CN113220158A - Touch panel preparation method, touch panel and display device - Google Patents
Touch panel preparation method, touch panel and display device Download PDFInfo
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- CN113220158A CN113220158A CN202110484083.6A CN202110484083A CN113220158A CN 113220158 A CN113220158 A CN 113220158A CN 202110484083 A CN202110484083 A CN 202110484083A CN 113220158 A CN113220158 A CN 113220158A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a touch panel preparation method, a touch panel and a display device, wherein the touch panel preparation method comprises the following steps: providing a substrate having a plurality of support tables: forming an insulating material layer including a plurality of insulating blocks covering the supporting stages; removing the supporting tables, and forming openings between the insulating blocks and the substrate; depositing and forming a conductive layer on the substrate and the insulating material layer, wherein the conductive layer penetrates into the opening; and patterning the conductive layer to form a first electrode and a second electrode which are insulated from each other, wherein the conductive layer positioned on one side of the insulating block, which is far away from the substrate, is formed into a first connecting part, adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conductive layer in the opening. The method effectively simplifies the process flow, reduces the times of deposition molding and patterning of the required conductive layer, improves the production efficiency and saves the manufacturing procedure and consumables.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a touch panel preparation method, a touch panel and a display device.
Background
In recent years, touch technology is more and more widely applied to display devices of various sizes, and as a display panel of a novel human-computer interaction input mode, a touch screen is simpler, more direct and more convenient to input compared with the traditional modes of a display, a keyboard and a mouse.
In order to realize the touch function of the display device, touch electrodes are usually required to be introduced into the display device, different touch electrodes are insulated from each other, and adjacent touch electrodes need to be connected by a bridge, so that the touch function is limited by the process.
Therefore, a new method for manufacturing a touch panel, a touch panel and a display device are needed.
Disclosure of Invention
The embodiment of the invention provides a touch panel preparation method, a touch panel and a display device, which effectively simplify the process flow, reduce the required times of deposition forming and patterning of a conductive layer, improve the production efficiency and save the manufacturing process and consumables.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a touch panel, including: providing a substrate having a plurality of support tables: forming an insulating material layer including a plurality of insulating blocks covering the respective supporting stages; removing the supporting platforms, and forming an opening between the insulating block and the substrate; depositing and forming a conductive layer on the substrate and the insulating material layer, wherein the conductive layer penetrates into the opening; and patterning the conducting layer to form a first electrode and a second electrode which are insulated from each other, wherein a first connecting part is formed on the conducting layer on one side of the insulating block, which is far away from the substrate, adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conducting layer in the opening.
In a second aspect, an embodiment of the present invention provides a touch panel, where the touch panel is prepared by using the touch panel preparation method in any of the above embodiments.
In a third aspect, an embodiment of the present invention provides a display device, including: a touch panel, which is the touch panel in the above embodiments.
Compared with the related art, the touch panel manufacturing method provided by the embodiment of the invention firstly provides the substrate with a plurality of support platforms, and the support tables are covered with the insulating blocks, and then the support tables are removed to form openings between the insulating blocks and the substrate, i.e. the shape and size of the opening is the shape and size of the removed support table, after which the conductive layer is patterned by deposition on the substrate, the layer of insulating material, and the conductive layer can penetrate into the opening under the rebound action of the collision between atoms or the collision between the atoms of the conductive layer and the substrate, so that the conductive layer can be formed in the opening, and finally, the conductive layer is patterned to form a first electrode, a second electrode and a first connecting part for connecting the adjacent first electrodes, wherein the first electrode and the second electrode are insulated from each other, and adjacent second electrodes are electrically connected by a second connection portion formed by the conductive layer in the opening. The touch panel preparation method provided by the embodiment of the invention can form the first electrode, the second electrode, the first connecting part and the second connecting part only by carrying out conductive layer deposition molding and patterning once, namely, the touch panel adopting the mutual capacitance touch electrode.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a touch panel according to an embodiment of the invention;
fig. 2 is a schematic diagram of step S110 in the touch panel manufacturing method according to the embodiment of the invention;
fig. 3 is a schematic diagram of step S120 in the touch panel manufacturing method according to the embodiment of the invention;
fig. 4 is a schematic diagram of step S130 in the method for manufacturing a touch panel according to the embodiment of the invention;
fig. 5 is a schematic diagram of step S140 in the touch panel manufacturing method according to the embodiment of the invention;
fig. 6 is a schematic view illustrating an optical adhesive being coated in a method for manufacturing a touch panel according to an embodiment of the present invention;
fig. 7 is a schematic view of step S150 in the method for manufacturing a touch panel according to the embodiment of the invention;
fig. 8 is a schematic diagram illustrating a conductive layer sputtered in an opening in a touch panel manufacturing method according to an embodiment of the invention.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
For better understanding of the present invention, a method for manufacturing a touch panel, a touch panel and a display device according to embodiments of the present invention are described in detail below with reference to fig. 1 to 8.
Referring to fig. 1, fig. 1 is a method for manufacturing a touch panel, including:
s110: providing a substrate having a plurality of support tables:
s120: forming an insulating material layer including a plurality of insulating blocks covering the supporting stages;
s130: removing the supporting tables, and forming openings between the insulating blocks and the substrate;
s140: depositing and forming a conductive layer on the substrate and the insulating material layer, wherein the conductive layer penetrates into the opening;
s150: and patterning the conductive layer to form a first electrode and a second electrode which are insulated from each other, wherein the conductive layer positioned on one side of the insulating block, which is far away from the substrate, is formed into a first connecting part, adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conductive layer in the opening.
Referring to fig. 1 to 7, a method for manufacturing a touch panel according to an embodiment of the present invention first provides a substrate 1 having a plurality of supporting platforms 2, and the insulating blocks 3 are respectively covered on the support platforms 2, and then the support platforms 2 are removed to form openings O between the insulating blocks 3 and the substrate 1, i.e. the opening O, is of a shape and size corresponding to the shape and size of the removed support table 2, after which the substrate 1, the layer of insulating material, is patterned by deposition of a conductive layer 4, and the conductive layer 4 can penetrate into the opening O due to the bouncing effect of the collision between the atoms 6 or the collision between the atoms 6 of the conductive layer 4 and the substrate 1, so that the conductive layer 4 can be formed in the opening O, and finally the conductive layer 4 is subjected to patterning, to form a first electrode 41, a second electrode 42 insulated from each other, and a first connection portion 43 connecting adjacent first electrodes 41, and the adjacent second electrodes 42 are electrically connected by a second connection portion 44 formed by the conductive layer 4 in the opening O. The touch panel manufacturing method provided by the embodiment of the invention can form the first electrode 41, the second electrode 42, the first connecting part 43 and the second connecting part 44 only by performing deposition forming and patterning treatment on the conductive layer 4 once, namely, the touch panel adopting the mutual capacitance touch electrode, compared with the related technology, the method effectively simplifies the process flow, reduces the required times of deposition forming and patterning treatment on the conductive layer 4, improves the production efficiency, and saves the manufacturing process and consumables.
Referring to fig. 2, in step S110, each support platform 2 on the substrate 1 may be formed by inkjet printing or deposition/lithography/etching, i.e., the substrate 1 is first fabricated, and then the support platform 2 is formed on the substrate 1, where both the substrate 1 and the support platform 2 are of a split structure, so as to facilitate removal of the support platform 2 in a subsequent process. Optionally, the substrate 1 and the support table 2 may also be an integrated structure, that is, a portion of the substrate 1 is removed by etching the substrate 1 to form the support table 2, and the support table 2 and the substrate 1 are made of the same material. Specifically, in order to facilitate removal of the supporting platform 2, the supporting platform 2 may be made of glass cement, acrylic cement, or other materials convenient to clean.
Referring to fig. 3, in step S120, an insulating material layer may be formed on one side of the substrate 1 and the supporting platforms 2, and then the insulating blocks 3 are formed on the other side of each supporting platform 2 away from the substrate 1 by etching or the like. The insulating blocks 3 can be formed only corresponding to the support tables 2 by a mask plate or the like, and the process is simpler. The insulating material layer may specifically be made of inorganic insulating materials such as silicon oxide, silicon nitride, and silicon oxynitride, or materials with certain viscosity such as optical cement, so as to improve the firmness of connection between the insulating block 3 and the substrate 1.
