CN113205993A - Sintered metal gas distribution ring for plasma - Google Patents
Sintered metal gas distribution ring for plasma Download PDFInfo
- Publication number
- CN113205993A CN113205993A CN202110433982.3A CN202110433982A CN113205993A CN 113205993 A CN113205993 A CN 113205993A CN 202110433982 A CN202110433982 A CN 202110433982A CN 113205993 A CN113205993 A CN 113205993A
- Authority
- CN
- China
- Prior art keywords
- ring
- gas distribution
- gas
- metal
- distribution ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 34
- 239000002923 metal particle Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 abstract description 43
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 4
- 150000002500 ions Chemical class 0.000 abstract description 3
- 210000002381 plasma Anatomy 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
Abstract
The invention provides a sintered metal gas distribution ring for plasma, which comprises a gas distribution ring body, wherein a metal ring is sintered on the side surface of an inner ring of the gas distribution ring body, and a plurality of vent holes are uniformly arranged on the metal ring at intervals. The whole metal ring can give off gas, the gas is uniformly distributed, the gas ionization efficiency is high, ions can be uniformly distributed in the ionization chamber, the gas output of oxygen can be increased, and the effectiveness of a coating process is enhanced.
Description
Technical Field
The invention relates to the technical field of plasmas, in particular to a sintered metal gas distribution ring for a plasma.
Background
The plasma source is a core part in a coating process, the gas distribution ring is of a hollow structure and is arranged in the plasma source, and the gas distribution ring can introduce oxygen into an ionization chamber of the plasma source so as to ionize the oxygen.
However, the side surface of the inner ring of the existing gas distribution ring is provided with a plurality of large vent holes, so that gas jet exists in the gas outlet process, the gas jet can cause gas to be discharged unevenly, the local concentration is too high, the gas distribution is uneven, and then accessories in the plasma source are easily damaged, and even the whole plasma source can be damaged.
Disclosure of Invention
The present invention is directed to a sintered metal gas distribution ring for plasma, which solves the above-mentioned problems of the prior art.
In order to solve the technical problems, the invention provides the following technical scheme: the sintered metal gas distribution ring for the plasma comprises a gas distribution ring body, wherein a metal ring is sintered on the side surface of an inner ring of the gas distribution ring body, and a plurality of vent holes with unequal intervals are formed in the metal ring.
The metal ring is formed by integrally sintering metal particles.
The diameter of the vent hole on the metal ring is 5-20 um.
The distance between the vent holes on the metal ring is 40-80 um.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the metal ring is sintered on the side surface of the inner ring of the gas distribution ring body, the plurality of vent holes are uniformly arranged on the metal ring at intervals, the whole ring can give out gas, the gas is uniformly discharged, the gas is uniformly distributed, the gas ionization efficiency is high, further, ions can be uniformly distributed in the ionization chamber, meanwhile, the gas discharge amount of oxygen can be increased, and the effectiveness of a coating process is enhanced.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, and are not intended to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a gas distribution ring before modification;
in the figure: 1 a gas distribution ring body; 2 a metal ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: the sintered metal gas distribution ring for the plasma comprises a gas distribution ring body 1, wherein a metal ring 2 is sintered on the side surface of an inner ring of the gas distribution ring body 1, and a plurality of vent holes with unequal intervals are formed in the metal ring 2.
The metal ring 2 is formed by integrally sintering metal particles.
The diameter of the vent hole on the metal ring 2 is 5-20 um.
The distance between the vent holes on the metal ring 2 is 40-80 um.
As shown in fig. 2, a plurality of large vent holes are formed in the side surface of the inner ring of the existing gas distribution ring, so that gas jet exists in the gas outlet process, the gas jet can cause the gas to be discharged unevenly, and the local concentration is too large, so that the gas distribution is uneven.
According to the invention, the metal ring 2 is sintered on the side surface of the inner ring of the gas distribution ring body 1, the metal ring 2 is uniformly provided with the plurality of vent holes at intervals, the whole ring can give out gas, the gas is uniformly distributed, the gas ionization efficiency is high, further, ions can be uniformly distributed in the ionization chamber, meanwhile, the gas output of oxygen can be increased, and the effectiveness of a coating process is enhanced.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A sintered metal gas distribution ring for plasma is characterized in that: the gas distribution ring comprises a gas distribution ring body, wherein a metal ring is sintered on the side surface of an inner ring of the gas distribution ring body, and a plurality of vent holes with unequal intervals are arranged on the metal ring.
2. The sintered metal gas distribution ring for plasma according to claim 1, wherein: the metal ring is formed by integrally sintering metal particles.
3. The sintered metal gas distribution ring for plasma according to claim 1, wherein: the diameter of the vent hole on the metal ring is 5-20 um.
4. The sintered metal gas distribution ring for plasma according to claim 1, wherein: the distance between the vent holes on the metal ring is 40-80 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110433982.3A CN113205993A (en) | 2021-04-22 | 2021-04-22 | Sintered metal gas distribution ring for plasma |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110433982.3A CN113205993A (en) | 2021-04-22 | 2021-04-22 | Sintered metal gas distribution ring for plasma |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113205993A true CN113205993A (en) | 2021-08-03 |
Family
ID=77027966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110433982.3A Pending CN113205993A (en) | 2021-04-22 | 2021-04-22 | Sintered metal gas distribution ring for plasma |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113205993A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0797690A (en) * | 1993-09-29 | 1995-04-11 | Toppan Printing Co Ltd | Plasma cvd device |
| US5595602A (en) * | 1995-08-14 | 1997-01-21 | Motorola, Inc. | Diffuser for uniform gas distribution in semiconductor processing and method for using the same |
| JP2009181973A (en) * | 2008-01-29 | 2009-08-13 | Mitsubishi Materials Corp | Gas diffusion board for plasma processing device and plasma processing device |
| CN102424955A (en) * | 2011-11-29 | 2012-04-25 | 中国科学院微电子研究所 | Novel even gas structure |
| CN111146063A (en) * | 2018-11-02 | 2020-05-12 | 江苏鲁汶仪器有限公司 | Air inlet system of plasma reaction cavity |
-
2021
- 2021-04-22 CN CN202110433982.3A patent/CN113205993A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0797690A (en) * | 1993-09-29 | 1995-04-11 | Toppan Printing Co Ltd | Plasma cvd device |
| US5595602A (en) * | 1995-08-14 | 1997-01-21 | Motorola, Inc. | Diffuser for uniform gas distribution in semiconductor processing and method for using the same |
| JP2009181973A (en) * | 2008-01-29 | 2009-08-13 | Mitsubishi Materials Corp | Gas diffusion board for plasma processing device and plasma processing device |
| CN102424955A (en) * | 2011-11-29 | 2012-04-25 | 中国科学院微电子研究所 | Novel even gas structure |
| CN111146063A (en) * | 2018-11-02 | 2020-05-12 | 江苏鲁汶仪器有限公司 | Air inlet system of plasma reaction cavity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210803 |