CN113186584A - Small pipe outer wall electroplating device - Google Patents
Small pipe outer wall electroplating device Download PDFInfo
- Publication number
- CN113186584A CN113186584A CN202110457586.4A CN202110457586A CN113186584A CN 113186584 A CN113186584 A CN 113186584A CN 202110457586 A CN202110457586 A CN 202110457586A CN 113186584 A CN113186584 A CN 113186584A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- base
- anode
- cathode lead
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a small pipe outer wall electroplating device which comprises an electroplating groove seat, a double-layer glass electroplating groove, an end cover, a base, a cathode leading-out unit, an anode and an electroplating piece. The small-tube outer-wall electroplating device can realize electroplating operation on the outer wall of the tubular target object for actinides, has good electric field distribution and small solution amount, can perform sealing operation on a local area, can realize solution temperature control in the electroplating process, is convenient and fast to operate, and meets the operation requirement of a glove box.
Description
Technical Field
The invention belongs to the technical field of nuclei, particularly relates to the field of uranium target preparation, and particularly relates to a small pipe outer wall electroplating device.
Background
Uranium targets prepared by loading actinides materials such as uranium on tubular substrates are widely applied to the field of nuclear technology. At the present stage, the electroplating method is the most common preparation method of the uranium target due to simple instruments and convenient operation. Compared with the preparation of a planar uranium target, the preparation difficulty of the tubular uranium target is as follows: 1) the electric field distribution of the tubular uranium target is difficult to control; 2) local masking of tubular uranium targets is difficult if regional plating is required.
In general, the plating of a tubular target is carried out by suspending a plate anode and the target to be plated in a large plating bath, and connecting the electrode and the target with an anode and a cathode of a high voltage power supply, respectively. Meanwhile, in order to ensure uniformity, the target is required to rotate at a constant speed. The disadvantage of this method is that 1) if the suspension is not vertical, the bottom offset is easy to be large during the rotation process, and the plated part is not uniform. 2) If local electroplating is required, the mode such as masking by an adhesive tape can be adopted, and the phenomenon such as falling off is easy to occur in the electroplating process. 3) In this way, if the electric field distribution is required to be uniform in electroplating, the distance between the plate anode and the target is required to be large enough, which obviously causes the solution amount of the plating bath to be increased, and is not suitable for electroplating precious raw materials such as actinide materials.
Disclosure of Invention
In view of the above, the invention provides a small-tube outer-wall electroplating device for actinides, which has good uniform electric field distribution and small solution amount, can perform sealing operation on a local area, can realize temperature control of solution in an electroplating process, is convenient to operate, and meets the operation requirement of a glove box.
The invention specifically adopts the following technical scheme:
the device comprises an electroplating bath seat, a double-layer glass electroplating bath, an end cover, a base, a cathode lead-out unit, an anode and a plating part; wherein, the base is sequentially placed in the electroplating bath seat, the double-layer glass plating bath is placed on the upper surface of the base, and a sealing gasket is arranged between the lower end surface of the double-layer glass plating bath and the upper surface of the base; the anode is sleeved in the double-layer glass plating tank, an anode annular gasket is arranged between the double-layer glass plating tank and the contact surface of the anode, and the anode annular gasket is tightly contacted with the anode; the outer diameter of the anode is matched with the inner diameter of the double-layer glass plating tank; one end of the plating piece is inserted into the cathode lead-out unit, and the other end of the plating piece is inserted into the sealing gasket; the end cover is a round cover with internal threads, the center of the end cover is provided with a positioning hole, the periphery of the end cover is provided with three liquid injection ports, the end cover internally embedded with a shock absorption gasket is sleeved at the upper end of the cathode leading-out unit, and the shock absorption gasket is contacted with the anode annular gasket; the double-layer glass plating tank is tightly combined with the sealing gasket by rotating the end cover.
Further, the electroplating bath seat is of a cylindrical cup-shaped structure with a hollowed side wall, the top of the electroplating bath seat is provided with an external thread, the center of the bottom of the electroplating bath seat is provided with a circular groove, and a base is placed in the circular groove; the base is of an upper concave and lower convex structure, a circular groove is formed in the center of the upper surface of the base and used for installing one end of a plating piece, and the convex part of the lower surface of the base is embedded into the electroplating groove seat.
Furthermore, the upper side and the lower side of the double-layer glass plating tank are respectively provided with a water inlet and a water outlet, and constant-temperature circulating cooling water can be introduced between the water inlet and the water outlet, so that the temperature of the plating solution in the electroplating process is ensured to be at a constant temperature level.