Referring to fig. 4, in step S130, the supporting table 2 needs to be removed by etching or laser lift-off, so as to form an opening O between the insulating block 3 and the substrate 1, and the space occupied by the supporting table 2 is removed from the space at the opening O.
Referring to fig. 5, in step S140, a conductive layer 4 is deposited on the substrate 1 and the insulating material layer, the conductive layer 4 is prepared on the substrate 1 and each insulating block 3 of the insulating material layer, and the conductive layer 4 may be metal such as aluminum, titanium aluminum titanium, or conductive oxide such as ITO (Indium tin oxide), as long as the conductive performance satisfies the touch requirement.
Referring to fig. 7, in step S150, the conductive layer 4 is patterned to form a first electrode 41 and a second electrode 42 that are insulated from each other, one of the first electrode 41 and the second electrode 42 is a touch driving electrode, and the other is a touch sensing electrode, and the two electrodes cooperate to realize mutual capacitance touch of the touch panel to determine a touch position. And because the existence of insulating block 3, can form first connecting portion 43 at the insulating block 3 surface of a side of deviating from base plate 1 to connect adjacent first electrode 41, and adjacent second electrode 42 is through the mutual electricity connection of second connecting portion 44 by the shaping of conducting layer 4 in the opening O, first connecting portion 43 and second connecting portion 44 set up insulating block 3 both sides that are carried on the back mutually respectively, can not interfere the influence each other, have effectively avoided having problems such as short circuit or signal interference between first electrode 41 and the second electrode 42.
Referring to fig. 1, in some alternative embodiments, the step of providing a substrate 1 having a plurality of support tables 2 comprises: the support table 2 has one of a polygonal shape and a semicircular shape in cross section in a direction perpendicular to the plane of the substrate 1.
It will be appreciated that the shape and structure of the supporting platform 2 will affect the shape of the insulating block 3 formed on the side of the supporting platform 2 away from the substrate 1 and the shape of the opening O formed by removing the supporting platform 2, so as to facilitate the deposition of the conductive layer 4 on the insulating block 3 and avoid the problem that the conductive layer 4 is locally accumulated or cannot be attached to the surface of the insulating block 3, the supporting platform 2 may have a trapezoidal cross section, such as an isosceles trapezoid or a semicircle. The support table 2 may be specifically configured as a step table, a half circular table, or the like.
For shaping the support table 2, it is optional that in the step of providing the substrate 1 with a plurality of support tables 2, it comprises: the support table 2 is formed on the substrate 1 by at least one of an inkjet printing, deposition, photolithography or etching process. The ink-jet printing specifically sprays the liquid material of the support platform 2 onto the substrate 1, and the support platform 2 is formed after drying, and the deposition is to deposit the material of the support platform 2 on the substrate 1 in an evaporation mode, and then the required structural shape of the support platform 2 is formed through the processes of photoetching and etching.
The etching is specifically classified into dry etching and wet etching. The difference is that the wet process uses a solvent or solution for etching. Wet etching is a pure chemical reaction process, which means that chemical reaction between solution and pre-etching material is used to remove the part not masked by the masking film material for etching purpose. The method has the advantages of good selectivity, good repeatability, high production efficiency, simple equipment and low cost. The dry etching is of various types, including photo-evaporation, gas phase etching, plasma etching, etc. The dry etching has the advantages that: good anisotropy, high selectivity ratio, good controllability, flexibility and repeatability, safe thin line operation, easy realization of automation, no chemical waste liquid, no pollution in the treatment process and high cleanliness. In this embodiment, dry etching or wet etching may be selected according to actual conditions.
In order to ensure the connection stability between the insulating block 3 and the substrate 1 and avoid the problem that the insulating block 3 falls down or falls down, in some optional implementations, the step of forming the insulating material layer includes: the contact area between each insulating block 3 and the substrate 1 is 50 μm or more2。
It should be noted that the contact area between each insulating block 3 and the substrate 1 is limited to ensure that each insulating block 3 and the substrate 1 can be stably connected, thereby improving the adhesion. The contact area between each insulating block 3 and the substrate 1 is not particularly limited as long as stable connection of the insulating block 3 and the substrate 1 can be ensured. Alternatively, the contact area between each insulating block 3 and the substrate 1 is 50 μm2. Meanwhile, each insulating block 3 and the substrate 1 can be connected through adhesive such as an adhesive layer, so that the connection firmness of the insulating blocks and the substrate is further improved.
In order to ensure that the conductive layer 4 can be effectively attached to the insulating block 3 to form the first connecting portion 43, referring to fig. 2, in some alternative embodiments, the step of forming the insulating material layer includes: each insulating block 3 of the insulating material layer includes two supporting portions 31 respectively contacting the substrate 1 and a connecting portion 32 connecting the two supporting portions 31, and the supporting portions 31 and the connecting portion 32 are connected by a broken line or a curved line.
It should be noted that the two supporting portions 31 and the connecting portion 32 form a bridge-shaped structure, when the supporting portions 31 and the connecting portion 32 are connected by a broken line, the insulating block 3 is shaped like an arch bridge, and when the supporting portions 31 and the connecting portion 32 are connected by a broken line, the insulating block 3 is shaped like a trapezoidal table with an opening in the middle. It can be understood that, because the conductive layer 4 needs to be formed on the side of the supporting portion 31 and the connecting portion 32 away from the substrate 1, an included angle between the supporting portion 31 and the plane of the substrate 1 is not too large, and if the included angle is too large, the conductive layer 4 cannot adhere to the surface of the supporting portion 31 during the deposition process and fall on the substrate 1, and is stacked on the substrate 1, which affects the connection effect between the adjacent first electrodes 41.
For example, when the support portion 31 and the connecting portion 32 are connected by a folding line and the included angle between the support portion 31 and the plane of the substrate 1 is 90 °, that is, the support portion 31 is disposed perpendicular to the substrate, the conductive layer 4 cannot be effectively attached to the surface of the support portion 31 under the influence of its own weight.
Optionally, an included angle between the supporting portion 31 and the plane of the substrate 1 is 30 ° to 75 °. The problem that the conductive layer 4 cannot be effectively attached to the surface of the supporting part 31 is avoided by reducing the included angle between the supporting part 31 and the plane of the substrate 1, and the production yield is improved.
In some alternative embodiments, referring to fig. 3, the step of removing the support platform 2, the insulating block 3 and the substrate 1 to form the opening O therebetween includes: the insulating block 3 includes a first surface P1 facing away from the substrate 1, a second surface P2 facing toward the substrate 1, and a side P3 connecting the first surface P1 and the second surface P2; the second surface P2 includes a first end P21 and a second end P22 connected to the substrate 1, respectively, and an opening O is formed between the first end P21 and the second end P22.
It is understood that, due to the presence of the opening O, the second surface P2 has a first end P21 connected with the substrate 1, a second end P22 and a portion of the surface not connected with the substrate 1 forming the opening O, and the second surface P2 may be understood as the lower surface of the entire insulating block 3, while the first surface P1 is the upper surface of the entire insulating block 3.
In order to facilitate the conductive layer 4 to penetrate into the opening O to form the second connection portion 44, in some alternative embodiments, the maximum distance from the second surface P2 to the substrate 1 is greater than or equal to 15 μm, and the orthographic width of the second surface P2 on the substrate 1 is greater than or equal to 10 μm.
It should be noted that, the maximum distance between the second surface P2 and the substrate 1, that is, the height of the opening O, should not be too large, and if it is too large, the structural strength of the entire insulating block 3 is affected, and the insulating block 3 is easily damaged when being stressed, and if it is too small, the height of the opening O may not be too small, and if it is too small, the conductive layer 4 may not completely penetrate into the opening O in the subsequent process, so that the conductive layer 4 in the opening O is broken, and the second connection portion 44 cannot be formed to connect the adjacent second electrodes 42, optionally, the maximum distance between the second surface P2 and the substrate 1 is equal to 15 μm.
The orthographic projection width of the second surface P2 on the substrate 1 specifically refers to the width of the opening O, and may also be understood as the width of the first connection portion 43, when the width of the first connection portion 43 is too small, problems such as breaking may occur, the connection effect is affected, and the signal transmission effect between adjacent first electrodes 41 is affected, and optionally, the orthographic projection width of the second surface P2 on the substrate 1 is equal to 10 μm.
Referring to fig. 6 and 7, in order to shape the conductive layer 4 into the first electrode 41, the second electrode 42 and the first connection portion 43, in some alternative embodiments, the step of patterning the conductive layer 4 includes coating a patterned photoresist 5 on a side of the conductive layer 4 away from the substrate 1; the conductive layer 4 not covered by the photoresist 5 is etched to form the first electrode 41, the second electrode 42, the first connection portion 43, and the second connection portion 44.
It is understood that the photoresist 5 is also called a photoresist, and refers to a resist material whose solubility is changed by irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, or the like. The photosensitive mixed liquid consists of three main components, including photosensitive resin, sensitizer and solvent. Used as a corrosion-resistant coating material during a photolithography process. In this embodiment, the photoresist 5 can protect the conductive layer 4 from being etched, so that the pattern shape of the photoresist 5 coated on the conductive layer 4 corresponds to the shapes of the first electrode 41, the second electrode 42 and the first connection portion 43, and after the conductive layer 4 not covered by the photoresist 5 is etched, the remaining photoresist 5 can be stripped off to reduce the thickness of the touch panel, and the remaining photoresist 5 can be retained to protect the first electrode 41, the second electrode 42 and the first connection portion 43.
In order to avoid the problem of film breaking or collapse of the insulating block 3 when the photoresist 5 is coated on the insulating block 3, referring to fig. 6, in some alternative embodiments, the step of coating the patterned photoresist 5 on the side of the conductive layer 4 away from the substrate 1 includes: along the extension of the insulating blocks 3, a patterned photoresist 5 is applied to the side of the conductive layer 4 facing away from the substrate 1. Specifically, the photoresist 5 is coated along the extending direction of the insulating block 3 to avoid the problem that the insulating block 3 collapses due to uneven stress.
Since the whole conductive layer 4 is formed on the substrate 1, the side surface of the insulating block 3 also covers a part of the conductive layer 4, and the part of the conductive layer 4 may connect the first connection portion 43 on the insulating block 3 and the second connection portion 44 or the second electrode 42 in the opening O under the insulating block 3, which may cause the first electrode 41 and the second electrode 42 to be short-circuited, thereby affecting the touch effect.
In order to avoid the above problem, in some alternative embodiments, the step of etching the conductive layer 4 not covered by the photoresist 5 includes: the conductive layer 4 formed on the side surface of the insulating block 3 is etched. By etching the conductive layer 4 on the side surface of the insulating block 3, insulation between the first connecting portion 43 and the second connecting portion 44 is ensured, and problems such as short circuit and signal interference are avoided.
Referring to fig. 7, in some alternative embodiments, the step of patterning the conductive layer 4 includes: the extending direction of the first connecting part 43 is the same as the extending direction of the insulating block 3, and/or; the extending direction of the second connecting portion 44 intersects the extending direction of the insulating block 3.
By setting the extending direction of the first connecting portion 43 to be the same as the extending direction of the insulating block 3, the stability of the first connecting portion 43 on the insulating block 3 is ensured, and the connecting effect between the first connecting portion 43 and the first electrode 41 is further improved. Optionally, the extending direction of the second connecting portion 44 intersects the extending direction of the insulating block 3, and specifically, the extending direction of the second connecting portion 44 is perpendicular to the extending direction of the insulating block 3, so as to connect with the adjacent second electrode 42 and avoid interference with the first electrode 41.
In some optional embodiments, the step of patterning the conductive layer 4 includes: the minimum distance from the surface of the first connection portion 43 in contact with the insulating block 3 to the surface of the first connection portion 43 on the side away from the insulating block 3 is a first distance, the minimum distance from the surface of the second connection portion 44 in contact with the substrate 1 to the surface of the second connection portion 44 on the side away from the substrate 1 is a second distance, and the first distance is greater than the second distance.
It will be appreciated that the minimum distance from the side surface of the first connection portion 43 in contact with the insulating block 3 to the side surface of the first connection portion 43 facing away from the insulating block 3, i.e. the thickness of the first connection portion 43, and the minimum distance from the side surface of the second connection portion 44 in contact with the substrate 1 to the side surface of the second connection portion 44 facing away from the substrate 1, i.e. the thickness of the second connection portion 44, is generally less than the thickness of the first connection portion 43, since the second connection portion 44 is formed by a portion of the conductive layer 4 penetrating into the opening O.
Referring to fig. 8, specifically, the conductive layer 4 is usually deposited by sputtering, and the sputtered atoms 6 of the material of the conductive layer 4 reach the opening O in various ways, for example, some of the sputtered atoms 6 are obliquely incident to the opening O below the insulating block 3 and deposited due to collision between the atoms 6 or magnetic field, or the sputtered atoms 6 of the material of the conductive layer 4 collide with the atoms 6 of the substrate 1 beside the opening O and bounce back into the opening below the insulating block 3. Thus, the thickness of the second connection portion 44 is generally smaller than that of the first connection portion 43 formed by normal deposition on the insulation block 3, i.e., the second distance is smaller than the first distance.
In some alternative embodiments, referring to fig. 7, a distance from a side surface of the second connection portion 44 near the second electrode 42, which is in contact with the substrate 1, to a side surface of the second connection portion 44, which faces away from the substrate 1, is greater than a distance from a side surface of the second connection portion 44 at a center of the second connection portion 44, which is in contact with the substrate 1, to a side surface of the second connection portion 44, which faces away from the substrate 1.
It should be noted that, due to the limitation of the forming process, the thickness of each portion of the second connection portion 44 may be inconsistent, and the closer to the center of the opening O, the less the conductive layer 4 material can be infiltrated, the smaller the thickness of the portion, and the closer to the second electrode 42, the more the conductive layer 4 material can be infiltrated, the larger the thickness of the portion. That is, the thickness of the second connection portion 44 near the second electrode 42 is greater than the thickness of the second connection portion 44 at the center, as long as the second connection portion 44 can effectively connect the adjacent second electrodes 42.
In some alternative embodiments, the step of depositing and forming the conductive layer 4 on the substrate 1 and the insulating block 3 by a sputtering process includes: the conductive layer 4 includes at least one of metal, indium tin oxide, and indium zinc oxide. The specific material of the conductive layer 4 is not particularly limited as long as the touch panel has stable signal transmission.
The embodiment of the invention also provides a touch panel, and the touch panel is prepared by adopting the touch panel preparation method in any embodiment.
Referring to fig. 2 to 7, a touch panel according to an embodiment of the invention includes a substrate 1, an insulating material layer, a first electrode 41, a second electrode 42, a first connection portion 43, and a second connection portion 44. The insulating material layer is arranged on one side of the substrate 1 and comprises a plurality of insulating blocks 3, an opening O is formed between each insulating block 3 and the substrate 1, a second connecting portion 44 is arranged in each opening O, two adjacent second electrodes 42 are electrically connected through the second connecting portions 44, the first connecting portions 43 are arranged on the side, away from the substrate 1, of each insulating block 3, and two adjacent first electrodes 41 are electrically connected through the first connecting portions 43.
Since the second connection portion 44 is formed by a portion of the conductive layer 4 penetrating into the opening O, the material of the conductive layer 4 that can penetrate into the opening O is limited, and the thickness of the second connection portion 44 is generally smaller than that of the first connection portion 43. And due to the limitation of the forming process, the thickness of each portion of the second connection portion 44 may be inconsistent, the closer to the center of the opening O, the less conductive layer 4 material can be infiltrated, and the smaller the thickness of the portion, and the closer to the second electrode 42, the more conductive layer 4 material can be infiltrated, and the larger the thickness of the portion. That is, the thickness of the second connection portion 44 near the second electrode 42 is greater than the thickness of the second connection portion 44 at the center, and specifically, the thickness of the second connection portion 44 gradually decreases from the position near the second electrode 42 to the center of the second connection portion 44, and the thickness gradually changes.
An embodiment of the present invention further provides a display device, including: a touch panel, which is the touch panel in any of the above embodiments. The display device provided by the embodiment of the invention has the technical effects of the technical solutions of the touch panel in any of the above embodiments, and the structures and terms identical to or corresponding to those in the above embodiments are not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone and can also be any electronic product with a display function, including but not limited to the following categories: the touch screen display system comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the invention is not particularly limited in this respect.
