CN113199825A - Shell assembly, manufacturing method thereof and electronic equipment - Google Patents

Shell assembly, manufacturing method thereof and electronic equipment Download PDF

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Publication number
CN113199825A
CN113199825A CN202110510755.6A CN202110510755A CN113199825A CN 113199825 A CN113199825 A CN 113199825A CN 202110510755 A CN202110510755 A CN 202110510755A CN 113199825 A CN113199825 A CN 113199825A
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CN
China
Prior art keywords
shell
reinforced resin
resin layer
fiber reinforced
housing assembly
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Pending
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CN202110510755.6A
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Chinese (zh)
Inventor
梁少雄
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Guangdong Xinxiu New Material Co ltd
Shenzhen Branch Of Guangdong Xinxiu New Material Co ltd
Original Assignee
Guangdong Xinxiu New Material Co ltd
Shenzhen Branch Of Guangdong Xinxiu New Material Co ltd
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Priority to CN202110510755.6A priority Critical patent/CN113199825A/en
Publication of CN113199825A publication Critical patent/CN113199825A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention relates to a shell assembly, a manufacturing method thereof and electronic equipment. The shell component comprises a ceramic matrix, an adhesion promoter layer and a fiber reinforced resin layer, wherein the fiber reinforced resin layer is connected with the ceramic matrix through the adhesion promoter layer. The fiber reinforced resin layer is provided on the ceramic substrate, so that the overall density of the housing assembly can be reduced, and the overall relative density can be reduced to 4.0 by taking the zirconia ceramic substrate housing as an example, thereby realizing light weight. Also, replacing the housing assembly portion with a fiber reinforced resin layer can reduce costs. Meanwhile, the fiber reinforced resin layer has good toughness, so that the overall toughness of the shell assembly can be improved, the thickness of the shell assembly can be reduced under the condition of meeting the strength, and the lightness and thinness are realized. In addition, the shell assembly is connected with the fiber reinforced resin layer and the ceramic matrix through the adhesion promoter layer, so that the firm connection degree between the fiber reinforced resin layer and the ceramic matrix is greatly improved, and the falling-off phenomenon is avoided.

Description

Shell assembly, manufacturing method thereof and electronic equipment
Technical Field
The invention relates to the field of electronic product shells, in particular to a shell assembly, a manufacturing method thereof and electronic equipment.
Background
The ceramic product has the advantages of being moist in touch feeling like jade, soft in luster, weather-proof and wear-resistant after being ground and polished, so that in recent years, shells made of ceramic materials are increasingly applied to electronic products, for example, the shells are used as smart phone back covers, tablet computer back covers, notebook computer shells, intelligent wearable equipment shells, wireless charger shells, smart home product shells and the like. In particular, zirconia ceramics have been applied in large scale due to their superior powder fineness and impact resistance.
However, since the ceramic material has a high density and a high brittleness, the thickness of the ceramic product tends to be thick in order to improve the impact resistance of the ceramic product, resulting in a heavy weight. Among them, the zirconia ceramics has a relative density (the density of water at 4 ℃ is taken as a reference density) of 6.0, so that the weight of the products is large, which is a problem to be widely accepted as the shell of electronic products. In addition, heavier products inevitably consume more expensive ceramic powder, which leads to cost increase and limits the use of the products in the field of electronic product shells.
Disclosure of Invention
Accordingly, there is a need for a housing assembly, a method for manufacturing the same, and an electronic device, which can solve the problems of heavy weight and high cost of a ceramic housing.
One of the purposes of the invention is to provide a shell component, and the scheme is as follows:
a shell component comprises a ceramic matrix, an adhesion promoter layer and a fiber reinforced resin layer, wherein the fiber reinforced resin layer is connected with the ceramic matrix through the adhesion promoter layer.
In one embodiment, the ceramic substrate has a receiving cavity, and the adhesion promoter layer and the fiber reinforced resin layer are both located in the receiving cavity.
In one embodiment, the fiber reinforced resin layer includes a resin matrix and reinforcing fibers filled in the resin matrix.
In one embodiment, the resin matrix is selected from at least one of epoxy resin and modified resin thereof, unsaturated polyester and modified resin thereof, phenolic resin and modified resin thereof, and vinyl resin and modified resin thereof.
