flexible circuit board 400 is blocked. When the stretchable conductive layer 200 is stretched to form a crack, the non-solid conductive adhesive 500 covers the stretchable conductive layer 200 and is located in the receiving groove 300a of the elastic conductive adhesive layer 300, and under the action of gravity, the non-solid conductive adhesive 500 can flow into the crack of the stretchable conductive layer 200 and then is filled in the crack of the stretchable conductive layer 200 after being cured, and the non-solid conductive adhesive 500 has a conductive property, so that the problem of electrical connection failure of the stretchable conductive layer 200 can be avoided, and the electrical connection assembly 10 can be ensured to maintain a stable electrical connection relationship.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a third electrical connection assembly according to an embodiment of the present invention. The third electrical connection element has a structure substantially the same as that of the first electrical connection element, except that the elastic conductive adhesive layer 300 has a receiving hole 300b, the receiving hole 300b is a through hole, and the non-solid conductive adhesive 500 is received in the receiving hole 300b and is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 400.

Specifically, in the present embodiment, the non-solid conductive adhesive 500 is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 400 at the same time, so that an electrical connection relationship can be formed between the stretchable conductive layer 200 and the flexible circuit board 400. In addition, since the elastic conductive adhesive layer 300 is further disposed between the stretchable conductive layer 200 and the flexible circuit board 400, the elastic conductive adhesive layer 300 may form an electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400. That is, at least two electrically connected paths may be formed between the stretchable conductive layer 200 and the flexible circuit board 400 due to the presence of the non-solid conductive paste 500 and the elastic conductive paste layer 300. And because the non-solid conductive adhesive 500 is located in the accommodating hole 300b formed by the elastic conductive adhesive layer 300, a stable electrical connection relationship is formed between the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300, so that a stable electrical connection relationship can be formed among the flexible circuit board 400, the non-solid conductive adhesive 500, the elastic conductive adhesive layer 300 and the stretchable conductive layer 200, thereby ensuring a stable electrical connection relationship of the electrical connection group and ensuring normal use of the electrical connection assembly 10.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a fourth electrical connection assembly according to an embodiment of the present invention. The structure of the fourth electrical connection assembly is substantially the same as that of the first electrical connection assembly, except that the elastic conductive adhesive layer 300 has a first receiving hole 301, one side of the flexible circuit board 400 adjacent to the elastic conductive adhesive layer 300 has a second receiving hole 401, the second receiving hole 401 is communicated with the first receiving hole 301, the first receiving hole 301 is a through hole, the second receiving hole 401 is a blind hole, and the non-solid conductive adhesive 500 is received in the first receiving hole 301 and the second receiving hole 401.

In an embodiment, the first receiving hole 301 is disposed opposite to the second receiving hole 401, and a radial dimension of the first receiving hole 301 is consistent with a radial dimension of the second receiving hole 401. Since the first receiving hole 301 communicates with the second receiving hole 401, the first receiving hole 301 and the second receiving hole 401 can be formed together in the manufacturing process, which contributes to saving the manufacturing process.

It is understood that, in other embodiments, the first receiving hole 301 may be offset from the second receiving hole 401, and the size of the first receiving hole 301 may not be consistent with the size of the second receiving hole 401. That is, the radial dimension of the first receiving hole 301 is greater than the radial dimension of the second receiving hole 401, or the radial dimension of the first receiving hole 301 is smaller than the radial dimension of the second receiving hole 401.

Further, since the first receiving hole 301 is a through hole and the second receiving hole 401 is a blind hole, the non-solid conductive adhesive 500 completely penetrates through the elastic conductive adhesive layer 300, and the non-solid conductive adhesive 500 partially penetrates through the flexible circuit board 400. Since the non-solid conductive adhesive 500 partially penetrates through the flexible circuit board 400, the flexible circuit board 400 generates a partial tensile force to the non-solid conductive adhesive 500, so that a stable electrical connection relationship is formed between the non-solid conductive adhesive 500 and the flexible circuit board 400. Moreover, since the non-solid conductive adhesive 500 completely penetrates through the elastic conductive adhesive layer 300, the non-solid conductive adhesive 500 is not easily separated from the elastic conductive adhesive layer 300, so that a stable electrical connection relationship is maintained between the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300. That is to say, by adopting the method of the present embodiment, a stable electrical connection relationship can be maintained among the non-solid conductive adhesive 500, the elastic conductive adhesive layer 300 and the flexible circuit board 400. Furthermore, since the elastic conductive adhesive layer 300 covers the surface of the stretchable conductive layer 200, a stable electrical connection relationship can be maintained between the elastic conductive adhesive layer 300 and the stretchable conductive layer 200, that is, the stretchable conductive layer 200 can directly form a stable electrical connection relationship with the flexible circuit board 400 through the elastic conductive adhesive layer 300, and the stretchable conductive layer 200 can also form a stable electrical connection relationship with the flexible circuit board 400 through the non-solid conductive adhesive 500, that is, the stretchable conductive layer 200 can form a stable electrical connection relationship with the flexible circuit board 400 through at least two paths, so that smooth transmission of electrical signals from the stretchable conductive layer 200 to the flexible circuit board 400 can be ensured, and a normal electrical connection function of the electrical connection assembly 10 can be ensured.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a fifth electrical connection element according to an embodiment of the present invention. The fifth electrical connection assembly has a structure substantially the same as that of the first electrical connection assembly, except that the elastic conductive adhesive layer 300 has a first through hole 302, the flexible circuit board 400 has a second through hole 402, the second through hole 402 is communicated with the first through hole 302, and the non-solid conductive adhesive 500 is accommodated in the first through hole 302 and the second through hole 402 and is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 400 at the same time.