Further, the anode is a cylindrical structure with an extension for connecting to the anode of an external power source.
Furthermore, the sealing gasket is placed in the groove of the base, the central hole of the sealing gasket corresponds to the mounting groove of the plated part of the base, the sealing gasket is used for sealing the bottom of the double-layer glass plating tank to prevent the plating solution from seeping out, and the central hole of the sealing gasket is used for ensuring the sealing of the non-plated area of the plated part.
Further, the cathode lead-out unit consists of a cathode lead-out body, a U-shaped sealing piece, a cathode contact, an adjusting spring, a pressure reducing spring and a cathode lead-out port, wherein the cathode lead-out body is a hollow inverted T-shaped insulating rod, the cathode contact sleeved with the adjusting spring is placed in the hollow interior of the cathode lead-out body, and the adjusting spring is locked in the cathode lead-out body through the cathode lead-out port with threads at the bottom; the periphery of the bottom of the cathode lead-out body is sleeved with a U-shaped sealing element, and the center of the bottom of the U-shaped sealing element is provided with a hole which corresponds to the center hole of the bottom of the cathode lead-out body and is used for installing a plated part; the pressure reducing spring is sleeved on the periphery of the middle part of the cathode lead-out body.
The small-tube outer-wall electroplating device can realize electroplating operation on the outer wall of the tubular target object for actinides, has good electric field distribution and small solution amount, can perform sealing operation on a local area, can realize solution temperature control in the electroplating process, is convenient and fast to operate, and meets the operation requirement of a glove box.
Drawings
FIG. 1 is a three-dimensional view of an electroplating apparatus according to the present invention;
FIG. 2 is a cross-sectional view of an electroplating apparatus according to the present invention;
FIG. 3 is a cross-sectional view of a cathode lead-out unit of the electroplating apparatus according to the present invention;
FIG. 4 is a top view of an end cap of an electroplating apparatus according to the present invention;
FIG. 5 is a three-dimensional view of an electroplating bath seat of the electroplating apparatus according to the present invention;
FIG. 6 is a three-dimensional view of an anode;
in the figure, 1, an electroplating bath seat 2, a double-layer glass plating bath 3, a sealing gasket 4, an end cover 5, a base 6, a cathode lead-out unit 7, a damping gasket 8, an anode annular gasket 9, an anode 10, a plating part 11, a cathode lead-out body 12, a U-shaped sealing part 13, a cathode contact 14, an adjusting spring 15, a pressure reducing spring 16 and a cathode lead-out port are arranged.
Detailed Description
The invention is further explained in detail below with reference to the drawings and examples.
In order to solve the problems of large plating liquid amount, uneven electric field distribution and difficult local masking of the traditional small pipe parts, the invention designs an actinide nuclide electroplating device for the outer wall of the small pipe. The device uses a small amount of plating solution, has uniform electric field distribution, does not need masking means such as tape winding and the like, and is particularly suitable for operation in a glove box of precious actinide raw materials.
Aiming at a typical plated part schematic diagram (a small tube consists of a plated area and a non-plated area) in the upper figure, the specific implementation mode is as follows;
the small pipe outer wall electroplating device comprises an electroplating bath seat 1, a double-layer glass electroplating bath 2, an end cover 4, a base 5, a cathode leading-out unit 6, an anode 9 and an electroplating piece 10; the connection relation is shown in figure 2, wherein a base 5 is sequentially placed in an electroplating bath seat 1, a double-layer glass plating bath 2 is placed on the upper surface of the base 5, and a sealing gasket 3 is arranged between the lower end surface of the double-layer glass plating bath 2 and the upper surface of the base 5; the anode 9 is sleeved in the double-layer glass plating tank 2, an anode annular gasket 8 is arranged between the contact surfaces of the double-layer glass plating tank 2 and the anode 9, and the anode annular gasket 8 is tightly contacted with the anode 9; the outer diameter of the anode 9 is matched with the inner diameter of the double-layer glass plating tank 2 and can be slightly smaller than the inner diameter of the double-layer glass plating tank 2, the small pipe outer wall electroplating device places the anode 9 with the anode annular gasket 8 in the double-layer glass plating tank 2, and the bottom of the anode 9 and the bottom of the double-layer glass plating tank 2 can be ensured to be horizontal by adjusting the thickness of the anode annular gasket 8; the plating piece 10 is a metal small pipe to be plated, one end of the plating piece is inserted into the cathode lead-out unit 6, and the other end of the plating piece is inserted into a small hole in the center of the sealing gasket 3; as shown in fig. 4, the end cap 4 is a round cap with internal threads, the center is provided with a positioning hole, the periphery is provided with three liquid injection ports, the central positioning small hole of the end cap 4, which is internally embedded with a shock absorption gasket 7, is sleeved at the upper end of the cathode lead-out unit 6, and the shock absorption gasket 7 is in contact with the anode ring gasket 8; the double-layer glass plating tank 2 is tightly combined with the sealing gasket 3 by rotating the end cover 4, so that the small pipe outer wall electroplating device is completely sealed.