In one embodiment, the reinforcing fibers are selected from at least one of glass fibers, carbon fibers, alumina fibers, polypropylene fibers, polyethylene fibers, aramid fibers, flax fibers, basalt fibers, and boron fibers.
In one embodiment, the thickness of the adhesion promoter layer is 10 μm to 50 μm.
In one embodiment, the thickness of the ceramic substrate is 0.2mm to 1.5 mm.
In one embodiment, the thickness of the fiber reinforced resin layer is 0.2mm to 1.5 mm.
In one embodiment, the ceramic matrix is at least one of zirconia ceramic and silicon nitride ceramic.
In one embodiment, the material of the adhesion promoter layer is polyurethane promoter.
In one embodiment, the relative density of the shell assembly (the density of water at 4 ℃ is taken as a reference density) is 2-5.
Another object of the present invention is to provide a method for manufacturing a housing assembly, which comprises the following steps:
a method of making a housing assembly comprising the steps of:
providing a ceramic matrix;
coating an adhesion promoter on the ceramic substrate;
after the surface of the bonding promoter layer is dried, adhering fiber reinforced prepreg on the bonding promoter layer to obtain a shell green body;
and heating and pressurizing the shell green body to obtain a shell assembly.
In one embodiment, the heat and pressure treatment comprises the following steps:
placing the shell green body into a profiling mold;
putting the profiling mold and the shell green compact into a vacuum bag film integrally, vacuumizing and sealing;
and putting the vacuum bag film, the profiling mold and the shell green compact into hot-pressing equipment for heating and pressing.
In one embodiment, the autoclave apparatus is an autoclave or a warm isostatic press.
In one embodiment, the heating temperature of the heating and pressurizing treatment is 60-150 ℃, the pressurizing pressure is 0.8-1.5 MPa, and the pressure maintaining time is 3-180 min.
In one embodiment, the method of making further comprises the step of machining the housing assembly. The machining is at least one of laser cutting, water jet cutting, CNC cutting, grinding, and polishing.
Compared with the prior art, the shell assembly and the manufacturing method thereof have the following beneficial effects:
the shell assembly and the manufacturing method thereof can reduce the overall density of the shell assembly by arranging the fiber reinforced resin layer on the ceramic substrate, and take the zirconia ceramic substrate shell as an example, the overall relative density can be reduced to 4.0, and the density is reduced by 33 percent compared with the density of a pure ceramic material, thereby realizing the light weight. Because the cost of the pure ceramic material is higher, the cost can be reduced by partially replacing the shell component with the fiber reinforced resin layer. Meanwhile, the fiber reinforced resin layer has good toughness, so that the overall toughness of the shell assembly can be improved, the thickness of the shell assembly can be reduced under the condition of meeting the strength, and the lightness and thinness are realized. In addition, the inventor finds that although the fiber reinforced resin layer can be adhered to the ceramic matrix during curing, the fiber reinforced prepreg is generally poor in adhesion to the ceramic matrix, and the shell can fall off when being impacted by falling, impact and the like.
Above-mentioned housing assembly has the advantage that density is low, light in weight, toughness is good, with low costs, has kept ceramic outward appearance texture, color and luster and sense of touch simultaneously, is applicable to very much the shell of preparation intelligent science and technology product, for example lid behind the cell-phone, panel computer back cover, notebook computer shell, intelligence wearing equipment shell, wireless charger shell etc. can also be used to shell or the decoration piece etc. of intelligence or traditional furniture product.
The invention also aims to provide a manufacturing method of the shell component, which adopts the following scheme:
an electronic device, comprising:
the housing assembly according to any one of the above embodiments or the housing assembly manufactured by the method of manufacturing the housing assembly according to any one of the above embodiments;
and the electronic component is accommodated in the shell assembly.
The electronic equipment is provided with the shell assembly, so that corresponding technical effects can be obtained.
Drawings
FIG. 1 is a schematic structural diagram of a housing assembly according to an embodiment;
fig. 2 is a cross-sectional view of the housing assembly of fig. 1 taken along the direction a-a.
