CN113235093A - Brightening powder for galvanizing and zinc alloy and aluminum alloy and preparation method thereof - Google Patents
Brightening powder for galvanizing and zinc alloy and aluminum alloy and preparation method thereof Download PDFInfo
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- CN113235093A CN113235093A CN202110549542.4A CN202110549542A CN113235093A CN 113235093 A CN113235093 A CN 113235093A CN 202110549542 A CN202110549542 A CN 202110549542A CN 113235093 A CN113235093 A CN 113235093A
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- acid
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- microetching
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- 229910001297 Zn alloy Inorganic materials 0.000 title claims abstract description 31
- 239000000843 powder Substances 0.000 title claims abstract description 25
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 24
- 238000005246 galvanizing Methods 0.000 title claims abstract description 16
- 238000005282 brightening Methods 0.000 title abstract description 13
- 238000002360 preparation method Methods 0.000 title abstract description 8
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 24
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims abstract description 24
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims abstract description 18
- -1 hydrogen ions Chemical class 0.000 claims abstract description 14
- 239000004317 sodium nitrate Substances 0.000 claims abstract description 12
- 235000010344 sodium nitrate Nutrition 0.000 claims abstract description 12
- 150000007524 organic acids Chemical class 0.000 claims abstract description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011701 zinc Substances 0.000 claims abstract description 10
- 239000011775 sodium fluoride Substances 0.000 claims abstract description 9
- 235000013024 sodium fluoride Nutrition 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims abstract description 6
- 235000002639 sodium chloride Nutrition 0.000 claims description 14
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims description 9
- 235000015165 citric acid Nutrition 0.000 claims description 7
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 claims description 6
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 claims description 6
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 235000006408 oxalic acid Nutrition 0.000 claims description 4
- 238000005303 weighing Methods 0.000 claims description 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- 235000011054 acetic acid Nutrition 0.000 claims description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- 239000001630 malic acid Substances 0.000 claims description 3
- 235000011090 malic acid Nutrition 0.000 claims description 3
- 239000001103 potassium chloride Substances 0.000 claims description 3
- 235000011164 potassium chloride Nutrition 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 37
- 239000002253 acid Substances 0.000 abstract description 17
- 239000007788 liquid Substances 0.000 abstract description 17
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- 239000003814 drug Substances 0.000 abstract description 9
- 229910052725 zinc Inorganic materials 0.000 abstract description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 abstract description 7
- 229910017604 nitric acid Inorganic materials 0.000 abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 238000007598 dipping method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 150000003839 salts Chemical class 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 239000006172 buffering agent Substances 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000003112 inhibitor Substances 0.000 abstract description 3
- 231100000252 nontoxic Toxicity 0.000 abstract description 3
- 230000003000 nontoxic effect Effects 0.000 abstract description 3
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 239000000872 buffer Substances 0.000 abstract description 2
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 2
- 239000001257 hydrogen Substances 0.000 abstract description 2
- 230000000087 stabilizing effect Effects 0.000 abstract description 2
- 238000005530 etching Methods 0.000 description 11
- 238000001878 scanning electron micrograph Methods 0.000 description 5
- 239000012224 working solution Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/02—Light metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention relates to the field of metal surface treatment processes, in particular to bright dipping powder for galvanizing and zinc alloy and aluminum alloy and a preparation method thereof. Bright dipping powder for galvanizing and zinc alloy and aluminum alloy and a preparation method thereof; the formula of the brightening agent is powder, and no liquid acid is used, so that the brightening agent does not have the problems of high corrosivity and fuming. Replacing nitric acid with a dry acid salt, wherein the dry acid salt is composed of sodium nitrate, sodium fluoride, sulfamic acid and citric acid; the organic acid provides hydrogen ions, reduces the acidity in the liquid medicine to meet the requirement of light emission, and other substances are buffer substances, so that the liquid medicine has the function of stabilizing the liquid medicine and reduces the microetching difference of high and low current regions. The buffering agent exists in the formula, so that the thickness difference of the microetching light on zinc and zinc alloy on the workpiece and the thickness difference of aluminum and aluminum alloy can be reduced, the surface of the workpiece is smoother and finer, the treatment capacity of acid exhaust can be reduced, and the corrosion inhibitor is more nontoxic and harmless compared with liquid acid in the production process.
Description
Technical Field
The invention relates to the field of metal surface treatment processes, in particular to bright dipping powder for galvanizing and zinc alloy and aluminum alloy and a preparation method thereof.
Background
At present, nitric acid is used for surface treatment of zinc and zinc alloy, nitric acid with different concentrations is used according to various requirements, consumption is high, concentrated acid-removing liquid and vapor have high corrosivity, and the problem of fuming also causes harm to the environment and health inspection.
The nitric acid has strong corrosivity to zinc and zinc alloy, the micro-etching rate of the zinc and the zinc alloy is not easy to control, and particularly, a workpiece in an electroplating process has a high-low current region, so that the stability of the process is low, and the workpiece is easy to generate poor quality due to excessive micro-etching at a thin part.
Disclosure of Invention
In order to solve the problems, the invention provides the glazing powder for the zinc plating, the zinc alloy, the aluminum plating and the aluminum alloy and the preparation method thereof, which have no high corrosivity and fuming problems, ensure that the surface of a workpiece is smoother, meticulous and can reduce the treatment amount of acid exhaust, and have no toxicity and harm compared with liquid acid in the production process. Under the same frequency of use, can reduce the change frequency of changing liquid medicine, increase life.
In order to achieve the purpose, the invention adopts the technical scheme that: the brightening powder for galvanizing and zinc alloy and aluminum alloy comprises the following components in percentage by weight: 50-80% of sodium nitrate, 1-10% of halogen salt, 10-20% of organic acid and 10-20% of sulfonic acid.
Further, the halogen salt comprises one or more of sodium fluoride, sodium chloride, potassium chloride, sodium bromide, potassium bromide and potassium iodide.
Further, the organic acid comprises one or more of citric acid, oxalic acid, formic acid, acetic acid and malic acid.
Further, the sulfonic acid comprises one or more of sulfamic acid, methanesulfonic acid and alkylsulfonic acid.
The application also provides a preparation method of the bright dipping powder for the zinc and zinc alloy plating and the aluminum and aluminum alloy plating, which comprises the following steps:
step 1: weighing sodium nitrate, halogen salt, organic acid and sulfonic acid according to the proportion;
step 2: and (3) uniformly mixing the raw materials weighed in the step (1), wherein the mixing time is 1-5 minutes.
Further, the raw materials weighed in the step 2 were uniformly mixed at 25 ℃. .
The invention has the beneficial effects that: the formula of the brightening agent is powder, and no liquid acid is used, so that the brightening agent does not have the problems of high corrosivity and fuming. Replacing nitric acid with a dry acid salt, wherein the dry acid salt is composed of sodium nitrate, sodium fluoride, sulfamic acid and citric acid; the organic acid provides hydrogen ions, reduces the acidity in the liquid medicine to meet the requirement of light emission, and other substances are buffer substances, so that the liquid medicine has the function of stabilizing the liquid medicine and reduces the microetching difference of high and low current regions. The buffering agent exists in the formula, so that the thickness difference of the microetching light on zinc and zinc alloy on the workpiece and the thickness difference of aluminum and aluminum alloy can be reduced, the surface of the workpiece is smoother and finer, the treatment capacity of acid exhaust can be reduced, and the corrosion inhibitor is more nontoxic and harmless compared with liquid acid in the production process. Under the same frequency of use, can reduce the change frequency of changing liquid medicine, increase life.
Drawings
FIG. 1 is an SEM image of a metal surface after a conventional micro-etching agent treatment.
FIG. 2 is an SEM image of the metal surface after the new micro-etching agent treatment.
Fig. 3 is a comparison of the arithmetic mean deviation Ra of the profile after the new microetching and the conventional microetching treatment.
Fig. 4 is a comparison of the microscopic unevenness ten-point height Rz after the new microetching treatment and the conventional microetching treatment.
Fig. 5 is a graph showing the relationship between the activity of the novel microetching agent and the standing time.
Detailed Description
Referring to fig. 1-5, the present invention relates to a bright dipping powder for zinc and zinc alloy and aluminum alloy, which comprises the following components by weight: 50-80% of sodium nitrate, 1-10% of halogen salt, 10-20% of organic acid and 10-20% of sulfonic acid.
Further, the halogen salt comprises one or more of sodium fluoride, sodium chloride, potassium chloride, sodium bromide, potassium bromide and potassium iodide.
Further, the organic acid comprises one or more of citric acid, oxalic acid, formic acid, acetic acid and malic acid.
Further, the sulfonic acid comprises one or more of sulfamic acid, methanesulfonic acid and alkylsulfonic acid.
Specific example 1: the brightening powder for galvanizing and zinc alloy and aluminum alloy comprises the following components in percentage by weight: 50% of sodium nitrate, 10% of sodium fluoride, 20% of citric acid and 20% of methanesulfonic acid.
Specific example 2: the brightening powder for galvanizing and zinc alloy and aluminum alloy comprises the following components in percentage by weight: 60% of sodium nitrate, 8% of sodium fluoride, 12% of citric acid and 20% of sulfamic acid.
Specific example 3: the brightening powder for galvanizing and zinc alloy and aluminum alloy comprises the following components in percentage by weight: 70% of sodium nitrate, 5% of sodium fluoride, 10% of oxalic acid and 15% of methanesulfonic acid.
Specific example 4: the brightening powder for galvanizing and zinc alloy and aluminum alloy comprises the following components in percentage by weight: 75% of sodium nitrate, 5% of sodium fluoride, 10% of citric acid and 10% of alkyl sulfonic acid.
The following preparation method of the bright dipping powder for galvanizing and zinc alloy and aluminum alloy comprises the following steps:
step 1: weighing sodium nitrate, halogen salt, organic acid and sulfonic acid according to the proportion;
step 2: the raw materials weighed in the step 1 are uniformly mixed at 25 ℃, and the mixing time is not more than 5 minutes.
In order to verify the reliability of microetching treatment using the gloss powder of the present application, a verification test was performed using the mixed powder prepared in specific example 1; meanwhile, in order to test the accuracy, nitric acid of the traditional technology is selected for microetching treatment for comparison;
1. experimental process
In this embodiment, a comparative experiment was performed on the surface of the same material (zinc alloy in this embodiment) by using the microetching agent of the present application and a conventional microetching agent (nitric acid), and the process flow was as follows: washing- > micro-etching treatment (30S treatment at 25 ℃, micro-etching rate: 0.90 +/-0.05 um/min) - > washing- > passivation- > washing- > sealing- > drying.
Wherein 1 to 5g/L of microetching agent for microetching treatment of the present application is prepared by weighing the present invention in the form of a fine powder and completely dissolving detachable water;
2. laboratory apparatus
Scanning Electron Microscope (SEM) (Hitachi S-3000N)
Optical microscope a (0lympus BX51M)
Roughness measuring instrument (DEKTAK 8Advanced Development Profile from Vecco)
3. Microetching treated surface topography
FIG. 1 is an SEM image of a metal surface treated by a conventional microetching agent, and FIG. 2 is an SEM image of a metal surface treated by a new microetching agent; comparing SEM images of the metal surface treated by the new micro-etching agent and the metal surface treated by the traditional micro-etching agent, it can be seen from the eyes of FIGS. 1-2 that the copper surface treated by the new micro-etching agent is smoother and smoother than that treated by the traditional micro-etching agent.
4. Surface roughness of microetching treatment
FIG. 3 is a comparison of the arithmetic mean deviation Ra of the profile after the new microetching agent and the conventional microetching treatment;
FIG. 4 is a comparison of the microscopic unevenness ten-point height Rz after the new microetching treatment and the conventional microetching treatment;
as can be seen from comparison of the surface phase roughness (ra.rz) in fig. 3 to 4, the surface roughness of the zinc alloy treated with the new microetching agent is smaller than that of the zinc alloy treated with the conventional microetching agent.
By comparing and analyzing the results of FIGS. 1-4, the new microetching agent treatment provides significant polishing and leveling of the surface of the zinc alloy.
5 stability of microetching agent
The conventional microetching agents, particularly peroxide microetching agents, are easily decomposed and unstable in working solution, so that it is inconvenient in actual operation to continuously supplement or strictly control the operating conditions to maintain the activity. FIG. 5 shows the relationship between the activity of the novel microetching agent and the standing time, and the stability of the novel microetching agent can be seen from FIG. 3. The new microetching agent is stable, and the activity of the working solution is kept unchanged after the working solution is placed for several months.
In conclusion, the formula of the brightening agent is powder, and no liquid acid is used, so that the brightening agent does not have the problems of high corrosivity and fuming. The buffering agent exists in the formula, so that the thickness difference of the microetching light on zinc and zinc alloy on the workpiece and the thickness difference of aluminum and aluminum alloy can be reduced, the surface of the workpiece is smoother and finer, the treatment capacity of acid exhaust can be reduced, and the corrosion inhibitor is more nontoxic and harmless compared with liquid acid in the production process. Under the same frequency of use, can reduce the change frequency of changing liquid medicine, increase life.
Microetching agents are widely used in the treatment of metal surfaces in microelectronic products and components. The microetching agent is a new technology for microetching copper surface, and not only has the advantages of traditional microetching agent, but also overcomes the disadvantages of traditional microetching agent. The surface of the new micro-etching agent pair material is subjected to the production of obvious polishing and leveling; the surface of the micro-etched aluminum and aluminum alloy or zinc alloy is protected; meanwhile, the novel microetching agent is stable, the microetching rate can be controlled easily, and the microetching rate of the working solution can be controlled to be 2-5000 nm/min, wherein the mass concentration, the total mass concentration, the concentration of accumulated aluminum ions or zinc ions and the temperature of the microetching agent have different influences on the microetching rate, so that the formula or the operating conditions of the microetching agent can be changed according to different requirements, the working solution with different microetching rates can be obtained, and the microetching agent can be used for microetching metal without influencing the size of the metal.
The above embodiments are merely illustrative of the preferred embodiments of the present invention, and not restrictive, and various changes and modifications to the technical solutions of the present invention may be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are intended to fall within the scope of the present invention defined by the appended claims.
Claims (6)
1. The light emitting powder for galvanizing and zinc alloy and aluminum alloy is characterized in that: comprises the following components in percentage by weight: 50-80% of sodium nitrate, 1-10% of halogen salt, 10-20% of organic acid and 10-20% of sulfonic acid.
2. A glazing powder for galvanising and zinc alloys and aluminium alloys according to claim 1, characterised in that: the halogen salt comprises one or more of sodium fluoride, sodium chloride, potassium chloride, sodium bromide, potassium bromide and potassium iodide.
3. A glazing powder for galvanising and zinc alloys and aluminium alloys according to claim 1, characterised in that: the organic acid comprises one or more of citric acid, oxalic acid, formic acid, acetic acid, and malic acid.
4. A glazing powder for galvanising and zinc alloys and aluminium alloys according to claim 1, characterised in that: the sulfonic acid comprises one or more of sulfamic acid, methanesulfonic acid and alkyl sulfonic acid.
5. A method for preparing glazing powder for galvanizing and zinc alloy and aluminum alloy according to any one of claims 1 to 4, characterized in that: the method comprises the following steps:
step 1: weighing sodium nitrate, halogen salt, organic acid and sulfonic acid according to the proportion;
step 2: and (3) uniformly mixing the raw materials weighed in the step (1), wherein the mixing time is 1-5 minutes.
6. A glazing powder for galvanization and zinc and aluminum alloys according to claim 5, characterized in that: the raw materials weighed in step 2 were mixed uniformly at 25 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110549542.4A CN113235093A (en) | 2021-05-20 | 2021-05-20 | Brightening powder for galvanizing and zinc alloy and aluminum alloy and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110549542.4A CN113235093A (en) | 2021-05-20 | 2021-05-20 | Brightening powder for galvanizing and zinc alloy and aluminum alloy and preparation method thereof |
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|---|---|
| CN113235093A true CN113235093A (en) | 2021-08-10 |
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| CN202110549542.4A Pending CN113235093A (en) | 2021-05-20 | 2021-05-20 | Brightening powder for galvanizing and zinc alloy and aluminum alloy and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2739129A (en) * | 1948-10-02 | 1956-03-20 | Henkel & Cie Gmbh | Cleaning composition |
| US3171765A (en) * | 1962-10-04 | 1965-03-02 | Conversion Chem Corp | Powder composition for bright dipping zinc and cadmium |
| CN101144164A (en) * | 2006-09-12 | 2008-03-19 | 长葛市天润有色金属研究所 | Method for preparing copper product polishing agent |
| CN108642496A (en) * | 2018-04-20 | 2018-10-12 | 吴伟华 | A kind of preparation method of stainless steel products special solid polishing agent |
-
2021
- 2021-05-20 CN CN202110549542.4A patent/CN113235093A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2739129A (en) * | 1948-10-02 | 1956-03-20 | Henkel & Cie Gmbh | Cleaning composition |
| US3171765A (en) * | 1962-10-04 | 1965-03-02 | Conversion Chem Corp | Powder composition for bright dipping zinc and cadmium |
| CN101144164A (en) * | 2006-09-12 | 2008-03-19 | 长葛市天润有色金属研究所 | Method for preparing copper product polishing agent |
| CN108642496A (en) * | 2018-04-20 | 2018-10-12 | 吴伟华 | A kind of preparation method of stainless steel products special solid polishing agent |
Non-Patent Citations (1)
| Title |
|---|
| 张宏祥，王为编著: "《电镀工艺学》", 30 June 2002 * |
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