CN113182704A - Laser cutting method, control device and system - Google Patents
Laser cutting method, control device and system Download PDFInfo
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- CN113182704A CN113182704A CN202110473367.5A CN202110473367A CN113182704A CN 113182704 A CN113182704 A CN 113182704A CN 202110473367 A CN202110473367 A CN 202110473367A CN 113182704 A CN113182704 A CN 113182704A
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 238
- 238000000034 method Methods 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 251
- 238000005520 cutting process Methods 0.000 claims abstract description 179
- 238000012545 processing Methods 0.000 claims abstract description 38
- 238000003754 machining Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 abstract description 12
- 238000002360 preparation method Methods 0.000 abstract description 6
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- 150000001247 metal acetylides Chemical class 0.000 description 6
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The embodiment of the application provides a laser cutting method, a control device and a system, after a target substrate is cut into a plurality of unit substrates by controlling a laser cutting device based on first laser power, the laser cutting lines are aligned to the substrate edge lines of the unit substrates by controlling the laser cutting device, then controlling the laser cutting equipment to carry out laser cutting on the unit substrate for a plurality of times within a preset cutting range by taking the edge line of the substrate as a reference line on the basis of a second laser power smaller than the first laser power, therefore, the cutting error range and the laser processing error range of the substrate can be effectively covered, the problem of carbide adhesion caused by processing errors is prevented, secondary cutting is carried out by adopting second laser power with lower power, the thermal influence on the substrate material is smaller, so that the carbide formed by secondary cutting is reduced, and the condition that the panel product is burnt due to short circuit in the preparation process is effectively avoided.
Description
Technical Field
The application relates to the technical field of manufacturing processes of flexible display panels, in particular to a laser cutting method, a control device and a system.
Background
In the related art, after the substrate is cut into a plurality of unit substrates by using a laser, a large amount of carbide having a conductive property is generally formed at the edge of the unit substrate due to laser burning and material properties of the substrate itself, which may cause a situation that when an FPC (Flexible Printed Circuit) is pressed against a Pin-side Circuit, there may be conductive communication with the carbide to cause a short Circuit, thereby causing a burn of a panel product.
Disclosure of Invention
Based on the defects of the existing design, the application provides a laser cutting method, a control device and a system, which can reduce carbide formed by cutting and effectively avoid the condition that a panel product is burnt due to short circuit in the preparation process.
According to a first aspect of the present application, there is provided a laser cutting method applied to a computer terminal in a laser cutting system, the laser cutting system further including a laser cutting device connected to the computer terminal, the method including:
controlling the laser cutting apparatus to cut a target substrate into a plurality of unit substrates based on a first laser power;
controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy;
and controlling the laser cutting equipment to perform multiple times of laser cutting on the unit substrate within a preset cutting range by taking the substrate edge line as a reference line based on second laser power, wherein the second laser power is smaller than the first laser power.
So, can effectively cover base plate cutting error range and laser beam machining error range, prevent to lead to the adhesion problem of carbide because of the machining error to adopt the less second laser power of power to carry out the secondary cutting, it is littleer to the heat influence of base plate material, thereby reduce the carbide that the secondary cutting formed, effectively avoid appearing the short circuit in the preparation process and arouse the condition of panel product burn.
In a possible implementation manner of the first aspect, the laser cutting system further includes a vision collecting device connected to the computer terminal, and the unit substrate is provided with a laser alignment mark;
the step of controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy comprises the following steps:
acquiring a substrate image of the unit substrate acquired by the vision acquisition device;
identifying the position coordinates of the laser alignment marks of the unit substrates in the substrate images;
and controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate according to the relation between the position coordinate and the reference coordinate corresponding to the substrate edge line.
Therefore, the laser cutting equipment is controlled to align the laser cutting line to the substrate edge line of the unit substrate through the laser alignment mark arranged on the unit substrate, so that the subsequent laser cutting is facilitated.
In a possible implementation manner of the first aspect, the laser cutting system further includes a vision collecting device connected to the computer terminal, and the step of controlling the laser cutting device to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment policy includes:
acquiring a substrate image of the unit substrate acquired by the vision acquisition device;
identifying a substrate edge position of the unit substrate in the substrate image;
and controlling the laser cutting equipment to align the laser cutting lines to the substrate edge lines of the unit substrates according to the substrate edge positions.
Therefore, by the image recognition method of the edge position of the substrate, the laser cutting equipment is controlled to align the laser cutting line to the substrate edge line of the unit substrate, so that the subsequent laser cutting is convenient.