Description of reference numerals:
100. a housing assembly; 110. a ceramic substrate; 120. an adhesion promoter layer; 130. a fiber reinforced layer.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, a housing assembly 100 according to an embodiment of the present invention includes a ceramic substrate 110, an adhesion promoter layer 120, and a fiber-reinforced resin layer 130. The fiber reinforced resin layer 130 is connected to the ceramic base 110 through the adhesion promoter layer 120.
By providing the fiber-reinforced resin layer 130 on the ceramic substrate 110, the density of the entire case assembly 100 can be reduced, and in the case of a zirconia ceramic substrate case, the overall relative density can be reduced to 4.0, which is reduced by 33% compared to the density of a simple ceramic material, thereby achieving a reduction in weight. Due to the high cost of pure ceramic materials, the partial replacement of the housing assembly 100 with the fiber reinforced resin layer 130 can reduce costs. Meanwhile, the fiber reinforced resin layer 130 has good toughness, so that the toughness of the entire housing assembly 100 can be improved, the thickness of the housing assembly can be reduced under the condition that the strength is satisfied, and the housing assembly can be made thin and light. In addition, the inventors have found that although the fiber reinforced resin layer 130 can adhere to the ceramic substrate 110 during curing, the fiber reinforced prepreg generally has poor adhesion to the ceramic substrate 110, and the shell may fall off when subjected to impacts such as dropping and bumping, and the shell assembly 100 connects the fiber reinforced resin layer 130 and the ceramic substrate 110 through the adhesion promoter layer 120, so that the degree of connection firmness between the fiber reinforced resin layer 130 and the ceramic substrate 110 is greatly improved, and the phenomenon of falling off is avoided.
The shell assembly 100 has the advantages of low density, light weight, good toughness and low cost, maintains the appearance texture, color and touch of ceramic, is very suitable for manufacturing shells of intelligent science and technology products, such as mobile phone rear covers, tablet computer rear covers, notebook computer shells, intelligent wearable equipment shells, wireless charger shells and the like, and can also be used for shells or decorative sheets of intelligent or traditional furniture products.
In one example, the ceramic substrate 110 is a zirconia ceramic. The zirconia ceramics has the advantages of good powder fineness and outstanding shock resistance. It is understood that in other examples, the ceramic substrate 110 is not limited to zirconia ceramics, but may be other types of ceramics, such as silicon nitride ceramics, etc.
In one example, the thickness of the ceramic substrate 110 is 0.2mm to 1.5 mm. The thickness range of the ceramic substrate 110 is much lower than the thickness of the ceramic shell of an electronic product such as a mobile phone under normal conditions, so that the amount of the ceramic can be reduced, and the effects of reducing weight and cost can be achieved.
Further, in one example, the thickness of the ceramic substrate 110 is 0.4mm to 1.2 mm. In some specific examples, the thickness of the ceramic substrate 110 is 0.3mm, 0.7mm, 1mm, 1.2mm, 1.4mm, and the like.
In one example, the material of the adhesion promoter layer is a polyurethane-based promoter.
In one example, the adhesion promoter layer 120 has a thickness of 10 μm to 50 μm. The thickness range of the adhesion promoter layer 120 is effective for improving the degree of the connection strength between the fiber reinforced resin layer 130 and the ceramic body 110, and has little influence on the overall thickness of the case assembly 100. Further, in one example, the adhesion promoter layer 120 has a thickness of 20 μm to 40 μm. In some specific examples, the adhesion promoter layer 120 has a thickness of 15 μm, 25 μm, 30 μm, 35 μm, 45 μm, or the like.
It is understood that the fiber reinforced resin layer 130 includes a resin matrix and reinforcing fibers filled in the resin matrix.
Wherein, the resin matrix can be selected from at least one of but not limited to epoxy resin and modified resin thereof, unsaturated polyester and modified resin thereof, phenolic resin and modified resin thereof, vinyl resin and modified resin thereof. In one example, the resin matrix is an epoxy resin. The reinforcing fiber may be selected from, but not limited to, at least one of glass fiber, carbon fiber, alumina fiber, polypropylene fiber, polyethylene fiber, aramid fiber, flax fiber, basalt fiber, and boron fiber.
