CN113170035A - Camera module and movable platform - Google Patents
Camera module and movable platform Download PDFInfo
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- CN113170035A CN113170035A CN202080006253.3A CN202080006253A CN113170035A CN 113170035 A CN113170035 A CN 113170035A CN 202080006253 A CN202080006253 A CN 202080006253A CN 113170035 A CN113170035 A CN 113170035A
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- 230000003287 optical effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000004519 grease Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000013021 overheating Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000000428 dust Substances 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
Abstract
A camera module and a movable platform, the camera module comprising: a camera housing (103) having an accommodating space therein; the image acquisition unit is arranged in the accommodating space; the heat conduction unit is respectively contacted with the image acquisition unit and the camera shell (103) so as to conduct the heat of the image acquisition unit to the camera shell (103); the heat conduction unit comprises a middle part (114) and an edge part (115), and the middle part (114) is in contact with the image acquisition unit; the edge portion (115) is adapted to engage the camera housing (103) to provide a substantial seal between the unit and the camera housing (103). The heat on the image acquisition unit is conducted to the camera shell through the heat conduction unit, so that the problem of service life reduction caused by overheating of the image acquisition unit is effectively solved.
Description
Technical Field
The present invention relates generally to the field of cameras, and more particularly to a camera module and a movable platform.
Background
With the progress of science and technology, various industries are developed towards automation and intellectualization. For example, for the automobile industry, advanced assistant driving or automatic driving is an important target for future development of the automobile industry, and the realization of the advanced assistant driving or automatic driving needs to rely on various sensors to bring information such as road rules, traffic flow or obstacles and the like so as to adjust the driving state. The camera serves as a sensor commonly used in automobiles, plays a role of 'eyes' of the automobile in automatic driving, and achieves the function of acquiring information such as road conditions, traffic flow, obstacles and the like by collecting images acquired by the camera.
Generally, the overall dimension of a camera arranged on a movable platform is relatively small, and active heat dissipation modes such as a fan and the like cannot be adopted, the movable platform may need to be in a high environmental temperature and outdoor environment for a long time, especially in summer, if a camera module does not have good heat conduction and heat dissipation performance, components inside the camera module can be damaged at a high temperature or the service life of the components is reduced; if the inside of the camera is communicated with the outside in order to promote the heat dissipation of the camera, the waterproof and dustproof functions of the camera cannot be guaranteed, so that the use safety and the service life of internal components are affected.
Disclosure of Invention
In this summary, concepts in a simplified form are introduced that are further described in the detailed description. This summary of the invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In view of the deficiencies of the prior art, a first aspect of the embodiments of the present invention provides a camera module, which includes:
the camera comprises a camera shell, a camera body and a camera body, wherein the camera shell is internally provided with an accommodating space;
the image acquisition unit is arranged in the accommodating space;
a heat conduction unit which is respectively contacted with the image acquisition unit and the camera shell so as to conduct the heat of the image acquisition unit to the camera shell;
wherein the heat conducting unit comprises a middle part and an edge part, and the middle part is in contact with the image acquisition unit; the edge portion is attached to the camera housing to substantially seal between the heat conducting unit and the camera housing.
A second aspect of an embodiment of the present invention provides a movable platform, including:
a movable platform body;
a camera module carried on the movable platform body, the camera module comprising:
the camera comprises a camera shell, a camera body and a camera body, wherein the camera shell is internally provided with an accommodating space;
the image acquisition unit is arranged in the accommodating space;
a heat conduction unit which is respectively contacted with the image acquisition unit and the camera shell so as to conduct the heat of the image acquisition unit to the camera shell;
wherein the heat conducting unit comprises a middle part and an edge part, and the middle part is in contact with the image acquisition unit; the edge portion is attached to the camera housing to substantially seal between the heat conducting unit and the camera housing.
According to the camera module and the movable platform, the heat conduction unit is arranged and is in contact with the image acquisition unit with larger heat productivity, so that the heat on the image acquisition unit is conducted to the heat conduction unit, the heat is conducted to the camera shell through the direct contact of the heat conduction unit and the camera shell, and finally conducted to air or other parts in contact with the shell, and the problem of service life reduction caused by overheating of the image acquisition unit is effectively solved. Meanwhile, the heat conducting unit is attached to the camera shell, and the heat conducting unit and the camera shell are basically sealed, so that the waterproof and dustproof effects are guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
FIG. 1 is an exploded view of a camera module of one embodiment of the present invention;
FIG. 2 is a perspective view of a camera module according to an embodiment of the invention;
FIG. 3 is a perspective view of a camera module according to another embodiment of the present invention;
FIG. 4 is a cross-sectional schematic view of a camera module of one embodiment of the invention;
FIG. 5 is another cross-sectional schematic view of a camera module of one embodiment of the invention;
FIG. 6 is a block diagram of a moveable platform according to one embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a subset of embodiments of the invention and not all embodiments of the invention, with the understanding that the invention is not limited to the example embodiments described herein. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention described herein without inventive step, shall fall within the scope of protection of the invention.
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
In order to provide a thorough understanding of the present invention, a detailed structure will be set forth in the following description in order to explain the present invention. Alternative embodiments of the invention are described in detail below, however, the invention may be practiced in other embodiments that depart from these specific details.
The camera module applied to the movable platform at present considers the waterproof and anti-fogging performance requirements of the external camera module, and does not consider the heat conduction and heat dissipation problems of the image sensor with higher and higher power consumption and larger heat productivity. For example, since the conventional camera module in the vehicle does not have a heat dissipation structure, the image sensor has low power consumption and low heat generation amount, and even if heat is accumulated in the camera module, the influence on the service life of the components is small. However, as the requirements for the resolution of images and the number of frames of captured video are higher, the power consumption and the heat generation of the image sensor are higher, and the heat generation problem of the camera module for the movable platform is also gradually exposed.
Generally, the overall dimension of a camera arranged on a movable platform is relatively small, and active heat dissipation modes such as a fan and the like cannot be adopted, the movable platform may need to be in a high environmental temperature and outdoor environment for a long time, especially in summer, if a camera module does not have good heat conduction and heat dissipation performance, components inside the camera module can be damaged at a high temperature or the service life of the components is reduced; if the inside of the camera is communicated with the outside in order to promote the heat dissipation of the camera, the waterproof and dustproof functions of the camera cannot be guaranteed, so that the use safety and the service life of internal components are affected.
In view of the above problems, embodiments of the present invention provide a camera module with good heat conduction and dissipation properties and a movable platform including the camera module, in which a heat conduction unit is added in the camera module to conduct heat generated by an image acquisition unit to a camera housing for heat dissipation, thereby avoiding a situation of a reduced service life of a component due to a high temperature for a long time. Meanwhile, the edge of the heat conducting unit is attached to the camera shell, the edge of the heat conducting unit and the camera shell are basically sealed, and the waterproof and dustproof effects are guaranteed. In the application scene of the movable platform, the heat dissipation, water resistance and dust resistance functions are excellent.
The camera module according to the embodiment of the present invention will be further described with reference to the drawings. Referring to fig. 1 to 5, fig. 1 is an exploded view of a camera module according to one embodiment of the present invention;
FIG. 2 is a perspective view of a camera module according to an embodiment of the invention; FIG. 3 is a perspective view of a camera module according to another embodiment of the present invention; FIG. 4 is a cross-sectional schematic view of a camera module of one embodiment of the invention; fig. 5 is another cross-sectional view of a camera module according to an embodiment of the invention.
Referring to fig. 1, a camera module according to an embodiment of the present invention includes a camera housing 103, where the camera housing 103 has an accommodating space therein. The accommodating space is provided with an image acquisition unit and a heat conduction unit, and the heat conduction unit is respectively contacted with the image acquisition unit and the camera shell 103 so as to conduct the heat of the image acquisition unit to the camera shell 103 and finally to the air or other parts contacted with the shell.
Specifically, referring to fig. 4 and 5, the camera housing 103 is a hollow housing, thereby forming an accommodating space therein; meanwhile, a front portion of the camera housing 103 protrudes forward to form a boss, and the front portion of the boss is communicated with an external space for installing the optical lens assembly 101 in the image pickup unit, so that the optical lens assembly 101 can receive external light, referring to fig. 2. In some embodiments, the camera housing 103 may be made of a thermally conductive material to improve heat dissipation. For example, the camera housing 103 may be made of a metal material.
In some embodiments, the exterior of the camera housing 103 may be provided with other heat dissipation structures, or the outer surface of the camera housing 103 may be provided in a form that facilitates heat dissipation, for example, increasing the surface area of the outer surface of the camera housing 103 to further improve the heat dissipation effect.
An image acquisition unit is arranged in the camera housing 103 for realizing an image acquisition function. The image pickup unit further includes an optical lens assembly 101, an image sensor 105, and an image pickup circuit board 106, which are sequentially disposed. That is, the optical lens assembly 101 is disposed in front of the image sensor 105, and the image capture circuit board 106 is disposed behind the image sensor 105.
Illustratively, the optical lens assembly 101 includes a lens barrel and at least one lens disposed in the lens barrel. The lens barrel may be formed using a metal-based material having high thermal conductivity. The lens may be fixed inside the lens barrel by an adhesive or the like. Illustratively, referring to fig. 1, the optical lens assembly 101 may be adhesively fixed to the boss by a lens adhesive 102. Alternatively, the lens barrel may be externally provided with an external thread portion for attachment to the camera housing 103. The camera housing 103 has a boss provided therein with an internal screw portion to be engaged with the external screw portion.
Illustratively, the image sensor includes, but is not limited to, a CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) sensor. The image sensor 105 is mounted to the image pickup circuit board 106 together with peripheral circuit components. The image sensor 105 and the image acquisition circuit board 106 can be fixed by welding electronic components. The image acquisition circuit board 106 and the camera housing 103 can be fixed by screw connection. In some embodiments, the camera housing 103 is provided with positioning posts, and the image capture circuit board 106 is provided with positioning holes, so that the image capture circuit board can be accurately positioned by matching the positioning posts with the positioning holes.
In one embodiment, since the optical lens assembly 101 is in communication with the outside, a dustproof structural member 104 is further disposed between the camera housing 103 and the image capture circuit board 106, and the dustproof structural member 104 is compressed and sealed to isolate the image sensor 105 from contacting the air, thereby reducing the risk of contamination of the image sensor 105 with dust in the air.
The dustproof structure 104 may be made of foam, which has a certain compressible amount, and the dustproof structure 104 may be compressed by the fixing process of the image capturing circuit board 106 and the camera housing 103. The aperture of the compressed foam is smaller than the size of dust in the air, so that the image sensor 105 can be isolated from the dust in the air.
With this arrangement, external ambient light enters the protective camera housing 103 from the front through the optical lens assembly 101, and then irradiates the image sensor 105, so that the image sensor 105 receives the external ambient light and records an ambient image.
With the improvement of the image resolution and the number of captured video frames, the image sensor 105 generates a large amount of heat during operation, and thus becomes a main heat generating device in the camera module. Since the image sensor 105 is disposed on the image capturing circuit board 106 to conduct heat to the image capturing circuit board 106, the heat conducting unit of the embodiment of the invention is in contact with at least one surface of the image capturing circuit board 106 to dissipate heat of the image capturing circuit board 106.
Further, since the image sensor 105 is disposed in front of the image capture circuit board 106, in order to avoid affecting the normal assembly of the camera module, the heat conduction unit is in contact with the back surface of the image capture circuit board 106.
The heat conducting unit comprises a middle part 114 and an edge part 115, wherein the middle part 114 is in contact with the image acquisition unit so as to conduct heat of the image acquisition unit; the edge portion 115 is attached to the camera housing, and on one hand, heat is conducted to the camera housing, and on the other hand, the heat conduction unit and the camera housing are basically sealed, so that waterproof and dustproof effects are achieved. The intermediate portion 114 of the heat conducting unit includes a terrace portion. The edge portion 115 of the heat conductive unit includes a sidewall portion and an outer edge portion. The sidewall portions extend downwardly along the edges of the platform portion and the outer edge portions extend outwardly along the bottom portions of the sidewall portions. Wherein, the platform part is parallel to the image acquisition circuit board 106. The side wall portion extends downward along the edge of the platform portion so as to conform to the inner wall of the camera housing 103 and constitutes a large contact surface. The outer edge portion extending outward along the bottom of the side wall portion is attached to the bottom of the camera housing 103, and the upper and lower sides of the outer edge portion are respectively pressed and fixed by the camera housing 103 and the control circuit board 112.
Specifically, the heat conducting unit includes a heat conducting structure 110 and a heat conducting medium 109. The heat conducting medium 109 is located in the middle portion 114, and one side of the heat conducting medium is attached to the image capturing circuit board 106 in the image capturing unit, and the other side is attached to the heat conducting structure 110. The heat conductive structure 110 is partially located in the middle portion 114 and partially located in the edge portion 115. The heat conducting structure 110 is in contact with the heat conducting medium 109 and the camera housing 103, respectively; the heat conducting medium 109 is closely attached to the image acquisition circuit board 106 and the heat conducting structural member 110, so that heat of the image acquisition circuit board 106 is conducted to the heat conducting structural member 110; the heat conductive structure 110 conducts heat to the camera housing 103. Therefore, the heat dissipation of the image acquisition circuit board 106 can be ensured, the camera shell 103 does not need to be penetrated, and the sealing effect inside the camera shell 103 is ensured.
Referring to fig. 1, 4 and 5, the heat conductive structure 110 includes a terrace portion, a sidewall portion extending downward along an edge of the terrace portion, and an outer edge portion extending outward along a bottom of the sidewall. Wherein, the platform part is parallel to the image acquisition circuit board 106. The side wall portion extends downward along the edge of the platform portion so as to conform to the inner wall of the camera housing 103 and constitutes a large contact surface. The outer edge portion extending outward along the bottom of the side wall portion is attached to the bottom of the camera housing 103, and the upper and lower sides of the outer edge portion are respectively pressed and fixed by the camera housing 103 and the control circuit board 112.
In some embodiments, the platform portion of the heat conducting structure is spaced apart from the image capture circuit board 106 by a distance, such as a set screw 108, under the image capture circuit board 106. The platform part is provided with a raised structure, such as a boss or a convex hull, at a position corresponding to the image acquisition circuit board so as to fill the distance. The heat conducting medium is disposed between the image capture circuit board 106 and the raised structure, and is in intimate contact with each other.
The heat conducting structure 110 has a compact structure, occupies a small space, and has little influence on the volume of the camera module. It should be noted that the heat conducting structure 110 is not limited to the above shape, and the embodiment is only exemplified here as long as the heat conducting structure 110 can contact with the image capturing circuit board 106 and the inner wall of the camera housing 103 to rapidly conduct the heat of the image capturing circuit board 106 out through the camera housing 103.
Since the heat conductive structural member 110 is used for heat conduction between the image pickup circuit board 106 and the camera housing 103, a material having high heat conductivity, such as a metal material, is used. Further, the heat conductive structure 110 may be made of red copper having both high heat conductivity and high ductility.
The heat conducting medium 109 is mainly used to improve the heat conduction efficiency between the image capturing circuit board 106 and the heat conducting structure 110. The heat conducting medium 109 is in contact with or bonded to the image capture circuit board 106 and the raised structure of the heat conducting structure 110, respectively. The heat conducting medium 109 is made of a material with high heat conductivity to ensure the heat conduction effect; further, since the heat conductive medium is provided in a narrow space inside the camera housing 103, a flexible material is preferable. In view of the above, the heat-conducting medium may be made of heat-conducting grease. The thermal grease is a glue-bonded object with high thermal conductivity, and can increase the thermal area between the image acquisition circuit board 106 and the thermal conductive structure 110.
In addition, in general, when the camera module is applied to a movable platform, an additional circuit component is required to connect with a host of the movable platform, so the camera module of the embodiment of the invention further includes a control circuit unit for taking charge of signal connection with the host of the movable platform for signal control and transmission.
Specifically, the control circuit unit is located behind the heat conducting unit and mainly includes a control circuit board 112. The control circuit board 112 and the camera housing 103 enclose an accommodating space, that is, the rear of the accommodating space is sealed by the control circuit board 112. The control circuit board 112 and the camera housing 103 may be fixed by screw connection.
The control circuit board 112 is connected to the image capturing circuit board 106 to receive the image information captured by the image capturing unit and send the image information captured by the image capturing unit to the host of the movable platform.
As an example, a board-to-board connector connection may be employed between the image capture circuit board 106 and the control circuit board 112. Referring to fig. 5, the board-to-board connector includes a male board-to-board connector receptacle 107 and a female board-to-board connector receptacle 111, the male board-to-board connector receptacle 107 is fixed to the image capture circuit board 106 by means of electronic component soldering, the female board-to-board connector receptacle 111 is fixed to the control circuit board 112 by means of electronic component soldering, and the image capture circuit board 106 is electrically connected to the control circuit board 112 by the engagement of the male board-to-board connector receptacle 107 and the female board-to-board connector receptacle 111.
Further, since the image capturing circuit board 106 and the control circuit board 112 have board-to-board connectors, such as the male socket 107 and the female socket 111 of the board-to-board connector, and the heat conductive structure 110 is disposed between the image capturing circuit board 106 and the control circuit board 112, openings are disposed at corresponding positions of the heat conductive structure, and the board-to-board connectors penetrate through the openings, so as to connect the image capturing circuit board 106 and the control circuit board 112.
Further, referring to fig. 4, the control circuit unit further includes an electrical connector 113, one end of the electrical connector 113 is connected to the control circuit board 112, and the other end is an external interface, which extends out of the camera housing 103 and is connected to other interfaces. The electrical connector 113 includes, but is not limited to, a French card electrical connector. Illustratively, the control circuit board 112 has a plurality of sockets, and the electrical connectors 113 are inserted into the corresponding sockets for electronic component soldering.
Based on the above description, the camera module according to the embodiment of the present invention, by providing the heat conduction unit in contact with the image capturing unit having a large heat value, conducts the heat on the image capturing unit to the heat conduction unit, and conducts the heat to the camera housing through the direct contact between the heat conduction unit and the camera housing, and finally to the air or other parts in contact with the camera housing, thereby effectively alleviating the problem of life reduction caused by overheating of the image capturing unit.
Referring to fig. 6, the movable platform 600 provided in the embodiment of the present invention includes a movable platform body 610 and a camera module 620 mounted on the movable platform body 610, where the camera module 620 may be the camera module described above, and specifically includes: the camera shell is internally provided with an accommodating space; the image acquisition unit is arranged in the accommodating space; the heat conduction unit is respectively contacted with the image acquisition unit and the camera shell so as to conduct the heat of the image acquisition unit to the camera shell, wherein the heat conduction unit comprises a middle part and an edge part, and the middle part is contacted with the image acquisition unit; the edge portion is attached to the camera housing to substantially seal between the heat conducting unit and the camera housing.
Wherein the movable platform 600 comprises at least one of an automobile, a remote control car, a robot, an unmanned aerial vehicle, or a boat. When the movable platform 600 is an automobile, the movable platform body 610 is a body of the automobile. When the movable platform 600 is a remote control car, the movable platform body 610 is a body of the remote control car. When the movable platform 600 is a robot, the movable platform body 610 is a body of the robot, and so on.
In one embodiment, the image acquisition unit comprises: the image acquisition circuit board, the heat conduction unit with at least one side of image acquisition circuit board contacts. The image acquisition unit is still including the optical lens subassembly and the image sensor that set gradually, image sensor locates the image acquisition circuit board.
The heat conducting unit comprises a heat conducting structural part and a heat conducting medium, wherein the heat conducting medium is positioned in the middle part, part of the heat conducting structural part is positioned in the middle part, and part of the heat conducting structural part is positioned in the edge part.
One side of the heat-conducting medium is attached to the image acquisition unit, the other side of the heat-conducting medium is attached to the heat-conducting structural member, and the heat-conducting structural member is respectively contacted with the heat-conducting medium and the camera shell.
In one embodiment, the image acquisition unit comprises an image acquisition circuit board, and the heat conducting medium is attached to the image acquisition circuit board
In one embodiment, the heat conductive structure includes a platform portion, a sidewall portion extending downward along an edge of the platform portion, and an outer edge portion extending outward along a bottom of the sidewall portion, the sidewall portion being attached to an inner wall of the camera housing, and the outer edge portion being attached to the bottom of the camera housing.
In one embodiment, the platform part is provided with a protruding structure, and the heat conducting medium is in contact with the protruding structure.
In one embodiment, the material of the heat conducting medium comprises a heat conducting grease. The material of the heat conducting structural member comprises metal.
In one embodiment, the camera module 620 further includes a control circuit unit, and the heat conducting unit is disposed between the image capturing unit and the control circuit unit. The control circuit unit comprises a control circuit board, the control circuit board is connected with the image acquisition circuit board, and the camera shell and the control circuit board enclose to form the accommodating space. The heat conduction unit set up in between the image acquisition circuit board with the control circuit unit, be provided with the opening in the heat conduction structure spare, camera module 620 still includes and runs through open-ended board to board connector, be used for connecting the image acquisition circuit board with control circuit board.
In one embodiment, the control circuit unit further includes an electrical connector, one end of the electrical connector is connected to the control circuit board, and the other end of the electrical connector is an external interface.
In one embodiment, a dustproof structure is disposed between the camera housing and the image acquisition circuit board.
Other specific details of the camera module 620 may refer to the camera modules described above with reference to fig. 1 to 5, which are not described herein again.
The camera module adopted by the movable platform provided by the embodiment of the invention is provided with the heat conduction unit which is in contact with the image acquisition unit with larger heat productivity, so that the heat on the image acquisition unit is conducted to the heat conduction unit, and is conducted to the camera shell through the direct contact of the heat conduction unit and the camera shell, and finally conducted to the air or other parts in contact with the shell, thereby effectively relieving the problem of service life reduction caused by overheating of the image acquisition unit.
Although the illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the foregoing illustrative embodiments are merely exemplary and are not intended to limit the scope of the invention thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present invention. All such changes and modifications are intended to be included within the scope of the present invention as set forth in the appended claims.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, and for example, the division of the units is only one logical functional division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another device, or some features may be omitted, or not executed.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the invention and aiding in the understanding of one or more of the various inventive aspects. However, the method of the present invention should not be construed to reflect the intent: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
It will be understood by those skilled in the art that all of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where such features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.
The various component embodiments of the invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art will appreciate that a microprocessor or Digital Signal Processor (DSP) may be used in practice to implement some or all of the functionality of some of the modules according to embodiments of the present invention. The present invention may also be embodied as apparatus programs (e.g., computer programs and computer program products) for performing a portion or all of the methods described herein. Such programs implementing the present invention may be stored on computer-readable media or may be in the form of one or more signals. Such a signal may be downloaded from an internet website or provided on a carrier signal or in any other form.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
Claims (31)
1. A camera module for a movable platform, the camera module comprising:
the camera comprises a camera shell, a camera body and a camera body, wherein the camera shell is internally provided with an accommodating space;
the image acquisition unit is arranged in the accommodating space;
a heat conduction unit which is respectively contacted with the image acquisition unit and the camera shell so as to conduct the heat of the image acquisition unit to the camera shell;
wherein the heat conducting unit comprises a middle part and an edge part, and the middle part is in contact with the image acquisition unit; the edge portion is attached to the camera housing to substantially seal between the heat conducting unit and the camera housing.
2. The camera module of claim 1, wherein the image capture unit comprises: the image acquisition circuit board, the heat conduction unit with at least one side of image acquisition circuit board contacts.
3. The camera module of claim 2, wherein the image capturing unit further comprises an optical lens assembly and an image sensor arranged in sequence, the image sensor being disposed on the image capturing circuit board.
4. The camera module of claim 1, wherein the heat conducting unit comprises a heat conducting medium and a heat conducting structure; the heat-conducting medium is located in the middle portion, and the heat-conducting structural part is located in the middle portion and located in the edge portion.
5. The camera module of claim 4, wherein one side of the heat conducting medium is attached to the image capturing unit, and the other side of the heat conducting medium is attached to the heat conducting structure, and the heat conducting structure is in contact with the heat conducting medium and the camera housing, respectively.
6. The camera module of claim 5, wherein the image capture unit comprises an image capture circuit board, and the thermal conductive medium is attached to the image capture circuit board.
7. The camera module of claim 4, wherein the thermally conductive structure includes a platform portion, a sidewall portion extending downward along an edge of the platform portion, and an outer edge portion extending outward along a bottom portion of the sidewall portion, the sidewall portion conforming to an inner wall of the camera housing, the outer edge portion conforming to the bottom portion of the camera housing.
8. The camera module of claim 4, wherein the platform portion has a protrusion structure thereon, and the heat conducting medium is in contact with the protrusion structure.
9. The camera module of claim 4, wherein the material of the thermally conductive medium comprises thermally conductive grease; and/or the presence of a gas in the gas,
the material of the heat conducting structural member comprises metal.
10. The camera module according to one of claims 2 to 9, further comprising a control circuit unit, wherein the heat conducting unit is disposed between the image capturing unit and the control circuit unit.
11. The camera module according to claim 10, wherein the control circuit unit includes a control circuit board, the control circuit board is connected to the image capture circuit board, and the camera housing and the control circuit board enclose the accommodating space.
12. The camera module of claim 11, wherein the heat conducting unit is disposed between the image capture circuit board and the control circuit unit.
13. The camera module of claim 12, wherein the thermally conductive structural member has an opening disposed therein, the camera module further comprising a board-to-board connector extending through the opening for connecting the image capture circuit board and the control circuit board.
14. The camera module according to claim 11, wherein the control circuit unit further includes an electrical connector, one end of which is connected to the control circuit board, and the other end of which is an external interface.
15. The camera module of claim 2, wherein a dust-proof structure is disposed between the camera housing and the image capture circuit board.
16. A movable platform, comprising:
a movable platform body;
a camera module carried on the movable platform body, the camera module comprising:
the camera comprises a camera shell, a camera body and a camera body, wherein the camera shell is internally provided with an accommodating space;
the image acquisition unit is arranged in the accommodating space;
a heat conduction unit which is respectively contacted with the image acquisition unit and the camera shell so as to conduct the heat of the image acquisition unit to the camera shell;
wherein the heat conducting unit comprises a middle part and an edge part, and the middle part is in contact with the image acquisition unit; the edge portion is attached to the camera housing to substantially seal between the heat conducting unit and the camera housing.
17. The movable platform of claim 16, wherein the movable platform comprises an automobile, a remote control car, a robot, a drone, or a boat.
18. The movable platform of claim 16, wherein the image capture unit comprises: the image acquisition circuit board, the heat conduction unit with at least one side of image acquisition circuit board contacts.
19. The movable platform of claim 18, wherein the image capture unit further comprises an optical lens assembly and an image sensor disposed in sequence, the image sensor being disposed on the image capture circuit board.
20. The movable platform of claim 16, wherein the thermally conductive unit comprises a thermally conductive medium and a thermally conductive structure; the heat-conducting medium is located in the middle portion, and the heat-conducting structural part is located in the middle portion and located in the edge portion.
21. The movable platform of claim 17, wherein one side of the thermal conductive medium is attached to the image capture unit and the other side of the thermal conductive medium is attached to the thermal conductive structure, the thermal conductive structure being in contact with the thermal conductive medium and the camera housing, respectively.
22. The movable platform of claim 20, wherein the image capture unit comprises an image capture circuit board, and the thermal conductive medium is attached to the image capture circuit board
23. The movable platform of claim 20, wherein the thermally conductive structure comprises a platform portion, sidewall portions extending downwardly along edges of the platform portion, and outer edge portions extending outwardly along a bottom portion of the sidewall portions, the sidewall portions conforming to the inner wall of the camera housing, the outer edge portions conforming to the bottom portion of the camera housing.
24. The movable platform of claim 20, wherein the platform portion has a raised structure thereon, and the thermal medium is in contact with the raised structure.
25. The movable platform of claim 20, wherein the material of the thermally conductive medium comprises thermally conductive grease; and/or the presence of a gas in the gas,
the material of the heat conducting structural member comprises metal.
26. The movable platform of any one of claims 18-25, further comprising a control circuit unit, the thermally conductive unit being disposed between the image capture unit and the control circuit unit.
27. The movable platform of claim 26, wherein the control circuit unit comprises a control circuit board, the control circuit board is connected to the image capture circuit board, and the camera housing and the control circuit board enclose the accommodating space.
28. The movable platform of claim 27, wherein the thermally conductive unit is disposed between the image capture circuit board and the control circuit unit.
29. The movable platform of claim 28, wherein the thermally conductive structural member has an opening disposed therein, the camera module further comprising a board-to-board connector extending through the opening for connecting the image capture circuit board and the control circuit board.
30. The movable platform of claim 26, wherein the control circuit unit further comprises an electrical connector, one end of the electrical connector is connected to the control circuit board, and the other end of the electrical connector is an external interface.
31. The movable platform of claim 18, wherein a dust-proof structure is disposed between the camera housing and the image capture circuit board.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/099387 WO2022000297A1 (en) | 2020-06-30 | 2020-06-30 | Camera module and mobile platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113170035A true CN113170035A (en) | 2021-07-23 |
| CN113170035B CN113170035B (en) | 2023-11-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080006253.3A Active CN113170035B (en) | 2020-06-30 | 2020-06-30 | Camera module and movable platform |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113170035B (en) |
| WO (1) | WO2022000297A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117055280A (en) * | 2023-10-12 | 2023-11-14 | 贵州航天控制技术有限公司 | Camera cooling circulation device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721206A (en) * | 2022-03-26 | 2022-07-08 | 上海欧菲智能车联科技有限公司 | Camera module, lens defogging method, storage medium and vehicle |
| DE102022108087A1 (en) | 2022-04-05 | 2023-10-05 | B. Braun Melsungen Aktiengesellschaft | Analysis device with separate and external sample receiving device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130148016A1 (en) * | 2011-12-09 | 2013-06-13 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
| CN205283679U (en) * | 2015-11-23 | 2016-06-01 | 深圳市大疆创新科技有限公司 | Image capturing module and aircraft of taking photo by plane |
| CN107113371A (en) * | 2015-11-23 | 2017-08-29 | 深圳市大疆创新科技有限公司 | Image capture module and aerial photography aircraft |
| CN108924393A (en) * | 2018-07-13 | 2018-11-30 | 北京大恒图像视觉有限公司 | A kind of radiator structure of big target surface imaging sensor |
| CN110896655A (en) * | 2018-03-20 | 2020-03-20 | 深圳市大疆创新科技有限公司 | Cloud platform camera, cloud platform subassembly and shooting equipment |
| CN213342362U (en) * | 2020-06-30 | 2021-06-01 | 深圳市大疆创新科技有限公司 | Camera module and movable platform |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202677045U (en) * | 2012-07-25 | 2013-01-16 | 福州鑫图光电有限公司 | Camera with heat noise reducing structure |
| CN105573014A (en) * | 2016-01-22 | 2016-05-11 | 南昌欧菲光电技术有限公司 | Camera module with focusing and anti-shaking functions |
| JP6827341B2 (en) * | 2017-02-23 | 2021-02-10 | リズム株式会社 | Information processing equipment, cameras and camera equipment |
| CN208890902U (en) * | 2018-09-05 | 2019-05-21 | 浙江华睿科技有限公司 | A kind of video camera cooling mechanism and video camera |
-
2020
- 2020-06-30 WO PCT/CN2020/099387 patent/WO2022000297A1/en active Application Filing
- 2020-06-30 CN CN202080006253.3A patent/CN113170035B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130148016A1 (en) * | 2011-12-09 | 2013-06-13 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
| CN205283679U (en) * | 2015-11-23 | 2016-06-01 | 深圳市大疆创新科技有限公司 | Image capturing module and aircraft of taking photo by plane |
| CN107113371A (en) * | 2015-11-23 | 2017-08-29 | 深圳市大疆创新科技有限公司 | Image capture module and aerial photography aircraft |
| US20180241917A1 (en) * | 2015-11-23 | 2018-08-23 | SZ DJI Technology Co., Ltd. | Image capture assembly and aerial photographing aerial vehicle |
| CN110896655A (en) * | 2018-03-20 | 2020-03-20 | 深圳市大疆创新科技有限公司 | Cloud platform camera, cloud platform subassembly and shooting equipment |
| CN108924393A (en) * | 2018-07-13 | 2018-11-30 | 北京大恒图像视觉有限公司 | A kind of radiator structure of big target surface imaging sensor |
| CN213342362U (en) * | 2020-06-30 | 2021-06-01 | 深圳市大疆创新科技有限公司 | Camera module and movable platform |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117055280A (en) * | 2023-10-12 | 2023-11-14 | 贵州航天控制技术有限公司 | Camera cooling circulation device |
| CN117055280B (en) * | 2023-10-12 | 2023-12-19 | 贵州航天控制技术有限公司 | Camera cooling circulation device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022000297A1 (en) | 2022-01-06 |
| CN113170035B (en) | 2023-11-07 |
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