CN113260166A - Method for improving insufficient ink in holes of rigid-flexible printed circuit board - Google Patents
Method for improving insufficient ink in holes of rigid-flexible printed circuit board Download PDFInfo
- Publication number
- CN113260166A CN113260166A CN202110432140.6A CN202110432140A CN113260166A CN 113260166 A CN113260166 A CN 113260166A CN 202110432140 A CN202110432140 A CN 202110432140A CN 113260166 A CN113260166 A CN 113260166A
- Authority
- CN
- China
- Prior art keywords
- rigid
- ink
- board
- holes
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for improving insufficient ink in holes of a rigid-flexible printed circuit board, which comprises the following steps: the soft-hard combination board is arranged on the tool board so that the first surface of the soft-hard combination board faces away from the tool board, at least one through hole area is arranged on the soft-hard combination board, a plurality of through holes are arranged in any one through hole area, an exhaust groove is arranged on the tool board corresponding to any one through hole area, and the opening area of the exhaust groove is larger than or equal to the area of the corresponding through hole area. The first surface of the rigid-flex board is provided with the screen plate, so that the scraper moves on the surface of the screen plate, which is back to the rigid-flex board, to exhaust the gas in any through hole to the preset requirement through the corresponding exhaust groove, and the ink on the screen plate flows into the first surface of the rigid-flex board and any through hole. And pre-baking the ink in the first surface of the rigid-flex board and any one through hole to be semi-solidified, and then printing the ink on the second surface of the rigid-flex board. The method can improve the ink amount in the through hole and on the surface of the rigid-flexible printed circuit board.
Description
Technical Field
The invention relates to the technical field of ink printing of rigid-flexible boards, in particular to a method for improving insufficient ink in holes of a rigid-flexible board.
Background
Due to the high-density wiring and via hole conduction mode, the rigid-flex board is provided with a through hole and a hole ring for conducting a circuit in the rigid board area. When solder-resisting ink is printed on the rigid-flexible printed circuit board, the diameter of the through hole is small, and sufficient ink is difficult to flow into the through hole, so that when the rigid-flexible printed circuit board is placed statically after ink is printed, the ink on the surface of the rigid-flexible printed circuit board flows into the through hole, and the ink on the surface of the rigid-flexible printed circuit board becomes thin. Even if the ink on the surface of the soft and hard bonding plate flows into the through hole, the ink amount in the through hole can not meet the requirement due to insufficient ink discharging amount of the screen plate. Insufficient ink on the surface of the rigid-flexible printed circuit board can cause false copper exposure or true copper exposure. Insufficient ink filling in the through hole, i.e. the through hole is not filled with ink, may cause the liquid medicine in the through hole during the subsequent process.
In the prior art, the problem is improved by adopting a secondary printing mode. And the secondary printing is to add a first dot blocking screen printing before the printing of the solder mask, the dot blocking screen is provided with openings corresponding to the through holes and the welding pads of the soft-hard combination board, and other areas of the dot blocking screen are shielded without ink. And (3) firstly printing ink on the through holes and the bonding pads of the rigid-flexible printed circuit board by using the dot blocking screen plate. After the first ink printing, the conventional screen plate is adopted to perform integral ink printing on the rigid-flexible printed circuit board, so that the through holes and the bonding pads are subjected to secondary printing, and the amount of ink is increased. By adopting the secondary printing method, although the problem of insufficient ink in the through hole can be solved, the printing times are increased, the cost is increased due to the use of the two screen plates, and the ink needs to be pre-baked after printing the ink every time, so that the baking times are increased, the processing procedure control points are increased due to the increased baking times, and the accelerated curing of the ink is caused due to the excessive baking, the developing effect is influenced, and the poor development is caused.
In the CN200610094336.4 patent circuit board air-suction ink-penetration hole-plugging method and device, a screen plate and an air suction device are respectively arranged on the upper and lower sides of the circuit board, a filling opening is arranged at a conductive hole corresponding to the circuit board through the screen plate, ink is filled in the conductive hole by using a screen printing method, and the ink is completely filled in the conductive hole by matching with air suction of the air suction device, so that no bubbles or depressions or broken holes are generated in the conductive hole with a high aspect ratio after completion, thereby achieving the yield of the whole manufacturing process.