In one example, the thickness of the fiber reinforced resin layer 130 is 0.2mm to 1.5 mm. The thickness range of the fiber reinforced resin layer 130 is effective to improve the strength and toughness of the housing assembly 100. Further, in one example, the thickness of the fiber reinforced resin layer 130 is 0.4mm to 1.2 mm. In some specific examples, the thickness of the fiber reinforced resin layer 130 is 0.3mm, 0.7mm, 1mm, 1.2mm, 1.4mm, or the like.
As shown in fig. 2, in one example, the ceramic substrate 110 has a receiving cavity, and the adhesion promoter layer 120 and the fiber reinforced resin layer 130 are located in the receiving cavity. In this example, the ceramic substrate 110 has a receiving cavity, which can receive components such as electronic components, and the case assembly 100 can be used as a housing of an electronic product, such as a mobile phone rear cover, a tablet computer rear cover, a notebook computer housing, an intelligent wearable device housing, a wireless charger housing, and the like, and can also be used as a housing or a decorative sheet of an intelligent or traditional furniture product. The fiber reinforced resin layer 130 faces the inside of the electronic product, and the ceramic substrate 110 is located on the outer surface of the product, so that the electronic product maintains the appearance texture, color and touch of the ceramic.
In one example, the relative density (with the density of water at 4 ℃ as a reference density) of the housing assembly 100 as a whole is 2-5. The ceramic base 110 is made of zirconia ceramics, and the overall relative density of the case component 100 is 4 to 5. The ceramic substrate 110 is made of silicon nitride ceramic, and the overall relative density of the case assembly 100 is 2.2 to 2.6.
Further, the present invention also provides a method for manufacturing the housing assembly according to any of the above embodiments, including the steps of:
step S1, providing a ceramic substrate;
step S2, coating an adhesion promoter on the ceramic substrate;
step S3, after the surface of the adhesion promoter layer is dried, adhering fiber reinforced prepreg on the adhesion promoter layer to obtain a shell green body;
and step S4, heating and pressurizing the shell green body to obtain the shell assembly.
In one example, the heat and pressure treatment includes the steps of:
placing the shell green body into a profiling mold;
putting the profiling mold and the shell green body in the profiling mold into a vacuum bag film integrally, vacuumizing and sealing;
and putting the vacuum bag film, the profiling mold and the shell green compact into hot-pressing equipment for heating and pressing.
Wherein, the hot pressing equipment can be selected from but not limited to a vacuum autoclave or a warm isostatic pressing equipment. The profiling mold and the vacuum autoclave or the warm isostatic pressing device ensure that the prepreg and the ceramic shell matrix are tightly and uniformly attached in the resin curing process, the bubble defect is reduced, and the bonding force of the ceramic shell matrix and the prepreg is optimized.
In one example, the heating temperature of the heating and pressurizing treatment is 60-150 ℃, the pressurizing pressure is 0.8-1.5 MPa, and the pressure maintaining time is 3-180 min.
Further, in one example, the heating temperature of the heating and pressurizing treatment is 90 ℃ to 120 ℃, the pressurizing pressure is 1MPa to 1.3MPa, and the pressure maintaining time is 40min to 150 min.
In one example, the method for manufacturing the shell assembly further comprises the step of machining the shell assembly obtained after demolding. The machining may be at least one of laser cutting, CNC cutting, grinding, and polishing.
Further, the present invention also provides an electronic device, comprising:
the housing assembly of any of the embodiments above or the housing assembly produced by the method of any of the embodiments above;
and the electronic component is accommodated in the shell assembly.
The electronic equipment is provided with the shell assembly, so that corresponding technical effects can be obtained.
The electronic device may be, for example, a mobile phone, a tablet computer, a computing device, or an information display device. In one example, the electronic device is a mobile phone and the housing assembly serves as a back cover of the mobile phone. Specifically, the electronic device includes a housing assembly, a display assembly, and a circuit board. The display assembly and the shell assembly are connected, and an installation space is defined between the display assembly and the shell assembly. The circuit board is arranged in the mounting space and electrically connected with the display assembly.
The following examples are provided to illustrate the present invention, but the present invention is not limited to the following examples, and it should be understood that the appended claims outline the scope of the present invention and those skilled in the art who are guided by the inventive concept will appreciate that certain changes made to the embodiments of the present invention will be covered by the spirit and scope of the claims of the present invention.