In a possible implementation manner of the first aspect, the step of controlling the laser cutting apparatus to perform a plurality of laser cuts on the unit substrate within a preset cutting range with the substrate edge line as a reference line based on the second laser power includes:
acquiring a target error of the laser cutting equipment according to preset configuration parameters of the laser cutting equipment;
determining a preset cutting range with the edge line of the substrate as a reference line according to the target error;
determining the number of cutting lines in the preset cutting range according to the preset cutting range and the width of the cutting lines of the laser cutting equipment, and determining cutting nodes of each corresponding laser cutting line in the preset cutting range based on the number of the cutting lines;
and controlling the laser cutting equipment to be in the preset cutting range, and respectively carrying out laser cutting on the unit substrate for multiple times according to the cutting node of each corresponding laser cutting line in the preset cutting range.
Thus, the target error of the laser cutting equipment is determined through the preset configuration parameters of the laser cutting equipment, so that the target error is associated with the configuration of the laser cutting equipment, and then the preset cutting range with the substrate edge line as the reference line is determined according to the target error, so that the cutting node of each corresponding laser cutting line in the preset cutting range is determined, and therefore, the unit substrate is subjected to multiple laser cutting according to the cutting node of each corresponding laser cutting line in the preset cutting range in a targeted manner, and the problem of carbide adhesion caused by processing errors is solved.
In a possible implementation manner of the first aspect, the step of obtaining a target error of the laser cutting device according to a preset configuration parameter of the laser cutting device includes:
acquiring a substrate cutting processing error and a laser processing error of the laser cutting equipment;
and determining the substrate cutting machining error, the laser machining error, the sum of the substrate cutting machining error and the laser machining error, or the weighted error of the substrate cutting machining error and the laser machining error as a target error of the laser cutting equipment.
So, in laser cutting's control process, the base plate cutting machining error and the laser beam machining error of laser cutting equipment have specifically been considered, and then can effectively cover base plate cutting error range and laser beam machining error range, prevent to lead to the adhesion problem of carbide because of the machining error.
In a possible implementation manner of the first aspect, the step of determining a preset cutting range with the edge line of the substrate as a reference line according to the target error includes:
and determining the range and the value of the maximum positive direction range and the maximum negative direction range of the reference line as the target error by taking the edge line of the substrate as the reference line, wherein the range union of the maximum positive direction range and the maximum negative direction range is the preset cutting range.
Therefore, the range and the value of the maximum positive direction range and the maximum negative direction range of the reference line are determined as the target error, the multidirectional range with the substrate edge line as the reference line can be covered, the substrate cutting error range and the laser processing error range can be effectively covered, and the problem of carbide adhesion caused by processing errors is prevented.
In a possible implementation manner of the first aspect, the step of determining the number of cutting lines within the preset cutting range according to the preset cutting range and the cutting line width of the laser cutting line of the laser cutting device includes:
and determining the integral ratio of the preset cutting range to the cutting line width as the number of the cutting lines in the preset cutting range.
According to a second aspect of the present application, there is provided a laser cutting control device applied to a computer terminal in a laser cutting system, the laser cutting system further includes a laser cutting device connected to the computer terminal, the laser cutting control device includes:
a first cutting module for controlling the laser cutting apparatus to cut a target substrate into a plurality of unit substrates based on a first laser power;
the control module is used for controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy;
and the second cutting module is used for controlling the laser cutting equipment to perform multiple times of laser cutting on the unit substrate within a preset cutting range by taking the edge line of the substrate as a reference line based on second laser power, wherein the second laser power is smaller than the first laser power.
According to a third aspect of the present application, there is provided a laser cutting system comprising a computer terminal and a laser cutting device connected with the computer terminal;
the computer terminal is specifically configured to:
controlling the laser cutting apparatus to cut a target substrate into a plurality of unit substrates based on a first laser power;
controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy;
and controlling the laser cutting equipment to perform multiple times of laser cutting on the unit substrate within a preset cutting range by taking the substrate edge line as a reference line based on second laser power, wherein the second laser power is smaller than the first laser power.
In a possible embodiment of the third aspect, the power of the second laser power is in the range of 4-8W.