The inventor of the present application has found through experimental tests that the solution described in the patent cannot be used for the rigid-flex board of the present application. This application soft or hard combines the thickness value of board low and have a plurality of comparatively soft regions, when bleeding to the soft or hard combination board, can cause the soft or hard combination board to warp, lead to the lower china ink position of otter board and the hole site dislocation of soft or hard combination board to cause printing ink not to the hole, and cause inconvenience to follow-up processing procedure. The inventor of the present application tries to cancel the air exhaust device, that is, according to the patent, the upper side and the lower side of the rigid-flex board are directly provided with the screen plates respectively, and then the ink is filled in the conductive holes by using the screen plate printing method.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a method for improving insufficient ink in holes of a rigid-flexible printed circuit board, which can improve the ink amount in the through holes of the rigid-flexible printed circuit board and the ink amount on the surface of the rigid-flexible printed circuit board and improve the phenomena of copper exposure and false copper exposure of the orifices of the rigid-flexible printed circuit board.
The invention discloses: a method for improving insufficient ink in holes of a rigid-flexible printed circuit board comprises the following steps:
placing a soft-hard combination board on a jig board so that a first surface of the soft-hard combination board faces away from the jig board, wherein the soft-hard combination board is provided with at least one through hole area, any one of the through hole areas is provided with a plurality of through holes, an exhaust groove is arranged on the jig board corresponding to any one of the through hole areas, and the opening area of the exhaust groove is larger than or equal to the area of the through hole area corresponding to the exhaust groove;
after the soft and hard combined plate is placed on the jig plate, arranging a screen plate on the first surface of the soft and hard combined plate;
moving a scraper on one surface of the screen plate, which is opposite to the rigid-flex board, so as to exhaust the gas in any one through hole to a preset requirement through the corresponding exhaust groove, and thus enabling the ink on the screen plate to flow to the first surface of the rigid-flex board and any one through hole;
and pre-baking the ink on the first surface of the rigid-flexible printed circuit board and the ink in any one through hole to be semi-cured, and then printing the ink on the second surface of the rigid-flexible printed circuit board, wherein the first surface and the second surface of the rigid-flexible printed circuit board are arranged oppositely.
Preferably, the method only moves the scraper on the side of the screen plate opposite to the rigid-flex board, so as to exhaust the gas in any one of the through holes to the preset requirement through the corresponding exhaust groove.
Preferably, the thickness of the jig plate is not less than 2mm, and any one of the exhaust grooves is arranged to penetrate through the thickness direction of the jig plate.
Preferably, the thickness of the soft and hard combined plate ranges from T =0.2-0.6mm, and the diameter of the through hole ranges from 0.15-0.2 mm.
Preferably, in the step "moving a scraper on a surface of the screen plate opposite to the rigid-flex board to exhaust the gas in any one of the through holes to a preset requirement through the corresponding exhaust groove, so that the ink on the screen plate flows to the first surface of the rigid-flex board and any one of the through holes", the ink occupying more than 80% of the volume of the through hole is contained in any one of the through holes.
Preferably, in the step "moving a scraper on a surface of the screen plate opposite to the rigid-flex board to exhaust the gas in any one of the through holes to a preset requirement through the corresponding exhaust groove, so that the ink on the screen plate flows to the first surface of the rigid-flex board and any one of the through holes", the ink in any one of the through holes completely covers the inner wall of the through hole.
Preferably, in the step of "pre-baking the ink on the first surface of the rigid-flex board and the ink in any one of the through holes to be semi-cured", gas in the ink is discharged first, and then the ink is pre-baked.
Preferably, the ratio of the opening area of any one of the through holes to the opening area of the corresponding exhaust groove is 1 (5-100).
Preferably, in the step of "pre-baking the ink on the first surface of the rigid-flexible printed circuit board and the ink in any one of the through holes to a semi-cured state, and then printing the ink on the second surface of the rigid-flexible printed circuit board", the specific steps are as follows: after the printing ink on the first surface of the rigid-flex board and the printing ink in any one of the through holes are pre-baked to be semi-cured, the rigid-flex board is placed on the tool board, so that the second surface of the rigid-flex board faces away from the tool board, a screen plate is arranged on the second surface of the rigid-flex board, and a scraper is moved on the surface, facing away from the rigid-flex board, of the screen plate, so that the printing ink on the screen plate flows to the second surface of the rigid-flex board.