Example 1
The embodiment provides a shell assembly and a manufacturing method thereof. The case assembly of the present embodiment includes a ceramic base, an adhesion promoter layer, and a fiber-reinforced resin layer. The fiber reinforced resin layer is connected with the ceramic matrix through the adhesion promoter layer. Wherein the thickness of the ceramic matrix is 0.6mm, the thickness of the adhesion promoter layer is 22 μm, and the thickness of the fiber reinforced resin layer is 0.32 mm.
The manufacturing method of the shell assembly of the embodiment comprises the following steps:
and (3) taking the zirconia ceramic substrate, carrying out numerical control machining, cutting, grinding and thinning to obtain a sheet with the thickness of 0.3mm, and thus obtaining the ceramic substrate.
And cleaning the thinned ceramic matrix. The polyurethane type adhesion promoter is uniformly applied to the non-exterior surface of the ceramic substrate to form an adhesion promoter layer.
And after the surface of the adhesion promoter is dried, 4 layers of 2116E-glass epoxy resin prepreg are attached to obtain a shell green body.
The other side of the shell green body, namely the appearance side of the ceramic substrate is tightly attached to the profiling single-side die.
And putting the profiling mold and the shell green body in the profiling mold into a high-temperature-resistant vacuum bag film integrally, vacuumizing and sealing.
Putting the vacuum bag film, the profiling mold therein and the shell green compact into a vacuum autoclave, pressurizing to 1.3MPa, slowly heating to 140 ℃ and keeping for 40 minutes. After the resin is completely cured, slowly cooling and reducing the pressure.
And (5) removing the vacuum bag film and demolding.
And processing the shell assembly obtained after demolding, including laser cutting, CNC cutting, grinding and polishing.
Example 2
The embodiment provides a shell assembly and a manufacturing method thereof. The case assembly of the present embodiment includes a ceramic base, an adhesion promoter layer, and a fiber-reinforced resin layer. The fiber reinforced resin layer is connected with the ceramic matrix through the adhesion promoter layer. Wherein the thickness of the ceramic matrix is 0.7mm, the thickness of the adhesion promoter layer is 22 μm, and the thickness of the fiber reinforced resin layer is 0.3 mm.
The manufacturing method of the shell assembly of the embodiment comprises the following steps:
and (3) taking the zirconia ceramic substrate, carrying out numerical control machining, cutting, grinding and thinning to obtain a sheet with the thickness of 0.3mm, and thus obtaining the ceramic substrate.
And cleaning the thinned ceramic matrix. The polyurethane type adhesion promoter is uniformly applied to the non-exterior surface of the ceramic substrate to form an adhesion promoter layer.
And after the surface of the adhesion promoter is dried, coating 3 layers of 1652E-glass epoxy resin prepreg to obtain a shell green body.
The other side of the shell green body, namely the appearance side of the ceramic substrate is tightly attached to the profiling single-side die.
And putting the profiling mold and the shell green body in the profiling mold into a high-temperature-resistant vacuum bag film integrally, vacuumizing and sealing.
Putting the vacuum bag film, the profiling mold therein and the shell green compact into a vacuum autoclave, pressurizing to 1.3MPa, slowly heating to 140 ℃ and keeping for 60 minutes. After the resin is completely cured, slowly cooling and reducing the pressure.
And (5) removing the vacuum bag film and demolding.
And processing the shell assembly obtained after demolding, including laser cutting, CNC cutting, grinding and polishing.
Example 3
The present embodiment provides a mobile phone including the housing assembly, the display assembly, and the circuit board provided in embodiment 1.
The display assembly and the shell assembly are connected, and an installation space is defined between the display assembly and the shell assembly. The circuit board is arranged in the mounting space and electrically connected with the display assembly.
Comparative example 1
The present comparative example provides a housing assembly and a method of making the same. The case assembly of this comparative example was made of zirconia ceramics and had a thickness of 0.3 mm.
Comparative example 2
The present comparative example provides a housing assembly and a method of making the same. The case component of the present comparative example includes a ceramic base and a fiber-reinforced resin layer. Wherein the thickness of the ceramic substrate is 0.6mm, and the thickness of the fiber reinforced resin layer is 0.32 mm.
The manufacturing method of the shell assembly of the embodiment comprises the following steps:
and (3) taking the zirconia ceramic substrate, carrying out numerical control machining, cutting, grinding and thinning to obtain a sheet with the thickness of 0.3mm, and thus obtaining the ceramic substrate.
And cleaning the thinned ceramic matrix. And 4 layers of 2116E-glass epoxy resin prepreg are pasted on the non-appearance surface of the ceramic matrix to obtain a shell green body.
The other side of the shell green body, namely the appearance side of the ceramic substrate is tightly attached to the profiling single-side die.
And putting the profiling mold and the shell green body in the profiling mold into a high-temperature-resistant vacuum bag film integrally, vacuumizing and sealing.
Putting the vacuum bag film, the profiling mold therein and the shell green compact into a vacuum autoclave, pressurizing to 1.3MPa, slowly heating to 140 ℃ and keeping for 40 minutes. After the resin is completely cured, slowly cooling and reducing the pressure.
And (5) removing the vacuum bag film and demolding.
And processing the shell assembly obtained after demolding, including laser cutting, CNC cutting, grinding and polishing.
The shell assemblies manufactured in the embodiments 1-2 and the comparative examples 1-2 are subjected to an impact resistance test, and whether the shell assembly cracks under the impact of the falling of the 32g steel ball at the height of 60cm is tested. The peel force test was performed on the case assemblies manufactured in examples 1 to 2 and comparative example 2, and the peel force between the ceramic base and the fiber reinforced resin layer having the dimensions of 20mm × 20mm was measured. The test results are shown in table 1 below.
TABLE 1
Impact resistance test Peel force test (N)
Example 1 Does not crack 26
Example 2 Does not crack 27
Comparative example 1 Cracking of —
Comparative example 2 Cracking of 5
From the above results, it is understood that examples 1 and 2, which are provided with the fiber reinforced resin layer, can resist the impact of the 32g steel ball falling at a height of 60cm without cracking, and have excellent impact toughness. The peel force between the fiber reinforced resin layer and the ceramic substrate in the case assembly obtained in example 1 was much higher than that in comparative example 2, which shows that the addition of the adhesion promoter layer can greatly improve the degree of the firm connection between the fiber reinforced resin layer and the ceramic substrate.
The shell assembly and the manufacturing method thereof can reduce the whole density of the shell assembly by arranging the fiber reinforced resin layer on the ceramic substrate, reduce the whole relative density to 4.0, reduce the density by 33 percent compared with the density of a pure ceramic material, and realize light weight. Because the cost of the pure ceramic material is higher, the cost can be reduced by partially replacing the shell component with the fiber reinforced resin layer. Meanwhile, the fiber reinforced resin layer has good toughness, so that the overall toughness of the shell assembly can be improved, the thickness of the shell assembly can be reduced under the condition of meeting the strength, and the lightness and thinness are realized. Above-mentioned shell assembly passes through adhesion promoter layer and connects fibre reinforced resin layer and ceramic base member, has improved the firm in connection degree between fibre reinforced resin layer and the ceramic base member by a wide margin, avoids appearing the phenomenon that drops.
Above-mentioned housing assembly has the advantage that density is low, light in weight, toughness is good, with low costs, has kept ceramic outward appearance texture, color and luster and sense of touch simultaneously, is applicable to very much the shell of preparation intelligent science and technology product, for example lid behind the cell-phone, panel computer back cover, notebook computer shell, intelligence wearing equipment shell, wireless charger shell etc. can also be used to shell or the decoration piece etc. of intelligence or traditional furniture product.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (13)

1. A shell component is characterized by comprising a ceramic matrix, an adhesion promoter layer and a fiber reinforced resin layer, wherein the fiber reinforced resin layer is connected with the ceramic matrix through the adhesion promoter layer.
2. The housing assembly of claim 1, wherein the ceramic substrate has a receiving cavity, and the adhesion promoter layer and the fiber-reinforced resin layer are both located in the receiving cavity.