The second through hole 402 may be square, circular, or other shapes.

Specifically, in this embodiment, the non-solid conductive adhesive 500 is located in the first through hole 302 and the second through hole 402, so that on one hand, when the elastic conductive adhesive layer 300 cracks, the cracks generated in the elastic conductive adhesive layer 300 can be repaired, and on the other hand, when the flexible circuit board 400 cracks, the cracks generated in the flexible circuit board 400 can also be repaired. In addition, since the non-solid conductive adhesive 500 is located on the surface of the stretchable conductive layer 200, when the stretchable conductive layer 200 is cracked due to the stretching action, the non-solid conductive adhesive 500 may repair the crack generated during the stretching of the stretchable conductive layer 200.

In one embodiment, the first through hole 302 is disposed opposite to the second through hole 402, and the radial dimension of the first through hole 302 is consistent with the radial dimension of the second through hole 402. Since the first through hole 302 communicates with the second through hole 402, the first through hole 302 and the second through hole 402 can be formed together in the manufacturing process, which contributes to saving the manufacturing process.

It is understood that in other embodiments, the first through hole 302 may be offset from the second through hole 402, and the size of the first through hole 302 may not be the same as the size of the second through hole 402. That is, the radial dimension of the first through hole 302 is larger than the radial dimension of the second through hole 402, or the radial dimension of the first through hole 302 is smaller than the radial dimension of the second through hole 402.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a sixth electrical connection element according to an embodiment of the present invention. The structure of the sixth electrical connection element is substantially the same as that of the first to fifth electrical connection elements, except that the stretchable conductive layer 200 is provided with a microstructure 600 at a position corresponding to the non-solid conductive adhesive 500, and the microstructure 600 is used for increasing the adhesion between the non-solid conductive adhesive 500 and the stretchable conductive layer 200.

The microstructures 600 may be saw-toothed structures to increase the contact area between the non-solid conductive adhesive 500 and the stretchable conductive layer 200. The non-solid conductive paste 500 has static thickening and shear thinning properties. When the film is left to stand, the viscosity is high and the fluidity is low, and when the film is pressed or stretched, the viscosity is low and the fluidity is increased. When the stretchable conductive layer 200 cracks, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity thereof increases, and thus the non-solid conductive adhesive 500 can flow into the cracks of the stretchable conductive layer 200, and the non-solid conductive adhesive 500 can be filled in the cracks of the stretchable conductive layer 200 after being cured, so that the cracks can be repaired. Since the microstructure 600 is disposed at the position of the stretchable conductive layer 200 corresponding to the non-solid conductive adhesive 500, more non-solid conductive adhesives 500 can be attached to the microstructure 600 of the stretchable conductive layer 200, and the adhesion between the non-solid conductive adhesive 500 and the stretchable conductive layer 200 can be increased, thereby facilitating the formation and repair of cracks generated in the stretchable conductive layer 200. In addition, the non-solid conductive adhesive 500 may also exhibit a partial stretching force when the stretchable conductive layer 200 is stretched, which helps to improve the occurrence of cracks in the stretchable conductive layer 200.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a seventh electrical connection element according to an embodiment of the disclosure. The structure of the seventh electrical connection assembly is substantially the same as that of the first to fifth electrical connection assemblies, except that a protrusion 210 is disposed at a position of the stretchable conductive layer 200 corresponding to the non-solid conductive adhesive 500, and the protrusion 210 is used to assist the non-solid conductive adhesive 500 to flow along the surface of the stretchable conductive layer 200.

Wherein the protrusion 210 is arched in an arc shape. When the protrusion 210 is disposed corresponding to the non-solid conductive adhesive 500, the non-solid conductive adhesive 500 may be assisted to flow toward a connection portion between the stretchable conductive layer 200 and the elastic conductive adhesive layer 300, so that more non-solid conductive adhesive 500 flows into a crack generated in the stretchable conductive layer 200, and the crack generated in the stretchable conductive layer 200 may be better repaired.

Referring to fig. 8, fig. 8 is a schematic structural diagram of an eighth electrical connection assembly according to an embodiment of the present invention. The eighth electrical connection assembly has substantially the same structure as the first to seventh electrical connection assemblies, except that the non-solid state conductive paste 500 has a first end 510 and a second end 520 opposite to each other, the radial dimension of the non-solid state conductive paste 500 is gradually reduced from the first end 510 toward the second end 520, and the second end 520 is located on the surface of the stretchable conductive layer 200.