The invention has the following beneficial effects:
the method for improving insufficient ink in the holes of the rigid-flexible combined board of the invention is characterized in that the exhaust grooves are arranged at the positions of the jig board corresponding to any one through hole region, the opening area is larger than or equal to the area of the through hole region, therefore, the gas in any one through hole can be exhausted to the preset requirement through the corresponding exhaust groove, when printing ink, the pressure generated by the scraper is utilized to discharge the gas in any one through hole of the rigid-flexible printed circuit board to the preset requirement, thereby increasing the underflow amount of the ink in the screen plate, enabling any one through hole to be filled with sufficient ink, so that the ink on the surface of the soft and hard bonding plate can not flow into the through hole any more, the thickness of the ink on the surface of the soft and hard bonding plate reaches a preset value, and the thickness of the printing ink at the position of the rigid-flexible board close to the hole edge is consistent with that of the printing ink at the position of the rigid-flexible board far away from the hole edge, so that the phenomena of copper exposure and false copper exposure at the orifice of the rigid-flexible board are improved.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a rigid-flex board placed on a jig board according to an embodiment of the present invention;
FIG. 2 is a diagram of a simulated hole pattern of a through hole on a rigid-flex circuit board according to an embodiment of the present invention;
FIG. 3 is a simulated hole site diagram after the area division is performed in the embodiment of the present invention;
FIG. 4 is a pictorial representation of an embodiment of the present invention after ink printing has been completed on both the first side and the second side;
reference numerals of the above figures: 1-a jig plate; 101-an exhaust groove; 2-rigid-flex boards; 201-a through hole; 3-hole edge ink; 4-printing ink in the holes; 5-a machine table; 6-hole site; 7-cutting the area; 8-outer frame line.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment provides a method for improving insufficient ink in a hole of a rigid-flex board, which can improve the amount of ink in the through hole 201 of the rigid-flex board 2, wherein the rigid-flex board 2 comprises a first surface and a second surface which are oppositely arranged.
The method for improving insufficient ink in the holes of the rigid-flexible printed circuit board comprises the following steps:
placing a soft-hard combination board 2 on a tool board 1, so that a first surface of the soft-hard combination board 2 faces away from the tool board 1, wherein the soft-hard combination board 2 is provided with at least one through hole area, any one of the through hole areas is provided with a plurality of through holes 201, an exhaust groove 101 is arranged on the tool board 1 corresponding to any one of the through hole areas, and the opening area of the exhaust groove 101 is larger than or equal to the area of the through hole area corresponding to the exhaust groove 101;
after the rigid-flex board 2 is placed on the jig board 1, a mesh plate is arranged on the first surface of the rigid-flex board 2;
moving a scraper on one surface of the screen plate, which is opposite to the rigid-flex board 2, so as to discharge the gas in any one of the through holes 201 to preset requirements through the corresponding exhaust groove 101, and thus enabling the ink on the screen plate to flow to the first surface of the rigid-flex board 2 and any one of the through holes 201;
and pre-baking the ink on the first surface of the rigid-flex board 2 and the ink in any one of the through holes 201 to be semi-solidified, and then printing the ink on the second surface of the rigid-flex board 2. The first surface and the second surface of the rigid-flex board 2 are oppositely arranged.
The ink on the first surface of the rigid-flex printed circuit board 2 and the ink in any one of the through holes 201 are pre-baked to be semi-cured, the pre-baking temperature is 85 ℃, and the pre-baking time is 15 min. Semi-cured, i.e.: leaving the ink in a non-flowable and non-tacky state.
In this embodiment, the exhaust of any through hole 201 is moved on the side of the screen plate opposite to the rigid-flex board 2 only by the scraper, so as to exhaust the gas in any through hole 201 to the preset requirement through the corresponding exhaust groove 101, and the effect of filling ink in the through hole 201 is achieved in the process of extruding and exhausting any through hole 201. That is, in the present embodiment, the exhaust of any through hole 201 is limited to the mode that the scraper moves on the side of the screen plate opposite to the rigid-flexible printed circuit board 2, and when the scraper moves on the side of the screen plate opposite to the rigid-flexible printed circuit board 2, the gas in any through hole 201 is exhausted only through the corresponding exhaust groove 101.