3. The housing assembly of claim 1 wherein the fiber-reinforced resin layer comprises a resin matrix and reinforcing fibers filled in the resin matrix.
4. The housing assembly of claim 3, wherein the resin matrix is selected from at least one of epoxy resins and modified resins thereof, unsaturated polyesters and modified resins thereof, phenolic resins and modified resins thereof, vinyl resins and modified resins thereof.
5. The housing assembly of claim 3 wherein the reinforcing fibers are selected from at least one of glass fibers, carbon fibers, alumina fibers, polypropylene fibers, polyethylene fibers, aramid fibers, flax fibers, basalt fibers, and boron fibers.
6. The housing assembly of any of claims 1-5, wherein the adhesion promoter layer has a thickness of 10 μm to 50 μm; and/or
The thickness of the ceramic substrate is 0.2 mm-1.5 mm; and/or
The thickness of the fiber reinforced resin layer is 0.2 mm-1.5 mm.
7. The housing assembly of any of claims 1 to 5, wherein the ceramic substrate is at least one of a zirconia ceramic and a silicon nitride ceramic.
8. A housing assembly as claimed in any one of claims 1 to 5, wherein the adhesion promoter layer is formed from a polyurethane promoter.
9. The housing assembly according to any one of claims 1 to 5, wherein the relative density of the whole of the housing assembly is 2 to 5.
10. A method of making a housing assembly, comprising the steps of:
providing a ceramic matrix;
coating an adhesion promoter on the ceramic substrate;
after the surface of the bonding promoter layer is dried, adhering fiber reinforced prepreg on the bonding promoter layer to obtain a shell green body;
and heating and pressurizing the shell green body to obtain a shell assembly.
11. The method of making a housing assembly of claim 10, wherein said heat and pressure treatment comprises the steps of:
placing the shell green body into a profiling mold;
putting the profiling mold and the shell green compact into a vacuum bag film integrally, vacuumizing and sealing;
and putting the vacuum bag film, the profiling mold and the shell green compact into hot-pressing equipment for heating and pressing.
12. The method of manufacturing a housing assembly according to claim 10, wherein the heating temperature of the heating and pressurizing treatment is 60 ℃ to 150 ℃, the pressurizing pressure is 0.8MPa to 1.5MPa, and the pressure holding time is 3min to 180 min.
13. An electronic device, comprising:
a housing component produced by the housing component according to any one of claims 1 to 9 or the method for producing a housing component according to any one of claims 10 to 12;
and the electronic component is accommodated in the shell assembly.
CN202110510755.6A 2021-05-11 2021-05-11 Shell assembly, manufacturing method thereof and electronic equipment Pending CN113199825A (en)

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Publication number Priority date Publication date Assignee Title
CN114804893A (en) * 2022-05-17 2022-07-29 惠州市纵胜电子材料有限公司 Electronic product shell based on continuous ceramic fibers and preparation method thereof
CN115215683A (en) * 2022-08-05 2022-10-21 湖南柯盛新材料有限公司 Zirconia ceramic matrix with surface chain structure and preparation method and application thereof
WO2023231694A1 (en) * 2022-05-30 2023-12-07 荣耀终端有限公司 5d ceramic shell structure and 5d ceramic machining process method

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CN110774676A (en) * 2019-11-29 2020-02-11 Oppo广东移动通信有限公司 Shell assembly, preparation method and electronic equipment
CN111016328A (en) * 2019-12-31 2020-04-17 潮州三环（集团）股份有限公司 Ceramic and glass composite shell for mobile terminal to be light and thin

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Publication number Priority date Publication date Assignee Title
CN110774676A (en) * 2019-11-29 2020-02-11 Oppo广东移动通信有限公司 Shell assembly, preparation method and electronic equipment
CN111016328A (en) * 2019-12-31 2020-04-17 潮州三环（集团）股份有限公司 Ceramic and glass composite shell for mobile terminal to be light and thin

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114804893A (en) * 2022-05-17 2022-07-29 惠州市纵胜电子材料有限公司 Electronic product shell based on continuous ceramic fibers and preparation method thereof
WO2023231694A1 (en) * 2022-05-30 2023-12-07 荣耀终端有限公司 5d ceramic shell structure and 5d ceramic machining process method
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