As will be apparent to those skilled in the art, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
Claims (17)
1. A method for manufacturing a touch panel includes:
providing a substrate having a plurality of support tables:
forming an insulating material layer including a plurality of insulating blocks covering the respective supporting stages;
removing the supporting platforms, and forming an opening between the insulating block and the substrate;
depositing and forming a conductive layer on the substrate and the insulating material layer, wherein the conductive layer penetrates into the opening;
and patterning the conducting layer to form a first electrode and a second electrode which are insulated from each other, wherein a first connecting part is formed on the conducting layer on one side of the insulating block, which is far away from the substrate, adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conducting layer in the opening.
2. The method for manufacturing a touch panel according to claim 1, wherein the step of providing a substrate having a plurality of supporting stages comprises:
the cross section of the supporting platform is in one of a polygon and a semicircle in the direction perpendicular to the plane of the substrate.
3. The method for manufacturing a touch panel according to claim 2, wherein the step of providing a substrate having a plurality of supporting stages comprises:
a support table is formed on the substrate by at least one of an inkjet printing, deposition, photolithography, or etching process.
4. The method for manufacturing a touch panel according to claim 1, wherein the step of forming the insulating material layer comprises:
the contact area between each insulating block and the substrate is greater than or equal to 50 μm2。
5. The method for manufacturing a touch panel according to claim 1, wherein the step of forming the insulating material layer comprises:
each insulating block of the insulating material layer comprises two supporting parts which are respectively contacted with the substrate and a connecting part which is used for connecting the two supporting parts, and the supporting parts and the connecting parts are connected in a broken line or a curve.
6. The method of claim 1, wherein an included angle between the supporting portion and the plane of the substrate is 30 ° to 75 °.
7. The method for manufacturing a touch panel according to claim 1, wherein the step of removing the support stage, the insulating block, and the substrate to form an opening therebetween includes:
the insulating block comprises a first surface facing away from the substrate, a second surface facing towards the substrate and a side surface connecting the first surface and the second surface; the second surface includes first and second ends respectively connected to the substrate, and the opening is formed between the first and second ends.
8. The method of claim 7, wherein a maximum distance between the second surface and the substrate is greater than or equal to 15 μm, and an orthogonal projection width of the second surface on the substrate is greater than or equal to 10 μm.
9. The method for manufacturing a touch panel according to claim 7, wherein the step of patterning the conductive layer includes:
coating a patterned photoresist on one side of the conductive layer, which is far away from the substrate;
and etching the conducting layer which is not covered by the photoresist to form the first electrode, the second electrode, the first connecting part and the second connecting part.
10. The method for manufacturing a touch panel according to claim 9, wherein the step of coating the patterned photoresist on the side of the conductive layer facing away from the substrate comprises:
and coating a patterned photoresist on one side of the conductive layer, which is far away from the substrate, along the extension direction of the insulating blocks.
11. The method for manufacturing a touch panel according to claim 9, wherein the step of etching the conductive layer not covered by the photoresist comprises:
and etching the conductive layer formed on the side surface of the insulating block.
12. The method for manufacturing a touch panel according to claim 7, wherein the step of patterning the conductive layer includes:
the extending direction of the first connecting part is the same as that of the insulating block, and/or;
the extending direction of the second connecting part and the extending direction of the insulating block intersect.
13. The method for manufacturing a touch panel according to claim 1, wherein the step of patterning the conductive layer includes:
the minimum distance from one side surface of the first connecting portion, which is contacted with the insulating block, to one side surface of the first connecting portion, which is deviated from the insulating block, is a first distance, the minimum distance from one side surface of the second connecting portion, which is contacted with the substrate, to one side surface of the second connecting portion, which is deviated from the substrate, is a second distance, and the first distance is greater than the second distance.
14. The method of manufacturing a touch panel according to claim 13, wherein a distance from a surface of the second connection portion near the second electrode, on which the second connection portion and the substrate are in contact, to a surface of the second connection portion facing away from the substrate is greater than a distance from a surface of the second connection portion at a center of the second connection portion, on which the second connection portion and the substrate are in contact, to a surface of the second connection portion facing away from the substrate.
15. The method for manufacturing a touch panel according to claim 1, wherein the step of depositing a conductive layer on the substrate and the insulating block by a sputtering process comprises:
the conductive layer comprises at least one of metal, indium tin oxide and indium zinc oxide.
16. A touch panel prepared by the method according to any one of claims 1 to 10.
17. A display device, comprising: a touch panel as defined in claim 16.
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