In the present embodiment, the jig plate 1 is provided with the exhaust grooves 101 corresponding to any one of the through hole regions, and the opening area of the exhaust grooves 101 is equal to the area of the through hole region. In some alternative embodiments, the open area of the vent slot 101 is greater than the area of the via area. Thus, the gas in any one of the through holes 201 can be discharged through the corresponding discharge groove 101. When printing ink, utilize the pressure that the scraper produced, make the gas in arbitrary through-hole 201 of soft or hard combination board 2 discharged, thereby the volume of underflowing of printing ink has been increased, make enough printing ink can be filled in arbitrary through-hole 201, and then make the printing ink on soft or hard combination board 2 surface no longer to flow in the through-hole 201, make the thickness of the printing ink on soft or hard combination board 2 surface reach the default, and make the printing ink that soft or hard combination board 2 is close to hole limit department reach the unanimity with the printing ink thickness of keeping away from hole limit department, the phenomenon of the copper is exposed in the 2 drill way of soft or hard combination board and the false copper that exposes has been improved. The copper is exposed at the hole opening, namely: the area of the surface of the rigid-flex board 2 near the through hole 201 is not printed with sufficient ink, and copper leakage occurs in the area. The false copper exposure is caused by the fact that the ink on the surface of the rigid-flexible printed circuit board 2 is thin.
Referring to fig. 1, in the embodiment, when printing ink on the rigid-flexible board 2, the jig board 1 is placed at the upper end of the machine table 5 of the ink printing machine, and then the rigid-flexible board 2 is placed at the upper end of the jig board 1. In this embodiment, the rigid-flex printed circuit board 2 has two through hole regions, any one of the through hole regions has a plurality of through holes 201, and the jig board 1 has an air discharge groove 101 corresponding to any one of the through hole regions, that is, the jig board 1 has two air discharge grooves 101.
The preparation method of the exhaust groove 101 on the jig plate 1 comprises the following steps:
referring to the attached drawing 2, the outline and the hole site of the rigid-flex board 2 are simulated, so as to obtain a simulated hole bitmap of the through holes on the rigid-flex board. In other words, the simulated hole site map includes the outer wire 8 of the rigid-flex board 2 and a plurality of hole sites 6 disposed within the outer wire 8.
Referring to fig. 3, the plurality of hole sites 6 in the simulated hole site map are divided into two cropped areas 7, in other words, a portion of the hole sites 6 are grouped in one cropped area 7 and another portion of the hole sites 6 are grouped in the other cropped area 7. The outline of each cut area 7 was simulated.
And cutting a corresponding exhaust groove 101 on the jig plate 1 according to the outline of each cutting area 7, thereby obtaining the jig plate 1 matched with the shape of the rigid-flexible combined plate 2. Specifically, the portion of the jig plate 1 corresponding to each of the cut areas 7 is cut away, resulting in the corresponding air discharge groove 101.
Referring to fig. 4, the ink 4 in the through hole 201 of any one of the rigid-flex boards 2 of the embodiment occupies more than 80% of the volume of the through hole 201, and the amount of the ink on the surface of the rigid-flex board 2 near the edge of the through hole 201 is also kept large. For convenience of illustration in the drawings, the ink on the surface of the rigid-flex printed circuit board 2 near the edge of the through hole 201 is recorded as hole edge ink 3.
The rigid-flex board 2 in this embodiment has two through hole regions in total. A plurality of through holes 201 are distributed in each through hole area. The jig plate 1 is provided with an exhaust groove 101 corresponding to each through hole region. The shape of the venting grooves 101 and the shape of the through-hole areas corresponding thereto are adapted.
In this embodiment, the thickness of the jig plate 1 is not less than 2mm, and any one of the exhaust grooves 101 of the jig plate 1 is arranged to penetrate through the thickness direction of the jig plate 1. If the thickness value of the jig plate 1 is too low, a better exhaust effect cannot be achieved, and because the exhaust groove 101 with a larger opening area is arranged on the jig plate 1, the jig plate 1 is easily broken in the using process and the cleaning process of the jig plate 1, so that the thickness of the jig plate 1 is set to be more than or equal to 2mm, the better exhaust effect can be ensured, and the jig plate 1 can have a longer service life.