Based on any one of the above aspects, according to the present application, after the target substrate is cut into the plurality of unit substrates by the laser cutting device controlled based on the first laser power, the laser cutting device is controlled to align the laser cutting line to the substrate edge line of the unit substrate, and then the laser cutting device is controlled based on the second laser power smaller than the first laser power to perform the laser cutting on the unit substrate for a plurality of times within the preset cutting range taking the substrate edge line as the reference line, so that the substrate cutting error range and the laser processing error range can be effectively covered, the adhesion problem of the carbide due to the processing error is prevented, and the secondary cutting is performed by using the second laser power with smaller power, so that the thermal influence on the substrate material is smaller, thereby reducing the carbide formed by the secondary cutting, and effectively avoiding the situation of the panel product burn caused by the short circuit in the preparation process.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic view illustrating an application scenario of a laser cutting system provided in an embodiment of the present application;
fig. 2 is a schematic view illustrating a substrate cutting in the related art;
fig. 3 is a schematic flow chart illustrating a laser cutting method provided in an embodiment of the present application;
fig. 4 shows one of the substrate cutting diagrams provided by the embodiments of the present application;
FIG. 5 shows one of the sub-step flow diagrams of step S120 shown in FIG. 3;
fig. 6 is a second schematic diagram illustrating a substrate cutting process according to an embodiment of the present disclosure;
FIG. 7 shows a second flow diagram of the substeps of step S120 shown in FIG. 3;
FIG. 8 is a flow chart illustrating the sub-steps of step S130 shown in FIG. 3;
FIG. 9 is a schematic diagram illustrating functional modules of a laser cutting control device provided by an embodiment of the present application;
fig. 10 shows a schematic block diagram of a structure of a computer terminal for implementing the laser cutting method according to an embodiment of the present application.
Detailed Description
In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it should be understood that the drawings in the present application are for illustrative and descriptive purposes only and are not used to limit the scope of protection of the present application. Additionally, it should be understood that the schematic drawings are not necessarily drawn to scale. The flowcharts used in this application illustrate operations implemented according to some of the embodiments of the present application.
It should be understood that the operations of the flow diagrams may be performed out of order, and steps without logical context may be performed in reverse order or simultaneously. One skilled in the art, under the guidance of this application, may add one or more other operations to, or remove one or more operations from, the flowchart.
Referring to fig. 1, an application scenario diagram of a laser cutting system according to an embodiment of the present application is shown first. In this embodiment, the laser cutting system may include a computer terminal 100, a laser cutting apparatus 200, and a vision acquisition device 300.
The computer terminal 100 may be any computer device with computing processing capability, such as a server.
The laser cutting device 200 may be configured to perform laser cutting on a substrate, for example, a high-power-density laser beam may be used to irradiate the substrate, so that a substrate material is heated to a vaporization temperature quickly and evaporated to form a hole, and the hole continuously forms a slit with a narrow width along with the movement of the substrate material by the beam, thereby completing the cutting of the substrate.
The vision collecting device 300 may be configured to collect vision of the substrate, so that the computer terminal 100 controls the laser cutting apparatus 200 to perform alignment during the cutting process. The vision collecting Device 300 may be an image collecting Device, and may include, but is not limited to, a CMOS (Complementary Metal Oxide Semiconductor) image collecting Device and a CCD (Charge-coupled Device) image collecting Device, for example, the substrate may be converted into an image signal and transmitted to the computer terminal 100, and the computer terminal 100 may convert the image signal into a digital signal according to information such as pixel distribution, brightness, and color, and perform various operations on the digital signal to extract characteristics of the substrate, and further control the cutting operation of the laser cutting apparatus 200 according to the result of the determination.
Referring to fig. 2, in the related art, after the laser cutting apparatus 200 is aligned within a certain range (e.g., 0.3mm) of the Pin end margin (e.g., by the alignment mark AA 1), the Green laser is used to perform a secondary cutting on the Pin end margin 22, so that the carbide 24 formed in the previous stage is removed along with the Pin end margin 22, and the problem of carbide 24 residue can be improved to some extent. However, as a result of the intensive research of the present inventors, it is found that, during the laser cutting process of the unit substrate 20, the unit substrate 20 is not completely in a flat state, but a partial region (such as the Pin end edge region 22) is in a deformed state, in this case, the Pin end edge region 22 has a certain probability of not completely falling off, and there is still a risk of burning the panel product; and in the subsequent reworking and appearance inspection processes, labor waste is also caused to a certain extent.
It should be noted that the above prior art solutions have defects which are the results of practical and careful study by the inventor, therefore, the discovery process of the above technical problems and the solutions proposed by the following embodiments of the present application for the above problems should be the contribution of the inventor to the present application in the course of the invention creation process, and should not be understood as technical contents known by those skilled in the art.
