CN113160908B - Dynamic thermal stealth device and method - Google Patents
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Abstract
The invention belongs to the technical field of infrared, and particularly discloses a dynamic thermal stealth device and a method, wherein the device comprises a plurality of layers of rotating layers and a controller, wherein: the section of each rotating layer is circular, the multiple rotating layers are sequentially concentrically arranged from inside to outside and are movably connected, a circular area in the innermost rotating layer is a central stealth area, and the central stealth area is used for accommodating an object to be stealthed; the controller is connected with the rotating layers and used for adjusting the rotating angular velocity of each rotating layer according to background thermal conductivity. And then the rotation angular velocity of each rotating layer is continuously adjusted in real time, so that the equivalent thermal conductivity of the whole dynamic thermal stealth device is equal to the background thermal conductivity, and dynamic stealth is realized. The dynamic thermal stealth device provided by the invention has real-time adaptability to background change, can still keep the thermal stealth effect when the background changes, and has good application prospect.
Description
Technical Field
The invention belongs to the technical field of infrared, and particularly relates to a dynamic thermal stealth device and a dynamic thermal stealth method.
Background
The thermal stealth device is a thermal function device designed based on a thermal metamaterial and is a popularization of an optical stealth device in the aspect of heat. An observer cannot know what is inside the cloaking device through the temperature distribution outside the thermal cloaking device. The thermal stealth device has great application prospect in the military field, and the thermal stealth technology can be used for hiding military personnel and equipment of own party. The thermal stealth device is mainly characterized in that: 1. the temperature gradient inside the stealth area is always zero, and an observer cannot judge whether an object exists in the stealth area or not and the related properties of the object through the temperature gradient; 2. no matter what kind of object is placed in the stealth area, the temperature field outside the device cannot be influenced.
A metamaterial is an artificial material with special properties. The metamaterial arranges basic natural materials in a special mode, such as perforation filling, layer design and the like, so as to realize specific properties. Aiming at the thermal metamaterial, the thermal metamaterial designs special thermal property parameters meeting functional requirements from the function, further designs a structure meeting the requirements of the thermal property parameters, and finally achieves the purpose of effectively regulating and controlling heat flow. At present, the main methods for designing the thermal stealth device are to transform a thermal theory and a scattering elimination theory. The thermal stealth device designed by changing the thermal theory requires a structure to have anisotropic thermal conductivity, which brings difficulty to the preparation of experiments. The thermal stealth device designed based on the scattering elimination theory does not need anisotropic thermal conductivity, and the experimental preparation is simplified. However, the common problem of the thermal stealth devices designed by the two methods is that the thermal stealth device cannot maintain the thermal stealth effect under the condition that the background thermal conductivity is changed. To achieve the thermal stealth effect, the desired thermal conductivity of the device is related to the background thermal conductivity. When the background thermal conductivity changes, the thermal conductivity of the originally satisfactory device no longer meets the requirements, and the thermal stealth device will fail. If the device is required to regain the thermal stealth effect, the desired thermal conductivity of the device must be calculated from the new background thermal conductivity and the structure or constituent materials of the device changed accordingly. This approach is complex to operate and does not have the real-time nature of dynamic adaptation.
Therefore, in order to solve the problems of the static thermal stealth device and improve the dynamic adaptability of the thermal stealth device, a dynamic thermal stealth device with real-time adaptability is urgently needed.
Disclosure of Invention
In view of the above drawbacks or needs for improvement in the prior art, the present invention provides a dynamic thermal stealth apparatus and method, which aim to adjust the equivalent thermal conductivity of the apparatus in real time according to the change of the external background thermal conductivity, thereby achieving dynamic thermal stealth.
To achieve the above object, according to an aspect of the present invention, there is provided a dynamic thermal stealth device including a multi-layered rotating layer and a controller, wherein:
the section of each rotating layer is circular, the multiple rotating layers are sequentially concentrically arranged from inside to outside and are movably connected, a circular area in the innermost rotating layer is a central stealth area, and the central stealth area is used for accommodating an object to be stealthed; the controller is connected with the rotating layers and used for adjusting the rotating angular velocity of each rotating layer according to background thermal conductivity.
Further preferably, the rotating layer has three layers in total.
As a further preferred, the rotation layer is made of a metal material.
More preferably, the contact surfaces of the respective rotation layers are filled with a heat conductive silicone grease.
More preferably, the width of each rotating layer is 0.5cm to 3cm.
According to another aspect of the present invention, there is provided a dynamic thermal hiding method implemented by using the above dynamic thermal hiding apparatus, including the following steps:
an object to be concealed is placed in the central concealed area, the controller adjusts the rotation angular velocity of each rotating layer in real time, so that the equivalent thermal conductivity of the whole dynamic thermal concealed device is a pure real number, and the equivalent thermal conductivity is equal to the background thermal conductivity, and dynamic concealment is achieved.
As a further preference, the angular velocity of the inner first rotating layer is greater than 1.3rad/s.
Generally, compared with the prior art, the technical scheme of the invention mainly has the following technical advantages:
1. when the background thermal conductivity is changed, in order to keep the thermal stealth effect, the thermal conductivity of the thermal stealth device is correspondingly changed, the equivalent thermal conductivity of the thermal stealth device is continuously regulated and controlled in real time by changing the angular speed of each rotating layer, so that the temperature gradient of a central circular stealth area is always zero no matter what kind of object is placed in the area, whether the stealth area has the object or not can not be judged through the temperature field of the area, and the external temperature field is not influenced. The dynamic thermal stealth device provided by the invention has real-time adaptability to background change, can still keep the thermal stealth effect when the background changes, and has good application prospect.
2. Different from the traditional static thermal stealth device, the structure or component materials need to be changed, the dynamic thermal stealth device provided with the rotating layer can keep the thermal stealth effect only by reasonably regulating and controlling the angular speed of the rotating layer, the dynamic adaptability and the application range of the thermal stealth device are greatly improved, and the dynamic thermal stealth device can be used for designing other thermal functional devices with different functions.
3. The rotating layer of the invention is preferably three layers, compared with a two-layer structure, the three-layer structure has three adjustable angular velocities, so that the three-layer structure has stronger adaptability, and the more-layer rotating structure can also realize the dynamic thermal stealth effect, but needs to be at the cost of more complicated experimental structures. Specifically, when the rotation angular velocity of the rotating layer is adjusted, the equivalent thermal conductivity of the structure needs to be a pure real number, so that the reciprocity in the heat transfer process is recovered, and the solid-like effect required by the thermal metamaterial is achieved.
4. The rotating layer is preferably made of metal materials such as iron and copper, so that the rotating structure is convenient to construct and drive, the rotating layers are in mutual contact, and the heat-conducting silicone grease is filled in gaps of a contact interface to reduce contact thermal resistance.
5. In order to realize thermal stealth, the temperature gradient in the stealth region needs to be close to zero, so that the rotation angular velocity of the first layer of rotating layer in the stealth region needs to be large enough, at the moment, the equivalent thermal conductivity of the stealth region in the interior is high, and under the condition of certain heat flow, the higher the equivalent thermal conductivity is, the smaller the temperature gradient is; meanwhile, the external temperature field is not affected, namely the external temperature field is kept parallel, so that a proper angular velocity combination is further selected, and the structural equivalent thermal conductivity is equal to the background thermal conductivity to achieve the condition of eliminating scattering.
Drawings
FIG. 1 is a two-dimensional schematic diagram of a dynamic thermal stealth device according to an embodiment of the present invention;
FIGS. 2 (a) - (c) are schematic diagrams showing temperature field simulation at different angular velocities of the first layer according to the embodiment of the present invention;
in fig. 3, (a) to (c) are schematic diagrams of temperature field simulation at different background thermal conductivities and the same angular velocity according to the embodiment of the invention;
FIG. 4 is a graph of the real and imaginary components of the equivalent thermal conductivity of the central circular region plus the first rotated layer as a function of the angular velocity of the first layer in an embodiment of the present invention;
FIG. 5 is a graph of temperature data on y =0 and x =8cm stubs for an embodiment of the present invention;
FIG. 6 is a schematic diagram of a reciprocity line of a dynamic thermal stealth device according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of equivalent thermal conductivity along the reciprocity line for an embodiment of the invention;
fig. 8 (a) to (c) are schematic diagrams of temperature field simulation after changing the angular velocity of the rotating layer under different background thermal conductivities according to the embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
An embodiment of the present invention provides a dynamic thermal stealth device, as shown in fig. 1, including a multi-layer rotating layer and a controller, where:
the section of each rotating layer is circular, the multiple rotating layers are sequentially concentrically arranged from inside to outside and are movably connected, a circular area in the innermost rotating layer is a central stealth area, and the central stealth area is used for accommodating an object to be stealthed; the controller is connected with the rotating layers and used for adjusting the rotating angular velocity of each rotating layer according to background thermal conductivity.
Preferably, the rotating layer is made of metal materials such as iron and copper; the rotating layers are mutually contacted, and heat-conducting silicone grease is filled in gaps of a contact interface to reduce contact thermal resistance; the rotation of the rotating layer is driven by a motor and gears.
When the dynamic thermal stealth device is adopted to realize stealth, an object to be stealthed needs to be placed in a central stealth area, the controller adjusts the rotation angular velocity of each rotating layer in real time, the rotation directions of the rotating layers are not identical, the equivalent thermal conductivity of the whole dynamic thermal stealth device is a pure real number, and the equivalent thermal conductivity is equal to the background thermal conductivity, so that dynamic stealth is realized.
Specifically, based on a heat transfer equation of a rotating structure, introducing a variable of a rotating angular velocity, substituting a convection effect caused by rotation into heat conduction, deducing and establishing a relation between the rotating angular velocity of each rotating layer and the structure equivalent thermal conductivity, and calculating the required rotating angular velocity reversely through the structure equivalent thermal conductivity; when the background thermal conductivity is changed, the required structural equivalent thermal conductivity is changed, so that the required rotation angular velocity is correspondingly changed, the thermal stealth effect can be kept by adjusting the corresponding rotation angular velocity, and the dynamic adaptation to the background change is realized. Taking the rotating layer as three layers as an example, the equivalent thermal conductivity calculation formula of the dynamic thermal stealth device is as follows:
wherein the content of the first and second substances,
is the equivalent thermal conductivity, κ, of the device structure as a whole c Thermal conductivity of the central stealth region, κ 1 ,κ 2 ,κ 3 Respectively represents the thermal conductivity of the first, second and third rotating layers from inside to outside; wherein the variables are defined by the formula:
wherein n represents the number of layers, n =1,2,3; omega 1 ,ω 2 ,ω 3 Respectively representing the angular velocities of the first rotating layer, the second rotating layer and the third rotating layer; r 1 ,R 2 ,R 3 ,R 4 Respectively representing the radius of the circular stealth area, the outer diameter of the first rotating layer, the outer diameter of the second rotating layer and the outer diameter of the third rotating layer; i is 1 (·)、K 1 (. Cndot.) are first and second class first order modified Bessel functions, respectively, i being imaginary units and D being the thermal diffusivity.
More specifically, the thermal stealth device needs to satisfy two requirements for realizing thermal stealth: 1. the temperature gradient in the stealth area is zero; 2. the external temperature field of the device is not influenced by the hidden area object, and is parallel when high and low temperature boundary conditions are respectively applied to the two external ends.
In order to meet the above two requirements, there is also a certain rule for setting the angular velocity of the rotating layer of the dynamic thermal stealth device: 1. the angular velocity of rotation of the inner first layer is sufficiently large (greater than 1.3 rad/s) to meet requirements 1 for a thermo-stealth device. When the rotational angular velocity of the first layer is sufficiently large, the equivalent thermal conductivity of the inner stealth region is high. The higher the equivalent thermal conductivity, the smaller the temperature gradient, given a constant heat flow. 2. The rotation angular velocities of other rotating layers are reasonably set through calculation, so that the structural equivalent thermal conductivity at the angular velocity is a pure real number and is equal to the thermal conductivity of the background, and the requirement 2 of the thermal stealth device is met. In order to keep the temperature field outside the device unaffected, the equivalent thermal conductivity of the thermal cloaking device needs to be equal to the background thermal conductivity to achieve the effect of scattering cancellation.
Therefore, the dynamic adaptive process of the dynamic thermal stealth device to the background is as follows: the background thermal conductivity is changed, the equivalent thermal conductivity required by the device is correspondingly changed, the required equivalent thermal conductivity is input through the relation between the equivalent thermal conductivity of the rotating structure and the rotating angular velocity, the required rotating angular velocity can be calculated, and finally the angular velocity of the rotating layer is correspondingly changed to keep the thermal stealth effect.
It should be noted that, in the process of calculating the angular velocity, the equivalent thermal conductivity of the structure needs to be a pure real number by adjusting the rotation angular velocity of each rotating layer, so as to recover the reciprocity in the heat transfer process, and achieve the solid-like effect required by the thermal metamaterial. Specifically, the rotating structure brings a thermal convection effect, the equivalent thermal conductivity of the structure at different angular velocities is a complex number with an imaginary part, the imaginary part of the equivalent thermal conductivity essentially comes from the damage of reciprocity, and from the view of a temperature field, the reciprocal damage caused by the rotating motion is reflected in that the temperature field of a rotating object can be twisted to a certain degree, which cannot meet the thermal regulation and control requirement of the traditional thermal metamaterial. Therefore, the reciprocity needs to be restored by adjusting the angular velocity of the rotating layer to enable the structural equivalent thermal conductivity to be a pure real number, and the requirement of the thermal metamaterial on thermal regulation is met.
Furthermore, after the angular velocity of the first layer is fixed, the equivalent thermal conductivity of the structure is made to be a pure real number by reasonably regulating and controlling the angular velocities of other layers, so that an angular velocity combination which can make the equivalent thermal conductivity of the structure to be the pure real number can be obtained, and the angular velocity of the structure can only be selected from the combinations. The structural equivalent thermal conductivity under other angular velocity combinations has imaginary parts, and does not meet the thermal regulation and control requirements. And calculating the structure equivalent thermal conductivity under the angular velocity combination, wherein the obtained structure equivalent thermal conductivity range is the adaptive range of the background thermal conductivity. Therefore, the number of the rotating layers is preferably three, and compared with a two-layer structure, the three-layer structure has three adjustable angular speeds, so that the three-layer structure has stronger adaptability, and meanwhile, the structure can be prevented from being too complex.
The following are specific examples:
the dynamic thermal stealth device is structurally shown in fig. 1, wherein any object can be placed in a central circular area, and three layers of annular areas are thermal stealth cloaks. The dynamic thermal stealth device can keep the thermal stealth effect by adjusting the angular velocity when the background thermal conductivity changes.
In order to show the effect of the dynamic thermal stealth device, the invention utilizes finite element simulation software COMSOL Multiphysics and math software Matlab to carry out verification. The structural parameters of the dynamic thermal stealth device in the verification are as follows: r 1 ＝0.03m,R 2 ＝0.04m,R 3 ＝0.05m,R 4 ＝0.06m,D 1 ＝D 2 ＝D 3 ＝13.3mm 2 s -1 ,κ c ＝κ 1 ＝κ 2 ＝κ 3 ＝50W m -1 K -1 The length L =0.2m of the square analog field. In the simulation process, high temperature 313K and low temperature 273K are set at the left and right boundaries respectively, and the upper and lower boundary conditions are adiabatic.
As shown in (a) to (c) of FIG. 2, the first layer angular velocities are 0.2rad s, respectively -1 ,0.5rad s -1 ,1.3rad s -1 The simulation of the temperature field when the angular velocities of the second layer and the third layer are fixed and unchanged shows that when the angular velocity of the first layer is not large enough, an isotherm enters the central circular stealth area, namely, a temperature gradient exists in the central stealth area, and when the angular velocity of the first layer is large enough, an isotherm does not exist in the central circular stealth area, namely, a temperature gradient does not exist in the stealth area, so that the fact that the angular velocity of the first layer of the dynamic thermal stealth device needs to be large enough is verified. Fig. 5 shows temperature data on the y =0 sectional line (a planar rectangular coordinate system is established with the circle center as the origin, the horizontal direction as the x axis, and the vertical direction as the y axis), and a quantitative analysis is performed on the temperature field simulation in fig. 2, and it is found that when the angular velocity of the first layer is larger, the temperature gradient of the central circular region is smaller, and when the angular velocity of the first layer is sufficiently large, the temperature gradient of the central circular region tends to zero, so that the first condition of the thermal stealth device is satisfied. Fig. 4 explains the reason why the temperature gradient of the central circular area is zero when the angular velocity of the first layer is large enough, and as the angular velocity of the first layer increases, the real part and the imaginary part of the equivalent thermal conductivity of the central circular area plus the first rotating layer both increase, and under a certain heat flow condition, the thermal conductivity is larger, and the temperature gradient is smaller.
As shown in FIGS. 3 (a) to (c), the background thermal conductivities were 100W m, respectively -1 K -1 ，166Wm -1 K -1 ，200W m -1 K -1 Simulation of temperature field with the same angular velocity, the equivalent thermal conductivity of the structure at the angular velocity is 166W m -1 K -1 It can be seen that the background thermal conductivity is 100W m -1 K -1 And 200W m -1 K -1 When the temperature is measured, the isotherms of the external temperature field are not parallel, and only the background thermal conductivity is 166W m -1 K -1 When the isotherms of the external temperature field are parallel, the book is verifiedThe dynamic thermal stealth device is used for setting the angular speed of a rotating layer. Fig. 5 shows temperature data on a x =8cm section line, and it is found that when the background thermal conductivity is not equal to the structure equivalent thermal conductivity, the outer isotherms are not parallel, and only when the background thermal conductivity is equal to the structure equivalent thermal conductivity, the outer isotherms are parallel, satisfying the second condition of the thermal stealth device.
Thus, it is proved that for the rotary type thermal hiding device, when the angular velocity of one layer is large enough and the three rotary layers are reasonably arranged, so that the structural equivalent thermal conductivity is equal to the background thermal conductivity, the thermal hiding effect can be realized. However, the above simulation only realizes a static thermal hiding effect, and in order to realize a dynamic thermal hiding effect, it is necessary to calculate a background thermal conductivity range that the dynamic thermal hiding cloak under the parameter can adapt to.
First, the second and third layer angular velocities which can make the structure equivalent thermal conductivity be a pure real number and are matched with each other are calculated under a certain first layer angular velocity, which is called a reciprocity line, as shown in fig. 6. The equivalent thermal conductivity of the structure is a complex number due to the convective effects brought about by the rotating layer. The reason that the equivalent thermal conductivity is complex is the disruption of the reciprocity of the heat transfer process. The temperature field of a heat transfer process that loses its reciprocity is distorted compared to a heat transfer process that has reciprocity. After the reciprocal line is calculated, the pure real thermal conductivity on the reciprocal line is calculated using the angular velocity on the reciprocal line, as shown in fig. 7. In the dynamic thermal stealth device, the thermal conductivity of the central circular area and the thermal conductivity of the rotating layer are both 50W m -1 K -1 . The equivalent thermal conductivity range of the structure is expanded to 100-250W m through the convection effect brought by the rotating layer -1 K -1 The limit of Maxwell-Gantt formula is broken through. Finally, three background thermal conductivities are selected to verify the dynamic adaptation effect of the dynamic thermal stealth device, as shown in (a) to (c) of fig. 8, the background thermal conductivities are respectively 120W m -1 K -1 ，186W m -1 K -1 ，230W m -1 K -1 And aiming at different background heat conductivities, the rotation angular velocity of the rotating layer is properly changed, and a good thermal stealth effect is realized.
It will be understood by those skilled in the art that the foregoing is only an exemplary embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, since various modifications, substitutions and improvements within the spirit and scope of the invention are possible and within the scope of the appended claims.
Claims (5)
1. A dynamic thermal stealth device comprising a plurality of rotating layers and a controller, wherein:
the section of each rotating layer is circular, the multiple rotating layers are sequentially concentrically arranged from inside to outside and are movably connected, a circular area in the innermost rotating layer is a central stealth area, and the central stealth area is used for accommodating an object to be stealthed; the controller is connected with the rotating layers and used for adjusting the rotating angular velocity of each rotating layer according to background heat conductivity; the rotating layer has three layers, and the angular speed of the first rotating layer in the rotating layer is more than 1.3rad/s, so that the temperature gradient in the stealth area is zero; the rotation angular velocities of other rotating layers are reasonably set through calculation, so that the structural equivalent thermal conductivity under the angular velocity is a pure real number and is equal to the thermal conductivity of the background, and the external temperature field of the device is not influenced by the object in the central stealth area.
2. The dynamic thermal camouflage apparatus of claim 1, wherein said rotating layer is made of a metallic material.
3. The dynamic thermal camouflage apparatus of claim 2, wherein the contact surfaces of the rotating layers are filled with thermally conductive silicone grease.
4. The dynamic thermal camouflage apparatus according to any one of claims 1 to 3, wherein each rotating layer has a width of 0.5cm to 3cm.
5. A dynamic thermal stealth method implemented by using the dynamic thermal stealth device according to any one of claims 1 to 4, comprising the steps of:
an object to be concealed is placed in the central concealed area, the controller adjusts the rotation angular velocity of each rotating layer in real time, so that the equivalent thermal conductivity of the whole dynamic thermal concealed device is a pure real number, and the equivalent thermal conductivity is equal to the background thermal conductivity, and dynamic concealment is achieved.
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