The thickness of the rigid-flex board 2 in this embodiment ranges from T =0.2 to 0.6mm, and the diameter of any one of the through holes 201 ranges from 0.15 to 0.2 mm.
For the sake of clarity of the description of the embodiment, the ink on the surface of the rigid-flex board 2 is referred to as surface ink. When the amount of ink in the through hole 201 is insufficient, the surface ink on the rigid-flex board 2 near the through hole 201 flows into the through hole 201, so that the thickness of the surface ink on the rigid-flex board 2 near the through hole 201 is inconsistent with the thickness of the surface ink on the rigid-flex board 2 far from the through hole 201, and the amount of ink on the entire surface of the rigid-flex board 2 is insufficient.
The method comprises the following steps that a scraper is moved on one surface, back to the rigid-flex board 2, of the screen plate to exhaust gas in any one of the through holes 201 to a preset requirement through the corresponding exhaust groove 101, so that ink on the screen plate flows to the first surface of the rigid-flex board 2 and any one of the through holes 201, the ink accounting for more than 80% of the volume of the through holes 201 is contained in any one of the through holes 201, and the amount of the ink in the through holes 201 can meet requirements. In other words, four or more fifths of the volume of any one of the through holes 201 is filled with ink. Therefore, the ink on the surface of the rigid-flex board 2 does not flow into the through holes 201 in a large amount, so that the ink amount on the surface of the rigid-flex board 2 is prevented from being reduced, and the thickness of the surface ink on the rigid-flex board 2 close to any one through hole 201 is consistent with that of the surface ink on the rigid-flex board 2 far away from any one through hole 201.
The step "make the scraper be in the otter board dorsad the one side of soft or hard combination board 2 is removed, with any one the gas in through-hole 201 is through corresponding rather than the air discharge duct 101 is arranged to predetermineeing the requirement, thereby makes ink on the otter board flow to first face and any one of soft or hard combination board 2 in the through-hole 201, any one ink in the through-hole 201 covers completely the inner wall of through-hole 201, because ink has the consistency, and the ink volume in the through-hole 201 is sufficient, ink can cover the inner wall of through-hole 201 to can avoid through-hole 201 to be welded in follow-up processing procedure and block up. The ink described in this example is solder mask ink.
In the step of pre-baking the ink on the first surface of the rigid-flex board 2 and the ink in any one of the through holes 201 to be in a semi-cured state, gas in the ink on the first surface of the rigid-flex board 2 and in any one of the through holes 201 is discharged, and then the ink is pre-baked. When the ink falls onto the rigid-flexible printed circuit board 2 through the mesh screen holes on the screen plate, the ink can have air to generate bubbles, so after the ink is printed on the first surface of the rigid-flexible printed circuit board 2 and any one of the through holes 201, the rigid-flexible printed circuit board 2 is kept static for 5-10min, the air in the ink is discharged, and then the ink of the rigid-flexible printed circuit board 2 is pre-baked, so that the required appearance can be formed.
The ratio of the opening area of any one through hole 201 to the opening area of the corresponding exhaust groove 101 is 1 (5-100), and the exhaust groove 101 is arranged to have a larger opening area in the present embodiment, so that the through hole 201 can be sufficiently exhausted.