Based on the above technical problems discovered by the inventors, the embodiments of the present application provide an improved laser cutting method, after controlling the laser cutting apparatus 200 to cut a target substrate into a plurality of unit substrates 20 based on a first laser power, aligning a laser cutting line to a substrate edge line of the unit substrate 20 by controlling the laser cutting apparatus 200, and then controlling the laser cutting apparatus 200 to perform a plurality of laser cuts on the unit substrate 20 within a preset cutting range with the substrate edge line as a reference line based on a second laser power smaller than the first laser power. For example, the laser cutting may be performed a plurality of times at different positions within a preset cutting range with the edge line of the substrate as a reference line.
From this, can effectively cover base plate cutting error range and laser beam machining error range, prevent to lead to carbide 24's adhesion problem because of the machining error to adopt the less second laser power of power to carry out the secondary cutting, the heat influence to the base plate material is littleer, thereby reduces carbide 24 that the secondary cutting formed, effectively avoids appearing the short circuit in the preparation process and arouses the condition of panel product burn.
The laser cutting method provided by the embodiment of the present application will be exemplarily described below with reference to fig. 3, and the laser cutting method can be executed by the computer terminal 100 shown in fig. 1 or other computer devices with computing processing capability. It should be understood that in other embodiments, the order of some steps in the laser cutting method of the present embodiment may be interchanged according to actual needs, or some steps may be omitted or deleted.
Referring to fig. 3, the laser cutting method may include the following steps, which are described in detail below.
In step S110, the laser cutting apparatus 200 is controlled to cut the target substrate into the plurality of unit substrates 20 based on the first laser power.
Step S120, based on the preset alignment strategy, controlling the laser cutting device 200 to align the laser cutting line to the substrate edge line of the unit substrate 20.
Step S130, based on a second laser power, controlling the laser cutting device 200 to perform multiple laser cutting on the unit substrate 20 within a preset cutting range using the substrate edge line as a reference line, wherein the second laser power is smaller than the first laser power.
In this embodiment, in the first laser cutting stage, the first laser power with higher power may be used to control the laser cutting device 200 to cut the target substrate into a plurality of unit substrates 20, and the specific cutting number and the cutting shape may be set according to actual design requirements, which is not specifically limited herein.
In the present embodiment, after the laser cutting apparatus 200 is controlled to cut the target substrate into the plurality of unit substrates 20, it is necessary to perform secondary cutting for each unit substrate 20 to remove the carbides 24 remaining on the unit substrate 20, considering that the carbide 24 having the conductive property may remain on the cut unit substrate 20. Before the secondary cutting, in order to ensure the accuracy of the secondary cutting, the laser cutting device 200 needs to be controlled to align the laser cutting line to the substrate edge line of the unit substrate 20 based on a preset alignment strategy. It is understood that the substrate edge line may refer to an edge contour line of the unit substrate 20, an arbitrary line within a range (e.g., 0.3mm) near the edge contour line of the unit substrate 20, or a pre-specified line, and is not particularly limited herein.
In the secondary cutting process, the laser cutting device 200 can be controlled to perform multiple laser cutting on the unit substrate 20 within a preset cutting range by taking the substrate edge line as a reference line based on the second laser power smaller than the first laser power, so that the substrate cutting error range and the laser processing error range can be effectively covered, the adhesion problem of carbides 24 caused by processing errors is prevented, the secondary cutting is performed by adopting the second laser power with smaller power, the heat influence on the substrate material is smaller, the carbides 24 formed by the secondary cutting are reduced, and the condition that a panel product is burnt due to short circuit in the preparation process is effectively avoided.
In one possible embodiment, the power of the second laser power may be in a range of 4-8W, for example, 4-5W, 4-6W, 4-7W, 4-8W, or 5-6W, 5-7W, 5-8W, or 6-7W, 6-8W, and the second laser power may be 5W for example.
In one possible embodiment, the laser emission speed of the second laser power may be 4000mm/s to 6000mm/s, such as 4000mm/s to 4500mm/s, 4000mm/s to 5000mm/s, 4000mm/s to 5500mm/s, 4500mm/s to 5000mm/s, 4500mm/s to 5500mm/s, 5000mm/s to 5500mm/s, 5500mm/s to 6000mm/s, and the like.
In the related art, the carbides 24 on the unit substrate 20 are fused by generating thermal energy for each laser cutting line, generally, the number of times of processing for each laser cutting line is 15-20 times, and the laser power thereof is generally high (greater than 10W), which may result in easy cutting of the material on the unit substrate 20 in the process of removing the carbides 24 on the upper surface of the unit substrate 20, and new carbides 24 may be generated on the surface of the unit substrate 20 after cutting of the material on the unit substrate 20, resulting in a complicated processing process.