After the electroplating device is completely assembled, the actinide nuclide electroplating solution is added into the plating tank through the liquid injection port of the end cover 4, meanwhile, the positive electrode of an external power supply is connected with the anode extension part of the anode 9, and the negative electrode is connected with the cathode lead-out port 16, so that a loop is formed in the system.
Further, as shown in fig. 5, the electroplating bath seat 1 is a cylindrical cup-shaped structure with a hollowed side wall, the top of the electroplating bath seat is provided with external threads, the center of the bottom of the electroplating bath seat is provided with a circular groove, and the base 5 is placed in the circular groove; the base 5 is of an upper concave and lower convex structure, a round groove is formed in the center of the upper surface of the base and used for installing one end of a plated part, and a convex part of the lower surface of the base is embedded into the electroplating groove seat 1.
Furthermore, the upper side and the lower side of the double-layer glass plating tank 2 are respectively provided with a water inlet and a water outlet, and constant-temperature circulating cooling water can be introduced between the water inlet and the water outlet, so that the temperature of the plating solution in the electroplating process is ensured to be constant.
Further, as shown in fig. 6, the anode 9 is shown as a cylindrical structure with an extension for connecting to the positive electrode of an external power source.
Further, the sealing gasket 3 is placed in the groove of the base 5, the small central hole of the sealing gasket 3 corresponds to the mounting groove of the plated part of the base 5, the sealing gasket 3 is used for sealing the bottom of the double-layer glass plating tank 2 to prevent the plating solution from seeping out, and the small central hole of the sealing gasket 3 is used for ensuring the sealing of the non-plated area of the plated part.
Further, as shown in fig. 3, the cathode lead-out unit 6 is composed of a cathode lead-out body 11, a U-shaped sealing member 12, a cathode contact 13, an adjusting spring 14, a pressure reducing spring 15 and a cathode lead-out port 16, wherein the cathode lead-out body 11 is a hollow inverted T-shaped insulating rod, a small hole is formed in the center of the bottom of the cathode lead-out body, and the small hole corresponds to the small hole formed in the center of the U-shaped sealing member 12 and the plated part mounting groove of the base 5 and is used for mounting a plated part. The cathode lead-out body 11 is hollow and provided with a cathode contact 13 sleeved with an adjusting spring 14, and the adjusting spring 14 is locked in the cathode lead-out body 11 by a cathode lead-out port 16 with threads at the bottom. The periphery of the bottom of the cathode lead-out body 11 is sleeved with a U-shaped sealing element 12, and a small hole is formed in the center of the bottom of the U-shaped sealing element 12, corresponds to the center hole of the bottom of the cathode lead-out body 11 and is used for installing a plated part. The pressure reducing spring 15 is sleeved on the periphery of the middle part of the cathode lead-out body 11.
Further, the pressure reducing spring 15 is used for reducing the longitudinal pressure of the plated part caused by the sealing cover, so that the plated part is not easy to deform. Because the deformation of the U-shaped sealing member 12 can lead the non-plating area of the plated piece to be partially exposed, in order to ensure the sealing performance between the plated piece and the U-shaped sealing member 12 and ensure good contact between the plated piece and the cathode contact 13, an adjusting spring 14 is additionally arranged between the cathode lead-out port 16 and the cathode contact 13. The processing size of the plated part has certain tolerance, and the verticality of the plated part can be ensured by the adjusting spring 13 and the pressure reducing spring 14 together.
The invention realizes the electroplating operation of the outer wall of the tubular target of actinides nuclide by utilizing the small-tube outer wall electroplating device, wherein the electroplating piece is effectively vertically placed in the positive center of the anode 9 through the electroplating piece mounting groove of the base 5 of the device and the positioning round hole at the center of the end cover 4, the complete consistency of the distance between each point of the electroplating piece in the Z-axis direction and the anode 9 can be ensured, and the uniform electric field distribution of the electroplating piece and the small amount of solution in the whole system are ensured. The sealing gasket 3 and the U-shaped sealing member 12 can realize effective sealing on the non-plating area of the plated part.
The device is simple to operate, and can be easily assembled and disassembled in the glove box without any auxiliary tool. The hollowed-out structure on the side surface of the electroplating groove seat 1 can facilitate the observation of the electroplating process in the experimental stage. The liquid injection port of the end cover 4 can realize the adding and taking of the electroplating liquid and the sampling in the process.
The invention has the following advantages:
1) the anode is fixedly suspended in the double-layer glass plating tank and the center of the end cover is provided with a hole for centering, so that the plated part is positioned at the center and has the same polar distance with the cylindrical mesh anode in each direction in the process of multiple times of electroplating, and the uniform plated part is obtained under the condition of no stirring. 2) Meanwhile, a sealing gasket 3 and a U-shaped sealing element 12 are designed for sealing common masking areas at two ends. 3) The position of a cathode contact can be adjusted by the cathode lead-out port 16, the adjusting spring 13 and the pressure reducing spring 14, so that the cathode is ensured to be in good contact, the pressure on a plated part is reduced, and when the diameter of the plated part is smaller, deformation such as bending is avoided when the material is softer.
When the processing size of the plated part has certain tolerance, the verticality of the plated part can be ensured by using the adjusting spring 13 and the pressure reducing spring 14 together.
The described embodiment of the invention is only one of the possibilities that is easy to implement. All relevant embodiments are exemplary and not exhaustive, and the invention is in no way limited to only these embodiments. Many modifications and variations are possible and apparent without departing from the scope and spirit of embodiments of the invention.
Claims (6)
1. The small pipe outer wall electroplating device is characterized by comprising an electroplating tank seat (1), a double-layer glass electroplating tank (2), an end cover (4), a base (5), a cathode leading-out unit (6), an anode (9) and an electroplating piece (10); wherein, a base (5) is sequentially placed in the electroplating bath seat (1), a double-layer glass plating bath (2) is placed on the upper surface of the base (5), and a sealing gasket (3) is arranged between the lower end surface of the double-layer glass plating bath (2) and the upper surface of the base (5); the anode (9) is sleeved in the double-layer glass plating tank (2), an anode annular gasket (8) is arranged between the contact surfaces of the double-layer glass plating tank (2) and the anode (9), and the anode annular gasket (8) is tightly contacted with the anode (9); the outer diameter of the anode 9 is matched with the inner diameter of the double-layer glass plating tank 2; one end of the plating piece (10) is inserted into the cathode lead-out unit (6), and the other end is inserted into the sealing gasket (3); the end cover 4 is a round cover with internal threads, the center of the end cover is provided with a positioning hole, the periphery of the end cover is provided with three liquid injection ports, the end cover (4) internally embedded with a shock absorption gasket (7) is sleeved at the upper end of the cathode leading-out unit (6), and the shock absorption gasket (7) is contacted with the anode annular gasket (8); the double-layer glass plating tank (2) is tightly combined with the sealing gasket (3) by rotating the end cover (4).
2. The small pipe outer wall electroplating device according to claim 1, wherein the electroplating bath base (1) is a cylindrical cup-shaped structure with a hollowed side wall, the top of the electroplating bath base is provided with external threads, the center of the bottom of the electroplating bath base is provided with a circular groove, and a base (5) is placed in the circular groove; the base (5) is of an upper concave and lower convex structure, a round groove is formed in the center of the upper surface of the base and used for installing one end of a plated part, and a convex part of the lower surface of the base is embedded into the electroplating groove seat (1).
3. The small pipe outer wall electroplating device according to claim 1, wherein the upper side and the lower side of the double-layer glass plating tank (2) are respectively provided with a water inlet and a water outlet, and constant temperature circulating cooling water can be introduced between the water inlet and the water outlet to ensure that the temperature of the plating solution is at a constant temperature level in the electroplating process.
4. The small tubed outer wall electroplating apparatus according to claim 1, characterized in that the anode (9) is a cylindrical structure with an extension for connecting to the positive pole of an external power source.
5. The small tubed outer wall electroplating device according to claim 1, characterized in that the sealing gasket (3) is placed in the groove of the base (5), the center hole of the sealing gasket (3) corresponds to the plating piece mounting groove of the base (5), the sealing gasket (3) is used for sealing the bottom of the double-layer glass plating tank (2) to prevent the plating solution from seeping out, wherein the center hole of the sealing gasket (3) is used for ensuring the sealing of the non-plating area of the plating piece.
6. The small tubed outer wall electroplating device according to claim 1, characterized in that the cathode lead-out unit (6) is composed of a cathode lead-out body (11), a U-shaped sealing member (12), a cathode contact (13), an adjusting spring (14), a pressure reducing spring (15) and a cathode lead-out port (16), wherein the cathode lead-out body (11) is a hollow inverted T-shaped insulating rod, the cathode contact (13) sleeved with the adjusting spring (14) is placed in the hollow interior of the cathode lead-out body (11), and the adjusting spring (14) is locked in the cathode lead-out body (11) by the cathode lead-out port (16) with threads at the bottom; the periphery of the bottom of the cathode lead-out body (11) is sleeved with a U-shaped sealing element (12), and the center of the bottom of the U-shaped sealing element (12) is provided with a hole which corresponds to the center hole of the bottom of the cathode lead-out body (11) and is used for installing a plated part; the pressure reducing spring (15) is sleeved on the periphery of the middle part of the cathode lead-out body (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110457586.4A CN113186584B (en) | 2021-04-27 | 2021-04-27 | Small pipe outer wall electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110457586.4A CN113186584B (en) | 2021-04-27 | 2021-04-27 | Small pipe outer wall electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113186584A true CN113186584A (en) | 2021-07-30 |
| CN113186584B CN113186584B (en) | 2022-11-04 |
Family
ID=76979231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110457586.4A Active CN113186584B (en) | 2021-04-27 | 2021-04-27 | Small pipe outer wall electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113186584B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000273698A (en) * | 1999-03-24 | 2000-10-03 | Electroplating Eng Of Japan Co | Cathode electrode for wafer plating |
| CN102031553A (en) * | 2011-01-11 | 2011-04-27 | 哈尔滨工业大学 | Local electroplating device for micro parts |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
| CN203625509U (en) * | 2013-12-09 | 2014-06-04 | 山西北方机械制造有限责任公司 | Solution plating device for inner hole of long and thin pipe fitting |
| CN104073863A (en) * | 2014-07-22 | 2014-10-01 | 天津工业大学 | Combined type device for plating MOF film through electrodeposition method |
| CN104762651A (en) * | 2015-03-03 | 2015-07-08 | 吉林安德电化科技有限公司 | Crystallizer internal surface electroplating production line and electroplating method thereof |
| CN204545353U (en) * | 2015-03-04 | 2015-08-12 | 吉林安德电化科技有限公司 | Internal surface of crystallizer electroplating device mounting structure |
| CN107052483A (en) * | 2017-03-30 | 2017-08-18 | 南京航空航天大学 | Insulation shielding jacking Electrolyzed Processing cathod system and processing method |
| CN109402692A (en) * | 2018-12-07 | 2019-03-01 | 中国航发南方工业有限公司 | Outer circle parcel plating part dress clip tool |
| CN111270282A (en) * | 2020-03-31 | 2020-06-12 | 重庆建设工业(集团)有限责任公司 | Power supply and mobile chromium plating device for single piece of slender pipe part with independent power supply |
| CN211227406U (en) * | 2019-10-23 | 2020-08-11 | 长春黄金研究院有限公司 | Annular anode experimental tank for electroplating or electroforming |
| CN211497844U (en) * | 2020-02-26 | 2020-09-15 | 俊杰机械(深圳)有限公司 | Layered electroplating shielding structure for tubular workpiece and electroplating anode hanger |
| CN112195497A (en) * | 2020-10-28 | 2021-01-08 | 重庆建设工业(集团)有限责任公司 | Controllable power supply and electrode automatic clamping device for deep small hole inner wall chromium plating |
-
2021
- 2021-04-27 CN CN202110457586.4A patent/CN113186584B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000273698A (en) * | 1999-03-24 | 2000-10-03 | Electroplating Eng Of Japan Co | Cathode electrode for wafer plating |
| CN102031553A (en) * | 2011-01-11 | 2011-04-27 | 哈尔滨工业大学 | Local electroplating device for micro parts |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
| CN203625509U (en) * | 2013-12-09 | 2014-06-04 | 山西北方机械制造有限责任公司 | Solution plating device for inner hole of long and thin pipe fitting |
| CN104073863A (en) * | 2014-07-22 | 2014-10-01 | 天津工业大学 | Combined type device for plating MOF film through electrodeposition method |
| CN104762651A (en) * | 2015-03-03 | 2015-07-08 | 吉林安德电化科技有限公司 | Crystallizer internal surface electroplating production line and electroplating method thereof |
| CN204545353U (en) * | 2015-03-04 | 2015-08-12 | 吉林安德电化科技有限公司 | Internal surface of crystallizer electroplating device mounting structure |
| CN107052483A (en) * | 2017-03-30 | 2017-08-18 | 南京航空航天大学 | Insulation shielding jacking Electrolyzed Processing cathod system and processing method |
| CN109402692A (en) * | 2018-12-07 | 2019-03-01 | 中国航发南方工业有限公司 | Outer circle parcel plating part dress clip tool |
| CN211227406U (en) * | 2019-10-23 | 2020-08-11 | 长春黄金研究院有限公司 | Annular anode experimental tank for electroplating or electroforming |
| CN211497844U (en) * | 2020-02-26 | 2020-09-15 | 俊杰机械(深圳)有限公司 | Layered electroplating shielding structure for tubular workpiece and electroplating anode hanger |
| CN111270282A (en) * | 2020-03-31 | 2020-06-12 | 重庆建设工业(集团)有限责任公司 | Power supply and mobile chromium plating device for single piece of slender pipe part with independent power supply |
| CN112195497A (en) * | 2020-10-28 | 2021-01-08 | 重庆建设工业(集团)有限责任公司 | Controllable power supply and electrode automatic clamping device for deep small hole inner wall chromium plating |
Non-Patent Citations (1)
| Title |
|---|
| 何遥 等: ""锕系核靶制备与应用"", 《强激光与粒子束》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113186584B (en) | 2022-11-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205115657U (en) | Rotatory device of electroplating of negative pole | |
| CN113186584B (en) | Small pipe outer wall electroplating device | |
| CN103512935A (en) | Electrolytic bath for testing coating electrochemical performance | |
| CN107164792B (en) | Prepare the magnetohydrodynamics electro-deposition method of high-resolution αsource | |
| CN109402687B (en) | Inner and outer surface chromium plating device for ball seat | |
| CN112301394B (en) | Plating cavity capable of improving uniformity of electroplated layer on inner surface of ring-shaped element | |
| CN107034512B (en) | Magnetohydrodynamics electrodeposition process prepares the precipitation equipment of high-resolution αsource | |
| CN206799779U (en) | Magnetohydrodynamics electrodeposition process prepares the precipitation equipment of high-resolution αsource | |
| CN108536197A (en) | A kind of porous air inlet Markov bottle and application method | |
| CN217717445U (en) | Bipolar plate micro-area electrochemical testing device | |
| CN110592632A (en) | Electrolytic reaction device suitable for porous metal composite flying piece electrodeposition | |
| CN203393253U (en) | Continuous electrolytic polishing device for metal wires | |
| CN205653526U (en) | Plating bath for adjustable volume's electrochemistry experiments | |
| CN210128950U (en) | Auxiliary cathode device for testing electrochemical performance of sacrificial anode | |
| CN103255444A (en) | Rotation and electricity-leading device with rotary cathode and revolute pair immersed in electroforming solution | |
| CN220352280U (en) | Porous radioactive source electrodeposition tank easy to disassemble and assemble | |
| CN220012845U (en) | Internal combustion engine cylinder batch coating device | |
| CN213417033U (en) | Is used for preparing63Four-hole electro-deposition tank device of Ni beta source | |
| CN111101148A (en) | Multipurpose columnar titanium anode and preparation method thereof | |
| CN211227404U (en) | Device for preparing electroplating source in cascade batch | |
| CN218147006U (en) | Anodic oxidation tool of drum class does not have hanging some part | |
| CN218621022U (en) | A auxiliary fixtures that is used for hemisphere harmonic oscillator vacuum coating | |
| CN213203253U (en) | Is used for preparing63Electrodeposition device of Ni beta source | |
| CN220132400U (en) | Electrolytic polishing batch hanging jig for inner holes of pipeline elbows | |
| CN110484952A (en) | A kind of piston junk to top surface range micro-arc oxidation process is equipped |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |