CN113232393A - Electronic grade polycrystalline silicon packaging bag and production method thereof - Google Patents

Electronic grade polycrystalline silicon packaging bag and production method thereof Download PDF

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Publication number
CN113232393A
CN113232393A CN202110450916.7A CN202110450916A CN113232393A CN 113232393 A CN113232393 A CN 113232393A CN 202110450916 A CN202110450916 A CN 202110450916A CN 113232393 A CN113232393 A CN 113232393A
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CN
China
Prior art keywords
temperature
electronic grade
weight percentage
packaging bag
polycrystalline silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110450916.7A
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Chinese (zh)
Inventor
彭震
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Simai New Material Technology Co ltd
Original Assignee
Suzhou Simai New Material Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Simai New Material Technology Co ltd filed Critical Suzhou Simai New Material Technology Co ltd
Priority to CN202110450916.7A priority Critical patent/CN113232393A/en
Publication of CN113232393A publication Critical patent/CN113232393A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B70/00—Making flexible containers, e.g. envelopes or bags
    • B31B70/14—Cutting, e.g. perforating, punching, slitting or trimming
    • B31B70/20—Cutting sheets or blanks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B70/00—Making flexible containers, e.g. envelopes or bags
    • B31B70/60—Uniting opposed surfaces or edges; Taping
    • B31B70/64—Uniting opposed surfaces or edges; Taping by applying heat or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/327—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polyolefins obtained by a metallocene or single-site catalyst
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D31/00—Bags or like containers made of paper and having structural provision for thickness of contents
    • B65D31/04—Bags or like containers made of paper and having structural provision for thickness of contents with multiple walls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/242—All polymers belonging to those covered by group B32B27/32
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/582—Tearability
    • B32B2307/5825—Tear resistant

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses an electronic-grade polycrystalline silicon packaging bag and a production method thereof, wherein the electronic-grade polycrystalline silicon packaging bag comprises an inner layer, a middle layer and an outer layer, the inner layer comprises LLDPE (linear low-density polyethylene) with the weight percentage of 100%, the middle layer comprises metallocene PE with the weight percentage of 68-72% and LLDPE with the weight percentage of 32-28%, and the outer layer comprises LLDPE with the weight percentage of 85% and auxiliary materials with the weight percentage of 15%. The invention has the beneficial effects that: the electronic grade polysilicon packaging bag has the advantages of high tensile strength, good puncture resistance, high surface flatness and less surface metal separation, meets the design requirements of polysilicon packaging, and is suitable for wide application.

