CN113178316A - High-power large-current integrally-formed inductor with electrodes metallized by electroplating - Google Patents

High-power large-current integrally-formed inductor with electrodes metallized by electroplating Download PDF

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Publication number
CN113178316A
CN113178316A CN202110389826.1A CN202110389826A CN113178316A CN 113178316 A CN113178316 A CN 113178316A CN 202110389826 A CN202110389826 A CN 202110389826A CN 113178316 A CN113178316 A CN 113178316A
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China
Prior art keywords
electroplating
product
current
integrally
inductor
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CN202110389826.1A
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Chinese (zh)
Inventor
苏立良
苏立锋
宋树华
黄利清
刘明松
龙清寿
刘余
苏学远
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Chuangyi Technology Changsha Co ltd
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Chuangyi Technology Changsha Co ltd
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Priority to CN202110389826.1A priority Critical patent/CN113178316A/en
Publication of CN113178316A publication Critical patent/CN113178316A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/005Impregnating or encapsulating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • H01F41/0246Manufacturing of magnetic circuits by moulding or by pressing powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06Coil winding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The invention provides an electrode adopting a high-power large-current integrally-formed inductance method for electroplating metallization, which comprises the following steps: winding coils, welding, compression molding, baking and curing, chamfering, insulating coating, grinding and electroplating. The electrode of the invention adopts the high-power high-current integrally-formed inductor with electroplated metallization to iterate the combined high-current inductor and the copper sheet end electrode type integrally-formed high-current chip inductor in the prior art, and the comprehensive performance of the product is greatly improved under the condition of the same size. The invention can realize intelligent manufacture, save resources, is environment-friendly and can create unique value for the development of the world electronic industry.

Description

High-power large-current integrally-formed inductor with electrodes metallized by electroplating
Technical Field
The invention relates to an inductance technology, in particular to a high-power large-current integrally-formed inductor with electrodes metallized by electroplating.
Background
The traditional large-current inductor comprises an alloy Core combined large-current inductor, a flat wire large-current inductor, a combined large-current chip inductor, a large-current plug-in inductor and a copper sheet end electrode type integrally-formed large-current chip inductor; the combined type large-current inductor is manufactured in a magnetic core and coil assembling mode, a large number of gaps are formed in the product, the magnetic circuit utilization rate of the product is reduced, the product cannot be used at a high frequency above 3MHz due to material limitation, meanwhile, most processes of the combined type large-current inductor adopt a manual operation mode, the production cost is high, and the control difficulty of the process products is large. The product comprehensive characteristics of the copper sheet end electrode type integrated large-current chip inductor are poor, the production investment is large, the production cost of the product is high, the large-scale production is not facilitated, and the market demand cannot be met.
Disclosure of Invention
The invention aims to provide a high-power high-current integrally-formed inductor adopting electroplating metallization, wherein a product electrode is manufactured in an electroplating metallization mode and is coated in an insulating mode; the product is only provided with the bottom electrode and is manufactured in an electroplating metallization mode, so that the mounting size of the product on a circuit board is reduced, the mounting space of the integrated circuit PCB is increased, and favorable conditions are created for the high-integration development of the integrated circuit industry; the comprehensive performance of the product is greatly improved under the condition of the same size.
In order to achieve the purpose, the technical scheme provided by the invention is as follows: the preparation method of the high-power large-current integrally-formed inductor with the electrodes metallized by electroplating comprises the following main steps: winding coils, welding, compression molding, baking and curing, chamfering, insulating coating, grinding and electroplating.
As an extension of the above process, the process of the present invention may further comprise the steps of: winding an air-core coil, spot welding, compression molding, baking and curing, chamfering a mature blank, insulating and coating, grinding, plating nickel on an electrode, plating copper on the electrode, plating a metallized electrode, and detecting and packaging.
As a preferred step of the above process: the winding mode of the hollow coil adopts single-shaft or multi-shaft winding on a winding jig, and corresponding technical standards are required to be referred.
As a preferred step of the above process: the spot welding is to place the hollow coil and the metal sheet into the spot welding jig at fixed points, and then send the spot welding jig into spot welding equipment for spot welding operation.
As a preferred step of the above process: the compression molding is to put a metal sheet containing the hollow coil into a mold of a molding machine, and to fill metal powder into a mold cavity to form a product by compression molding; and (4) carrying out thin film forming on the thin film by thin film forming method according to the forming density not less than 3 g/cm.
As a preferred step of the above process: the baking and curing are to bake and cure the product in baking equipment, wherein the baking operation is finished under the baking conditions that the baking temperature is not less than 80 ℃ and the baking time is not less than 1H.
As a preferred step of the above process: the mature blank chamfering is to mix the baked and cured product with chamfering medium in a certain proportion according to the weight of the product and then put the mixture into chamfering equipment to finish the mature blank chamfering operation.
As a preferred step of the above process: the insulating coating is to use polyimide material to carry out insulating coating treatment on the surface of the product, the thickness of the insulating layer is not less than 3um, and the product is baked for more than 0.5 hour after being coated to solidify the insulating layer.
As a preferred step of the above process: grinding is to arrange the goods neatly to the high-accuracy grinding machine platform on, use the high-accuracy grinding machine to carry out the grinding operation to the goods, the goods grinds not less than 3um (insulating layer thickness), exposes the product bottom enameled wire cross-section after the grinding.
As a preferred step of the above process: the electrode copper plating is to electroplate a copper layer of not less than 1um on the ground product.
As a preferred step of the above process: the electroplated metallization electrode is formed by combining one or two of a vacuum coating process (PVD technology) and a traditional electroplating process on a product, and adding a required metal and alloy material coating on the surface of the original once-plated copper so as to increase the weldability, the welding resistance and the adhesive force of the product.
As a preferred step of the above process: the detection packaging is to detect the product to eliminate defective products with size, appearance and characteristics, and then package the product.
The technical advantages of the invention are as follows:
1) the invention has the technical advantages that the high-power high-current integrally-formed inductor which is metalized by electroplating, only the bottom electrode is reserved and the product body is coated by the insulating material is provided, the mounting size of the product on a circuit board is saved, the mounting space of an integrated circuit PCB is increased, the production cost is greatly reduced, the product has high reliability and high cost performance, and favorable conditions are created for the high-integration development of the integrated circuit industry; the comprehensive performance of the product is greatly improved under the condition of the same size.
2) The manufacturing process uses a vacuum coating technology (PVD technology) or a traditional electroplating technology, thereby saving the manufacturing cost and improving the yield of the manufacturing process.
3) The thickness of the insulating coating of the product is more than 3um by adopting a new insulating coating material and an insulating coating process, and the insulating coating material is a thermosetting environment-friendly polyimide material.
4) The inductance device prepared by the scheme has the advantages of high frequency, low loss, chip, high voltage resistance and high reliability, completely accords with the development trend of high-end products of electronic components, has a wide application range, and can meet the requirements of industries such as intelligent terminals, servers, 5G signal towers, industrial internets, data centers, new energy automobiles, smart power grids, aerospace, high-speed rails and the like.
Drawings
FIG. 1 is a process flow diagram of the present invention.
FIG. 2 is a comparison of the load current characteristics of the present invention and commercial products.
FIG. 3 is a comparison of the characteristics of the present invention and commercial products.
FIG. 4 is measured data of the characteristics of the product of the present invention.
Fig. 5 is a side view of a product of the invention.
Fig. 6 is a front view of a product of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, 1 to 5, in which preferred embodiments of the invention are shown:
a high-power large-current integrally-formed inductor with electrodes metallized by electroplating comprises the following steps: winding an air-core coil, spot welding, compression molding, baking and curing, chamfering a mature blank, insulating and coating, grinding, plating nickel on an electrode, plating copper on the electrode, plating a metallized electrode, and detecting and packaging.
Wherein the content of the first and second substances,
the first step is as follows: winding an air-core coil: manufacturing an air core coil according to the specification setting requirement of a product; the winding mode adopts single-shaft or multi-shaft winding on a winding jig, and the winding must meet the corresponding technical standard. The selection and winding of the enameled copper wire are repeatedly tested, and parameters of winding equipment and specification data of wire rods which can be produced in batches are obtained. The winding mode adopts unipolar or multiaxis coiling on the winding tool, promotes wire winding speed.
The second step is as follows: spot welding: the hollow coil and the metal sheet are placed into a spot welding jig at fixed points, and then the spot welding jig is sent into spot welding equipment for spot welding operation; and the research and development team records data through a plurality of tests, and screens out the best spot welding material piece material and welding conditions after statistical analysis.
The third step: compression molding: carbonyl iron powder, alloy materials (material systems such as iron silicon, iron silicon chromium, iron nickel, iron silicon aluminum, amorphous nanocrystalline and the like) or ferrite materials are adopted for molding and research and development teams, and after a plurality of tests, data are recorded and statistical analysis is carried out, the optimal carbonyl powder component formula is screened out as follows:
carbonyl iron powder/alloy material/ferrite material: epoxy resin: acetone according to the weight ratio of 100: less than or equal to 7: uniformly mixing the components at the temperature of less than or equal to 20 ℃, then preserving heat for 1-3 hours at the temperature of less than or equal to 80 ℃, and then grinding and granulating, wherein the prepared powder needs to meet the requirement that the sphericity is more than or equal to 60 percent, and the particle size of the powder meets the following requirements: d50 is less than or equal to 30 mu m, D90 is less than or equal to 90 mu m, and D10 is less than or equal to 20 mu m; (D10 is the cumulative particle size distribution of 10%, i.e., the volume fraction of particles smaller than this size is 10% of the total particles; D50 is the cumulative particle size distribution of 50%, also called median or median size, which is a typical value representing the size of the particles.) D90 is the cumulative particle size distribution of 90%, i.e., the volume fraction of particles smaller than this size is 90% of the total particles.) epoxy resin is used as a binder, and zinc stearate, barium stearate or other release lubricant is added after powder granulation is complete;
and putting the metal sheet containing the hollow coil into a die of a forming machine, filling metal powder into a die cavity to form a punch forming product, and carrying out shaped density double-row forging on the metal sheet with the forming density not less than 3 g/cm.
Selecting specific pressure of a forming machine: the pressure has been big can scratch the lacquer leather coat of coil or crush, and pressure is not enough, and the goods density of producing is not enough, can lead to goods unfilled corner, inductance value low grade bad, through a large amount of experiments, statistical data selects can satisfy goods quality, the best parameter of production efficiency and yields.
The fourth step: baking and curing: and (3) putting the product into an oven device for baking and curing, wherein the baking operation is finished under the baking conditions that the baking temperature is not less than 80 ℃ and the baking time is not less than 1H.
The fifth step: chamfering the mature blank: adding a chamfering medium into the baked product according to the weight of the product, and putting the product into chamfering equipment to finish the blank chamfering operation, wherein the chamfering time is not less than 5 minutes, and the chamfering medium is special chamfering stone (one or more of high-density and high-hardness particles such as granular zirconia, granular alumina and the like).
A sixth step: insulating and coating: the surface of the product is subjected to insulation coating treatment by using a polyimide material, the thickness of the insulation layer is not less than 3um, and the product is baked at the temperature of more than 100 ℃ for more than 0.5 hour after being coated to solidify the insulation layer.
A seventh step of: grinding: and (3) arranging the products in order on a high-precision grinding machine platform, grinding the products by using a high-precision grinding machine, wherein the ground products are not less than 3um, and the cross section of the enameled copper wire at the top of the products is exposed after grinding.
An eighth step: and (3) electrode nickel plating: electroplating a nickel layer of not less than 0.3um on the grinded product.
A ninth step: and (3) electrode copper plating: and electroplating a copper layer with the thickness not less than 1um on the nickel-plated product.
The materials of the eighth step and the ninth step can be exchanged or replaced by other conventional metal materials.
A tenth step: electroplating a metallized electrode: the method is characterized in that the product is subjected to one or two of a vacuum coating process (PVD technique) and a traditional electroplating process, and a required metal and alloy material coating is added on the surface of the nickel-plated base copper layer, wherein the metal is an alloy material coating formed by mixing one or more of nickel, aluminum, copper, silver, magnesium, molybdenum, manganese, zinc, titanium, cobalt, vanadium, chromium, steel, tin and gold, so that the weldability, the welding resistance and the adhesive force of the product are improved.
An eleventh step: detecting and packaging: and detecting the product to remove defective products with size, appearance and characteristics, and then packaging.
The actual measurement data of the product manufactured by the process refers to an attached figure 4, the schematic diagram of the product manufactured by the process refers to an attached figure 5 and an attached figure 6, the characteristic comparison with the product of the market post enterprise refers to an attached figure 3, and the load current, the working current and the energy loss of the product are all obviously superior to those of the product of the post enterprise in the same country by comprehensive comparison.
The data of the product manufactured by the above process are shown in figure 4.
The above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, so that the changes in the shape and principle of the present invention should be covered within the protection scope of the present invention.

Claims (10)

1. The electrode adopts the high-power heavy current integrated into one piece inductance of electroplate metallization, its characterized in that: the preparation method of the inductor comprises the following steps: winding coils, welding, compression molding, baking and curing, chamfering, insulating coating, grinding and electroplating.
2. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: the steps include: winding an air-core coil, welding, compression molding, baking and curing, chamfering a blank, insulating and coating, grinding, plating nickel on an electrode, plating copper on the electrode, plating tin on the electrode, detecting and packaging.
3. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: and the winding of the coil is to form the hollow coil by single-axis or multi-axis winding on the winding core rod.
4. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: the welding is to put the hollow coil and the metal sheet into the spot welding jig at fixed points, and then send the spot welding jig into spot welding equipment for spot welding operation.
5. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: the compression molding is to put the metal sheet containing the coil into the die of a molding machine at a fixed point, and to fill the die cavity with metal powder to form a product by compression molding.
6. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: the baking and curing are to put the product into an oven device for baking and curing.
7. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: the chamfering is to mix the baked product with chamfering medium in a certain proportion according to the weight of the product and put the mixture into chamfering equipment to complete the chamfering operation.
8. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: the insulating coating is to perform insulating coating treatment on the surface of the product.
9. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: and in the grinding step, the products are arranged in a grinding machine in order, the grinding operation is carried out on the products by using the grinding machine, and the cross section of the enameled copper wire at the bottom of the product is exposed after grinding.
10. The high-power high-current integrally-formed inductor with the electrodes metallized by electroplating according to claim 1, is characterized in that: the electroplating comprises one or more of electroplating nickel, electroplating aluminum, electroplating copper, electroplating silver, electroplating magnesium, electroplating molybdenum, electroplating manganese, electroplating zinc, electroplating titanium, electroplating cobalt, electroplating vanadium, electroplating chromium, electroplating steel, electroplating tin and electroplating gold.
CN202110389826.1A 2021-04-12 2021-04-12 High-power large-current integrally-formed inductor with electrodes metallized by electroplating Pending CN113178316A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425121A (en) * 2013-08-27 2015-03-18 三积瑞科技(苏州)有限公司 Embedded alloy inductor fabrication method
CN105355409A (en) * 2015-11-18 2016-02-24 韵升控股集团有限公司 Surface mounting inductor manufacture method
CN109148137A (en) * 2018-09-04 2019-01-04 珠海群创新材料技术有限公司 A kind of high pressure resistant inductor and preparation method thereof
CN110565134A (en) * 2019-10-09 2019-12-13 深圳华络电子有限公司 method for preparing electrode of inductance device
CN111128526A (en) * 2020-01-19 2020-05-08 美磊电子科技(昆山)有限公司 Integrally molded inductor structure with terminal electrode led out from bottom and manufacturing process thereof
CN112164570A (en) * 2020-10-19 2021-01-01 湖南创一电子科技股份有限公司 Preparation method of metal magnetic powder core integrated chip inductor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425121A (en) * 2013-08-27 2015-03-18 三积瑞科技(苏州)有限公司 Embedded alloy inductor fabrication method
CN105355409A (en) * 2015-11-18 2016-02-24 韵升控股集团有限公司 Surface mounting inductor manufacture method
CN109148137A (en) * 2018-09-04 2019-01-04 珠海群创新材料技术有限公司 A kind of high pressure resistant inductor and preparation method thereof
CN110565134A (en) * 2019-10-09 2019-12-13 深圳华络电子有限公司 method for preparing electrode of inductance device
CN111128526A (en) * 2020-01-19 2020-05-08 美磊电子科技(昆山)有限公司 Integrally molded inductor structure with terminal electrode led out from bottom and manufacturing process thereof
CN112164570A (en) * 2020-10-19 2021-01-01 湖南创一电子科技股份有限公司 Preparation method of metal magnetic powder core integrated chip inductor

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Application publication date: 20210727