CN113153875A - Earphone upper cover pressure maintaining jig and earphone upper cover assembling method - Google Patents
Earphone upper cover pressure maintaining jig and earphone upper cover assembling method Download PDFInfo
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- CN113153875A CN113153875A CN202110409024.2A CN202110409024A CN113153875A CN 113153875 A CN113153875 A CN 113153875A CN 202110409024 A CN202110409024 A CN 202110409024A CN 113153875 A CN113153875 A CN 113153875A
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- earphone
- pressure maintaining
- upper cover
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000000926 separation method Methods 0.000 claims abstract description 72
- 238000003825 pressing Methods 0.000 claims abstract description 65
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000004484 Briquette Substances 0.000 description 1
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/02—Assembly jigs
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Telephone Set Structure (AREA)
Abstract
The application discloses a pressure maintaining jig for an upper cover of an earphone and a method for assembling the upper cover of the earphone, and relates to the technical field of earphone manufacturing. The pressure maintaining jig for the upper cover of the earphone comprises a pressure maintaining upper die, and the pressure maintaining upper die is provided with a plurality of copying positioning blocks; the pressure maintaining lower die is provided with a plurality of earphone positioning grooves, and the earphone positioning grooves are arranged corresponding to the profiling positioning blocks; the separation briquetting, the setting can be dismantled to the separation briquetting is in earphone position groove one side, the separation briquetting is used for keeping apart to be located the earphone upper cover in earphone position groove attracts mutually or two at least first magnetic part that repel each other. The first magnetic parts which are attracted or repelled on the upper cover of the earphone can be separated through the separation pressing block, so that one-time assembly is realized, and the assembly cost is reduced.
Description
Technical Field
The application relates to the field of earphone manufacturing, in particular to an earphone upper cover pressure maintaining jig and an earphone upper cover assembling method.
Background
Earphones, such as tws (true Wireless stereo) earphones, are typically placed in an earphone case that has a suction and charging function. Specifically, the TWS earphone is fixedly adsorbed through the earphone upper cover of the earphone box, so that the charging position can be aligned to charge after the TWS earphone is placed into the box. The earphone upper cover is generally formed by integrally forming two groove bodies matched with the earphone in shape, and magnets are arranged on the side edges of the groove bodies and the joints of the two groove bodies to provide enough adsorption force. However, because the distance between the magnets is relatively short, particularly, the magnets at the joint of the two slot bodies can generate attractive force or repulsive force, when the upper cover of the earphone is assembled, the repulsive magnets need to be assembled one by one, and the magnets are assembled after being fixed in the previous assembly, so that the change of the installation position of the magnets caused by the attractive force or the repulsive force is avoided. However, this method results in a long assembly cycle of the upper cover of the earphone and high assembly cost.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the pressure maintaining jig for the upper cover of the earphone and the method for assembling the upper cover of the earphone are provided, the assembling period of the upper cover of the earphone can be shortened, and the assembling cost is reduced.
According to this application first aspect embodiment's an earphone upper cover pressurize tool includes:
the pressure maintaining upper die is provided with a plurality of copying positioning blocks;
the pressure maintaining lower die is provided with a plurality of earphone positioning grooves, and the earphone positioning grooves are arranged corresponding to the profiling positioning blocks;
the separation briquetting, the setting can be dismantled to the separation briquetting is in earphone position groove one side, the separation briquetting is used for keeping apart to be located the earphone upper cover in earphone position groove attracts mutually or two at least first magnetic part that repel each other.
According to the above embodiments of the first aspect of the present application, at least the following advantages are provided: after the glued upper cover of the earphone is placed in the earphone positioning groove, one first magnetic part is assembled at the glue dispensing position, then the separation pressing block is clamped on the pressure maintaining lower die next to the installed first magnetic part, and the first magnetic part is clamped and pressed by the separation pressing block and the earphone; and another first magnetic piece is placed on the other side of the separation pressing block; or after the earphone upper cover is placed in the earphone positioning groove, the fixed separation pressing block is clamped firstly, the two first magnetic parts are assembled in sequence, at the moment, the earphone upper cover and the first magnetic parts are assembled rapidly through different assembling modes, and then the pressure maintaining upper die and the pressure maintaining lower die are assembled and pressed down in sequence to be fixed in a bonding mode. Therefore, the separation pressing block is used for separating the magnetic force between the two adjacent first magnetic parts, so that under the action of the profiling positioning block and the separation pressing block, the two first magnetic parts and the upper cover of the earphone can be kept in a pressing state, the earphone can be assembled at one time, the assembling period of the upper cover of the earphone and the first magnetic parts is shortened, and the assembling cost is reduced.
According to some embodiments of the first aspect of the present application, the separation compact is made of iron or copper. The separation pressing block is made of iron, so that the first magnetic piece can be adsorbed on the separation pressing block, and the position of the first magnetic piece is fixed. The separation pressing block is made of copper, so that the magnetic forces of the two first magnetic pieces are not influenced by each other; thereby being more convenient for the first magnetic part to fix the position.
According to some embodiments of the first aspect of the present application, the pressure holding upper die includes a bottom cover and a movable platen disposed between the bottom cover and the pressure holding lower die; the movable pressing plate is movably connected with the bottom cover, and the profiling positioning block is arranged on the movable pressing plate. Through this with activity clamp plate elastic connection for at pressurize in-process behind the compound die, first magnetic part atress is even, prevents the condition of pressurize in-process because the atress is inhomogeneous to lead to the skew.
According to some embodiments of the first aspect of the present application, the bottom cover and the movable platen are elastically connected by a spring.
According to some embodiments of the application, be provided with a plurality of spacing holes on the bottom, the activity clamp plate with the one side correspondence that the bottom is relative is provided with a plurality of spacing posts, spacing post one end is fixed to be set up on the activity clamp plate, the other end activity of spacing post sets up corresponding spacing downthehole. Through setting up spacing hole and spacing post, can restrict the direction that spring elasticity changes to further guarantee the pressurize in-process after the compound die, first magnetic part atress is even.
According to some embodiments of the first aspect of the present application, a surface of the pressure maintaining lower die opposite to the pressure maintaining upper die is provided with a second magnetic member, and the second magnetic member is provided with at least one magnetic member; the second magnetic pieces are arranged along the edge of the earphone setting groove, and one of the second magnetic pieces is positioned between the separation pressing block and the pressure maintaining lower die; the second magnetic part is used for adsorbing a third magnetic part on the upper cover of the earphone in the earphone setting groove. Through setting up the second magnetic part for when adjacent position equipment three magnetic part, can fix third magnetic part and two first magnetic parts respectively with the help of second magnetic component, separation briquetting, promote the convenience of equipment.
According to some embodiments of the first aspect of the present application, the earphone placing groove is laid with a flexible object. Through setting up the flexible thing for when the earphone was pressed by the profile modeling locating piece, because the cushioning effect of flexible thing, the earphone upper cover is difficult to warp.
According to some embodiments of the first aspect of the present application, the mould on the pressurize the both ends of pressurize lower mould all are equipped with the arch, mould on the pressurize lower mould through setting up convex column and recess on the arch clamp the compound die each other. Set up the arch and clamp each other through protruding projection and recess on the pressurize through the both ends of going up mould, pressurize lower mould in the pressurize to make the both sides of earphone upper cover pressurize tool after the compound die be formed with the opening, can be convenient for observe the process of earphone upper cover equipment, be convenient for in time discover the problem.
According to the method for assembling the upper cover of the earphone of the embodiment of the second aspect of the application, the pressure maintaining jig for the upper cover of the earphone of the first aspect is adopted for realizing, and the method comprises the following steps:
dispensing glue at a preset dispensing position on an upper cover of the earphone to be assembled, and placing the upper cover of the earphone into a corresponding earphone positioning groove; at least two dispensing positions are arranged, and the two dispensing positions correspond to the two first magnetic pieces which are oppositely arranged respectively;
clamping the separation pressing block on one side of the corresponding earphone setting groove on the pressure maintaining lower die;
assembling the two first magnetic pieces at the corresponding dispensing positions respectively; the two first magnetic pieces are respectively positioned on two sides of the separation pressing block;
and carrying out die assembly on the pressure maintaining upper die and the pressure maintaining lower die and maintaining the pressure for a preset time to obtain the assembled earphone upper cover.
Because the method of this application second aspect's earphone upper cover equipment through the earphone upper cover pressurize tool of first aspect, consequently can realize once assembling a plurality of first magnetic part to shorten the equipment cycle of earphone upper cover, reduce the assembly cost.
According to some embodiments of the second aspect of the present application, there are three dispensing positions; a second magnetic part is arranged on one surface of the pressure maintaining lower die, which is opposite to the pressure maintaining upper die, and the second magnetic part is positioned between the separation pressing block and the pressure maintaining lower die; before the step of clamping the separation pressing block on the pressure maintaining lower die corresponding to the earphone setting groove side, the method further comprises the following steps:
and placing a third magnetic piece on the second magnetic piece so as to align the third magnetic piece with the corresponding dispensing position on the upper cover of the earphone.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is an exploded view of a structure of an earphone upper cover pressure maintaining jig according to an embodiment of the present application;
fig. 2 is a schematic view of a pressure maintaining lower die structure of an earphone upper cover pressure maintaining jig according to an embodiment of the present application;
fig. 3 is a schematic diagram illustrating a side surface explosion of a pressure maintaining upper die of the pressure maintaining jig for the upper cover of the earphone according to the embodiment of the present application;
fig. 4 is a process diagram illustrating a method for assembling an upper cover of a headset according to an embodiment of the present application;
fig. 5 is a schematic top view of an earphone upper cover obtained by a method for assembling the earphone upper cover according to an embodiment of the present application.
Reference numerals:
an upper pressure maintaining mold 100, a profiling positioning block 110, a bottom cover 120, a limiting hole 121, a movable pressure plate 130, a limiting column 131, a spring 140, a protrusion 150, a convex column 151, a concave column,
A pressure maintaining lower die 200, an earphone positioning groove 210, a groove 152,
A separation briquette 300,
The earphone comprises an upper cover 410, a slot 411, a first magnetic part 420, a fourth magnetic part 430 and a fifth magnetic part 440.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and larger, smaller, larger, etc. are understood as excluding the present number, and larger, smaller, inner, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated. It should be understood that the positional or orientational descriptions referred to, for example, the directions of up, down, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings and are only for convenience of describing the present application and for simplicity of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Along with the intelligent AI of TWS bluetooth headset, the more magnet that its inside equipment of box that charges used, lead to earphone upper cover 410 dysmorphism face more complicated, simultaneously because the polarity characteristic of magnet: due to the repulsion of the same poles and the attraction of the opposite poles, repeated dispensing and assembly bonding pressure maintaining are required, so that the difficulty of assembling the magnet after dispensing the earphone upper cover 410 is increased, and the labor cost is increased.
Therefore, in order to enable the plurality of magnets to be rapidly assembled on the earphone upper cover 410 under the condition of different polarities in a short distance, the application provides a pressure maintaining jig for the earphone upper cover and a method for assembling the earphone upper cover, so that the assembling period of the earphone upper cover 410 is shortened, and the assembling cost is reduced.
As shown in fig. 1 to 3, the earphone upper cover pressure maintaining jig includes:
the pressure maintaining upper die 100, the pressure maintaining upper die 100 is provided with a plurality of profiling positioning blocks 110;
the pressure maintaining lower die 200 is provided with a plurality of earphone positioning grooves 210, and the earphone positioning grooves 210 are arranged corresponding to the profiling positioning blocks 110;
the separating pressing block 300, the separating pressing block 300 is detachably disposed at one side of the earphone placing groove 210, and the separating pressing block 300 is used for isolating at least two first magnetic members 420 that are attracted or repelled on the earphone upper cover 410 located in the earphone placing groove 210.
Note that the separation compact 300 is a copying compact. The first magnetic member 420 is a magnet; be provided with the mounting groove that matches with separation briquetting 300 on pressurize lower mould 200 for the one end of separation briquetting 300 can clamp on pressurize lower mould 200, and the other end of separation briquetting 300 clamps the surface at the earphone upper cover this moment, makes two first magnetic part 420 that adjacent set up (if be located the first magnetic part 420 of separation briquetting 300 both sides) isolated, thereby can cut off the magnetic force between two first magnetic part 420, avoids mutual influence. It should be noted that, because magnet and earphone upper cover 410 need bond through the mode of gluing, consequently can dismantle the connection with separation briquetting 300, can make things convenient for the equipment of earphone upper cover 410 and magnet more, simultaneously, can be through the separation briquetting 300 of designing the difference, the isolation of the different magnet shape of adaptation or a plurality of magnet promotes the utilization ratio of earphone upper cover pressurize tool.
It should be noted that, the pressure maintaining upper die 100 and the pressure maintaining lower die 200 are clamped by the groove 152 and the protrusion 151, so that the pressure maintaining upper die 100 and the pressure maintaining lower die 200 do not move relative to each other during the pressure maintaining process after the dies are closed.
It should be noted that, as required by the position and number of the first magnetic member 420, a plurality of separation pressing blocks 300 may be provided for convenient assembly and fixation.
It should be noted that one or more earphone positioning grooves 210 and profile modeling positioning blocks 110 may be provided, and the number of the earphone upper covers 410 for one pressure maintaining is set.
Therefore, after the glued upper earphone cover 410 is placed in the earphone positioning groove 210, one of the first magnetic members 420 is assembled at the glue dispensing position, and then the separation pressing block 300 is clamped on the pressure maintaining lower die 200 next to the installed first magnetic member 420, at this time, the first magnetic member 420 is clamped and pressed by the separation pressing block 300 and the earphone; and another first magnetic member 420 is placed on the other side of the separation pressing block 300; or after the earphone upper cover 410 is placed in the earphone positioning groove 210, the fixed separation pressing block 300 is clamped and fixed, and the two first magnetic pieces 420 are assembled in sequence, at this time, the earphone upper cover 410 and the first magnetic pieces 420 are rapidly assembled in different assembling modes, and then the pressure maintaining upper die 100 and the pressure maintaining lower die 200 are closed and pressed down in sequence to be fixedly bonded. Therefore, the separating press block 300 is used for separating the magnetic force between two adjacent first magnetic members 420, so that under the action of the profiling positioning block 110 and the separating press block 300, the two first magnetic members 420 and the earphone can be kept in a compressed state, and thus, the assembly can be completed at one time, the assembly period of the upper cover 410 of the earphone and the first magnetic members 420 can be shortened, and the assembly cost can be reduced.
It should be noted that the shape of the profiling positioning block 110 is matched with the shape of the upper surface of the earphone upper cover 410 to be assembled, when the mold is closed and the pressure is maintained, the profiling positioning block 110 provides a downward force to the earphone upper cover 410, and at this time, under the action of the profiling positioning block 110 and the separation pressing block 300, the earphone upper cover 410 and the first magnetic member 420 are kept in a pressing state, so as to be fixed in an adhering manner.
It is understood that the separation compact 300 is made of iron or copper. By making the separation compact 300 of iron, the first magnetic member 420 may be attracted to the separation compact 300, thereby fixing the position of the first magnetic member 420. The separation compact 300 is made of copper, so that the magnetic forces of the two first magnetic members 420 do not affect each other; thereby facilitating the position fixing of the first magnetic member 420.
It can be understood that, as shown in fig. 1, the pressure maintaining upper die 100 includes a bottom cover 120 and a movable platen 130, and the movable platen 130 is disposed between the bottom cover 120 and the pressure maintaining lower die 200; the movable pressing plate 130 is movably connected with the bottom cover 120, and the profiling positioning block 110 is arranged on the movable pressing plate 130. Through this with activity clamp plate 130 elastic connection for in the pressurize process after the compound die, first magnetic part 420 atress is even, prevents to pressurize the in-process because the inhomogeneous condition that leads to the offset of atress.
It is understood that, as shown in fig. 3, the bottom cover 120 and the movable pressure plate 130 are elastically coupled by the spring 140.
It can be understood that, as shown in fig. 3, the bottom cover 120 is provided with a plurality of limiting holes 121, one surface of the movable pressing plate 130 opposite to the bottom cover 120 is correspondingly provided with a plurality of limiting posts 131, one end of each limiting post 131 is fixedly arranged on the movable pressing plate 130, and the other end of each limiting post 131 is movably arranged in the corresponding limiting hole 121. Through setting up spacing hole 121 and spacing post 131, can restrict the direction of spring 140 elasticity change to further guarantee the pressurize in-process after the compound die, first magnetic part 420 atress is even.
It can be understood that a second magnetic member is disposed on a surface of the pressure maintaining lower die 200 opposite to the pressure maintaining upper die 100, and at least one second magnetic member is disposed on the second magnetic member; the second magnetic members are arranged along the edge of the earphone positioning groove 210, and one of the second magnetic members is located between the separation pressing block 300 and the pressure maintaining lower die 200; the second magnetic member is used for attracting the third magnetic member on the upper cover 410 of the earphone in the earphone positioning groove 210. Through setting up the second magnetic part for when three magnetic parts are assembled in same position, can fix third magnetic part and two first magnetic parts 420 respectively with the help of second magnetic component, separation briquetting 300, promote the convenience of equipment.
It should be noted that, as shown in fig. 5, the earphone upper cover 410 is integrally formed by two slots 411 matching with the shape of the earphone, at this time, two first magnetic members 420 are oppositely disposed on the surfaces of the two slots 411, and a third magnetic member is disposed at the joint of the two slots 411, so that the first magnetic member 420, the third magnetic member, and the other first magnetic member 420 are distributed along the earphone upper cover 410. Therefore, the separation pressing block 300 can be clamped after the third magnetic member is attracted to the second magnetic member, and at this time, the separation pressing block 300 can fix the third magnetic member and can separate two first magnetic members 420 which need to be assembled.
The second magnetic member may be embedded in the pressure holding lower mold 200, or may be protruded and fixed on the surface of the pressure holding lower mold 200, specifically, according to the bonding position of the third magnetic member.
It is understood that the earphone placing groove 210 is laid with a flexible object. Through setting up the flexible thing for when the earphone was pressed by profile modeling locating piece 110, because the cushioning effect of flexible thing, the earphone upper cover is difficult to warp.
It should be noted that the flexible object may be a substance with small elasticity and softness, such as foam or foam, and may provide a certain buffering force to the earphone upper cover 410 during pressure maintaining, so as to reduce surface damage to the earphone upper cover 410.
It can be understood that the protrusions 150 are disposed at both ends of the upper pressure maintaining mold 100 and the lower pressure maintaining mold 200, and the upper pressure maintaining mold 100 and the lower pressure maintaining mold 200 are clamped and assembled with each other through the convex columns 151 and the concave grooves 152 disposed on the protrusions 150. Through setting up protruding 150 and clamping each other through projection 151 and recess 152 on protruding 150 at the both ends of mould 100, pressurize lower mould 200 in the pressurize to make the both sides of the earphone upper cover pressurize tool after the compound die be formed with the opening, can be convenient for observe the process of earphone upper cover 410 equipment, be convenient for in time discover the problem.
It should be noted that the convex pillar 151 and the concave groove 152 are respectively disposed at two ends of the pressure maintaining upper die 100 (the bottom cover 120) and the pressure maintaining lower die 200.
As shown in fig. 4, the method includes:
step S100, dispensing at a preset dispensing position on the upper cover 410 of the earphone to be assembled, and placing the upper cover 410 of the earphone into the corresponding earphone positioning slot 210; at least two dispensing positions are provided, and the two dispensing positions correspond to the two first magnetic members 420 which are oppositely arranged respectively.
And step S200, clamping the separation pressing block 300 on one side of the corresponding earphone positioning groove 210 on the pressure maintaining lower die 200.
Step S300, assembling the two first magnetic members 420 at the corresponding dispensing positions respectively; wherein, the two first magnetic members 420 are respectively located at two sides of the separation pressing block 300.
It should be noted that, since the first magnetic members 420 are disposed on two sides of the separation pressing block 300, the separation pressing block 300 may be fixed and then the first magnetic members 420 may be assembled, or after one of the first magnetic members 420 is assembled, the separation pressing block 300 may be placed and then another first magnetic member 420 may be assembled.
And step S400, carrying out die assembly on the pressure maintaining upper die 100 and the pressure maintaining lower die 200 and maintaining the pressure for a preset time to obtain the assembled earphone upper cover 410.
Because the method for assembling the upper cover of the earphone is used for assembling through the pressure maintaining jig for the upper cover of the earphone, the plurality of first magnetic parts 420 can be assembled at one time, so that the assembling period of the earphone is shortened, and the assembling cost is reduced.
It can be understood that three dispensing positions are provided; a second magnetic member is disposed below the partition of the separation compact 300 (i.e., the second magnetic member is disposed between the pressure maintaining lower die 200 and the separation compact 300); the method further comprises the following steps between the step S100 and the step S200:
the third magnetic member is placed on the second magnetic member, so that the third magnetic member is aligned with the corresponding dispensing position on the upper cover 410 of the earphone.
Note that, when the separation compact 300 is clamped, one end of the separation compact 300 is fixedly connected to the holding pressure lower die 200, and the other end (partition) of the separation compact 300 forms a gap with the surface of the holding pressure lower die 200, so that the third magnetic member is held between the separation compact 300 and the second magnetic member at this time.
The pressure maintaining jig for the upper cover of the earphone of the present application is described in detail with a specific embodiment with reference to fig. 1 to 5. It is to be understood that the following description is illustrative only and is not intended to be in any way limiting.
As shown in fig. 5, in the assembled earphone upper cover 410, the earphone upper cover 410 includes 2 slots 411, two first magnetic members 420 at the joint of the two slots 411 are disposed oppositely, three third magnetic members are disposed along the edge of the earphone upper cover 410, and the three third magnetic members include two fourth magnetic members 430 and one fifth magnetic member 440; the fifth magnetic member 440 is disposed obliquely below the two first magnetic members 420, and the two fourth magnetic members 430 are disposed along the edge of the slot 411 away from the first magnetic members 420 and the fifth magnetic member 440.
At this moment, at first carry out the customization of pressurize tool according to waiting to assemble the earphone upper cover, as shown in fig. 1-3, earphone upper cover pressurize tool includes:
the pressure maintaining upper die 100 is provided with two profiling positioning blocks 110;
the pressure maintaining lower die 200 is provided with two earphone positioning grooves 210, and the earphone positioning grooves 210 are arranged corresponding to the profiling positioning blocks 110;
the separating pressing block 300, the separating pressing block 300 is detachably disposed at one side of the earphone placing groove 210, and the separating pressing block 300 is used for isolating two first magnetic members 420 which are attracted or repelled on the earphone upper cover 410 located in the earphone placing groove 210.
Specifically, as shown in fig. 1, protrusions 150 are disposed at two ends of the upper pressure maintaining mold 100 and the lower pressure maintaining mold 200, and the upper pressure maintaining mold 100 and the lower pressure maintaining mold 200 are clamped to each other by a convex column 151 and a concave groove 152 respectively disposed on the protrusions 150.
Further, the separation compact 300 is made of iron.
Further, as shown in fig. 1, the pressure maintaining upper die 100 includes a bottom cover 120 and a movable platen 130, and the movable platen 130 is disposed between the bottom cover 120 and the pressure maintaining lower die 200; the movable pressing plate 130 is movably connected with the bottom cover 120, and the profiling positioning block 110 is arranged on the movable pressing plate 130.
Specifically, as shown in fig. 3, the bottom cover 120 and the movable pressure plate 130 are elastically connected by a spring 140.
Further, as shown in fig. 3, a plurality of limiting holes 121 are formed in the bottom cover 120, a plurality of limiting posts 131 are disposed on a surface of the movable pressing plate 130 opposite to the bottom cover 120, one end of each limiting post 131 is fixedly disposed on the movable pressing plate 130, and the other end of each limiting post 131 is movably disposed in the corresponding limiting hole 121.
Further, a second magnetic member is disposed below the separation pressing block 300. That is, as shown in fig. 2, the second magnetic member is also provided at a position where the fourth magnetic member 430 and the fifth magnetic member 440 face each other.
Further, foam is laid in the earphone placing groove 210.
At this time, referring to the assembly method shown in fig. 4, first, in step S100, 5 positions of glue is dispensed on the upper cover 410 of the earphone to be assembled and placed in the corresponding earphone position slots 210. Then, two fourth magnetic members 430 and one fifth magnetic member 440 are respectively assembled above the corresponding second magnetic members, and the separation pressing block 300 is clamped on one side of the fifth magnetic member 440 with reference to the step S200, at this time, the other end of the separation pressing block 300 presses the fifth magnetic member 440; both sides of the separation compact 300 correspond to the installation positions of the first magnetic member 420. Further refer to step S300 to assemble the two first magnetic members 420 to the corresponding dispensing positions, and finally refer to the assembled earphone upper cover 410 in step S410.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application.
Claims (10)
1. The utility model provides an earphone upper cover pressurize tool which characterized in that includes:
the pressure maintaining upper die is provided with a plurality of copying positioning blocks;
the pressure maintaining lower die is provided with a plurality of earphone positioning grooves, and the earphone positioning grooves are arranged corresponding to the profiling positioning blocks;
the separation briquetting, the setting can be dismantled to the separation briquetting is in earphone position groove one side, the separation briquetting is used for keeping apart to be located the earphone upper cover in earphone position groove attracts mutually or two at least first magnetic part that repel each other.
2. The pressure maintaining jig for the upper cover of the earphone according to claim 1,
the separation pressing block is made of iron or copper.
3. The pressure maintaining jig for the upper cover of the earphone according to claim 1,
the pressure maintaining upper die comprises a bottom cover and a movable pressing plate, and the movable pressing plate is arranged between the bottom cover and the pressure maintaining lower die; the movable pressing plate is movably connected with the bottom cover, and the profiling positioning block is arranged on the movable pressing plate.
4. The earphone upper cover pressure maintaining jig of claim 3,
the bottom cover is elastically connected with the movable pressing plate through a spring.
5. The earphone upper cover pressure maintaining jig of claim 3,
the bottom cover is provided with a plurality of limiting holes, one surface of the movable pressing plate opposite to the bottom cover is correspondingly provided with a plurality of limiting columns, one ends of the limiting columns are fixedly arranged on the movable pressing plate, and the other ends of the limiting columns are movably arranged in the corresponding limiting holes.
6. The earphone upper cover pressure maintaining jig according to any one of claims 1 to 5,
a second magnetic part is arranged on one surface of the pressure maintaining lower die, which is opposite to the pressure maintaining upper die, and at least one second magnetic part is arranged on the second magnetic part; the second magnetic pieces are arranged along the edge of the earphone setting groove, and one of the second magnetic pieces is positioned between the separation pressing block and the pressure maintaining lower die; the second magnetic part is used for adsorbing a third magnetic part on the upper cover of the earphone in the earphone setting groove.
7. The earphone upper cover pressure maintaining jig of claim 6,
and a flexible object is laid in the earphone positioning groove.
8. The earphone upper cover pressure maintaining jig according to any one of claims 1 to 5,
the mould on the pressurize the both ends of pressurize lower mould all are equipped with the arch, mould on the pressurize lower mould through setting up convex column and recess on the arch clamp the compound die each other.
9. A method for assembling an upper cover of an earphone is characterized in that,
the method for assembling the upper cover of the earphone is realized by adopting an upper cover pressure maintaining jig of the earphone, wherein the upper cover pressure maintaining jig of the earphone comprises an upper pressure maintaining die, a lower pressure maintaining die and a separation pressing block; the pressure maintaining upper die is provided with a plurality of copying positioning blocks; the pressure maintaining lower die is provided with a plurality of earphone positioning grooves, and the earphone positioning grooves are arranged corresponding to the profiling positioning blocks; the separation pressing block is detachably arranged on one side of the earphone positioning groove and is used for isolating two first magnetic pieces which are attracted or repelled from an upper earphone cover in the earphone positioning groove;
the method comprises the following steps:
dispensing glue at a preset dispensing position on an upper cover of the earphone to be assembled, and placing the upper cover of the earphone into a corresponding earphone positioning groove; at least two dispensing positions are arranged, and the two dispensing positions respectively correspond to two attracted or repelled first magnetic pieces;
clamping the separation pressing block on one side of the corresponding earphone setting groove on the pressure maintaining lower die;
assembling the two first magnetic pieces at the corresponding dispensing positions respectively; the two first magnetic pieces are respectively positioned on two sides of the separation pressing block;
and carrying out die assembly on the pressure maintaining upper die and the pressure maintaining lower die and maintaining the pressure for a preset time to obtain the assembled earphone upper cover.
10. The method of earphone top cover assembly of claim 9,
three dispensing positions are arranged; a second magnetic part is arranged on one surface of the pressure maintaining lower die, which is opposite to the pressure maintaining upper die, and the second magnetic part is positioned between the separation pressing block and the pressure maintaining lower die; the step of clamping the separation pressing block on one side of the corresponding earphone setting groove on the pressure maintaining lower die further comprises the following steps:
and placing a third magnetic piece on the second magnetic piece so as to align the third magnetic piece with the corresponding dispensing position on the upper cover of the earphone.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110409024.2A CN113153875A (en) | 2021-04-16 | 2021-04-16 | Earphone upper cover pressure maintaining jig and earphone upper cover assembling method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110409024.2A CN113153875A (en) | 2021-04-16 | 2021-04-16 | Earphone upper cover pressure maintaining jig and earphone upper cover assembling method |
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