Specifically, the method comprises the following steps. In this embodiment, the non-solid conductive adhesive 500 has a tapered shape, and includes a first end 510 and a second end 520 opposite to each other, the second end 520 directly contacts the stretchable conductive layer 200, and a radial dimension of the first end 510 is larger than a radial dimension of the second end 520. At this time, the non-solid conductive paste 500 flows more easily toward the stretchable conductive layer 200 due to gravity. When the stretchable conductive layer 200 is stretched to generate cracks, the non-solid conductive adhesive 500 flows into the cracks generated in the stretchable conductive layer 200 due to gravity, and the cracks generated when the stretchable conductive layer 200 is stretched can be filled after the non-solid conductive adhesive 500 is cured. Since the non-solid conductive adhesive 500 has the conductive property, when the non-solid conductive adhesive 500 is filled in the cracks of the stretchable conductive layer 200, the normal electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 can be ensured, and the problem of electrical connection failure between the stretchable conductive layer 200 and the flexible circuit board 400 is avoided, that is, the non-solid conductive adhesive 500 can protect the stretchable conductive layer 200, prevent the stretchable conductive layer 200 from cracking, and help to ensure that the electrical connection assembly 10 ensures a stable electrical connection relationship.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a ninth electrical connection element according to an embodiment of the present invention. The ninth electrical connection component has a structure substantially the same as the first to eighth electrical connection components, except that the electrical connection component 10 further includes a protection layer 600, the protection layer 600 is located on a side of the stretchable conductive layer 200 away from the flexible substrate 100, the protection layer 600 covers the stretchable conductive layer 200 and the flexible circuit board 400 at the same time, and the protection layer 600 is used for improving the bearing force when stretching between the stretchable conductive layer 200 and the flexible circuit board 400.

The protection layer 600 may be an elastic encapsulation layer, such as an organic silicon rubber. The hardness of the protective layer 600 is greater than that of the flexible substrate 100, and the elongation of the protective layer 600 is less than that of the flexible substrate 100. For example, when the flexible substrate 100 has a hardness of 30 shore a and an elongation at break of 500%, the protection layer 400 is made of silicone rubber having a hardness of greater than 40 shore a and an elongation at break of less than 300%. Because the protection layer 600 has higher hardness and smaller stretching ratio, when the electrical connection assembly 10 is under the action of the stretching force, the protection layer 600 can bear part of the stretching force, so that the bearing force of the stretchable conductive layer 200 and the flexible circuit board 400 can be improved when the stretchable conductive layer 200 and the flexible circuit board 400 are stretched, the stable electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 is ensured, and the normal use of the electrical connection assembly 10 is further ensured.

The protective layer 600 includes a first portion 610 and a second portion 620 connected to each other, the first portion 610 covers the stretchable conductive layer 200, and the second portion 620 covers the flexible circuit board 400. When the stretchable conductive layer 200 and the flexible circuit board 400 are simultaneously stretched, the stretchable conductive layer 200 and the flexible circuit board 400 may be stretched asynchronously due to the different material characteristics of the stretchable conductive layer 200 and the flexible circuit board 400. The protective layer 600 covers the stretchable conductive layer 200 and the flexible circuit board 400, and can bear a part of the stretching force between the stretchable conductive layer 200 and the flexible circuit board 400, thereby improving the bearing force between the stretchable conductive layer 200 and the flexible circuit board 400 when stretching, further maintaining the stable electrical connection relationship of the electrical connection assembly 10, and ensuring the service life of the electrical connection assembly 10.

In one possible embodiment, the first portion 610 is directly connected to the second portion 620.

Specifically, in the present embodiment, the first portion 610 covers the stretchable conductive layer 200, the second portion 620 covers the flexible circuit board 400, and the first portion 610 is directly connected to the second portion 620. At this time, the end surface of the first portion 610 close to the flexible circuit board 400 is directly attached to the flexible circuit board 400. Because the protection layer 600 is closely attached to the flexible circuit board 400 and covers the stretchable conductive layer 200 and the flexible circuit board 400, when the stretchable conductive layer 200 and the flexible circuit board 400 are stretched simultaneously, the protection layer 600 can provide partial stretching force for the stretchable conductive layer 200 and the flexible circuit board 400 to reduce asynchronous deformation generated between the stretchable conductive layer 200 and the flexible circuit board 400, thereby avoiding the electrical connection failure caused by asynchronous stretching between the stretchable conductive layer 200 and the flexible circuit board 400, helping to ensure that the stretchable conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship, and ensuring that the electrical connection assembly 10 can be normally used.

With reference to fig. 10, in another possible embodiment, a gap a is formed between the end surface of the first portion 610 close to the flexible circuit board 400 and the flexible circuit board 400.

Specifically, in this embodiment, the protection layer 600 further includes a third portion 630 connected between the first portion 610 and the second portion 620, the first portion 610 covers the stretchable conductive layer 200, the second portion 620 covers the flexible circuit board 400, and the third portion 630 does not cover the flexible circuit board 400, that is, a gap a is formed between the third portion 630 and the stretchable conductive layer 200. The gap a is used to eliminate internal stress formed between the protective layer 600 and the stretchable conductive layer 200 and between the stretchable conductive layer 200 and the flexible circuit board 400. If the third portion 630 also covers the flexible circuit board 400, that is, the protection layer 600 is closely attached to the stretchable conductive layer 200 and the flexible circuit board 400, due to different stretching ratios of the three materials, it is inevitable to exhibit different degrees of stretching deformation when being subjected to a stretching force, in other words, when being subjected to a stretching force, non-uniform internal stress is generated among the protection layer 600, the stretchable conductive layer 200 and the flexible circuit board 400, and when the interior of the electrical connection assembly 10 is subjected to such internal stress for a long time, cracks may be generated under the action of the internal stress, thereby causing the electrical connection failure of the electrical connection assembly 10. Therefore, when the gap a is formed between the third portion 630 and the stretchable conductive layer 200, the stretchable conductive layer 200 in the portion corresponding to the gap a can be subjected to normal stretching deformation without being interfered by the third portion 630 of the protection layer 600, so that the non-uniform internal stress generated inside the electrical connection component 10 can be released from the stretchable conductive layer 200 in the portion corresponding to the gap a, so that the uniform stress is maintained inside the electrical connection component 10, which helps to maintain the electrical connection component 10 in a stable electrical connection relationship, thereby ensuring the normal use of the electrical connection component 10.

Referring to fig. 11, fig. 11 is a schematic structural diagram of a first electronic device 1 according to an embodiment of the invention.

The electronic device 1 may be any device having communication and storage functions. For example: the system comprises intelligent equipment with a network function, such as a tablet Computer, a mobile phone, an electronic reader, a remote controller, a Personal Computer (PC), a notebook Computer, vehicle-mounted equipment, a network television, wearable equipment and the like.

Specifically, taking the electronic device 1 as a flexible folding mobile phone as an example for explanation, the electronic device 1 includes a middle frame 1000, a circuit board 1100 and keys 2000, and the keys 2000 are control buttons, which may be power keys, volume keys, or other function keys. The electrical signal generated after the key 2000 is pressed is transmitted to the circuit board 1100 via the flexible circuit board 400, and then the circuit board 1100 performs a corresponding control function. One end of the flexible circuit board 400 needs to be electrically connected to the circuit board 1100, and at this time, the electrical connection assembly 10 provided in the embodiment of the present invention may be used to bind one end of the flexible circuit board 400 to the circuit board 1100, so as to ensure a stable electrical connection relationship inside the electronic device 1.

Referring to fig. 12, fig. 12 is a schematic diagram illustrating a method for manufacturing a first electrical connection assembly according to an embodiment of the invention. The method for manufacturing the electrical connection assembly 10 includes, but is not limited to, steps S100, S200, S300, and S400, and the steps S100, S200, S300, and S400 are described in detail as follows.

S100: a flexible substrate 100 is provided. Please refer to fig. 13.

The flexible substrate 100 may be an elastic substrate, such as a high-elongation silicone rubber.

S200: a stretchable conductive layer 200 is formed covering the flexible substrate 100. Please refer to fig. 14.

The stretchable conductive layer 200 may be prepared from liquid silicone silver powder conductive ink.

S300: forming a non-solid conductive adhesive 500 and an elastic conductive adhesive layer 300 covering the stretchable conductive layer 200, wherein the stretchable conductive layer 200 is electrically connected with the elastic conductive adhesive layer 300, and the non-solid conductive adhesive 500 is used for repairing cracks generated in the stretchable conductive layer 200 during stretching. Please refer to fig. 15.

The elastic conductive adhesive layer 300, the elastic conductive adhesive layer 300 has high elasticity, conductivity and high adhesiveness, and can be liquid silicone silver powder conductive adhesive or room temperature vulcanized silicone conductive adhesive, and the elastic conductive adhesive layer 300 is arranged around the non-solid conductive adhesive 500. Specifically, the elastic conductive adhesive layer 300 may form the elastic conductive adhesive layer 320 into the center and the edge of the bonding region of the electrical connection assembly 10 by dispensing, printing, transferring, and the like.

The non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as silicone conductive silicone grease, conductive gel, liquid metal, etc., or a partial mixture of the non-solid film-forming conductive adhesive and the elastic conductive adhesive layer 300. The non-solid conductive adhesive 500 is flowable after stretching and is highly viscous when left standing. When the non-solid conductive adhesive 500 is stretched, it may flow into cracks formed on the surface of the stretchable conductive layer 200, thereby repairing the cracks formed on the surface of the stretchable conductive layer 200. When the non-solid conductive paste 500 is not stretched, the non-solid conductive paste 500 has a greater viscosity, thereby closely adhering the stretchable conductive layer 200 and the flexible circuit board 400 such that the stretchable conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship.

In one embodiment, the non-solid conductive adhesive 500 covering the stretchable conductive layer 200 is formed first, and then the elastic conductive adhesive layer 300 surrounding the non-solid conductive adhesive 500 is formed. In another embodiment, the elastic conductive adhesive layer 300 covering the stretchable conductive layer 200 is formed first, and the non-solid conductive adhesive 500 penetrating the elastic conductive adhesive layer 300 and covering the stretchable conductive layer 200 is formed.

Referring to fig. 16, in one possible embodiment, the non-solid conductive adhesive 500 has a first end 510 and a second end 520 opposite to each other, a radial dimension of the non-solid conductive adhesive 500 is gradually reduced from the first end 510 to the second end 520, and the second end 520 is located on the surface of the stretchable conductive layer 200.

Specifically, in the present embodiment, the non-solid conductive adhesive 500 has a tapered shape, and includes a first end 510 and a second end 520 opposite to each other, the second end 520 directly contacts the stretchable conductive layer 200, and a radial dimension of the first end 510 is larger than a radial dimension of the second end 520. At this time, the non-solid conductive paste 500 flows more easily toward the stretchable conductive layer 200 due to gravity. When the stretchable conductive layer 200 is stretched to generate cracks, the non-solid conductive adhesive 500 flows into the cracks generated in the stretchable conductive layer 200 due to gravity, and the cracks generated when the stretchable conductive layer 200 is stretched can be filled after the non-solid conductive adhesive 500 is cured. Since the non-solid conductive adhesive 500 has the conductive property, when the non-solid conductive adhesive 500 is filled in the cracks of the stretchable conductive layer 200, the normal electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 can be ensured, and the problem of electrical connection failure between the stretchable conductive layer 200 and the flexible circuit board 400 is avoided, that is, the non-solid conductive adhesive 500 can protect the stretchable conductive layer 200, prevent the stretchable conductive layer 200 from cracking, and help to ensure that the electrical connection assembly 10 ensures a stable electrical connection relationship.

S400: forming a flexible circuit board 400 covering the elastic conductive adhesive layer 300, wherein the elastic conductive adhesive layer 300 is electrically connected with the flexible circuit board 400. Please refer to fig. 17.

The flexible printed circuit board 400 is also called a "flexible board", and is a flexible printed circuit board with high reliability and excellent performance, which is made of polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.

In the present embodiment, the stretchable conductive layer 200 is electrically connected to the flexible circuit board 400 through the elastic conductive adhesive layer 300. Due to the difference in the stretching rates of the stretchable conductive layer 200, the elastic conductive adhesive layer 300 and the flexible printed circuit board 400, the three layers will exhibit different deformation amounts when being stretched, thereby resulting in an asynchronous stretching effect. In this process, when the stretchable conductive layer 200 is stretched and the magnitude of the stretching force is greater than a certain threshold or the duration of the stretching force is greater than a predetermined time, the stretchable conductive layer 200 may crack. When a crack occurs, the cross-sectional area of the stretchable conductive layer 200 decreases, which may cause a sudden increase in the resistance of the stretchable conductive layer 200, and further may cause a decrease in the current passing through the stretchable conductive layer 200, which may be detrimental to the transmission of electrical signals from the stretchable conductive layer 200. And in the process, the stretchable conductive layer 200 may be pulled apart, the electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 is broken, and the signal transmission through the flexible circuit board 400 is blocked. In order to solve the problem, the non-solid conductive adhesive 500 is adopted to cover the stretchable conductive layer 200, when the stretchable conductive layer 200 is stretched to generate cracks, the non-solid conductive adhesive 500 can flow into the cracks of the stretchable conductive layer 200 and then is filled in the cracks of the stretchable conductive layer 200 after being cured, and the non-solid conductive adhesive 500 has conductive performance, so that the problem of electrical connection failure of the stretchable conductive layer 200 can be avoided, and the electrical connection assembly 10 is ensured to maintain a stable electrical connection relationship.

Referring to fig. 18, fig. 18 is a schematic view illustrating a method for manufacturing a second electrical connection assembly according to an embodiment of the invention. The second electrical connection member is prepared in substantially the same manner as the first electrical connection member except that the "S300: the forming of the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300 ″ covering the stretchable conductive layer 200 includes, but is not limited to, the steps S310 and S320, which are described in detail below with respect to the steps S310 and S320.

S310: a non-solid conductive paste 500 is formed to cover the stretchable conductive layer 200. Please refer to fig. 19.

The non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as an organic silicon conductive silicone grease, a conductive gel, a liquid metal, or the like.

S320: an elastic conductive adhesive layer 300 is formed to cover the non-solid conductive adhesive 500 and the stretchable conductive layer 200. Please refer to fig. 20.

Specifically, in the present embodiment, a receiving groove 300a is formed on a side of the elastic conductive adhesive layer 300 adjacent to the stretchable conductive layer 200, and the non-solid conductive adhesive 500 is received in the receiving groove 300 a. The opening of the receiving groove 300a faces the stretchable conductive layer 200. The non-solid conductive adhesive 500 is disposed in the receiving groove 300a and directly contacts the stretchable conductive layer 200. The stretchable conductive layer 200 is electrically connected to the elastic conductive adhesive layer 300 through the non-solid conductive adhesive 500 at a position corresponding to the receiving slot 300a, and the other position of the stretchable conductive layer 200 is directly electrically connected to the elastic conductive adhesive layer 300. When the stretchable conductive layer 200, the elastic conductive adhesive layer 300 and the flexible circuit board 400 are stretched, the stretchable conductive layer 200, the elastic conductive adhesive layer 300 and the flexible circuit board 400 have different stretching rates, and the three exhibit different deformation amounts when being stretched, thereby resulting in an asynchronous stretching effect. In this process, when the stretchable conductive layer 200 is stretched and the magnitude of the stretching force is greater than a certain threshold value or the stretching duration is greater than a predetermined length, the stretchable conductive layer 200 may crack. When a crack occurs, the cross-sectional area of the stretchable conductive layer 200 decreases, which may cause a sudden increase in the resistance of the stretchable conductive layer 200, and further may cause a decrease in the current passing through the stretchable conductive layer 200, which may be detrimental to the transmission of electrical signals from the stretchable conductive layer 200. And in the process, the stretchable conductive layer 200 may be pulled apart, the electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 is broken, and the signal transmission through the flexible circuit board 400 is blocked. When the stretchable conductive layer 200 is stretched to form a crack, the non-solid conductive adhesive 500 covers the stretchable conductive layer 200 and is located in the receiving groove 300a of the elastic conductive adhesive layer 300, and under the action of gravity, the non-solid conductive adhesive 500 can flow into the crack of the stretchable conductive layer 200 and then is filled in the crack of the stretchable conductive layer 200 after being cured, and the non-solid conductive adhesive 500 has a conductive property, so that the problem of electrical connection failure of the stretchable conductive layer 200 can be avoided, and the electrical connection assembly 10 can be ensured to maintain a stable electrical connection relationship.

Referring to fig. 21, fig. 21 is a schematic view illustrating a third method for manufacturing an electrical connection assembly according to an embodiment of the invention. The third electrical connection member is prepared in substantially the same manner as the first electrical connection member except that the "S300: the forming of the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300 ″ covering the stretchable conductive layer 200 includes, but is not limited to, the steps S330, S340, and S350, which are described in detail below with respect to the steps S330, S340, and S350.

S330: a non-solid conductive paste 500 is formed to cover the stretchable conductive layer 200. Please refer to fig. 22.

S340: forming an elastic conductive adhesive layer 300 covering the stretchable conductive layer 200, wherein the elastic conductive adhesive layer 300 has a receiving hole 300b, and the receiving hole 300b is a through hole to expose the non-solid conductive adhesive 500. Please refer to fig. 23.

S350: forming a flexible circuit board 400 covering the elastic conductive adhesive layer 300 and the non-solid conductive adhesive 500 at the same time. Please refer to fig. 24.

Referring to fig. 25, fig. 25 is a schematic view illustrating a method for manufacturing a fourth electrical connection assembly according to an embodiment of the invention. The fourth electrical connection member is prepared substantially in the same manner as the first electrical connection member except that the "S300: the forming of the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300 ″ covering the stretchable conductive layer 200 includes, but is not limited to, the steps S360, S370, and S380, which are described in detail below with respect to the steps S360, S370, and S380.

S360: a non-solid conductive paste 500 is formed to cover the stretchable conductive layer 200. Please refer to fig. 26.

S370: forming an elastic conductive adhesive layer 300 covering the stretchable conductive layer 200, wherein the elastic conductive adhesive layer 300 has a first receiving hole 301, and the first receiving hole 301 is a through hole to expose the non-solid conductive adhesive 500. Please refer to fig. 27.

S380: forming a flexible circuit board 400 covering the elastic conductive adhesive layer 300, wherein the flexible circuit board 400 has a second receiving hole 401, the second receiving hole 401 is a blind hole, and the flexible circuit board 400 covers the non-solid conductive adhesive 500. Please refer to fig. 28.

Referring to fig. 29, fig. 29 is a schematic view illustrating a fifth method for manufacturing an electrical connection assembly according to an embodiment of the invention. The fifth electrical connection member is manufactured substantially the same as the first electrical connection member except that the "S300: the forming of the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300 ″ covering the stretchable conductive layer 200 includes, but is not limited to, the steps S301, S302, and S303, which are described in detail below with respect to the steps S301, S302, and S303.

S301: a non-solid conductive paste 500 is formed to cover the stretchable conductive layer 200. Please refer to fig. 30.

S302: forming an elastic conductive adhesive layer 300 covering the stretchable conductive layer 200, wherein the elastic conductive adhesive layer 300 has a first through hole 302 to expose the non-solid conductive adhesive 500. Please refer to fig. 31.

S303: forming a flexible circuit board 400 covering the elastic conductive adhesive layer 300, wherein the flexible circuit board 400 is provided with a second through hole 402 to expose the non-solid conductive adhesive 500. Please refer to fig. 32.

The second through hole 402 may be square, circular, or other shapes.

Referring to fig. 33, fig. 33 is a schematic view illustrating a method for manufacturing a sixth electrical connection element according to an embodiment of the invention. The sixth electrical connection assembly is prepared by a method substantially the same as the first to fifth electrical connection assemblies, except that the method for preparing the electrical connection assembly 10 further includes, but is not limited to, step S250, which is described in detail below with respect to step S250.

S250: a microstructure 600 is formed at a position of the stretchable conductive layer 200 corresponding to the non-solid conductive adhesive 500, and the microstructure 600 is used for increasing the adhesion between the non-solid conductive adhesive 500 and the stretchable conductive layer 200. Please refer to fig. 34.

The microstructures 600 may be saw-toothed structures to increase the contact area between the non-solid conductive adhesive 500 and the stretchable conductive layer 200. The non-solid conductive paste 500 has static thickening and shear thinning properties. When the film is left to stand, the viscosity is high and the fluidity is low, and when the film is pressed or stretched, the viscosity is low and the fluidity is increased. When the stretchable conductive layer 200 cracks, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity thereof increases, and thus the non-solid conductive adhesive 500 can flow into the cracks of the stretchable conductive layer 200, and the non-solid conductive adhesive 500 can be filled in the cracks of the stretchable conductive layer 200 after being cured, so that the cracks can be repaired. Since the microstructure 600 is disposed at the position of the stretchable conductive layer 200 corresponding to the non-solid conductive adhesive 500, more non-solid conductive adhesives 500 can be attached to the microstructure 600 of the stretchable conductive layer 200, and the adhesion between the non-solid conductive adhesive 500 and the stretchable conductive layer 200 can be increased, thereby facilitating the formation and repair of cracks generated on the stretchable conductive layer 200. In addition, the non-solid conductive adhesive 500 may also exhibit a partial stretching force when the stretchable conductive layer 200 is stretched, which helps to improve the occurrence of cracks in the stretchable conductive layer 200.

Referring to fig. 35, fig. 35 is a schematic view illustrating a method for manufacturing a seventh electrical connection device according to an embodiment of the invention. The seventh electrical connection assembly is prepared by the same method as the first to fifth electrical connection assemblies, except that the method for preparing the electrical connection assembly 10 further includes, but is not limited to, step S270, and the details about step S270 are described below.

S270: a protrusion 210 is formed at a position of the stretchable conductive layer 200 corresponding to the non-solid conductive adhesive 500, and the protrusion 210 is used for assisting the non-solid conductive adhesive 500 to flow along the surface of the stretchable conductive layer 200. Please refer to fig. 36.

Referring to fig. 37, fig. 37 is a schematic view illustrating a method for manufacturing an eighth electrical connection assembly according to an embodiment of the present invention. The eighth electrical connection member is prepared substantially in the same manner as the first to seventh electrical connection members except that, in the case of the "S400: after the flexible circuit board 400 ″ covering the elastic conductive adhesive layer 300 is formed, the method for manufacturing the electrical connection assembly 10 further includes, but is not limited to, step S500, and the following detailed description is provided with respect to step S500.

S500: a protective layer 600 is formed on one side of the stretchable conductive layer 200 away from the flexible substrate 100, the protective layer 600 covers the stretchable conductive layer 200 and the flexible circuit board 400 at the same time, and the protective layer 600 is used for improving the bearing force when the stretchable conductive layer 200 and the flexible circuit board 400 are stretched. Please refer to fig. 38.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily made by those skilled in the art within the technical scope of the present invention will be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

The electric connection assembly is characterized by comprising a flexible substrate, a stretchable conductive layer, an elastic conductive adhesive layer and a flexible circuit board which are sequentially stacked, wherein the stretchable conductive layer is electrically connected with the flexible circuit board through the elastic conductive adhesive layer, the electric connection assembly further comprises non-solid conductive adhesive, and the non-solid conductive adhesive is used for repairing cracks generated in the stretching process of the stretchable conductive layer.
The electrical connection assembly as claimed in claim 1, wherein a side of the elastic conductive adhesive layer adjacent to the stretchable conductive layer has a receiving slot, and the non-solid conductive adhesive is received in the receiving slot.
The electrical connection assembly of claim 1, wherein the elastic conductive adhesive layer has a receiving hole, the receiving hole is a through hole, and the non-solid conductive adhesive is received in the receiving hole and is electrically connected to the stretchable conductive layer and the flexible circuit board.
The electrical connection assembly according to claim 1, wherein the elastic conductive adhesive layer has a first receiving hole, a side of the flexible circuit board adjacent to the elastic conductive adhesive layer has a second receiving hole, the second receiving hole is connected to the first receiving hole, the first receiving hole is a through hole, the second receiving hole is a blind hole, and the non-solid conductive adhesive is received in the first receiving hole and the second receiving hole.
The electrical connection assembly of claim 1, wherein the elastic conductive adhesive layer has a first through hole, the flexible circuit board has a second through hole, the second through hole is connected to the first through hole, and the non-solid conductive adhesive is received in the first through hole and the second through hole and is electrically connected to the stretchable conductive layer and the flexible circuit board.
The electrical connection assembly according to any one of claims 1 to 5, wherein the stretchable conductive layer is provided with microstructures corresponding to the non-solid conductive adhesive, the microstructures being configured to increase adhesion between the non-solid conductive adhesive and the stretchable conductive layer.
The electrical connection assembly as recited in any one of claims 1 to 5, wherein the stretchable conductive layer is provided with a protrusion corresponding to the non-solid conductive adhesive, the protrusion being configured to assist the non-solid conductive adhesive to flow along a surface of the stretchable conductive layer.
The electrical connection assembly as recited in any one of claims 1 to 7, wherein the non-solid conductive gel has opposing first and second ends, the non-solid conductive gel having a radial dimension that decreases from the first end toward the second end, the second end being located on a surface of the stretchable conductive layer.
The electrical connection assembly as claimed in any one of claims 1 to 8, further comprising a protective layer disposed on a side of the stretchable conductive layer away from the flexible substrate, the protective layer covering both the stretchable conductive layer and the flexible circuit board, the protective layer being configured to increase the resistance when stretched between the stretchable conductive layer and the flexible circuit board.
An electronic device, characterized in that it comprises an electrical connection assembly according to any one of claims 1-9.
A method of making an electrical connection assembly, the method comprising:

providing a flexible substrate;

forming a stretchable conductive layer covering the flexible substrate;

forming a non-solid conductive adhesive and an elastic conductive adhesive layer which cover the stretchable conductive layer, wherein the stretchable conductive layer and the elastic conductive adhesive layer are electrically connected, and the non-solid conductive adhesive is used for repairing cracks generated in the stretching process of the stretchable conductive layer;

and forming a flexible circuit board covering the elastic conductive adhesive layer, wherein the elastic conductive adhesive layer is electrically connected with the flexible circuit board.
The method of making an electrical connection assembly of claim 11, wherein the forming a non-solid conductive adhesive and an elastic conductive adhesive layer overlying the stretchable conductive layer comprises:

forming a non-solid conductive adhesive covering the stretchable conductive layer;

and forming an elastic conductive adhesive layer covering the non-solid conductive adhesive and the stretchable conductive layer.
The method of making an electrical connection assembly of claim 11, wherein the forming a non-solid conductive adhesive and an elastic conductive adhesive layer overlying the stretchable conductive layer further comprises:

forming a non-solid conductive adhesive covering the stretchable conductive layer;

forming an elastic conductive adhesive layer covering the stretchable conductive layer, wherein the elastic conductive adhesive layer is provided with a containing hole which is a through hole so as to expose the non-solid conductive adhesive;

and forming a flexible circuit board which covers the elastic conductive adhesive layer and the non-solid conductive adhesive at the same time.
The method of making an electrical connection assembly of claim 11, wherein the forming a non-solid conductive adhesive and an elastic conductive adhesive layer overlying the stretchable conductive layer further comprises:

forming a non-solid conductive adhesive covering the stretchable conductive layer;

forming an elastic conductive adhesive layer covering the stretchable conductive layer, wherein the elastic conductive adhesive layer is provided with a first accommodating hole which is a through hole so as to expose the non-solid conductive adhesive;

and forming a flexible circuit board covering the elastic conductive adhesive layer, wherein the flexible circuit board is provided with a second accommodating hole which is a blind hole, and the flexible circuit board covers the non-solid conductive adhesive.
The method of making an electrical connection assembly of claim 11, wherein the forming a non-solid conductive adhesive and an elastic conductive adhesive layer overlying the stretchable conductive layer further comprises:

forming a non-solid conductive adhesive covering the stretchable conductive layer;

forming an elastic conductive adhesive layer covering the stretchable conductive layer, wherein the elastic conductive adhesive layer is provided with a first through hole so as to expose the non-solid conductive adhesive;

and forming a flexible circuit board covering the elastic conductive adhesive layer, wherein the flexible circuit board is provided with a second through hole so as to expose the non-solid conductive adhesive.
The method of making an electrical connection assembly of any of claims 11-15, further comprising:

and forming a microstructure at a position of the stretchable conductive layer corresponding to the non-solid conductive adhesive, wherein the microstructure is used for increasing the adhesive force between the non-solid conductive adhesive and the stretchable conductive layer.
The method of making an electrical connection assembly of any of claims 11-15, further comprising:

and forming a convex part at the part of the stretchable conductive layer corresponding to the non-solid conductive adhesive, wherein the convex part is used for assisting the non-solid conductive adhesive to flow along the surface of the stretchable conductive layer.
The method of making an electrical connection assembly as in any one of claims 11-17 wherein the non-solid conductive gel has opposing first and second ends, the non-solid conductive gel having a radial dimension that decreases from the first end toward the second end, the second end being located on a surface of the stretchable conductive layer.
The method for manufacturing an electrical connection assembly according to any one of claims 11 to 18, wherein after the "forming a flexible circuit board covering the elastic conductive adhesive layer", the method for manufacturing an electrical connection assembly further comprises:

and forming a protective layer on one side of the stretchable conductive layer, which is far away from the flexible substrate, wherein the protective layer covers the stretchable conductive layer and the flexible circuit board at the same time, and is used for improving the bearing force between the stretchable conductive layer and the flexible circuit board during stretching.