Description

Electronic grade polycrystalline silicon packaging bag and production method thereof
Technical Field
The invention belongs to the field of packaging, and particularly relates to an electronic grade polycrystalline silicon packaging bag and a production method thereof.
Background
The localization of the product not only includes manufacturing equipment, but also includes various raw materials and auxiliary materials. Packaging bags and protective films currently used for electronic grade polycrystalline silicon are provided by eastern and company of japan. An electronic grade polysilicon packaging bag mainly solves the problem of metal pollution of semiconductor raw materials in the transportation process, and mainly comprises surface metal and bulk metal. The technical difficulty of the product lies in the control of the physical properties of the body metal, mainly the puncture resistance and the flatness of the bag.
Disclosure of Invention
The invention aims to provide an electronic grade polysilicon packaging bag capable of meeting performance requirements and a production method thereof.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides an electronic grade polycrystalline silicon wrapping bag, electronic grade polycrystalline silicon wrapping bag comprises the packaging film that the gross thickness is 280 ~ 320 mu m, the packaging film includes inlayer, intermediate level and skin, its characterized in that: the inner layer comprises LLDPE with the weight percentage of 100%, the middle layer comprises metallocene PE with the weight percentage of 68-72% and LLDPE with the weight percentage of 32-28%, the outer layer comprises LLDPE with the weight percentage of 85% and an auxiliary material with the weight percentage of 15%, and the auxiliary material contains a conductive material.
Preferably, the thickness ratio among the inner layer, the intermediate layer and the outer layer is 2:4: 4.
Preferably, the auxiliary materials are multi-carbon copolymerized polyethylene and polyaniline, wherein the weight percentage of the multi-carbon copolymerized polyethylene to the polyaniline is 50:50, and the polyaniline is arranged on the outer side of the multi-carbon copolymerized polyethylene in a grid shape through printing.
The invention also provides a production method of the electronic grade polycrystalline silicon packaging bag, which comprises the electronic grade polycrystalline silicon packaging bag and comprises the following steps:
1) batching, namely fully mixing the raw materials according to the raw material ratio of the inner layer, the middle layer and the outer layer, and then putting the fully mixed raw materials into three hoppers of a film blowing machine;
2) heating and stirring, and heating the raw materials to be liquid;
3) drawing, extruding and cooling by a film blowing machine to form a film comprising an inner layer, a middle layer and an outer layer;
4) and (4) making a bag, namely die-cutting and hot-pressing the film to obtain the electronic grade polycrystalline silicon packaging bag.
Preferably, in the step 2), the temperatures for heating the hoppers in which the raw materials of the inner layer, the middle layer and the outer layer are placed are respectively a first temperature, a second temperature and a third temperature, wherein the second temperature is 8-12 ℃ higher than the first temperature and the third temperature.
Preferably, the first temperature and the third temperature are the same, and the second temperature is 10 ℃ higher than the first temperature and the third temperature.
The invention has the beneficial effects that: the electronic grade polysilicon packaging bag has the advantages of high tensile strength, good puncture resistance, high surface flatness and less surface metal separation, meets the design requirements of polysilicon packaging, and is suitable for wide application.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
The invention relates to an electronic grade polycrystalline silicon packaging bag which comprises an inner layer, a middle layer and an outer layer. The inner layer comprises LLDPE (linear low density polyethylene) with the weight percentage of 100%, the middle layer comprises metallocene PE with the weight percentage of 68-72% and LLDPE with the weight percentage of 32-28%, the outer layer comprises LLDPE with the weight percentage of 85% and an auxiliary material with the weight percentage of 15%, and the auxiliary material is multi-carbon copolymerized polyethylene. The total thickness of the electronic grade polycrystalline silicon packaging bag is 280-320 mu m, and the thickness ratio of the inner layer, the middle layer and the outer layer is 2:4: 4. The electronic grade polysilicon packaging bag with the structure fully utilizes the stretch-resistant, penetration-resistant, impact-resistant and tear-resistant performances of LLDPE and the penetration-resistant performance of metallocene PE, adopts the structure of pure LLDPE as the inner layer, can effectively reduce the precipitation rate of surface metal, and is very suitable for packaging polysilicon.
The invention also provides a production method of the electronic grade polycrystalline silicon packaging bag, which comprises the electronic grade polycrystalline silicon packaging bag and comprises the following steps:
1) batching, namely fully mixing the raw materials according to the raw material ratio of the inner layer, the middle layer and the outer layer, and then putting the fully mixed raw materials into three hoppers of a film blowing machine;
2) heating and stirring, and heating the raw materials to be liquid;
3) drawing, extruding and cooling by a film blowing machine to form a film comprising an inner layer, a middle layer and an outer layer;
4) and (4) making a bag, namely die-cutting the film, and performing hot pressing to obtain the electronic grade polycrystalline silicon packaging bag.
In the step 2), the temperature for heating the hoppers in which the raw materials of the inner layer, the middle layer and the outer layer are put is respectively a first temperature, a second temperature and a third temperature, wherein the first temperature and the third temperature are the same, and the second temperature is 10 ℃ higher than the first temperature and the third temperature. By adopting the mode, after extrusion and in the cooling process, the inner layer and the outer layer begin to be cooled, the middle layer still has higher temperature, when the middle layer begins to be cooled, the inner layer and the outer layer are solidified and formed, and the middle layer generates certain tensile stress on the inner layer and the outer layer due to thermal expansion and cold contraction.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (6)

1. The utility model provides an electronic grade polycrystalline silicon wrapping bag, electronic grade polycrystalline silicon wrapping bag comprises the packaging film that the gross thickness is 280 ~ 320 mu m, the packaging film includes inlayer, intermediate level and skin, its characterized in that: the inner layer comprises LLDPE with the weight percentage of 100%, the middle layer comprises metallocene PE with the weight percentage of 68-72% and LLDPE with the weight percentage of 32-28%, the outer layer comprises LLDPE with the weight percentage of 85% and an auxiliary material with the weight percentage of 15%, and the auxiliary material contains a conductive material.
2. The electronic grade polysilicon packaging bag of claim 1, wherein: the thickness ratio among the inner layer, the middle layer and the outer layer is 2:4: 4.
3. The electronic grade polysilicon packaging bag of claim 1, wherein: the auxiliary materials are multi-carbon copolymerized polyethylene and polyaniline, wherein the weight percentage of the multi-carbon copolymerized polyethylene to the polyaniline is 50:50, and the polyaniline is arranged on the outer side of the multi-carbon copolymerized polyethylene in a grid shape through printing.
4. A method for producing an electronic grade polysilicon packaging bag, comprising the electronic grade polysilicon packaging bag according to any one of claims 1 to 3, characterized by comprising the steps of:
1) batching, namely fully mixing the raw materials according to the raw material ratio of the inner layer, the middle layer and the outer layer, and then putting the fully mixed raw materials into three hoppers of a film blowing machine;
2) heating and stirring, and heating the raw materials to be liquid;
3) drawing, extruding and cooling by a film blowing machine to form a film comprising an inner layer, a middle layer and an outer layer;
4) and (4) making a bag, namely die-cutting and hot-pressing the film to obtain the electronic grade polycrystalline silicon packaging bag.
5. The method for producing electronic grade polysilicon packaging bags according to claim 4, wherein the method comprises the following steps: in the step 2), the temperature for heating the hoppers in which the raw materials of the inner layer, the middle layer and the outer layer are put is respectively a first temperature, a second temperature and a third temperature, wherein the second temperature is 8-12 ℃ higher than the first temperature and the third temperature.
6. The method for producing an electronic grade polysilicon packaging bag according to claim 5, wherein the method comprises the following steps: the first temperature and the third temperature are the same, and the second temperature is 10 ℃ higher than the first temperature and the third temperature.
CN202110450916.7A 2021-04-26 2021-04-26 Electronic grade polycrystalline silicon packaging bag and production method thereof Pending CN113232393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110450916.7A CN113232393A (en) 2021-04-26 2021-04-26 Electronic grade polycrystalline silicon packaging bag and production method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110450916.7A CN113232393A (en) 2021-04-26 2021-04-26 Electronic grade polycrystalline silicon packaging bag and production method thereof

Publications (1)

Publication Number Publication Date
CN113232393A true CN113232393A (en) 2021-08-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110450916.7A Pending CN113232393A (en) 2021-04-26 2021-04-26 Electronic grade polycrystalline silicon packaging bag and production method thereof

Country Status (1)

Country Link
CN (1) CN113232393A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112172290A (en) * 2019-07-02 2021-01-05 新特能源股份有限公司 Film, production method thereof, packaging bag containing film and application of packaging bag

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112172290A (en) * 2019-07-02 2021-01-05 新特能源股份有限公司 Film, production method thereof, packaging bag containing film and application of packaging bag

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
岳德茂: "《印刷科技实用手册 第3分册 印刷器材篇》", 30 April 2010, 印刷工业出版社 *

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Application publication date: 20210810

RJ01 Rejection of invention patent application after publication