Based on this, in one possible embodiment, in the process of controlling the laser cutting apparatus 200 to perform the multiple laser cutting on the unit substrate 20 within the preset cutting range with the substrate edge line as the reference line based on the second laser power, after the test and study of the inventors of the present application, the processing frequency of each laser cutting line may range from 6 to 10, and compared with the processing frequency (e.g., 15 to 20) of the related art, the processing frequency is smaller and the laser power is lower, so that the carbide 24 on the upper surface of the unit substrate 20 can be effectively eliminated, the material on the unit substrate 20 can not be cut off, and the generation of new carbide 24 on the surface of the unit substrate 20 is avoided.
In one possible embodiment, regarding step S120, a process of controlling the laser cutting apparatus 200 to align the laser cutting line to the substrate edge line of the unit substrate 20 will be exemplarily described below with reference to two possible examples.
Exemplary protocol A:
referring to fig. 4, the unit substrate 20 may be provided with a laser alignment mark AA1, and the laser alignment mark AA1 may be configured to perform image analysis by the computer terminal 100 after the vision acquisition device 300 acquires an image of the unit substrate 20, so as to provide a reference position for the laser cutting device 200 during the laser alignment process. The specific shape of the laser alignment mark AA1 can be flexibly set according to actual design requirements, which is not specifically limited in this embodiment.
On this basis, step S120 may be implemented by the exemplary sub-steps shown in fig. 5, which are described in detail below.
In the substep S121, the substrate image of the unit substrate 20 acquired by the vision acquisition apparatus 300 is acquired.
In this embodiment, before performing the secondary cutting of the carbide 24, the computer terminal 100 may control the vision collecting device 300 to collect substrate images of the unit substrate 20 that needs to be subjected to the secondary cutting of the carbide 24, where the collected substrate images may be one or more, for example, may be a plurality of consecutive substrate image frames. In addition, in order to improve the accuracy of alignment, the dithering amplitude of the adjacent substrate image frames can be detected in real time, and the substrate image frames with the dithering amplitude larger than the preset amplitude are removed.
In the substep S122, the position coordinates of the laser alignment mark AA1 of the unit substrate 20 in the substrate image are identified.
And a substep S123 of controlling the laser cutting apparatus 200 to align the laser cutting line to the substrate edge line of the unit substrate 20 according to the relationship between the position coordinates and the reference coordinates corresponding to the substrate edge line.
In the present embodiment, referring to fig. 4, by identifying the position coordinates of the laser alignment mark AA1 of the unit substrate 20 in the substrate image, the position coordinates can be used for comparing the reference coordinates corresponding to the substrate edge lines of the unit substrate 20, so as to determine the orientation relationship between the substrate edge lines of the unit substrate 20 and the laser cutting lines of the laser cutting device 200, for example, the laser cutting device 200 can be controlled to align the laser cutting lines to the substrate edge lines of the unit substrate 20 according to the relationship between the position coordinates and the reference coordinates corresponding to the substrate edge lines. In this way, a preset cutting range with the substrate edge line as a reference line may be determined, which may cover the Pin edge region 22 and the carbide region 24 of the unit substrate 20, and may include a plurality of laser cutting lines made of dotted lines shown in fig. 4.
Exemplary scheme B:
referring to fig. 6 in combination, in another possible implementation, step S120 may be implemented by the exemplary sub-steps shown in fig. 7, which are described in detail below.
In the substep S124, the substrate image of the unit substrate 20 captured by the vision capturing device 300 is acquired.
In substep S125, the substrate edge position of the unit substrate 20 in the substrate image is identified.
For example, an edge detection algorithm may be employed to identify the substrate edge position of a unit substrate 20 in the substrate image. By edge is meant the collection of pixels whose surrounding pixels have sharply changed grey levels, and in edge detection, the region can be determined from the closed edge by extracting the features of the discontinuities in the substrate image. Illustratively, the edge can be roughly divided into two types, one type is a step-like edge, and the gray values of pixels on two sides of the edge are obviously different; the other is a roof-shaped edge, and the edge is positioned at a turning point of the change of the gray value from small to large to small. The main tool for edge detection is an edge detection template, which may include, but is not limited to, Laplacian operator, Roberts operator, Sobel operator, log (Laplacian-Gauss) operator, Kirsch operator, Prewitt operator, and the like, and is not limited thereto.
And a substep S126 of controlling the laser cutting apparatus 200 to align the laser cutting line to the substrate edge line of the unit substrate 20 according to the substrate edge position.