The step of pre-baking the ink on the first surface of the rigid-flexible printed circuit board and the ink in any one of the through holes to be semi-solidified, and then printing the ink on the second surface of the rigid-flexible printed circuit board comprises the following specific steps: the printing ink of the first face of the rigid-flex board 2 and any one after the printing ink in the through hole 201 is dried, the rigid-flex board 2 is arranged on the fixture board 1, so that the second face of the rigid-flex board 2 faces away from the fixture board 1, a screen plate is arranged on the second face of the rigid-flex board 2, a scraper is arranged on the screen plate, the screen plate faces away from the one face of the rigid-flex board 2 and moves, so that the printing ink on the screen plate flows to the second face of the rigid-flex board 2, and then the printing ink on the second face of the rigid-flex board 2 is dried.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (9)
1. A method for improving insufficient ink in holes of a rigid-flexible printed circuit board is characterized by comprising the following steps:
placing a soft-hard combination board on a jig board so that a first surface of the soft-hard combination board faces away from the jig board, wherein the soft-hard combination board is provided with at least one through hole area, any one of the through hole areas is provided with a plurality of through holes, an exhaust groove is arranged on the jig board corresponding to any one of the through hole areas, and the opening area of the exhaust groove is larger than or equal to the area of the through hole area corresponding to the exhaust groove;
after the soft and hard combined plate is placed on the jig plate, arranging a screen plate on the first surface of the soft and hard combined plate;
moving a scraper on one surface of the screen plate, which is opposite to the rigid-flex board, so as to exhaust the gas in any one through hole to a preset requirement through the corresponding exhaust groove, and thus enabling the ink on the screen plate to flow to the first surface of the rigid-flex board and any one through hole;
and pre-baking the ink on the first surface of the rigid-flexible printed circuit board and the ink in any one through hole to be semi-cured, and then printing the ink on the second surface of the rigid-flexible printed circuit board, wherein the first surface and the second surface of the rigid-flexible printed circuit board are arranged oppositely.
2. The method for improving ink shortage in holes of rigid-flexible printed circuit boards according to claim 1, wherein the method only moves a scraper on a side of the screen plate opposite to the rigid-flexible printed circuit board to exhaust the gas in any one of the through holes to a preset requirement through the corresponding exhaust groove.
3. The method for improving ink shortage in holes of rigid-flex boards as claimed in claim 1, wherein the thickness of the jig board is greater than or equal to 2mm, and any one of the air vent grooves is arranged through the thickness direction of the jig board.
4. The method for improving ink shortage in holes of rigid-flexible printed circuit boards according to claim 1, wherein the thickness of the rigid-flexible printed circuit board ranges from T =0.2-0.6mm, and the diameter of the through hole ranges from 0.15-0.2 mm.
5. The method for improving ink shortage in holes of a rigid-flexible printed circuit board according to claim 1, wherein the step "moves a scraper on a side of the screen plate opposite to the rigid-flexible printed circuit board to exhaust the gas in any one of the through holes to a preset requirement through the corresponding exhaust groove, so that the ink on the screen plate flows to the first side of the rigid-flexible printed circuit board and any one of the through holes", and the ink in any one of the through holes occupies more than 80% of the volume of the through hole.
6. The method for improving ink shortage in holes of rigid-flexible printed circuit boards according to claim 1, wherein the step "moves a scraper on a side of the screen plate opposite to the rigid-flexible printed circuit board to exhaust the gas in any one of the through holes to a preset requirement through the corresponding exhaust groove, so that the ink on the screen plate flows to the first side of the rigid-flexible printed circuit board and any one of the through holes", and the ink in any one of the through holes completely covers the inner wall of the through hole.
7. The method for improving ink shortage in holes of a rigid-flex board according to claim 1, wherein the step of pre-baking the ink on the first surface of the rigid-flex board and the ink in any one of the through holes to be semi-cured is to pre-bake the ink after exhausting the gas in the ink.
8. The method for improving ink shortage in holes of rigid-flex printed circuit board according to claim 1, wherein the ratio of the opening area of any one of the through holes to the opening area of the corresponding air vent groove is 1 (5-100).
