CN113133265A - Steady flow supercharging device of evaporator - Google Patents
Steady flow supercharging device of evaporator Download PDFInfo
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- CN113133265A CN113133265A CN201911406454.8A CN201911406454A CN113133265A CN 113133265 A CN113133265 A CN 113133265A CN 201911406454 A CN201911406454 A CN 201911406454A CN 113133265 A CN113133265 A CN 113133265A
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- plate surface
- heat dissipation
- channel
- evaporator
- water
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 99
- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- 239000007788 liquid Substances 0.000 claims description 34
- 230000000087 stabilizing effect Effects 0.000 claims description 16
- 230000000903 blocking effect Effects 0.000 claims description 11
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000002791 soaking Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A steady flow supercharging device of an evaporator comprises a heat dissipation module and a shell, wherein the heat dissipation module is formed by continuously stacking and assembling a large number of heat dissipation components, each heat dissipation component is provided with a first plate surface, a second plate surface and a third plate surface, so that a half-open inner flow channel is formed inside the heat dissipation component, a fourth plate surface is respectively arranged at two ends of the heat dissipation component, which are opposite to the inner flow channel, a water inlet channel and a gas outlet channel are respectively arranged on the heat dissipation module, the heat dissipation module is arranged in the shell and the outer cover, and by virtue of the structure, the fourth plate surfaces can effectively block two ends of each inner flow channel, so that gaseous water evaporated by heating in the inner flow channel can be effectively reserved in each inner flow channel, the internal pressure is quickly increased, and the gaseous water can be stably and quickly discharged towards the gas outlet channel.
Description
Technical Field
The invention relates to a steady flow supercharging device of an evaporator, which is a heat dissipation structure which can convert liquid and gas state of liquid water in the interior to achieve the heat dissipation effect and is suitable for providing an electronic component for heat dissipation.
Background
In recent years, the heat productivity of electronic components is rapidly increased continuously with the refinement of semiconductor technology; how to improve the heat dissipation capability of the electronic component and maintain the normal operation of the component becomes a very important engineering topic. The direct air cooling technology in large use today has not been able to meet the need for heat dissipation in many electronic components with high heat fluxes, and other solutions must be sought.
In the prior art, besides an air cooling technology, a heat dissipation effect can be achieved by utilizing liquid-gas conversion of water, the technology provides two groups of soaking devices and two groups of communicated pipe bodies, one group of soaking devices is used for evaporating to bring away heat absorbed by water, the other group of soaking devices is used for condensing to cool to return output water for cooling and heat dissipation, and the pressure in the two groups of soaking devices is different, so that the water can be automatically conveyed back and forth to form a circulating loop, but a large amount of water flows inside the soaking devices, so that when a water flow path is not limited, the water inside the soaking devices is easy to leak, the pressure cannot be properly reserved inside the soaking devices, the circulation of the water inside the soaking devices is disturbed, and the use benefit is influenced.
Therefore, the heat dissipation module is designed to prevent water inside the heat dissipation module from directly contacting with the shell, so that leakage is avoided, the circulation direction of the water is limited, the water evaporated by heating inside the heat dissipation module is effectively reserved, the internal pressure is quickly increased, the water can be stably and quickly discharged, and the stability of water flow is improved.
Disclosure of Invention
The invention relates to a steady flow supercharging device of an evaporator, which comprises a heat dissipation module and a shell, wherein the heat dissipation module is formed by continuously stacking and assembling a large number of heat dissipation components, each heat dissipation component is provided with a first plate surface, a second plate surface and a third plate surface, so that a half-open inner flow channel is formed inside the heat dissipation component, both ends of the heat dissipation component, which are opposite to the inner flow channel, are respectively provided with a fourth plate surface, and the heat dissipation module is respectively provided with a water inlet channel and a gas outlet channel which are not communicated with each other from the outside; the shell is internally provided with a containing chamber for placing the heat dissipation module, and is also provided with an outer cover for covering the containing chamber; by virtue of, this water inlet can flow into liquid water, liquid water evaporates in each interior runner, discharge by this gas outlet again, and this fourth face can effectually block at each interior runner both ends, consequently, can avoid the liquid water or gaseous state water at each interior runner direct should hold room and this enclosing cover by the direct contact in each interior runner both ends, and then avoid the overflow and the seepage, and liquid water or gaseous state water is by a large amount of remain in each interior runner, liquid water can be heated steadily and evaporate and make gaseous state water can discharge from this gas outlet channel fast, so can make inside rivers stable.
In a preferred embodiment, two ends of each heat dissipation assembly are tightly attached to the accommodating chamber, and the heat dissipation module is provided with at least one channel penetrating through each heat dissipation assembly.
In a preferred embodiment, a predetermined space is formed between two ends of each heat dissipation assembly and the inner side surface of the accommodating chamber.
In a preferred embodiment, a blocking block is respectively arranged between two ends of the heat dissipation assembly and the inner side surface of the accommodating chamber, and each blocking block is arranged at one side close to the air outlet channel, so that liquid water or gaseous water in each inner channel can be prevented from directly contacting the accommodating chamber and the outer cover from two ends of each inner channel, and further overflowing and leaking at a seam.
In a preferred embodiment, each stop block is arranged on one surface of the outer cover relative to the accommodating chamber.
In a preferred embodiment, the fourth plate surface is formed by extending two ends of the first plate surface towards the inner flow channels, and the extending length of the fourth plate surface is consistent with that of the second plate surface and the third plate surface, so that the fourth plate surface completely covers two ends of each inner flow channel.
In a preferred embodiment, the fourth plate surface is formed by extending two ends of the first plate surface towards the middle of the inner flow channel direction, and the extending length of the fourth plate surface is consistent with that of the second plate surface and the third plate surface, so that the fourth plate surface completely covers the middle of two ends of each inner flow channel.
In a preferred embodiment, the fourth plate surface is formed by extending two ends of the first plate surface towards the upper side of the inner flow channel direction, and the extending length of the fourth plate surface is consistent with that of the second plate surface and the third plate surface, so that the fourth plate surface completely covers the upper side of two ends of each inner flow channel.
In a preferred embodiment, the lower portions of the two ends of the first plate surface extend towards the outer side direction to form a protruding section.
In a preferred embodiment, the fourth plate surface is formed by extending two ends of the first plate surface towards the inner flow channels, and the extending length of the fourth plate surface is shorter than that of the second plate surface and the third plate surface, so that the fourth plate surface does not completely shield two ends of each inner flow channel.
In a preferred embodiment, a slot is respectively formed above the first board surface near two ends, and the fourth board surface is inserted into the slot.
Drawings
FIG. 1 is an exploded perspective view of a first embodiment of a flow stabilizing and pressurizing device for an evaporator of the present invention;
FIG. 2 is a perspective view of a first embodiment of a heat sink assembly of the steady flow supercharging device of the evaporator of the present invention;
FIG. 3 is an overall view of a steady flow booster in combination with a condenser of the evaporator of the present invention;
FIG. 4 is a schematic view of the operation section of the steady flow supercharging device of the evaporator according to the first embodiment of the present invention;
FIG. 5 is a schematic view of the operation section of the steady flow pressurizing device of the evaporator according to the first embodiment of the present invention;
FIG. 6 is a schematic view of the operation section of the steady flow pressurizing device of the evaporator according to the first embodiment of the present invention;
FIG. 7 is a schematic view, partially in cross-section, of a first embodiment of a flow stabilizing and pressurization arrangement for an evaporator of the present invention;
fig. 8A is a perspective view of a heat sink assembly of a steady flow supercharging device of an evaporator according to a second embodiment of the present invention;
fig. 8B is a perspective view of a heat sink assembly of a steady flow supercharging device of an evaporator according to a third embodiment of the present invention;
fig. 8C is a perspective view of a heat sink assembly of a steady flow supercharging device of an evaporator according to a fourth embodiment of the present invention;
fig. 8D is a perspective view of a fifth embodiment of a heat sink assembly of the steady flow supercharging device of the evaporator of the present invention;
fig. 8E is a schematic perspective view of a heat dissipation assembly of a steady flow supercharging device of an evaporator according to a sixth embodiment of the present invention;
FIG. 9 is an exploded perspective view of a second embodiment of the flow stabilizing and pressurizing device of the evaporator of the present invention;
FIG. 10 is a schematic view, partially in cross-section, of a second embodiment of a flow stabilizing and pressurization arrangement for an evaporator of the present invention;
FIG. 11 is an exploded perspective view of a third embodiment of the flow stabilizing and pressurizing device of the evaporator of the present invention;
FIG. 12 is an exploded perspective view of a fourth embodiment of the flow stabilizing and pressurization device of the evaporator of the present invention;
FIG. 13 is a schematic view, partially in cross-section, of a fourth embodiment of a flow stabilizing and pressurization arrangement for an evaporator of the present invention;
FIG. 14 is an exploded perspective view of a fifth embodiment of the flow stabilizing and pressure increasing device of the evaporator of the present invention;
FIG. 15 is a schematic cross-sectional view of the fifth embodiment of the steady flow pressurizer of the evaporator of the present invention;
fig. 16 is an operation cross-sectional view of a steady flow supercharging device of an evaporator according to a sixth embodiment of the present invention.
Description of the reference numerals
1 Heat radiation module
11 heat sink assembly
111 first plate surface
112 second plate surface
113 third panel
114 inner flow passage
115 fourth plate surface
116 bulge section
117 slot
12 water inlet channel
13 air outlet channel
14 channels
2 outer cover
21 chamber
22 outer cover
23 water inlet
24 air outlet
3 stop block
31 gap
4 electronic component
5 Heat dissipation fin
6-way pipe
7 a condenser.
Detailed Description
Other technical matters, features and effects of the present invention will become apparent from the following detailed description of preferred embodiments, which proceeds with reference to the accompanying drawings.
Referring to fig. 1 to 2, a schematic perspective view and a schematic sectional view of an internal structure of a steady flow supercharging device of an evaporator according to the present invention are respectively shown, and as shown in the drawings, the steady flow supercharging device is a first embodiment of an overall structural configuration of the present invention, and at least includes a heat dissipation module 1 and a housing 2;
the heat dissipation module 1 is formed by continuously stacking and assembling a large number of heat dissipation assemblies 11, each heat dissipation assembly 11 has a first plate 111, a second plate 112 and a third plate 113, the first plate 111, the second plate 112 and the third plate 113 are integrally formed or fixedly connected with each other, so that a half-open inner flow channel 114 is formed inside the heat dissipation assembly 11, two ends of the heat dissipation assembly 11 opposite to the inner flow channel 114 are respectively provided with a fourth plate 115, the heat dissipation module 1 is respectively provided with an inlet channel 12 and an outlet channel 13 which are not communicated with each other from the outside (i.e. part of each heat dissipation assembly 11 is provided with the inlet channel 12; part of each heat dissipation assembly 11 is provided with the outlet channel 13), and the heat dissipation module 1 is provided with at least one channel 14 running through each heat dissipation assembly 11;
wherein, a containing chamber 21 is provided in the housing 2 for placing the heat dissipation module 1, and two ends of each heat dissipation assembly 11 are tightly attached to the containing chamber 21, the housing 2 further has an outer cover 22 for covering the containing chamber 21, the housing 2 is provided with a water inlet 23 and an air outlet 24, the water inlet 23 corresponds to the position of the water inlet channel 12, and the air outlet 24 corresponds to the position of the air outlet channel 13.
Referring to fig. 3 to 6, the bottom surface of the housing 2 can be locked with an electronic component 4, the cover 22 can be installed with a heat sink fin 5 and a through pipe 6, the through pipe 6 is connected to a condenser 7:
when the electronic component 4 generates heat, heat energy generated by the electronic component 4 can be guided into the housing 2 to the heat dissipation module 1, liquid water in the housing can be evaporated into gaseous water after the heat dissipation module 1 is heated, the gaseous water sequentially enters the through pipe 6 to the condenser 7 through the gas outlet channel 13 and the gas outlet 24, and the gaseous water enters the condenser 7 to be cooled and then becomes liquid water, and then flows back to the heat dissipation module 1 through the through pipe 6;
the liquid water flows back to enter each inner flow channel 114 through the water inlet 23 and the water inlet channel 12 in sequence, and then flows to each position in the heat dissipation module 1 through each channel 14, so that the liquid water is heated once and evaporated into gaseous water, and the gaseous water is circulated continuously, thereby achieving the purpose of circulating heat dissipation;
referring to fig. 5 and 7, the fourth plate 115 is disposed at the two ends of each inner flow channel 114 for blocking, so that the liquid water or the gaseous water in each inner flow channel 114 can be prevented from directly contacting the chamber 21 and the outer cover 22 from the two ends of each inner flow channel 114, and then overflowing and leaking at the joint, and the liquid water or the gaseous water is largely retained in each inner flow channel 114, the liquid water is stably heated and evaporated to make the gaseous water, especially blocked at the two ends of each inner flow channel 114, the internal pressure is rapidly increased to form a high pressure, and the high pressure can rapidly force the gaseous water to be discharged from the gas outlet channel 13, so that the internal water flow can be stabilized.
Referring to fig. 2, which is a first implementation of the heat dissipation assembly 11, the fourth plate surface 115 of the heat dissipation assembly 11 is formed by extending two ends of the first plate surface 111 toward the inner flow channel 114, the extended length of the fourth plate surface 115 is the same as the second plate surface 112 and the third plate surface 113, and the fourth plate surface 115 completely covers two ends of each inner flow channel 114; referring to fig. 8A, which is a second implementation manner of the heat dissipation assembly 11, the fourth board surface 115 is formed by extending two ends of the first board surface 111 towards the upper side of the direction of the inner flow channels 114, the extending length of the fourth board surface 115 is the same as that of the second board surface 112 and the third board surface 113, and the fourth board surface 115 only covers the upper side of two ends of each inner flow channel 114; referring to fig. 8B, which is a third implementation of the heat dissipation assembly 11, the fourth board surface 115 is formed by extending two ends of the first board surface 111 toward the middle of the inner flow channel 114, the extending length of the fourth board surface 115 is the same as the second board surface 112 and the third board surface 113, and the fourth board surface 115 only covers the middle of two ends of each inner flow channel 114; referring to fig. 8C, which is a fourth implementation of the heat dissipation assembly 11, the fourth plate surface 115 is formed by extending two ends of the first plate surface 111 toward the inner flow channels 114, and the extended length of the fourth plate surface 115 is shorter than the second plate surface 112 and the third plate surface 113, and the fourth plate surface 115 does not completely shield two ends of each inner flow channel 114; referring to fig. 8D, which is a fifth implementation of the heat dissipation assembly 11, the fourth board surface 115 is formed by extending two ends of the first board surface 111 towards the upper side of the inner flow channel 114, the lower side of the two ends of the first board surface 111 extends towards the outer side to form a protruding section 116, the extending length of the fourth board surface 115 is the same as that of the second board surface 112 and the third board surface 113, and the fourth board surface 115 only covers the upper side of the two ends of each inner flow channel 114; referring to fig. 8E, which is a sixth implementation manner of the heat dissipation assembly 11, a slot 117 is respectively formed above the first board 111 near two ends, the fourth board 115 is inserted into the slot 117, and the fourth board 115 only covers the upper ends of the inner channels 114; the first embodiment described above belongs to a full-blocking type, and the second to sixth embodiment all belong to a half-blocking type, so that a user can selectively choose a matching type from each of the above-mentioned embodiments of the heat dissipation assembly 11, if the heat dissipation assembly 11 of the full-blocking type is used, the heat dissipation module 1 must be provided with at least one channel 14 penetrating through each heat dissipation assembly 11, and if the heat dissipation assembly 11 of the half-blocking type is used, the channel 14 can be selectively provided or not provided by the heat dissipation module 1.
Referring to fig. 9 and 10, in a second embodiment of the overall structure configuration of the present invention, in the present embodiment, a predetermined space is provided between two ends of each heat dissipation assembly 11 and the inner side of the accommodating chamber 21, a blocking block 3 is respectively disposed between two ends of each heat dissipation assembly 11 and the inner side of the accommodating chamber 21, each blocking block 3 is disposed at a side close to the air outlet channel 13, so as to prevent liquid water or gaseous water in each inner channel 114 from directly contacting the accommodating chamber 21 and the outer cover 22 from two ends of each inner channel 114, and then overflowing and leaking at a seam, while the liquid water or gaseous water is largely retained in each inner channel 114, the liquid water is stably heated and evaporated to evaporate the gaseous water, and particularly blocked at two ends of each inner channel 114, to rapidly increase the internal pressure to form a high pressure, which can rapidly force the gaseous water to be discharged from the air outlet channel 13, and each heat dissipation assembly 11 uses the half-stop form of the second to sixth embodiments (corresponding to fig. 8A, b, c, Fig. 8B, 8C, 8D, and 8E, which use the second embodiment), and a gap 31 is opened at two ends of the blocking block 3 opposite to the inner flow channels 114, and the gap 31 keeps a space for liquid water or gaseous water to flow through.
Referring to fig. 11, a third embodiment of the overall structure configuration of the present invention is shown, in this embodiment, the second embodiment is continued, a predetermined space is provided between two ends of each heat dissipation assembly 11 of this embodiment and the inner side surface of the accommodating chamber 21, each blocking block 3 is disposed on one surface of the outer cover 22 opposite to the accommodating chamber, when the outer cover 22 is covered in the accommodating chamber 21, each blocking block 3 is disposed between two ends of the heat dissipation assembly 11 and the inner side surface of the accommodating chamber 21, each heat dissipation assembly 11 uses a half-stop form of the second to sixth embodiments (corresponding to fig. 8A, 8B, 8C, 8D, and 8E, where the second embodiment is used), and a gap 31 is formed at two ends of the blocking block 3 opposite to each inner flow channel 114, and the gap 31 keeps a space for liquid water or gaseous water to flow.
Referring to fig. 12 and 13, in a fourth embodiment of the overall structure configuration of the present invention, in the present embodiment, a predetermined space is provided between two ends of each heat dissipation assembly 11 and an inner side surface of the accommodating chamber 21, and each heat dissipation assembly 11 provided with the air outlet channel 13 uses a half-stop form corresponding to the fifth embodiment shown in fig. 8D, the protruding section 116 may be located between two ends of the heat dissipation assembly 11 and the inner side surface of the accommodating chamber 21, and each fourth plate surface 115 shields the upper portions of two ends of each inner channel 114, so that liquid water or gaseous water in each inner channel 114 may be prevented from directly contacting the accommodating chamber 21 and the outer cover 22 from two ends of each inner channel 114, and overflow and leakage may occur at a joint, the liquid water or gaseous water is largely retained in each inner channel 114, and the liquid water is stably heated and evaporated to rapidly increase internal pressure to form high pressure.
Referring to fig. 14 and 15, in a fifth embodiment of the overall structure configuration of the present invention, in this embodiment, a predetermined space is provided between two ends of each heat dissipation assembly 11 and the inner side surface of the accommodating chamber 21, each heat dissipation assembly 11 uses a half-stop form corresponding to the fifth embodiment shown in fig. 8D, the protruding section 116 can be located between two ends of each heat dissipation assembly 11 and the inner side surface of the accommodating chamber 21, each fourth plate 115 shields the upper portion of two ends of each inner flow channel 114, the water inlet channel 12 is disposed at the upper portion corresponding to each protruding section 116, liquid water sequentially passes through the water inlet 23 and the water inlet channel 12, passes through the lower portion of each fourth plate 115, enters each inner flow channel 114, and then flows to each position in the heat dissipation module 1 through each channel 14, and evaporates into gaseous water by one-time heating, in this embodiment, the liquid water or gaseous water in each inner flow channel 114 does not directly contact with the accommodating chamber 21 and the outer cover 22 from two ends of each inner flow channel 114, further, the joint overflows and leaks, liquid water or gaseous water is largely retained in each inner flow channel 114, the liquid water is stably heated and evaporated to make the gaseous water, the internal pressure is rapidly raised to form high pressure, and the liquid water is also stably heated and evaporated to make the gaseous water be rapidly discharged from the gas outlet channel 13, so that the internal water flow is stabilized, in addition, referring to fig. 16, compared with the fifth embodiment, in the sixth embodiment of the overall structural configuration of the present invention, the water inlet 23 is disposed at the side corresponding to each protruding section 116 (on the housing 2), and this embodiment can achieve the same effect as the fifth embodiment.
The above-described embodiments are only some of the preferred embodiments of the present invention, and it should be understood that the present invention is not limited thereto, and those skilled in the art can understand the technical features and embodiments of the present invention and make equivalent changes or modifications without departing from the spirit and scope of the present invention, and the scope of the present invention is defined by the claims appended to the present specification.
Claims (10)
1. A flow stabilizing and pressurizing device for an evaporator, comprising:
a heat dissipation module, which is formed by continuously stacking and assembling a large number of heat dissipation components, wherein each heat dissipation component is provided with a first plate surface, a second plate surface and a third plate surface, so that a half-open inner flow channel is formed inside the heat dissipation component, both ends of the heat dissipation component opposite to the inner flow channel are respectively provided with a fourth plate surface, and the heat dissipation module is respectively provided with a water inlet channel and a gas outlet channel which are not communicated with each other;
a housing, in which a chamber for placing the heat dissipation module is arranged, the housing further has an outer cover for covering the chamber, and the housing is respectively provided with a water inlet and an air outlet, the water inlet corresponds to the water inlet channel, and the air outlet corresponds to the air outlet channel;
this water inlet can flow in liquid water, liquid water evaporates in each interior runner, discharge by this gas outlet again, and this fourth face can effectually block at each interior runner both ends, consequently, can avoid the liquid water or gaseous state water at each interior runner direct should hold room and this enclosing cover by the direct contact in each interior runner both ends, and then avoid the overflow and the seepage, and liquid water or gaseous state water is by a large amount of reservations in each interior runner, liquid water can steadily be heated the evaporation and make gaseous state water can discharge from this gas outlet channel fast, the event makes inside rivers stable through the pressure boost.
2. The flow-stabilizing and pressure-increasing device of claim 1, wherein two ends of each heat sink are tightly attached to the chamber, and the heat sink module is formed with at least one channel passing through each heat sink.
3. A flow stabilizing and pressure increasing device for an evaporator as set forth in claim 1 wherein a predetermined space is provided between both ends of each heat dissipating module and the inner side of the accommodating chamber, and the heat dissipating module is provided with at least one channel passing through each heat dissipating module.
4. A flow stabilizing and pressure increasing device for an evaporator as set forth in claim 1, wherein a predetermined space is provided between the two ends of each heat dissipating module and the inner side of the accommodating chamber, a blocking block is respectively provided between the two ends of the heat dissipating module and the inner side of the accommodating chamber, each blocking block is provided at a side close to the air outlet channel, so as to prevent liquid water or gaseous water in each inner channel from directly contacting the accommodating chamber and the outer cover from the two ends of each inner channel, and further overflowing at the joint to leak.
5. A flow stabilizing and pressure increasing device for an evaporator as set forth in claim 1, wherein the fourth plate surface is formed by extending two ends of the first plate surface toward the inner flow passage, and the extending length of the fourth plate surface is the same as the second plate surface and the third plate surface, so that the fourth plate surface completely covers two ends of each inner flow passage.
6. A flow stabilizing and pressure increasing device for an evaporator as set forth in claim 1 wherein the fourth plate surface is formed by extending the two ends of the first plate surface toward the middle of the inner flow passage, and the extending length of the fourth plate surface is the same as the second plate surface and the third plate surface, so that the fourth plate surface is completely shielded between the two ends of each inner flow passage.
7. A flow stabilizing and pressure increasing device for an evaporator as set forth in claim 1 wherein the fourth plate surface is formed by extending the two ends of the first plate surface upward in the direction of the inner flow passage, and the length of the fourth plate surface is consistent with the second plate surface and the third plate surface, so that the fourth plate surface completely covers the two ends of each inner flow passage.
8. A flow stabilizing and pressure increasing device for an evaporator as set forth in claim 7 wherein a convex portion is formed extending outwardly from and below the ends of the first plate.
9. A flow stabilizing and pressure increasing device for an evaporator as set forth in claim 1 wherein the fourth plate surface is formed by extending the two ends of the first plate surface toward the inner flow passage, and the extending length of the fourth plate surface is shorter than the second plate surface and the third plate surface, so that the fourth plate surface is not completely covered by the two ends of the inner flow passages.
10. The flow-stabilizing and pressure-increasing device of an evaporator as claimed in claim 1, wherein a slot is formed above the first plate near both ends, and the fourth plate is inserted into the slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911406454.8A CN113133265A (en) | 2019-12-31 | 2019-12-31 | Steady flow supercharging device of evaporator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911406454.8A CN113133265A (en) | 2019-12-31 | 2019-12-31 | Steady flow supercharging device of evaporator |
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| CN113133265A true CN113133265A (en) | 2021-07-16 |
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| CN201911406454.8A Pending CN113133265A (en) | 2019-12-31 | 2019-12-31 | Steady flow supercharging device of evaporator |
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| TWM580672U (en) * | 2019-02-20 | 2019-07-11 | 龍大昌精密工業有限公司 | Heat dissipating structure of condenser |
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2019
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| CN101886885A (en) * | 2009-05-12 | 2010-11-17 | Ls美创有限公司 | Heat-exchangers of the plate type |
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| KR20190074604A (en) * | 2017-12-20 | 2019-06-28 | 엘지전자 주식회사 | Condenser and Refrigerator having the same |
| TWM576339U (en) * | 2018-09-21 | 2019-04-01 | 龍大昌精密工業有限公司 | Evaporator structure |
| TWM580672U (en) * | 2019-02-20 | 2019-07-11 | 龍大昌精密工業有限公司 | Heat dissipating structure of condenser |
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