In this embodiment, after the substrate edge position of the unit substrate 20 in the substrate image is determined, the position relationship between the current position of the laser cutting line of the laser cutting device 200 and the substrate edge position may be determined, so that after the alignment planning path is determined, the laser cutting device 200 is controlled to align the laser cutting line to the substrate edge line of the unit substrate 20. In this way, a preset cutting range AA2 with the substrate edge line as a reference line may be determined, the preset cutting range AA2 may cover the Pin end edge region 22 and the carbide region 24 of the unit substrate 20, and may include a plurality of laser cutting lines made of dotted lines shown in fig. 6.
In one possible implementation, please refer to fig. 8 in combination, and regarding step S130, the following exemplary sub-steps can be implemented, which are described in detail below.
And a substep S131 of obtaining a target error of the laser cutting device 200 according to preset configuration parameters of the laser cutting device 200.
For example, through research by the present inventors, it was found that, during the operation of the laser cutting apparatus 200, the main errors affecting the laser cutting process are derived from the substrate cutting processing error Δ X1 and the laser processing error Δ X2, and therefore, the substrate cutting processing error Δ X1 and the laser processing error Δ X2 of the laser cutting apparatus 200 can be obtained, and then the substrate cutting processing error Δ X1, or the laser processing error Δ X2, or the sum of the substrate cutting processing error Δ X1 and the laser processing error Δ X2 (Δ X1+ Δ X2), or the weighted error of the substrate cutting processing error Δ X1 and the laser processing error Δ X2 (w1 × Δ X1+ w2 × 2) is determined as the target error C of the laser cutting apparatus 200.
In the substep S132, a predetermined cutting range AA2 with the edge line of the substrate as a reference line is determined according to the target error.
For example, the substrate edge line may be used as a reference line, and the ranges and values of the maximum positive direction range and the maximum negative direction range of the reference line may be determined as the target error, where the ranges of the maximum positive direction range and the maximum negative direction range are merged to the preset cutting range AA 2.
For example, referring to fig. 4 and 6, the edge line of the substrate is L1, the edge line of the maximum positive direction range of the edge line of the substrate is L2, and the edge line of the maximum negative direction range of the edge line of the substrate is L3, then L1-L2 is the maximum positive direction range Q1, L1-L3 is the maximum negative direction range Q2, the ranges and values of Q1 and Q2 are target errors, and the ranges of Q1 and Q2 are merged into the preset cutting range AA 2.
The substep S133 determines the number of cutting lines within the preset cutting range according to the preset cutting range and the width of the cutting lines of the laser cutting line of the laser cutting device 200, and determines a cutting node of each corresponding laser cutting line within the preset cutting range based on the number of cutting lines.
For example, in one possible embodiment, the integer ratio AA2/W of the preset cutting range AA2 to the width W of the cutting line may be determined as the number of cutting lines within the preset cutting range AA 2. For example, the predetermined cutting range AA2 is 1.2mm, and the width W of the cutting line is 0.1mm, then the number of the cutting lines in the predetermined cutting range AA2 is 12, that is, the predetermined cutting range AA2 may include 12 laser cutting lines, so that the cutting nodes (i.e., cutting positions) of the 12 laser cutting lines in the AA2 range may be sequentially configured, and compared with performing laser cutting with 1 laser cutting line in the related art, a larger error range may be covered, and the problem of adhesion of the carbide 24 due to the processing error is prevented.
And a substep S134 of controlling the laser cutting device 200 to perform multiple laser cutting on the unit substrate 20 within a preset cutting range according to the cutting node of each corresponding laser cutting line within the preset cutting range.
For example, taking the foregoing example as an example, the laser cutting apparatus 200 may be controlled to perform the laser cutting on the unit substrates 20 a plurality of times respectively at the cutting nodes of each corresponding laser cutting line within the preset cutting range AA2 within the range of AA2 shown in fig. 4 or 6. If the cutting nodes within the preset cutting range AA2 include the cutting node 1, the cutting node 2, and the cutting node 12, the unit substrate 20 may be laser-cut a plurality of times at the laser cutting line position of the cutting node 1, and the unit substrate 20 may be laser-cut a plurality of times at the laser cutting line position of the cutting node 2, and the unit substrate 20 may be laser-cut a plurality of times at the laser cutting line position of the cutting node 12, so as to complete the secondary cutting process of the carbide 24. In the process of performing multiple laser cutting on the unit substrate 20 at each cutting node (e.g., cutting node 1, cutting node 2, cutting node 12), the cutting frequency may be 6-10 times, that is, in the process of performing laser cutting at each cutting node, the cutting frequency is less compared to the cutting frequency of the related art, and the laser power is lower, so that the carbide 24 on the surface of the unit substrate 20 at the position corresponding to each cutting node can be effectively eliminated, the material on the unit substrate 20 at the position corresponding to each cutting node can not be cut off, and the generation of new carbide 24 on the surface of the unit substrate 20 at the position corresponding to each cutting node can be avoided.
Based on the same inventive concept, please refer to fig. 9, which shows a functional module schematic diagram of the laser cutting control device 110 provided in the embodiment of the present application, where the laser cutting control device 110 is applied to a computer terminal in a laser cutting system, the laser cutting system further includes a laser cutting device connected to the computer terminal, and in this embodiment, the laser cutting control device 110 may be divided into functional modules according to the embodiment of the laser cutting method in the foregoing embodiment. For example, the functional blocks may be divided for the respective functions, or two or more functions may be integrated into one processing block. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. It should be noted that, in the embodiment of the present application, the division of the module is schematic, and is only one logic function division, and there may be another division manner in actual implementation. For example, in the case of dividing each function module according to each function, the laser cutting control device 110 shown in fig. 9 is only a device diagram. The laser cutting control device 110 may include a first cutting module 111, a control module 112, and a second cutting module 113, and the functions of the functional modules of the laser cutting control device 110 are described in detail below.
A first cutting module 111 for controlling the laser cutting apparatus 200 to cut the target substrate into a plurality of unit substrates based on the first laser power. It is to be understood that the first cutting module 111 can be used to perform the step S110, and for the detailed implementation of the first cutting module 111, reference can be made to the above description of the step S110.
And a control module 112, configured to control the laser cutting apparatus 200 to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy. It is understood that the control module 112 can be used to execute the above step S120, and for the detailed implementation of the control module 112, reference can be made to the above description of step S120.
And a second cutting module 113, configured to control the laser cutting apparatus 200 to perform multiple laser cutting on the unit substrate within a preset cutting range using the substrate edge line as a reference line based on a second laser power, where the second laser power is smaller than the first laser power. It is understood that the second cutting module 113 may be configured to perform the step S130, and for the detailed implementation of the second cutting module 113, reference may be made to the content related to the step S130.
It should be noted that the division of the modules of the above apparatus is only a logical division, and the actual implementation may be wholly or partially integrated into one physical entity, or may be physically separated. Furthermore, all of the modules may be implemented in a form called by software through the processing element, or may be implemented in a form called by hardware, or some of the modules may be implemented in a form called by software through the processing element, or some of the modules may be implemented in a form called by hardware. For example, the first cutting module 111, the control module 112, and the second cutting module 113 may be individually established processing elements, or may be implemented by being integrated in a chip of the apparatus, or may be stored in a storage medium in the form of program codes, and the functions of the first cutting module 111, the control module 112, and the second cutting module 113 may be called and executed by a certain processing element. In addition, all or part of the modules can be integrated together or can be independently realized. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in the form of software.
Referring to fig. 10, based on the same inventive concept, there is shown a schematic block diagram of a computer terminal 100 for executing the laser cutting method provided in the embodiment of the present application, where the computer terminal 100 may include a laser cutting control device 110, a machine-readable storage medium 120, and a processor 130.
In this embodiment, the machine-readable storage medium 120 and the processor 130 may be located in the computer terminal 100 separately. However, it should be understood that the machine-readable storage medium 120 may also be separate from the computer terminal 100 and accessible by the processor 130 through a bus interface. Alternatively, the machine-readable storage medium 120 may be integrated into the processor 130, e.g., may be a cache and/or general purpose registers.
The laser cutting control device 110 may include software functional modules (e.g., the first cutting module 111, the control module 112, and the second cutting module 113 shown in fig. 9) stored in the machine-readable storage medium 120, when the processor 130 executes the software functional modules in the laser cutting control device 110, so as to implement the laser cutting method provided by the foregoing method embodiments.
Since the computer terminal 100 provided in the embodiment of the present application is another implementation form of the method embodiment of the laser cutting method, and the computer terminal 100 can be used to execute the laser cutting method provided in the above method embodiment, specific description and technical effects that can be obtained refer to the above method embodiment, and are not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
The embodiments described above are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the application, but is merely representative of selected embodiments of the application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims. Moreover, all other embodiments that can be made available by a person skilled in the art without making any inventive step based on the embodiments of the present application shall fall within the scope of protection of the present application.
Claims (10)
1. A laser cutting method is applied to a computer terminal in a laser cutting system, the laser cutting system further comprises a laser cutting device connected with the computer terminal, and the method comprises the following steps:
controlling the laser cutting apparatus to cut a target substrate into a plurality of unit substrates based on a first laser power;
controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy;
and controlling the laser cutting equipment to perform multiple times of laser cutting on the unit substrate within a preset cutting range by taking the substrate edge line as a reference line based on second laser power, wherein the second laser power is smaller than the first laser power.
2. The laser cutting method according to claim 1, wherein the laser cutting system further comprises a vision collecting device connected with the computer terminal, and the unit substrate is provided with a laser alignment mark;
the step of controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy comprises the following steps:
acquiring a substrate image of the unit substrate acquired by the vision acquisition device;
identifying the position coordinates of the laser alignment marks of the unit substrates in the substrate images;
and controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate according to the relation between the position coordinate and the reference coordinate corresponding to the substrate edge line.
3. The laser cutting method according to claim 1, wherein the laser cutting system further includes a vision collecting device connected to the computer terminal, and the step of controlling the laser cutting device to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy includes:
acquiring a substrate image of the unit substrate acquired by the vision acquisition device;
identifying a substrate edge position of the unit substrate in the substrate image;
and controlling the laser cutting equipment to align the laser cutting lines to the substrate edge lines of the unit substrates according to the substrate edge positions.
4. The laser cutting method according to any one of claims 1 to 3, wherein the step of controlling the laser cutting apparatus to perform the plurality of laser cuts on the unit substrate within a preset cutting range with the substrate edge line as a reference line based on the second laser power comprises:
acquiring a target error of the laser cutting equipment according to preset configuration parameters of the laser cutting equipment;
determining a preset cutting range with the edge line of the substrate as a reference line according to the target error;
determining the number of cutting lines in the preset cutting range according to the preset cutting range and the width of the cutting lines of the laser cutting equipment, and determining each cutting node corresponding to the laser cutting lines in the preset cutting range based on the number of the cutting lines;
and controlling the laser cutting equipment to be in the preset cutting range, and respectively carrying out laser cutting on the unit substrate for multiple times according to each cutting node corresponding to the laser cutting line in the preset cutting range.
5. The laser cutting method according to claim 4, wherein the step of obtaining the target error of the laser cutting device according to the preset configuration parameters of the laser cutting device comprises:
acquiring a substrate cutting processing error and a laser processing error of the laser cutting equipment;
and determining the substrate cutting machining error, the laser machining error, the sum of the substrate cutting machining error and the laser machining error, or the weighted error of the substrate cutting machining error and the laser machining error as a target error of the laser cutting equipment.
6. The laser cutting method according to claim 4, wherein the step of determining the preset cutting range with the substrate edge line as a reference line according to the target error comprises:
and determining the range and the value of the maximum positive direction range and the maximum negative direction range of the reference line as the target error by taking the edge line of the substrate as the reference line, wherein the range union of the maximum positive direction range and the maximum negative direction range is the preset cutting range.
7. The laser cutting method according to claim 4, wherein the step of determining the number of cutting lines within the preset cutting range according to the preset cutting range and the width of the cutting line of the laser cutting device comprises:
and determining the integral ratio of the preset cutting range to the cutting line width as the number of the cutting lines in the preset cutting range.
8. The utility model provides a laser cutting controlling means which characterized in that is applied to the computer terminal in the laser cutting system, the laser cutting system still include with the laser cutting equipment that computer terminal is connected, the laser cutting controlling means includes:
a first cutting module for controlling the laser cutting apparatus to cut a target substrate into a plurality of unit substrates based on a first laser power;
the control module is used for controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy;
and the second cutting module is used for controlling the laser cutting equipment to perform multiple times of laser cutting on the unit substrate within a preset cutting range by taking the edge line of the substrate as a reference line based on second laser power, wherein the second laser power is smaller than the first laser power.
9. The laser cutting system is characterized by comprising a computer terminal and laser cutting equipment connected with the computer terminal;
the computer terminal is specifically configured to:
controlling the laser cutting apparatus to cut a target substrate into a plurality of unit substrates based on a first laser power;
controlling the laser cutting equipment to align the laser cutting line to the substrate edge line of the unit substrate based on a preset alignment strategy;
and controlling the laser cutting equipment to perform multiple times of laser cutting on the unit substrate within a preset cutting range by taking the substrate edge line as a reference line based on second laser power, wherein the second laser power is smaller than the first laser power.
10. The laser cutting system of claim 9, wherein the second laser power has a power in the range of 4-8W.
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Application publication date: 20210730 |