9. The method for improving ink shortage in holes of the rigid-flexible printed circuit board according to claim 1, wherein the step of pre-baking the ink on the first surface of the rigid-flexible printed circuit board and the ink in any one of the through holes to be semi-cured and then printing the ink on the second surface of the rigid-flexible printed circuit board comprises the following specific steps: after the printing ink on the first surface of the rigid-flex board and the printing ink in any one of the through holes are pre-baked to be semi-cured, the rigid-flex board is placed on the tool board, so that the second surface of the rigid-flex board faces away from the tool board, a screen plate is arranged on the second surface of the rigid-flex board, and a scraper is moved on the surface, facing away from the rigid-flex board, of the screen plate, so that the printing ink on the screen plate flows to the second surface of the rigid-flex board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110432140.6A CN113260166A (en) | 2021-04-21 | 2021-04-21 | Method for improving insufficient ink in holes of rigid-flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110432140.6A CN113260166A (en) | 2021-04-21 | 2021-04-21 | Method for improving insufficient ink in holes of rigid-flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113260166A true CN113260166A (en) | 2021-08-13 |
Family
ID=77221153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110432140.6A Pending CN113260166A (en) | 2021-04-21 | 2021-04-21 | Method for improving insufficient ink in holes of rigid-flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113260166A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939088A (en) * | 2021-09-30 | 2022-01-14 | 福莱盈电子股份有限公司 | Method for improving burr of back knife face of soft and hard combined plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
| CN104507273A (en) * | 2014-12-18 | 2015-04-08 | 深圳市五株科技股份有限公司 | PCB (printed circuit board) stepped hole plugging process and jig |
| CN104540331A (en) * | 2014-12-31 | 2015-04-22 | 广州兴森快捷电路科技有限公司 | Printed circuit board solder mask manufacturing method |
| CN208971864U (en) * | 2018-08-24 | 2019-06-11 | 厦门市铂联科技股份有限公司 | A kind of frock clamp for silk-screen consent |
-
2021
- 2021-04-21 CN CN202110432140.6A patent/CN113260166A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
| CN104507273A (en) * | 2014-12-18 | 2015-04-08 | 深圳市五株科技股份有限公司 | PCB (printed circuit board) stepped hole plugging process and jig |
| CN104540331A (en) * | 2014-12-31 | 2015-04-22 | 广州兴森快捷电路科技有限公司 | Printed circuit board solder mask manufacturing method |
| CN208971864U (en) * | 2018-08-24 | 2019-06-11 | 厦门市铂联科技股份有限公司 | A kind of frock clamp for silk-screen consent |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939088A (en) * | 2021-09-30 | 2022-01-14 | 福莱盈电子股份有限公司 | Method for improving burr of back knife face of soft and hard combined plate |
| CN113939088B (en) * | 2021-09-30 | 2023-01-03 | 福莱盈电子股份有限公司 | Method for improving burr of back knife face of soft and hard combined plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113260166A (en) | Method for improving insufficient ink in holes of rigid-flexible printed circuit board | |
| JP2002094204A (en) | High-frequency module and its manufacturing method | |
| CN110113877B (en) | Method for manufacturing metal-based circuit board by laser cutting method | |
| CN112954902B (en) | Circuit board copper paste hole plugging method | |
| CN110708873A (en) | Manufacturing method for realizing positioning of embedded copper block | |
| CN112739015A (en) | Manufacturing method of circuit board resistance welding half plug hole | |
| US5090120A (en) | Process for forming solder lands in a printed wiring board manufacturing method | |
| CN215096296U (en) | FPC tin cream printing device | |
| CN112911835B (en) | Production method of multilayer mixed-pressing stepped back-pressing metal-based high-frequency circuit board | |
| TW201906515A (en) | Fabrication method of circuit board | |
| CN211267300U (en) | Steel mesh and welded structure | |
| CN113141716B (en) | Manufacturing method of circuit board half plug hole | |
| CN108347822B (en) | Circuit board, terminal equipment and manufacturing method of circuit board | |
| JP2806394B2 (en) | Via formation method | |
| JPH0529752A (en) | Manufacture of printed wiring board | |
| CN111901973B (en) | Method for effectively avoiding tin leakage of through hole and PCB | |
| CN219780475U (en) | PCB structure | |
| CN218103666U (en) | Miniature through-hole processingequipment of circuit board | |
| CN215420883U (en) | Circuit board, multilayer mainboard structure and terminal | |
| JPH1130851A (en) | Film for photomask as well as photomask and its production | |
| CN108337814A (en) | The production method and wiring board of wiring board | |
| JPH09277690A (en) | Printing plate, manufacture of printing plate, and manufacture of printed wiring board employing the same | |
| CN208509397U (en) | A kind of thick copper circuit board with welding resistance light photosensitive-ink | |
| CN117641724A (en) | Bonding pad structure, steel mesh and printed circuit board | |
| KR20110004030A (en) | Multiple squeegee device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |