CN113138036A - Temperature detection method and device and electronic equipment - Google Patents
Temperature detection method and device and electronic equipment Download PDFInfo
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- CN113138036A CN113138036A CN202010058888.XA CN202010058888A CN113138036A CN 113138036 A CN113138036 A CN 113138036A CN 202010058888 A CN202010058888 A CN 202010058888A CN 113138036 A CN113138036 A CN 113138036A
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- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The disclosure relates to a temperature detection method and device and electronic equipment. The temperature detection method is applied to electronic equipment, the electronic equipment comprises a plurality of heat source devices and a plurality of temperature sensors, and at least one temperature sensor is arranged near each heat source device; the detection method comprises the following steps: acquiring the temperature detected by at least one temperature sensor; and acquiring the temperature of the electronic equipment according to the temperature detected by the at least one temperature sensor and the weight coefficient respectively corresponding to the at least one temperature sensor.
Description
Technical Field
The present disclosure relates to the field of terminal technologies, and in particular, to a temperature detection method and apparatus, and an electronic device.
Background
Along with the development of intelligent electronic products, the performance of various intelligent electronic products is also stronger and stronger, but the power consumption of the electronic products is increased, the heat productivity is large, particularly, the pursuit of a user for high-definition games and high-definition videos leads to the fact that the heat productivity of the electronic products is larger and larger, the temperature rise condition of the electronic products is more and more serious, and the temperature rise experience of the electronic products is influenced.
Disclosure of Invention
The present disclosure provides a temperature detection method and apparatus, and an electronic device, to solve the deficiencies in the related art.
According to a first aspect of the embodiments of the present disclosure, there is provided a method for detecting a temperature change, applied to an electronic device, the electronic device including a plurality of heat source devices and a plurality of temperature sensors, at least one of the temperature sensors being disposed near each of the heat source devices, the at least one of the temperature sensors being in contact with the heat source device and/or being spaced apart from the heat source device by less than a preset distance;
the detection method comprises the following steps:
acquiring the temperature detected by at least one temperature sensor;
and acquiring the temperature of the electronic equipment according to the temperature detected by the at least one temperature sensor and the weight coefficient respectively corresponding to the at least one temperature sensor.
Optionally, the method further includes:
identifying an application scene of the electronic equipment;
and determining a weight coefficient corresponding to each temperature sensor according to the application scene.
Optionally, the method further includes:
identifying an application scene of the electronic equipment;
determining part of the heat source devices in the plurality of heat source devices as main heating devices according to the application scene;
the acquiring the temperature detected by the at least one temperature sensor comprises:
and acquiring the temperature detected by a temperature sensor which is in contact with the part of the heat source device or is spaced from the part of the heat source device by less than a preset distance.
Optionally, the method further includes:
determining the temperature variation of the electronic equipment according to the acquired temperature of the electronic equipment;
and adjusting the working state of at least one heat source device according to the temperature variation so as to reduce the heat productivity of the at least one heat source device.
Optionally, the method further includes:
judging whether the acquired temperature of the electronic equipment is greater than or equal to a preset temperature threshold value or not;
when the temperature of the electronic equipment is larger than or equal to the preset temperature threshold value, the working state of at least one heat source device is adjusted to reduce the heat generation amount of the at least one heat source device.
Optionally, each heat source device is one of the following:
treater, camera module, charging module, battery pack.
According to a second aspect of the embodiments of the present disclosure, there is provided a temperature detection apparatus applied to an electronic device including a plurality of heat source devices and a plurality of temperature sensors,
each heat source device is in contact with at least one temperature sensor or is spaced by less than a preset distance;
the detection device includes:
the first acquisition module is used for acquiring the temperature detected by at least one temperature sensor;
and the second acquisition module is used for acquiring the temperature of the electronic equipment according to the temperature detected by the at least one temperature sensor and the weight coefficient respectively corresponding to the at least one temperature sensor.
Optionally, the method further includes:
the first identification module is used for identifying an application scene of the electronic equipment;
and the first determining module is used for determining a weight coefficient corresponding to each temperature sensor according to the application scene.
Optionally, the method further includes:
the second identification module is used for identifying the application scene of the electronic equipment;
the second determining module is used for determining part of the heat source devices in the plurality of heat source devices as main heating devices according to the application scene;
the first obtaining module is further configured to obtain a temperature detected by a temperature sensor in contact with the part of the heat source device or spaced from the part of the heat source device by a distance smaller than a preset distance.
Optionally, the method further includes:
the first judging module is used for judging whether the acquired temperature of the electronic equipment is greater than or equal to a preset temperature threshold value or not;
and the first adjusting module is used for adjusting the working state of at least one heat source device according to the temperature variation so as to reduce the heat productivity of the at least one heat source device.
Optionally, the method further includes:
the second judging module is used for judging whether the acquired temperature of the electronic equipment is greater than or equal to a preset temperature threshold value or not;
and the second adjusting module is used for adjusting the working state of at least one heat source device when the temperature of the electronic equipment is greater than or equal to the preset temperature threshold value so as to reduce the heat productivity of the at least one heat source device.
Optionally, each heat source device is one of the following:
treater, camera module, charging module, battery pack.
According to a third aspect of embodiments of the present disclosure, there is provided a computer-readable storage medium having stored thereon computer instructions which, when executed by a processor, implement the steps of the method according to any one of the embodiments described above.
According to a fourth aspect of the embodiments of the present disclosure, there is provided an electronic apparatus including:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to carry out the steps of the method according to any one of the above embodiments when executed.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
as can be seen from the foregoing embodiments, in the present disclosure, the temperature change of the electronic device is calculated through the temperature detected by each temperature sensor and the weight coefficient corresponding to the temperature sensor, and compared with the related art in which the surface temperature of the electronic device is determined by the temperature at the motherboard in various application scenarios, the accuracy of detecting the surface temperature of the electronic device in various application scenarios is facilitated.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a flow chart illustrating a temperature change detection apparatus method according to an exemplary embodiment.
FIG. 2 is a flow chart illustrating another method of a temperature change sensing device in accordance with an exemplary embodiment.
FIG. 3 is a block diagram illustrating a temperature change detection device according to an exemplary embodiment.
FIG. 4 is a block diagram illustrating another temperature change detection device according to an exemplary embodiment.
Fig. 5 is a block diagram illustrating yet another temperature change detection apparatus according to an exemplary embodiment.
Fig. 6 is a block diagram illustrating yet another temperature change detection apparatus according to an exemplary embodiment.
FIG. 7 is a block diagram illustrating yet another apparatus for detecting temperature changes in accordance with an exemplary embodiment.
FIG. 8 is a block diagram illustrating a detection device for temperature changes according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
At present, with the development of intelligent electronic products, the performance of various intelligent electronic products is also increasingly powerful, but the power consumption of the electronic products is increased and the heat productivity is large, so in order to obtain the temperature condition of the electronic device in time, in the related art, a processor in the electronic device is usually used as a main heat source, so a temperature sensor is arranged on a main board of the electronic device, and the surface temperature of the electronic device is determined through the relationship between the temperature detected by the temperature sensor on the main board and the surface temperature of the electronic device.
However, it can be understood that when an application scene of the electronic device changes, a power consumption condition of the motherboard may change, so that a heating condition changes, and when the application scene changes, other heat dissipation elements may be added. For example, when a game program is run on an electronic device, the difference between the surface temperature of the electronic device and the temperature detected by the temperature sensor is 3 °, whereas in a charging scene, the difference between the surface temperature of the electronic device and the temperature detected by the temperature sensor may be only 1 °, and if the surface temperature of the electronic device is determined simply by using one temperature difference, a large temperature detection error may be caused.
Based on the existing related art, as shown in fig. 1, fig. 1 is a flowchart illustrating a method for detecting a temperature change according to an exemplary embodiment, and as shown in fig. 1, the method is applied to an electronic apparatus, which may include a plurality of heat source devices and a plurality of temperatures, and at least one temperature sensor is disposed near each heat source device. The heat source device may be an electronic device that generates heat within the electronic device, and may include, for example, a camera module, a processor, a charging assembly, and a battery. The temperature sensor is located near the heat source device, which may be understood as a temperature sensor in contact with the heat source device or a temperature sensor spaced from the heat source device by a distance not less than a predetermined distance. When a plurality of temperature sensors are disposed near the same heat source device, the plurality of temperature sensors may all be in contact with the heat source device or may all be spaced from the heat source device by a distance less than a preset distance, or one portion of the temperature sensors may be in contact with the heat source device and another portion of the temperature sensors may be spaced from the heat source device by a distance less than a preset distance, which is not limited by the present disclosure. The detection method may include the steps of:
in step 101, a temperature detected by at least one temperature sensor is acquired.
In this embodiment, since the at least one temperature sensor is located in the vicinity of one heat source device, heat is generated due to the operation of the heat source device, so that the temperature detected by the at least one temperature sensor changes.
In step 102, the temperature of the electronic device is obtained according to the temperatures detected by the at least one temperature sensor and the weighting coefficients respectively corresponding to the at least one temperature sensor.
In this embodiment, the changed temperature of the electronic device may be obtained according to the mathematical relationship between the temperature detected by each temperature sensor and the weight coefficient, and the temperature change of the electronic device may be obtained according to the comparison between the changed temperature of the electronic device and the historical temperature of the electronic device. For example, the current temperature T ═ T1 × Q1+ T2 × Q2+ T3 × Q3 of the electronic device can be obtained according to the temperature detected by each temperature sensor and the weight coefficient. Wherein T1 is the temperature detected by the first temperature sensor, and Q1 is the weight coefficient corresponding to the first temperature sensor; t2 is the temperature detected by the second temperature sensor, and Q2 is the weight coefficient corresponding to the second temperature sensor; t3 is the temperature detected by the third temperature sensor, and Q3 is the weight coefficient corresponding to the third temperature sensor. The weighting coefficients Q1, Q2, and Q1 may be zero or other positive numbers, but the present disclosure is not limited thereto, and the weighting coefficient of each temperature sensor may be obtained after testing under a large number of different application scenarios.
Of course, the above calculation manner regarding the temperature of the electronic device is only an exemplary illustration, and in other embodiments, there may be other calculation manners, such as the current temperature T of the electronic device T1 × Q1+ T2 × Q2+ T3 × Q3+ K, where K is a constant.
In an embodiment, the value of the weight coefficient corresponding to each temperature sensor located near the same heat source device may be the same in different application scenarios, that is, in the temperature T of the electronic device T-T1-Q1 + T1-Q2 + T1-Q3, the values of the weight coefficients Q1, Q2, and Q1 are not changed, and the temperature T of the electronic device varies with the changes of T1, T2, and T3.
In another embodiment, the weighting factor corresponding to each temperature sensor located near the same heat source device may vary according to different application scenarios. For example, an application scenario of the electronic device may be identified, and then a weight coefficient corresponding to each temperature sensor may be determined according to the application scenario. The application scenes can include charging scenes, shooting scenes, game scenes and other working scenes with high power consumption. Assuming that the heat source device includes a battery, and the temperature sensor includes a first temperature sensor disposed on a surface of or near the battery, when the electronic apparatus is in a charging scene, the weight coefficient of the first temperature sensor may be appropriately increased, and the weight coefficients of the other temperature sensors may be decreased; in other non-charging scenarios, the weight coefficient of the first temperature sensor may be appropriately reduced, and the weight coefficient of the temperature sensor near the heat source device that mainly contributes to the main power consumption may be increased.
In a further embodiment, an application scenario of the electronic device may be identified, then a portion of the plurality of heat source devices that undertake most of power consumption is determined as a main heat source device according to the application scenario, and then a temperature detected by a temperature sensor in contact with the portion of the heat source devices or spaced from the portion of the heat source devices by less than a preset distance is obtained, so as to determine a current temperature of the electronic device. For example, when the current application scenario is identified as a charging scenario, it may be determined that the current part of the heat source devices are the battery and the charging component, so the temperature change of the electronic device may be determined according to the temperature detected by the temperature sensor located near the battery and the temperature detected by the temperature sensor located near the charging component; for another example, when it is recognized that the current application scene is a game scene, the processor in the electronic device is in a high-load operation state in order to support a game function with large power consumption, and therefore the processor can be determined as a part of the heat source device, and the temperature change of the electronic device can be determined based on the temperature detected by the temperature sensor located near the processor.
The above description is given by taking as an example that the same temperature sensor near the same heat source device has the same or different weight coefficients in different application scenarios. In fact, for the case that a plurality of temperature sensors may be disposed near the same heat source device, the weighting coefficients of different temperature sensors located near the same heat source device may be the same or different, and the disclosure does not limit this.
Based on the above embodiments, the temperature variation of the electronic device may be determined according to the acquired temperature of the electronic device, and the operating state of the at least one heat source device may be adjusted according to the temperature variation to reduce the heat generation amount of the at least one heat source device. For example, the charging current can be reduced in a charging scene, the processing frequency of the processor can be reduced in a game scene, and the like, so that the temperature rise of the electronic device is reduced, and the user experience is improved.
In another embodiment, it may be determined whether the acquired temperature of the electronic device is greater than or equal to a preset temperature threshold, and when the acquired temperature of the electronic device is greater than or equal to the preset temperature threshold, the operating state of the at least one heat source device is adjusted to reduce the amount of heat generated by the at least one heat source device.
As can be seen from the foregoing embodiments, in the present disclosure, the temperature change of the electronic device is calculated through the temperature detected by each temperature sensor and the weight coefficient corresponding to the temperature sensor, and compared with the related art in which the surface temperature of the electronic device is determined by the temperature at the motherboard in various application scenarios, the accuracy of detecting the surface temperature of the electronic device in various application scenarios is facilitated.
To specifically describe the above embodiments, the following describes the technical solution of the present disclosure in detail by taking an example of an electronic device applied to a charging scene and a game scene. As shown in fig. 2, the method for detecting a temperature change may include the steps of:
in step 201, it is identified that the electronic device is currently a charging scene and a game scene.
In this embodiment, when it is recognized that the electronic device is connected to the external charging terminal, it may be determined that the current electronic device is switched to the charging scenario; according to the application program in the running state in the electronic equipment, the current electronic equipment can be determined to be in the game scene.
In step 202, temperatures detected by a first temperature sensor near the battery, a second temperature sensor near the charging assembly, and a third temperature sensor near the processor, respectively, are acquired.
In step 203, a weight coefficient corresponding to each temperature sensor is determined.
In this embodiment, the first temperature sensor, the second temperature sensor and the third temperature sensor may correspond to different weighting coefficients in various application scenarios. For example, in a charging scenario, a first temperature sensor located near the charging assembly has a weight factor of 0.5, a second temperature sensor located near the battery has a weight factor of 0.5, and a third temperature sensor located near the processor has a weight factor of 0.3; in the game scene, the weight coefficient of the first temperature sensor is 0.2, the weight coefficient of the second temperature sensor is 0.2, and the weight coefficient of the third temperature sensor is 0.5, and it is further assumed that the temperature detected by the first temperature sensor is T1, the temperature detected by the second temperature sensor is T2, and the temperature detected by the third temperature sensor is T3.
Then, in an embodiment, the coefficient of the temperature sensor in the vicinity of the heat source device that assumes the main power consumption in each application scenario may be calculated. Namely, the temperature T of the electronic device T1 0.5+ T2 0.5+ T3 0.5; alternatively, in another embodiment, the calculation may be performed by an average of the weighting coefficients in a plurality of different scenarios, that is, the temperature T of the electronic device is (0.5+ 0.2)/2T 1+ (0.5+ 0.2)/2T 2+ (0.5+ 0.3)/2T 3. Of course, besides the heat source device with the main power consumption, other heat generating devices may also be present in the electronic device, and the temperature detected by the temperature sensor near the other heat generating devices may also determine the temperature change of the electronic device, which is not described herein any more. In addition, in this embodiment, the electronic device is described as being in multiple application scenarios at the same time, and in an actual practical process, the electronic device may be only in one application scenario or may be in three or more application scenarios, which is not described herein again.
In step 204, the current temperature of the electronic device is determined.
In step 205, the temperature change amount of the electronic device is determined.
In step 206, it is determined whether the temperature variation of the electronic device is greater than a preset threshold.
In this embodiment, step 207 is executed when the temperature variation of the electronic device is greater than a preset threshold, and step 202 is executed when the temperature variation of the electronic device is less than or equal to the preset threshold.
In step 207, the processing frequency of the processor is reduced and the charging current of the electronic device is reduced.
In this embodiment, when the temperature rise of the electronic device is greater than the preset threshold, the processing frequency of the processor and the charging current of the electronic device can be reduced, so that the heat productivity of the processor, the battery and the charging assembly is reduced, the temperature rise can be reduced, and the holding effect is improved. In other embodiments, the processing frequency of the processor or the charging current of the electronic device may be reduced, which is not limited by the present disclosure.
It should be noted that: in the embodiment shown in fig. 2, the example that the temperature variation exceeds the preset threshold is illustrated, but in other embodiments, the operating state of the heat source device may be adjusted according to whether the detected surface temperature of the electronic device exceeds the corresponding threshold.
Corresponding to the embodiment of the temperature detection method, the disclosure also provides an embodiment of a temperature detection device.
Fig. 3 is a block diagram illustrating a temperature detection apparatus according to an exemplary embodiment, in which the temperature change detection apparatus is applied to an electronic device including a plurality of heat source devices and a plurality of temperature sensors, and at least one of the temperature sensors is disposed in the vicinity of each of the heat source devices. Referring to fig. 3, the apparatus includes a first obtaining module 301 and a second obtaining module 302, wherein:
a first obtaining module 301, configured to obtain a temperature detected by at least one temperature sensor;
a second obtaining module 302, configured to obtain the temperature of the electronic device according to the temperature detected by the at least one temperature sensor and the weight coefficients corresponding to the at least one temperature sensor respectively.
As shown in fig. 4, fig. 4 is a block diagram of another temperature detecting apparatus according to an exemplary embodiment, which is based on the foregoing embodiment shown in fig. 3, and further includes a first identifying module 303 and a second determining module 304, wherein:
a first identification module 303, configured to identify an application scenario of the electronic device;
a first determining module 304, configured to determine a weight coefficient corresponding to each of the temperature sensors according to the application scenario.
As shown in fig. 5, fig. 5 is a block diagram of another temperature detecting device according to an exemplary embodiment, which is based on the foregoing embodiment shown in fig. 3, and further includes:
a second identification module 305, configured to identify an application scenario of the electronic device;
a second determining module 306, configured to determine, according to the application scenario, that part of the heat source devices in the plurality of heat source devices are main heat generating devices;
the first obtaining module 301 includes:
an obtaining unit 3011, configured to obtain a temperature detected by a temperature sensor in contact with the part of the heat source device or spaced from the part of the heat source device by less than a preset distance.
As shown in fig. 6, fig. 6 is a block diagram of another temperature detecting device according to an exemplary embodiment, which is based on the foregoing embodiment shown in fig. 3, and further includes a first determining module 307 and a first adjusting module 308, wherein:
a first determination module 307, configured to determine whether the acquired temperature of the electronic device is greater than or equal to a preset temperature threshold;
the first adjusting module 308 is configured to adjust an operating state of at least one of the heat source devices to reduce a heat generation amount of the at least one heat source device when the temperature of the electronic device is greater than or equal to the preset temperature threshold.
It should be noted that, the structures of the first determining module 307 and the first adjusting module 308 in the apparatus embodiment shown in fig. 6 may also be included in the apparatus embodiment of fig. 4 or fig. 5, and the disclosure is not limited thereto.
As shown in fig. 7, fig. 7 is a block diagram of another temperature detecting device according to an exemplary embodiment, which is based on the foregoing embodiment shown in fig. 3, and further includes a second determining module 309 and a second adjusting module 310, wherein:
a second determining module 309, configured to determine whether the acquired temperature of the electronic device is greater than or equal to a preset temperature threshold;
the second adjusting module 310 is configured to adjust an operating state of at least one of the heat source devices to reduce a heat generation amount of the at least one of the heat source devices when the temperature of the electronic device is greater than or equal to the preset temperature threshold.
Optionally, each heat source device is one of the following:
treater, camera module, charging module, battery pack.
With regard to the apparatus in the above-described embodiment, the specific manner in which each module performs the operation has been described in detail in the embodiment related to the method, and will not be elaborated here.
For the device embodiments, since they substantially correspond to the method embodiments, reference may be made to the partial description of the method embodiments for relevant points. The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the disclosed solution. One of ordinary skill in the art can understand and implement it without inventive effort.
Correspondingly, the present disclosure also provides a device for detecting temperature variation, which is applied to an electronic apparatus, where the electronic apparatus includes a plurality of heat source devices and a plurality of temperature sensors, at least one temperature sensor is disposed near each heat source device, and the at least one temperature sensor is in contact with and/or spaced from the heat source device by less than a preset distance; the method comprises the following steps: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to: acquiring the temperature detected by at least one temperature sensor; and acquiring the temperature of the electronic equipment according to the temperature detected by the at least one temperature sensor and the weight coefficient respectively corresponding to the at least one temperature sensor.
Correspondingly, the present disclosure further provides a terminal applied to an electronic device, where the electronic device includes a plurality of heat source devices and a plurality of temperature sensors, at least one of the temperature sensors is disposed near each of the heat source devices, and the at least one of the temperature sensors is in contact with the heat source device and/or is spaced from the heat source device by less than a preset distance; the terminal includes a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured for execution by the one or more processors to include instructions for: acquiring the temperature detected by at least one temperature sensor; and acquiring the temperature of the electronic equipment according to the temperature detected by the at least one temperature sensor and the weight coefficient respectively corresponding to the at least one temperature sensor.
Fig. 8 is a block diagram illustrating an apparatus 800 for temperature detection according to an exemplary embodiment. For example, the apparatus 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, an exercise device, a personal digital assistant, and the like.
Referring to fig. 8, the apparatus 800 may include one or more of the following components: processing component 802, memory 804, power component 806, multimedia component 808, audio component 810, input/output (I/O) interface 812, sensor component 814, and communication component 816.
The processing component 802 generally controls overall operation of the device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operations at the apparatus 800. Examples of such data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The multimedia component 808 includes a screen that provides an output interface between the device 800 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. The front camera and/or the rear camera may receive external multimedia data when the device 800 is in an operating mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the apparatus 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor assembly 814 includes one or more sensors for providing various aspects of state assessment for the device 800. For example, the sensor assembly 814 may detect the open/closed status of the device 800, the relative positioning of components, such as a display and keypad of the device 800, the sensor assembly 814 may also detect a change in the position of the device 800 or a component of the device 800, the presence or absence of user contact with the device 800, the orientation or acceleration/deceleration of the device 800, and a change in the temperature of the device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 816 is configured to facilitate communications between the apparatus 800 and other devices in a wired or wireless manner. The apparatus 800 may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, 4G LTE, 5G NR, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the apparatus 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
In an exemplary embodiment, a non-transitory computer-readable storage medium comprising instructions, such as the memory 804 comprising instructions, executable by the processor 820 of the device 800 to perform the above-described method is also provided. For example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (14)
1. The temperature detection method is applied to electronic equipment, the electronic equipment comprises a plurality of heat source devices and a plurality of temperature sensors, at least one temperature sensor is arranged near each heat source device, and the at least one temperature sensor is in contact with the heat source devices and/or is spaced from the heat source devices by less than a preset distance;
the detection method comprises the following steps:
acquiring the temperature detected by at least one temperature sensor;
and acquiring the temperature of the electronic equipment according to the temperature detected by the at least one temperature sensor and the weight coefficient respectively corresponding to the at least one temperature sensor.
2. The detection method according to claim 1, further comprising:
identifying an application scene of the electronic equipment;
and determining a weight coefficient corresponding to each temperature sensor according to the application scene.
3. The detection method according to claim 1, further comprising:
identifying an application scene of the electronic equipment;
determining part of the heat source devices in the plurality of heat source devices as main heating devices according to the application scene;
the acquiring the temperature detected by the at least one temperature sensor comprises:
and acquiring the temperature detected by a temperature sensor which is in contact with the part of the heat source device or is spaced from the part of the heat source device by less than a preset distance.
4. The detection method according to claim 1, further comprising:
determining the temperature variation of the electronic equipment according to the acquired temperature of the electronic equipment;
and adjusting the working state of at least one heat source device according to the temperature variation so as to reduce the heat productivity of the at least one heat source device.
5. The detection method according to claim 1, further comprising:
judging whether the acquired temperature of the electronic equipment is greater than or equal to a preset temperature threshold value or not;
when the temperature of the electronic equipment is larger than or equal to the preset temperature threshold value, the working state of at least one heat source device is adjusted to reduce the heat generation amount of the at least one heat source device.
6. The inspection method of claim 1, wherein each heat source device is one of:
treater, camera module, charging module, battery pack.
7. A temperature detection apparatus applied to an electronic device including a plurality of heat source devices and a plurality of temperature sensors,
each heat source device is in contact with at least one temperature sensor or is spaced by less than a preset distance;
the detection device includes:
the first acquisition module is used for acquiring the temperature detected by at least one temperature sensor;
and the second acquisition module is used for acquiring the temperature of the electronic equipment according to the temperature detected by the at least one temperature sensor and the weight coefficient respectively corresponding to the at least one temperature sensor.
8. The detection device of claim 7, further comprising:
the first identification module is used for identifying an application scene of the electronic equipment;
and the first determining module is used for determining a weight coefficient corresponding to each temperature sensor according to the application scene.
9. The detection device of claim 7, further comprising:
the second identification module is used for identifying the application scene of the electronic equipment;
the second determining module is used for determining part of the heat source devices in the plurality of heat source devices as main heating devices according to the application scene;
the first obtaining module is further configured to obtain a temperature detected by a temperature sensor in contact with the part of the heat source device or spaced from the part of the heat source device by a distance smaller than a preset distance.
10. The detection device of claim 7, further comprising:
the first judging module is used for judging whether the acquired temperature of the electronic equipment is greater than or equal to a preset temperature threshold value or not;
and the first adjusting module is used for adjusting the working state of at least one heat source device according to the temperature variation so as to reduce the heat productivity of the at least one heat source device.
11. The detection device of claim 7, further comprising:
the second judging module is used for judging whether the acquired temperature of the electronic equipment is greater than or equal to a preset temperature threshold value or not;
and the second adjusting module is used for adjusting the working state of at least one heat source device when the temperature of the electronic equipment is greater than or equal to the preset temperature threshold value so as to reduce the heat productivity of the at least one heat source device.
12. The detecting device according to claim 7, wherein each of the heat source devices is one of:
treater, camera module, charging module, battery pack.
13. A computer-readable storage medium having stored thereon computer instructions, which, when executed by a processor, carry out the steps of the method according to any one of claims 1-6.
14. An electronic device, comprising:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to carry out the steps of the method according to any one of claims 1-6 when executed.
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