CN113185912A - Flexible thermal protection substrate for wearable electronic equipment and preparation method thereof - Google Patents
Flexible thermal protection substrate for wearable electronic equipment and preparation method thereof Download PDFInfo
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- CN113185912A CN113185912A CN202110281098.2A CN202110281098A CN113185912A CN 113185912 A CN113185912 A CN 113185912A CN 202110281098 A CN202110281098 A CN 202110281098A CN 113185912 A CN113185912 A CN 113185912A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
Abstract
A flexible thermal protective substrate for a wearable electronic device and a method of making the same, comprising: (1) fully mixing the microcapsule phase change material and the liquid silicone rubber prepolymer in proportion to obtain a blend; (2) spinning a layer of thermosetting coating on the substrate, and heating and curing on a hot plate to obtain a sacrificial layer; (3) directly spin-coating the blend on a substrate with a sacrificial layer, or pouring the blend in a mold without the sacrificial layer to obtain a primary blank; (4) placing the primary blank into vacuum equipment for degassing treatment, and removing air in the primary blank; (5) placing the degassed primary blank into an oven for heating and curing to obtain a thermal protection flexible substrate; (6) soaking the cured primary blank in a release solvent, and dissolving the sacrificial layer to release to obtain a flexible thermal protection substrate; or directly demoulding the solidified primary blank from the mould to obtain the flexible thermal protection substrate. By utilizing the invention, the prepared flexible thermal protection substrate is used for wearable electronic devices, and the problems of device heating and heat dissipation are solved.
Description
Technical Field
The invention belongs to the field of flexible thermal protection substrates, and particularly relates to a flexible thermal protection substrate for wearable electronic equipment and a preparation method thereof.
Background
With the continuous progress of material science and manufacturing technology, the society and the industry have made new requirements on the functionality, the portability, the comfort and the like of various electronic devices, and the flexible wearable electronic device has become an important development direction of new electronic devices. Compared with the traditional rigid electronic device, the wearable electronic device has the advantages of flexibility, elasticity and capability of bearing any deformation. Recent advances in mechanical design and materials have enabled high-performance wearable electronics with pre-diagnostic health management functions that can conformally contact human skin and accurately measure skin activity and physiological signals such as skin hydration, body temperature, blood flow, blood oxygenation, skin strain, blood glucose, and the like.
Many wearable electronics integrated on the skin consist of two parts: a functional electronic unit and a flexible substrate. The flexible substrate is skin-like flexible and has one side integrated with the functional electronic unit and the other side adhesively integrated on the skin. Functional electronic units often utilize light emitting diodes or thin film heaters that generate undesirable heat during operation that can cause discomfort or even damage to the skin tissue and, at the same time, can degrade device performance.
To reduce the undesirable thermal effects of wearable electronics, improvements to flexible substrates have been made primarily. Various types of silicone rubber are commonly used as flexible substrates, but the heat conduction coefficient of rubber materials is generally low, which is not favorable for heat dissipation.
The current improvement methods mainly comprise: 1) metal nanoparticles are mixed with the rubber matrix as a filler, but the metal particles introduced by this method weaken the flexibility of the rubber substrate; 2) the carbon nano tube or the graphene sheet is used as a filling material to be mixed with the rubber matrix, but the price of the carbon nano tube used by the method is high; 3) the phase change material (such as paraffin) is mixed with the rubber matrix, and the principle of phase change heat absorption is utilized to process the excessive heat, but the paraffin introduced by the method leaks from the rubber matrix in a liquid state.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides the flexible thermal protection substrate for the wearable electronic equipment and the preparation method thereof.
A method of making a flexible thermal protective substrate for a wearable electronic device, comprising the steps of:
(1) fully mixing the microcapsule phase change material and the liquid silicone rubber prepolymer in proportion to obtain a blend; the mass of the microcapsule phase change material accounts for 0-40% of the total mass of the blend;
the particle size of the microcapsule phase change material is 1-100 microns, the wall material thickness of the microcapsule phase change material is 0.2-10 microns, the capsule core of the microcapsule phase change material is paraffin, alcohol, inorganic salt, fatty acid or a compound of the paraffin, the alcohol, the inorganic salt and the fatty acid, and the wall material of the microcapsule phase change material is a high polymer material or an inorganic material;
the liquid silicon rubber prepolymer is a heat-vulcanized silicon rubber material or a room-temperature vulcanized silicon rubber material;
(2) spinning a layer of thermosetting coating on the substrate, and heating and curing on a hot plate to obtain a sacrificial layer;
(3) directly spin-coating the obtained mixture on a substrate with a sacrificial layer, or pouring the mixture in a mold without the sacrificial layer to obtain a primary blank;
(4) placing the primary blank into vacuum equipment for degassing treatment, and removing air in the primary blank;
(5) placing the degassed primary blank into an oven for heating and curing to obtain a thermal protection flexible substrate;
(6) soaking the cured primary blank in a release solvent, and dissolving the sacrificial layer to release to obtain a flexible thermal protection substrate;
or directly demoulding the solidified primary blank from the mould to obtain the flexible thermal protection substrate.
Preferably, in the step (1), the core of the microcapsule phase change material is high-purity n-paraffin wax, and the wall material of the microcapsule phase change material is urea-formaldehyde resin. The paraffin has higher specific heat capacity in solid and liquid states, and is beneficial to absorbing heat generated by wearable electrons. The urea-formaldehyde resin has low price and good film-forming property.
Preferably, in the step (1), the liquid silicone rubber prepolymer is a thermal vulcanization type silicone rubber using polydimethylsiloxane as a matrix, and the mass ratio of the body to the curing agent is 10: 1. the polydimethylsiloxane silica gel is non-toxic and free of peculiar smell, has good chemical stability, and is good in fluidity and easy to fuse with hollow glass beads.
Preferably, in the step (1), the mass of the microcapsule phase change material accounts for 40% of the total mass of the blend. Too high a proportion of doping can lead to conditions in which the final heat does not cure.
Preferably, in the step (1), the microcapsule phase change material and the liquid silicone rubber prepolymer are put into a mixing device with a stirring function for mixing. Sufficient mechanical agitation will increase the homogeneity of the composite.
Preferably, in the step (2), the substrate is a glass sheet or a silicon sheet with a diameter of 50-100 mm and a thickness of 0.5-2 mm.
Preferably, in the step (2), the thermosetting coating is a photoresist or a water-soluble sodium polystyrene sulfonate solution.
Preferably, in the step (2), a spin coater is selected for spin coating of the thermosetting coating, the rotation speed is preferably 1000 and 4000rpm, and the spin coating time is preferably 40-120 seconds.
In the step (3), the mold may be a groove with a regular pattern or a groove with an irregular pattern. The bottom surface of the groove is a smooth surface or a non-smooth surface with a structure. The material of the mould is aluminum alloy or polytetrafluoroethylene, and the depth of the groove of the mould is 0.05-3 mm.
Preferably, in the step (4), the duration of the degassing treatment is 4 to 12 hours.
Preferably, in step (5), the degassed blank is placed into an oven for heat curing, and is heated at 85 ℃ for 4 hours, followed by heating at 115 ℃ for 10 hours.
In the step (6), the selection of the release solvent is determined by the sacrificial layer, and when the thermosetting coating of the sacrificial layer is a photoresist, the release solvent is acetone; when the thermosetting coating of the sacrificial layer is sodium polystyrene sulfonate, the release solvent is selected to be water.
The invention also provides a flexible thermal protection substrate for wearable electronic equipment, which is prepared by adopting the preparation method.
Compared with the prior art, the invention has the following beneficial effects:
the preparation method of the flexible thermal protection substrate is scientific, reasonable, simple and feasible, and the cheap microcapsule phase change material is used for replacing expensive materials such as carbon nano tubes, graphene sheets and the like, so that the flexibility of the substrate is ensured, and the substrate has a heat absorption function.
Drawings
FIG. 1 is a graph comparing the thermal protection effect of comparative tests of examples of the present invention;
FIG. 2 is a graph showing the flexibility in comparative tests of examples of the present invention.
Detailed Description
The invention will be described in further detail below with reference to the drawings and examples, which are intended to facilitate the understanding of the invention without limiting it in any way.
A method for preparing a flexible thermal protection substrate for a wearable electronic device,
(1) mixing material
Fully mixing the microcapsule phase change material and the liquid silicone rubber prepolymer according to a proportion to obtain a blend.
Specifically, the microcapsule phase change material and the liquid silicone rubber prepolymer are put into a mixing device with a stirring function to be mixed. When the mixing equipment with the stirring function is used, the stirring speed can be set to be 800rpm, and the time duration is 10 minutes.
The microcapsule phase change material can be a commercial microcapsule phase change material, the phase change temperature is 28 ℃, the capsule core is high-purity n-paraffin wax, and the wall material is urea-formaldehyde resin wall material. The diameter of the microcapsule is 3-10 microns.
The liquid silicone rubber prepolymer is preferably polydimethylsiloxane prepolymer and is formed by mixing a body and a curing agent according to the mass ratio of 10: 1.
The proportion of the mass of the microcapsule phase change material to the total mass of the blend is preferably 40%.
(2) Sacrificial layer: a layer of thermosetting coating is spin-coated on the substrate and is heated and cured on a hot plate to obtain the sacrificial layer.
Specifically, the heat-curable coating is selected from a photoresist. Spin coating is carried out by a spin coater at 3000rpm, preferably for 40 seconds.
(3) Pouring: and pouring the mixture into a mold, or spin-coating the mixture on a substrate with a sacrificial layer to obtain a primary blank.
Specifically, the mold is a polytetrafluoroethylene cylindrical groove with a diameter of 30 mm and a depth of 3 mm.
(4) Vacuum: and (4) placing the primary blank into vacuum equipment for degassing treatment, and removing air in the primary blank.
(5) Curing and forming: and (4) putting the primary blank into an oven or a hot plate for heating and curing to obtain the thermal protection flexible substrate.
The molding conditions are as follows: the temperature was maintained at 85 degrees Celsius for 4 hours, followed by 115 degrees Celsius for 10 hours.
(6) Releasing: soaking the cured primary blank in a release solvent, and dissolving the sacrificial layer to release to obtain a flexible thermal protection substrate; or directly demoulding the solidified primary blank from the mould to obtain the flexible thermal protection substrate.
In order to verify the effect of the present invention, the flexible thermal protective substrate prepared by the above method was subjected to the following tests.
Test data 1-comparison of thermal protection effect.
According to the specific implementation method of the invention, a thermal protection substrate doped with 40% of microcapsule phase change material and a thermal protection substrate not doped with the microcapsule phase change material are prepared. A thin film heater is arranged on the upper surfaces of the two heat protection substrates to simulate the heating of the wearable electronic equipment, and then a thin film temperature sensor is arranged on the lower surface of the heat protection substrate to record the temperature. The experimental data are shown in fig. 1, and it can be seen that the thermal protection substrate doped with 40% of microcapsule phase change material has a very obvious thermal protection effect.
Test data 2-flexibility comparison.
According to the specific implementation method of the invention, thermal protection substrates doped with 10%, 20%, 30% and 40% of microcapsule phase change materials are prepared, and a thermal protection substrate not doped with the microcapsule phase change materials is prepared for comparison. Tensile rupture tests were conducted on each sample and the experimental data was analyzed to obtain the modulus of elasticity and the maximum elongation for each sample. The modulus of elasticity indicates the degree of softness and the maximum elongation indicates the flexibility. As shown in FIG. 2, as the doping ratio of the microcapsule phase change material is increased, the flexible thermal protection substrate becomes softer and more flexible.
The embodiments described above are intended to illustrate the technical solutions and advantages of the present invention, and it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, additions and equivalents made within the scope of the principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. A method for preparing a flexible thermal protection substrate for a wearable electronic device, comprising the steps of:
(1) fully mixing the microcapsule phase change material and the liquid silicone rubber prepolymer in proportion to obtain a blend; the mass of the microcapsule phase change material accounts for 0-40% of the total mass of the blend;
the particle size of the microcapsule phase change material is 1-100 microns, the wall material thickness of the microcapsule phase change material is 0.2-10 microns, the capsule core of the microcapsule phase change material is paraffin, alcohol, inorganic salt, fatty acid or a compound of the paraffin, the alcohol, the inorganic salt and the fatty acid, and the wall material of the microcapsule phase change material is a high polymer material or an inorganic material;
the liquid silicon rubber prepolymer is a heat-vulcanized silicon rubber material or a room-temperature vulcanized silicon rubber material;
(2) spinning a layer of thermosetting coating on the substrate, and heating and curing on a hot plate to obtain a sacrificial layer;
(3) directly spin-coating the obtained mixture on a substrate with a sacrificial layer, or pouring the mixture in a mold without the sacrificial layer to obtain a primary blank;
(4) placing the primary blank into vacuum equipment for degassing treatment, and removing air in the primary blank;
(5) placing the degassed primary blank into an oven for heating and curing to obtain a thermal protection flexible substrate;
(6) soaking the cured primary blank in a release solvent, and dissolving the sacrificial layer to release to obtain a flexible thermal protection substrate;
or directly demoulding the solidified primary blank from the mould to obtain the flexible thermal protection substrate.
2. The method for preparing the flexible thermal protection substrate for the wearable electronic device according to claim 1, wherein in the step (1), the core of the microcapsule phase change material is high-purity n-paraffin wax, and the wall material of the microcapsule phase change material is urea-formaldehyde resin.
3. The method for preparing the flexible thermal protection substrate for the wearable electronic device according to claim 1, wherein in the step (1), the liquid silicone rubber prepolymer is a thermal-vulcanized silicone rubber with polydimethylsiloxane as a matrix, and the mass ratio of the body to the curing agent is 10: 1.
4. the method for preparing the flexible thermal protection substrate for the wearable electronic device according to the claim 1, wherein in the step (2), the substrate is a glass sheet or a silicon sheet with a diameter of 50-100 mm and a thickness of 0.5-2 mm.
5. The method for preparing a flexible thermal protective substrate for a wearable electronic device according to claim 1, wherein in step (2), the thermal curable coating is a photoresist or a water-soluble sodium polystyrene sulfonate solution.
6. The method for preparing the flexible thermal protection substrate for the wearable electronic device according to claim 1, wherein in the step (3), the mold is made of aluminum alloy or polytetrafluoroethylene, and the depth of the groove of the mold is 0.05-3 mm.
7. The method for preparing a flexible thermal protection substrate for a wearable electronic device according to claim 1, wherein in the step (4), the degassing treatment is carried out for 4-12 hours.
8. The method for preparing a flexible thermal protective substrate for a wearable electronic device as claimed in claim 1, wherein in the step (5), the degassed blank is placed in an oven for heat curing, and is heated at 85 ℃ for 4 hours, and then heated at 115 ℃ for 10 hours.
9. The method for preparing the flexible thermal protection substrate for the wearable electronic device according to the claim 1, wherein in the step (6), the selection of the releasing solvent is determined by the sacrificial layer, and when the thermosetting coating of the sacrificial layer is a photoresist, the releasing solvent is selected from acetone; when the thermosetting coating of the sacrificial layer is sodium polystyrene sulfonate, the release solvent is selected to be water.
10. A flexible thermal protection substrate for wearable electronic equipment, which is prepared by the preparation method of any one of claims 1 to 9.
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Cited By (1)
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| CN114098746A (en) * | 2021-10-18 | 2022-03-01 | 中国科学院深圳先进技术研究院 | Ultra-narrow high-density flexible electrode with multiple relatively independent channels and preparation method and application thereof |
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