CN113133147B - Heating circuit - Google Patents

Heating circuit Download PDF

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Publication number
CN113133147B
CN113133147B CN201911416405.2A CN201911416405A CN113133147B CN 113133147 B CN113133147 B CN 113133147B CN 201911416405 A CN201911416405 A CN 201911416405A CN 113133147 B CN113133147 B CN 113133147B
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China
Prior art keywords
power supply
heating
heating element
circuit
switch
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CN201911416405.2A
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CN113133147A (en
Inventor
左远洋
尹坤任
侯俊峰
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Midea Group Co Ltd
Guangdong Midea White Goods Technology Innovation Center Co Ltd
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Midea Group Co Ltd
Guangdong Midea White Goods Technology Innovation Center Co Ltd
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Priority to CN201911416405.2A priority Critical patent/CN113133147B/en
Priority to EP20909801.1A priority patent/EP4068903A4/en
Priority to PCT/CN2020/141094 priority patent/WO2021136306A1/en
Priority to JP2022540723A priority patent/JP7424683B2/en
Publication of CN113133147A publication Critical patent/CN113133147A/en
Priority to US17/843,903 priority patent/US20220361299A1/en
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Publication of CN113133147B publication Critical patent/CN113133147B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/36Coil arrangements

Abstract

The embodiment of the invention discloses a heating circuit, which comprises: the heating circuit includes: the power supply comprises an inverter circuit, at least one sub-circuit, a first power supply and a second power supply; wherein the sub-circuit comprises: a heating element, a detection element and a switch module; the switch module is respectively connected with the heating element and the detection element; if the switch module is in a first switch state, the first power supply, the inverter circuit and the heating element are connected to form a first conduction loop, the first power supply supplies power to the heating element through the first conduction loop, and the heating element generates heat based on the power supply of the first power supply; if the switch module is in a second switch state, the second power supply, the detection element and the heating element are connected into a second conduction loop, and the second power supply supplies power to the heating element and the detection element through the second conduction loop.

Description

Heating circuit
Technical Field
The invention relates to the technical field of electronics, in particular to a heating circuit.
Background
Before the household appliance is heated, the impedance of the heating element of the household appliance can be detected to determine whether a cooking device or the like exists on the heating element, so that the heating condition caused by the fact that the cooking device or the like does not exist on the heating element can be reduced. A heating loop for providing heating current and a detection loop for detecting whether the heating element exists in the cooking device and the like are required to be connected with the heating element; thus, the heating circuit and the detection circuit may affect each other, which may cause inaccuracy in detecting the impedance of the heating element or cause excessive current heated by the heating element.
Disclosure of Invention
In view of the above, an embodiment of the present invention provides a heating circuit.
The technical scheme of the embodiment of the invention is realized as follows:
a heating circuit, characterized in that the heating circuit comprises: the power supply comprises an inverter circuit, at least one sub-circuit, a first power supply and a second power supply; wherein the sub-circuit comprises: a switch module, a heating element and a detection element;
the switch module is respectively connected with the heating element and the detection element;
if the switch module is in a first switch state, the first power supply, the inverter circuit and the heating element are connected to form a first conduction loop, the first power supply supplies power to the heating element through the first conduction loop, and the heating element generates heat based on the power supply of the first power supply;
if the switch module is in a second switch state, the second power supply, the detection element and the heating element are connected into a second conduction loop, and the second power supply supplies power to the heating element and the detection element through the second conduction loop.
In the above scheme, the switch module includes: a first switching element and a second switching element;
the first switch element is connected with the heating element;
the second switch element is connected with the detection element;
if the first switch element is on and the second switch element is off, the switch module is in the first switch state;
if the first switch element is turned off and the second switch element is turned on, the switch module is in the second switch state.
In the above-mentioned scheme, the switch module includes:
a first end connected to the heating element;
a second terminal connected to the inverter circuit;
a third end connected to the detection element;
if the first end is connected with the second end, the switch module is in the first switch state;
and if the first end is connected with the third end, the switch module is in the second switch state.
In the above scheme, N sub-circuits are connected in parallel;
wherein N is an integer greater than 1.
In the above solution, the sub-circuit includes: the MOS transistor comprises a first MOS transistor and a second MOS transistor;
the drain electrode of the first MOS tube is connected with the second power supply, and the source electrode of the first MOS tube is respectively connected with the drain electrode of the second MOS tube and the detection element;
and the source electrode of the second MOS tube is connected with the grounding point.
In the above solution, the sub-circuit further includes: a first capacitor;
the first capacitor is connected between the switch module and the detection element; wherein the first capacitance is used to control the alternating frequency of the detection current of the heating element.
In the above aspect, the detection element includes: a first resistor and a second resistor; the sub-circuit comprises: a third MOS transistor and a fourth MOS transistor;
the first resistor is connected between the drain electrode of the third MOS tube and the second power supply;
the second resistor is connected between the source electrode of the fourth MOS tube and the grounding point;
the source electrode of the third MOS tube is respectively connected with the drain electrode of the fourth MOS tube and the switch module;
wherein the second resistance detects the resistance of the heating element based on the power supplied by the second power source.
In the above scheme, the first power supply is a power supply for providing a first voltage, and the second power supply is a power supply for providing a second voltage; wherein the first voltage is greater than the second voltage;
alternatively, the first and second liquid crystal display panels may be,
when the first power supply supplies power to the heating element through the first conduction loop, the current flowing through the second heating element is a first current;
when the second power supply supplies power to the heating element through the second conduction loop, the current flowing through the heating element is a second current;
wherein the first current is greater than the second current.
In the above aspect, the inverter circuit includes: a first IGBT and a second IGBT;
the collector of the first IGBT is connected with the first power supply, and the emitter of the first IGBT is connected with the switch module and the collector of the second IGBT respectively;
and the emitter of the second IGBT is grounded.
In the above scheme, the heating circuit further includes: a second capacitor; wherein, the first and the second end of the pipe are connected with each other,
the second capacitance is connected between the heating element and the ground point;
if the switch module is in the first switch state, the second capacitor is used for controlling the alternating frequency of the heating current of the heating element;
and if the switch module is in the second switch state, the second capacitor is used for controlling the alternating frequency of the detection current of the heating element.
The embodiment of the invention provides a heating circuit, which is respectively connected with a heating element and a detection element through a switch module, if the switch module is in a first switch state, the first power supply, an inverter circuit and the heating element are connected into a first conduction loop (namely a heating loop), the first power supply supplies power to the heating element through the first conduction loop, and the heating element generates heat based on the power supply of the first power supply; if the switch module is in a second switch state, the second power supply, the detection element and the heating element are connected into a second conduction loop (namely, a detection loop), and the second power supply supplies power to the heating element and the detection element through the second conduction loop.
In this way, the heating circuit may not detect the detection element when heating the heating element, or the heating circuit may not heat the heating element when detecting the detection element, so that the first conduction loop and the second conduction loop do not affect each other. That is to say, the embodiment of the invention can enable the heating circuit not to be affected by the second power supply when the heating element is heated, thereby greatly reducing the occurrence of the situation that the current of the heating element is too large due to the heating of the heating element by the second power supply; or the heating circuit is not influenced by the first power supply when detecting the impedance of the heating element, thereby improving the accuracy of detecting the impedance on the heating element.
Drawings
FIG. 1 is a schematic diagram of an alternative heating circuit configuration according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another alternative configuration of a heating circuit according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another alternative heating circuit according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of another alternative heating circuit according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a heating circuit according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a heating circuit according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1, an embodiment of the present invention provides a heating circuit, including: an inverter circuit 11, at least one sub-circuit 12, a first power supply 13, and a second power supply 14; wherein the sub-circuit comprises: a switch module 121, a heating element 122 and a detection element 123;
the switch module 121 is respectively connected to the heating element 122 and the detecting element 123;
if the switch module 121 is in a first switch state, the first power supply 13, the inverter circuit 11 and the heating element 122 are connected to form a first conduction loop, the first power supply supplies power to the heating element through the first conduction loop, and the heating element generates heat based on the power supplied by the first power supply;
if the switch module 121 is in the second switch state, the second power source 14, the detecting element 123 and the heating element 122 are connected to form a second conducting loop, and the second power source 14 supplies power to the heating element 122 and the detecting element 123 through the second conducting loop.
In the present embodiment, the detection element 123 detects the impedance of the heating element 122 based on the power supplied by the second power source 14; wherein the detected impedance is used to control the supply of power from the first power source 13 to the heating element 122.
Here, the heating element 122 includes, but is not limited to, at least one of: coil, electric heating wire, electric hot plate, electric hot rod and electric hot plate.
Here, the sensing element 123 may include a resistor.
For example, the heating element is a coil in an electromagnetic oven. If the switch module is in a second switch state, a second conduction loop of the heating circuit is conducted, and the second power supply supplies power to the coil and the detection element. Detecting the current of the second conduction loop by using an ammeter, and comparing the detected current with a preset current to determine whether the coil of the induction cooker has cooking equipment with certain impedance; wherein the predetermined current is a detected current when no cooking device is present on the coil. Or, if the detecting element is a resistor, a voltmeter may be used to detect the voltage across the resistor, and the detected voltage is compared with a predetermined voltage to determine whether there is a cooking device with a certain impedance on the coil of the induction cooker; wherein the predetermined voltage is a detected voltage when no cooking device is present on the coil. If the fact that the coil has certain impedance is determined; the switch module can be in a first switch state (the first conduction loop is conducted), so that the first power supply is used for heating the induction cooker.
Here, the heating element may be one or more.
In one embodiment, the heating element is a plurality of heating elements, and the plurality of heating elements are connected in series.
In another embodiment, the heating elements are multiple, and the multiple heating elements are connected between the inverter circuit and the switch module in parallel. Here, each of the heating elements may also be connected to a switching element; wherein the switching element is connected between the heating element and the switch module.
Here, the switch module is a module having a switch function. If the switch module is in a first switch state, the first power supply, the inverter circuit and the heating element can be connected to form a first conduction loop; and if the switch module is in a second switch state, the second power supply, the detection element and the heating element can be connected into a second conduction loop.
The inverter circuit is used for converting a direct current signal of the first power supply into an alternating current signal, for example, a high-frequency electric signal with a frequency higher than a preset value.
In this way, in the embodiment of the present invention, the heating circuit does not detect the detection element when heating the heating element, or the heating circuit does not heat the heating element when detecting the detection element, so that the first conduction loop and the second conduction loop do not affect each other.
In this way, the heating circuit is not influenced by the second power supply when heating the heating element, and the situation that the current of the heating element is overlarge due to the fact that the heating element is heated by the second power supply is greatly reduced; or the heating circuit is not influenced by the first power supply when detecting the impedance of the heating element, thereby improving the accuracy of detecting the impedance on the heating element.
In some embodiments, as shown in fig. 2, the switch module 121 includes: a first switch element 1210 and a second switch element 1211;
the first switch element 1210 is connected to the heating element 122;
the second switching element 1211 is connected to the detection element 123;
if the first switch element 1210 is turned on and the second switch element 1211 is turned off, the switch module 121 is in the first switch state;
if the first switch element 1210 is turned off and the second switch element 1211 is turned on, the switch module 121 is in the second switch state.
Here, the first switching element and the second switching element may each be a single-pole single-throw switch or a single-pole single-throw relay.
In the embodiment of the present invention, if the first switch element and the second switch element are single-pole single-throw relays, the first switch element and the second switch element can be automatically turned on or off, so that a danger caused by manual power to turn on or off the first switch element and the second switch element can be reduced. If the first switch element and the second switch element are single-pole single-throw switches, the hardware cost of the whole heating circuit can be reduced, and the weight of the whole heating circuit can be reduced.
In other embodiments, as shown in fig. 3, the switch module 121 includes:
a first end connected to the heating element 122;
a second terminal connected to the inverter circuit 11;
a third end connected to the detecting element 123;
if the first end is connected to the second end, the switch module 121 is in the first switch state;
if the first terminal is connected to the third terminal, the switch module 121 is in the second switch state.
Here, the switch module may be a single-pole double-throw switch or a single-pole double-throw relay.
Here, as shown in fig. 3, the first terminal and the second terminal of the switch module 121 are illustrated to be connected, so that the switch module of the heating circuit is in a first switch state. In other examples, the first terminal of the switch module may be connected to the third terminal.
In the embodiment of the present invention, if the switch module is a single-pole double-throw relay, the switch module can be automatically in a first switch state or a second switch state, so as to automatically implement conduction of the first conduction loop or conduction of the second conduction loop; therefore, danger caused by the fact that the switch module is in the first switch state or in the second switch state due to manual adjustment can be reduced. If the switch module is a single-pole single-throw switch, the hardware cost of the whole heating circuit can be reduced, and the weight of the whole heating circuit can be reduced.
Furthermore, in the embodiment of the present invention, the switch module in the one sub-circuit includes one switch device, and the switch module can be in the first switch state or in the second switch state based on the one switch device. Therefore, compared with the case that the number of the switching devices included in the switching module in one sub-circuit is two, the number of the switching devices can be reduced, the structure of the heating circuit is simplified, the hardware cost of the heating circuit is reduced, and the weight of the heating circuit can be further reduced. If the subcircuits are multiple, the effect is more obvious, the number of switching elements can be greatly reduced, the hardware cost of the heating circuit is reduced, and the like.
It will be appreciated that the at least one sub-circuit 12 may comprise one or more sub-circuits.
For example, as shown in FIG. 1, the heating circuit is shown to include a sub-circuit. As another example, as shown in fig. 4, the heating circuit shown includes 2 sub-circuits, wherein the 2 sub-circuits are connected in parallel. If the sub-circuits are 3 or more than 3 sub-circuits, 3 or more than 3 sub-circuits may be connected in parallel similarly to the connection of the sub-circuits in the heating circuit shown in fig. 4.
Here, when the heating circuit includes a plurality of sub-circuits, the plurality of sub-circuits may be respectively connected to a second power supply; or, the plurality of sub-circuits may all be connected to the same second power supply; or, some sub-circuits in the plurality of sub-circuits are connected with one second power supply, and other sub-circuits are connected with another second power supply.
Here, when the plurality of sub-circuits are connected to different second power sources, voltages supplied from the different second power sources are the same, or a difference between voltages supplied from any two of the different second power sources is within a predetermined range.
In some embodiments, the number of sub-circuits is N, the N sub-circuits being connected in parallel; wherein N is an integer greater than 1.
It is understood that the number and type of components of the N sub-circuits are substantially the same. For example, the number of sub-circuits is 2, specifically, sub-circuit 1 and sub-circuit 2.
In a practical application, the number and types of the heating elements, the detecting elements and the switch modules in the sub-circuits 1 and 2 are the same.
In another practical application, the heating element in the sub-circuit 1 is a coil; the heating element in the sub-circuit 2 is an electric heating plate; the difference between the impedances of the coil and the electric heating plate is within a predetermined threshold range.
In yet another practical application, the number of the detection elements in the sub-circuit 1 is 2, and the 2 detection elements in the sub-circuit 1 are connected in series; the number of detection elements in the sub-circuit 2 is 1; the sum of the impedances of the 2 detection elements in the sub-circuit 1 and the difference between the impedances of the 1 detection elements in the sub-circuit 2 are within a predetermined threshold range.
For example, the impedances of the 2 detection elements in the sub-circuit are each 10 ohms (Ω), and the impedance of the detection element of the sub-circuit 2 is between 19 Ω and 20 Ω.
As another example, the impedances of 2 detection elements in the sub-circuit are one 50 Ω and one 20 Ω; the impedance of the detection element of the sub-circuit 2 is between 68 Ω and 72 Ω.
In another practical application, the switch module in the sub-circuit 1 is a switch module including a first switch element and a second switch element, and the switch module in the sub-circuit 2 is a switch module including a first terminal, a second terminal and a third terminal.
In short, the plurality of sub-circuits are not limited herein as long as the sub-circuits include the heating element, the detecting element and the switch module, and the sub-circuits can heat the heating element and detect the impedance of the heating element without affecting each other.
In the embodiment of the present invention, the N sub-circuits may jointly use one inverter circuit, and may implement a multi-path function of detecting the impedance of the heating element and/or heating the heating element based on one inverter circuit; the utilization rate of the inverter circuit is improved.
Moreover, the plurality of sub-circuits can share one first power supply, so that the utilization rate of the first power supply can be improved.
And if the plurality of sub-circuits share one second power supply or a part of the sub-circuits share one second power supply, the utilization rate of the second power supply can be improved.
An Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device composed of a BJT (Bipolar Transistor) and a MOS (Insulated Gate field effect Transistor).
In some embodiments, as shown in fig. 5, the inverter circuit 11 includes: a first IGBT and a second IGBT;
a collector of the first IGBT is connected to the first power supply, and an emitter of the first IGBT is connected to the switching module 121 and a collector of the second IGBT, respectively;
and the emitter of the second IGBT is grounded.
Here, the heating circuit shown in fig. 5 includes 2 sub-circuits.
Here, the inverter circuit 11 may be configured to invert the dc voltage into an ac voltage. For example, the 220V dc voltage is inverted to a 220V sine wave voltage or a square wave voltage.
The inverter circuit 11 can also be used to convert the positive half-wave ac voltage into a full-wave ac voltage (the full-wave ac voltage is a voltage having a positive half-wave and a negative half-wave). For example, the square wave voltage of the positive half wave of 220V is converted into the square wave voltage of the positive half wave and the negative half wave of 220V.
In the embodiment of the invention, the frequency of the electric signal output by the first power supply can be adjusted through the on and off frequencies of the first IGBT and the second IGBT. The direct current signal of the first power supply can be converted into an alternating current signal or further converted into a high-frequency electric signal higher than a preset value through an inverter circuit formed by the first IGBT and the second IGBT.
And because the inverter circuit adopts the IGBT, the inverter circuit has the advantages of both high input impedance of the MOS tube and low conduction voltage drop of the power transistor. Therefore, the embodiment of the invention can improve the stability and the safe working voltage area of power supply for the heating element, thereby improving the safety of power supply for the heating element.
It should be noted that the high frequency is relatively comparable to the low frequency mentioned in the following embodiments, and the frequency of the high frequency is greater than that of the low frequency under the same reference standard.
It is understood that the inverter circuit may be composed of two Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs), or the inverter circuit may be composed of two transistors.
For example, in some embodiments, the inverter circuit may further include: a fifth MOS transistor and a sixth MOS transistor;
the drain of the fifth MOS transistor is connected to the first power supply 13, and the source of the fifth MOS transistor is connected to the switch module 121 and the drain of the sixth MOS transistor respectively;
and the source electrode of the sixth MOS tube is grounded.
In this way, in the embodiment of the present invention, the high-frequency electric signal may be provided to the heating element by the alternate conduction of the fifth MOS transistor and the sixth MOS transistor.
In some embodiments, the first power supply is a power supply for providing a first voltage, and the second power supply is a power supply for providing a second voltage; wherein the first voltage is greater than the second voltage;
alternatively, the first and second electrodes may be,
when the first power supply supplies power to the heating element through the first conduction loop, the current flowing through the second heating element is first current;
when the second power supply supplies power to the heating element through the second conduction loop, the current flowing through the heating element is a second current;
wherein the first current is greater than the second current.
Here, the first power source is used to obtain a power greater than or equal to 110V, and the second power source is used to obtain a power less than or equal to 36V.
In one embodiment, the first power supply is used for obtaining 220V direct current voltage; the second power supply is used for obtaining 5V direct current voltage.
It can be understood that, if the voltage obtained by the first power supply is greater than 110V, the voltage obtained by the first power supply is a strong electric voltage; if the voltage obtained by the second power supply is less than 36V, the voltage obtained by the second power supply is weak current voltage; if the first conduction loop and the second conduction loop are both conducted under the condition of power supply of the first power supply and the second power supply, noise of the first conduction loop can crosstalk with the second conduction loop, and therefore inaccurate impedance existing on the heating element is detected. Moreover, when the second conduction loop detects the impedance of the heating element, the actual voltage of the second conduction loop may be a strong voltage greater than 110V, which also brings a certain danger to people near the heating circuit.
In the embodiment of the invention, the switch module is in different switch states, so that the first conduction loop is switched on and the second conduction loop is switched off, or the second conduction loop is switched on and the first conduction loop is switched off; therefore, the isolation of strong current and weak current is realized, and the danger caused by the low insulating property of a weak current circuit is reduced.
Referring again to fig. 5, in some embodiments, the sub-circuit 12 includes: the MOS transistor comprises a first MOS transistor and a second MOS transistor;
the drain of the first MOS transistor is connected to the second power supply, and the source of the first MOS transistor is connected to the drain of the second MOS transistor and the detection element 123, respectively;
and the source electrode of the second MOS tube is connected with the grounding point.
Here, if the first MOS transistor is an N-channel MOS transistor, the second MOS transistor is an N-channel MOS transistor; if the first MOS tube is a P-channel MOS tube, the second MOS tube is a P-channel MOS tube.
In this embodiment of the present invention, if the second conduction loop is turned on, the second power supply provides a low-voltage high-frequency electrical signal to the heating element through the first MOS transistor and the second MOS transistor. Thus, if no cooking equipment exists on the heating element, the detection current flowing through the detection element is a first detection current value; if cooking equipment exists on the heating element, the detection current flowing through the detection element is a second detection current value; therefore, the current of the detection element is detected by the current meter, and whether the cooking device with certain resistance exists on the heating element or not is determined. Further, the impedance value of the cooking appliance may be calculated by a predetermined first detected current value, a second detected current value, and the like.
Alternatively, it is possible to determine whether a cooking device having a certain resistance is present on the heating element by detecting the magnitude of the voltage on the detecting element. Further, an impedance value of the cooking apparatus may be calculated based on the first detection voltage value and the second detection voltage value on the detection element; wherein the first detected voltage value is a voltage value on the detection element when the cooking device is not present on the heating element; the second voltage value is a voltage value on the detection element when the cooking device is present on the heating element.
Referring again to fig. 5, in some embodiments, the sub-circuit 12 further includes: a first capacitor C1;
the first capacitor C1 is connected between the switch module 121 and the detecting element 123; wherein the first capacitor C1 is used to control the alternating frequency of the detection current of the heating element 122.
Here, one detection element is included in one sub-circuit 12. In one embodiment, the sensing element is a resistor. Thus, the number of detection elements in the heating circuit can be reduced.
In the embodiment of the present invention, the oscillation frequency (i.e., the alternating frequency) of the heating element in the second conductive loop may be adjusted by adjusting the capacitive reactance of the first capacitor C1, the impedance of the heating element, and the impedance of the detection element.
In some embodiments, as shown in fig. 6, the detection element 123 includes: a first resistor R1 and a second resistor R2; the sub-circuit 12 comprises: a third MOS transistor and a fourth MOS transistor;
the first resistor R1 is connected between the drain electrode of the third MOS tube and the second power supply 14;
the second resistor R2 is connected between the source electrode of the fourth MOS transistor and the grounding point PGND;
the source electrode of the third MOS transistor is respectively connected with the drain electrode of the fourth MOS transistor and the switch module 121;
wherein the second resistor R2 detects the resistance of the heating element 122 based on the power supplied from the second power source 14.
Here, the detection element in one sub-circuit includes: a first resistor and a second resistor.
Here, as shown in fig. 6, the switch module is shown to include a first switch element 1210 and a second switch element 1211, and the source of the third MOS transistor is connected to the switch module 121: the source of the third MOS transistor is connected to the second switching element 1211.
In the embodiment of the invention, two resistors are arranged in the detection element in one sub-circuit and are respectively connected between the third MOS tube and the second power supply and between the fourth MOS tube and the ground, so that the impedance of the second conduction loop is consistent when the second conduction loop is charged and discharged, the power supply of the second conduction loop is more stable on one hand, and the loss of components in the second conduction loop is reduced.
Moreover, when it is detected whether or not there is a cooking setting of a certain impedance in the heating resistor based on the voltage of the second resistor R2, since the low-voltage end of the second resistor R2 is grounded and the voltage thereof is 0, only the high-voltage end of the second resistor R2 (for example, the detection point shown in fig. 6) can be obtained, and the voltage across the second resistor R2 can be obtained; this makes it easier to detect the voltage of the detection element. At the same time, the accuracy of the detected resistance of the heating element can be further improved.
Referring again to fig. 6, in some embodiments, the heating circuit further comprises: a second capacitor C2; wherein the content of the first and second substances,
the second capacitor C2 is connected between the heating element 122 and the grounding point PGND;
if the switch module 121 is in the first switch state, the second capacitor C2 is used for controlling the alternating frequency of the heating current of the heating element 122;
if the switch module 121 is in the second switch state, the second capacitor C2 is used for controlling the alternating frequency of the detection current of the heating element 122.
In the embodiment of the present invention, if the switch module is in the first switch state, the alternating frequency of the heating current of the heating element can be adjusted by adjusting the capacitive reactance of the second capacitor and the impedance of the heating element.
In a practical application of the embodiment of the present invention, if the second capacitor C2 exists in the heating circuit, the first capacitor may not be needed in the heating circuit. In this way, the second capacitor C2 may be used to control the alternating frequency of the detection current of the heating element when the switching module is in the second switching state.
Here, the oscillation frequency (i.e., the alternating frequency) of the heating element in the second conductive loop may be adjusted by adjusting the capacitive reactance of the second capacitor C2, the impedances of the first and second resistors, and the impedance of the heating element.
In another practical application of the embodiment of the present invention, if both the second capacitor C2 and the first capacitor C1 exist in the heating circuit. In this way, the second capacitor C2 and the first capacitor C1 together serve to control the alternating frequency of the detection current of the heating element when the switching module is in the first switching state.
Here, the oscillation frequency (i.e., the alternating frequency) of the heating element in the second conductive loop may be adjusted by adjusting the capacitive reactance of the second capacitor C2 and the first capacitor C1, the impedance of the first resistor and the second resistor, and the impedance of the heating element.
In the embodiment of the invention, the adjustment of the alternating frequency of the heating current of the heating element in the first conduction loop or the detection current of the heating element in the second conduction loop can be realized through one capacitor, so that the utilization rate of the second capacitor can be improved; compared with the situation that the two capacitors are used for respectively adjusting the alternating frequency of the heating current of the heating element in the first conduction loop or the alternating frequency of the detection current of the heating element in the second conduction loop, the number of components of the heating circuit can be reduced, and therefore the hardware cost of the heating circuit is reduced.
Example 1
Referring to fig. 5 again, an embodiment of the invention provides a heating circuit, including:
the power supply comprises an inverter 11, 2 subcircuits 12, a first power supply 13, a second power supply 14 and a second capacitor C2;
wherein the sub-circuit 12 comprises: the circuit comprises a switch module 121, a heating element 122, a detection element 123, a first capacitor C1, a first MOS (metal oxide semiconductor) tube and a second MOS tube;
the inverter circuit 11 includes: a first IGBT and a second IGBT; the collector of the first IGBT is connected with the first power supply 13, and the emitter of the first IGBT is connected with the collector of the second IGBT; an emitter electrode of the second IGBT is grounded PGND;
the switch module 121 includes: a first end, a second end and a third end; wherein the first end is connected to the heating element 122; the second end is connected with the emitter of the first IGB; the third end is connected with the first capacitor C1;
the first capacitor C1 is connected to the detection element 123;
the drain of the first MOS transistor is connected to the second power supply 14, and the source of the first MOS transistor is connected to the drain of the second MOS transistor and the detection element 123, respectively; the source electrode of the second MOS tube is connected with the grounding point PGND;
the second capacitor C2 is connected between the heating element 122 and the ground point PGND;
if the first end and the second end of the switch module 121 are connected, the switch module 121 is in a first switch state, the first power supply 13, the inverter circuit 11 and the heating element 122 are connected to form a first conduction loop, the first power supply 13 supplies power to the heating element 122 through the first conduction loop, and the heating element 122 generates heat based on the power supplied by the first power supply 13;
if the first end of the switch module 121 is connected to the third end, the switch module 121 is in a second switch state, the second power source 14, the detecting element 123 and the heating element 122 are connected to form a second conducting loop, and the second power source 14 supplies power to the heating element 122 and the detecting element 123 through the second conducting loop.
Here, the detection element 123 detects the impedance of the heating element 122 based on the power supply of the second power source 14; wherein the detected impedance is used to control the supply of power from the first power supply 13 to the heating element 122.
In the embodiment of the invention, the conduction of the first conduction loop and the second conduction loop can be switched by the switch module in different states, so that the first conduction loop and the second conduction loop are isolated from each other; in this way, the heating circuit is not influenced by the second power supply when heating the heating element, and the situation that the current of the heating element is overlarge due to the fact that the heating element is heated by the second power supply is greatly reduced; or the heating circuit is not influenced by the first power supply when detecting the impedance of the heating element, thereby improving the accuracy of detecting the impedance on the heating element.
The switch module comprises three ends and can conduct the first conduction loop when the first end is connected with the second end; or when the first end and the third end are connected, the second conduction loop is conducted, so that the first conduction loop and the second conduction loop can be switched and conducted; compared with the method that the second conduction loop and the second conduction loop are switched by using the switch module of the two switch elements, the number of components of the heating circuit can be greatly reduced, and therefore the hardware cost of the heating circuit can be greatly reduced.
Example 2
Referring to fig. 6 again, an embodiment of the invention provides a heating circuit, including:
the power supply comprises an inverter 11, 2 subcircuits 12, a first power supply 13, a second power supply 14 and a second capacitor C2;
wherein the sub-circuit 12 comprises: the circuit comprises a switch module 121, a heating element 122, a first resistor R1, a second resistor R2, a first capacitor C1, a third MOS (metal oxide semiconductor) transistor and a fourth MOS transistor;
the inverter circuit 11 includes: a first IGBT and a second IGBT; the collector of the first IGBT is connected with the first power supply 13, and the emitter of the first IGBT is connected with the collector of the second IGBT; an emitter electrode of the second IGBT is grounded PGND;
the switch module 121 includes: a first switching element 1210 and a second switching element 1211; wherein the first switching element 1210 is connected between the heating element 122 and the emitter of the first IGBT; the second switching element 1211 is connected between the heating element 122 and the first capacitor C1;
the first capacitor C1 is also connected with a source electrode of a third MOS tube;
the first resistor R1 is connected between the drain electrode of the third MOS tube and the second power supply 14; the second resistor R2 is connected between the source electrode of the fourth MOS transistor and the grounding point PGND; the source electrode of the third MOS tube is also connected with the drain electrode of the fourth MOS tube; wherein the second resistance detects the resistance of the heating element based on the power supplied by the second power source 14;
the second capacitance C2 is connected between the heating element 122 and the ground point PGND;
if the first switch element 1210 is turned on and the second switch element 1211 is turned off, the switch module 121 is in the first switch state, the first power supply 13, the inverter circuit 11 and the heating element 122 are connected to form a first conducting loop, the first power supply 13 supplies power to the heating element 122 through the first conducting loop, and the heating element 122 generates heat based on the power supplied by the first power supply 13;
if the first switch element 1210 is turned off and the second switch element 1211 is turned on, the switch module 121 is in the second switch state, the second power source 14, the first resistor R1, the second resistor R2 and the heating element 122 are connected to form a second conducting loop, and the second power source 14 supplies power to the heating element 122, the first resistor R1 and the second resistor R2 through the second conducting loop.
In the embodiment of the present invention, the first resistor R1 and the second resistor R2 are the detecting element 123 in the above embodiment.
In an embodiment, the second resistor R2 is the detecting element 123 in the above embodiment.
Here, the detection element 123 detects the impedance of the heating element 122 based on the power supply of the second power source 14; wherein the detected impedance is used to control the supply of power from the first power supply 13 to the heating element 122.
In the embodiment of the invention, the switch module can be in different states to switch the conduction of the first conduction loop and the second conduction loop, so that the first conduction loop and the second conduction loop are isolated from each other; in this way, the heating circuit is not influenced by the second power supply when heating the heating element, and the situation that the current of the heating element is overlarge due to the fact that the heating element is heated by the second power supply is greatly reduced; or the heating circuit is not influenced by the first power supply when detecting the impedance of the heating element, thereby improving the accuracy of detecting the impedance on the heating element.
And the detection element comprises a first resistor R1 and a second resistor R2, and the first resistor R1 and the resistor R2 are connected in the heating circuit in such a way that the impedance of the second conduction loop is consistent when the second conduction loop is charged and discharged, so that the power supply of the second conduction loop is more stable on one hand, and the loss of components in the second conduction loop is reduced.
In this connection mode, the low-voltage end of the second resistor R2 is grounded. In this way, when the voltage of the second resistor R2 is detected to determine whether or not a certain resistance cooking device is present on the heating element, the operation of obtaining the detected voltage can be simplified.
The second capacitor may be configured to adjust an alternating frequency of a heating current of the heating element when the first conductive loop is turned on, or may be configured to adjust an alternating frequency of a detection current of the heating element when the second conductive loop is turned on; thereby improving the utilization of the second capacitor. And the first capacitor of the heating circuit can be replaced, so that the first capacitor does not need to be configured in the heating circuit, the number of components of the heating circuit can be reduced, and the hardware cost of the heating circuit is reduced.
Features disclosed in several of the product embodiments provided in the present application may be combined in any combination to yield new product embodiments without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (9)

1. A heating circuit, characterized in that the heating circuit comprises: the power supply comprises an inverter circuit, at least one sub-circuit, a first power supply and a second power supply; wherein the sub-circuit comprises: the switch module, the heating element and the detection element;
the switch module is respectively connected with the heating element and the detection element; if the switch module is in a first switch state, the first power supply, the inverter circuit and the heating element are connected to form a first conduction loop, the first power supply supplies power to the heating element through the first conduction loop, the heating element generates heat based on the power supply of the first power supply, and the voltage acquired by the first power supply is strong voltage;
if the switch module is in a second switch state, the second power supply, the detection element and the heating element are connected to form a second conduction loop, the second power supply supplies power to the heating element and the detection element through the second conduction loop, and the voltage obtained by the second power supply is weak current voltage;
the switch module includes: a first switching element and a second switching element; the first switch element is connected with the heating element; the second switching element is connected with the detection element; if the first switch element is turned on and the second switch element is turned off, the switch module is in the first switch state; if the first switch element is turned off and the second switch element is turned on, the switch module is in the second switch state.
2. The heating circuit of claim 1, wherein the switch module comprises:
a first end connected to the heating element;
a second terminal connected to the inverter circuit;
a third end connected to the detection element;
if the first end is connected with the second end, the switch module is in the first switch state;
and if the first end is connected with the third end, the switch module is in the second switch state.
3. The heating circuit of claim 1, wherein the number of sub-circuits is N, the N sub-circuits being connected in parallel;
wherein N is an integer greater than 1.
4. The heating circuit of claim 1, wherein the sub-circuit comprises: the MOS transistor comprises a first MOS transistor and a second MOS transistor;
the drain electrode of the first MOS tube is connected with the second power supply, and the source electrode of the first MOS tube is respectively connected with the drain electrode of the second MOS tube and the detection element;
and the source electrode of the second MOS tube is connected with the grounding point.
5. The heating circuit of claim 1 or 4, wherein the sub-circuit further comprises: a first capacitor;
the first capacitor is connected between the switch module and the detection element; wherein the first capacitance is used to control the alternating frequency of the detection current of the heating element.
6. The heating circuit of claim 1, wherein the sensing element comprises: a first resistor and a second resistor; the sub-circuit comprises: a third MOS transistor and a fourth MOS transistor;
the first resistor is connected between the drain electrode of the third MOS tube and the second power supply;
the second resistor is connected between the source electrode of the fourth MOS tube and the grounding point;
the source electrode of the third MOS tube is respectively connected with the drain electrode of the fourth MOS tube and the switch module;
wherein the second resistance detects the resistance of the heating element based on the power supplied by the second power source.
7. The heating circuit according to any one of claims 1 to 4 and 6, wherein the first power supply is a power supply for supplying a first voltage, and the second power supply is a power supply for supplying a second voltage; wherein the first voltage is greater than the second voltage;
alternatively, the first and second liquid crystal display panels may be,
when the first power supply supplies power to the heating element through the first conduction loop, the current flowing through the heating element is a first current;
when the second power supply supplies power to the heating element through the second conduction loop, the current flowing through the heating element is a second current;
wherein the first current is greater than the second current.
8. The heating circuit of claim 1, wherein the inverter circuit comprises: a first IGBT and a second IGBT;
the collector of the first IGBT is connected with the first power supply, and the emitter of the first IGBT is connected with the switch module and the collector of the second IGBT respectively;
and the emitter of the second IGBT is grounded.
9. The heating circuit of claim 1, further comprising: a second capacitor; wherein the content of the first and second substances,
the second capacitor is connected between the heating element and a ground point;
if the switch module is in the first switch state, the second capacitor is used for controlling the alternating frequency of the heating current of the heating element;
and if the switch module is in the second switch state, the second capacitor is used for controlling the alternating frequency of the detection current of the heating element.
CN201911416405.2A 2019-12-31 2019-12-31 Heating circuit Active CN113133147B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201911416405.2A CN113133147B (en) 2019-12-31 2019-12-31 Heating circuit
EP20909801.1A EP4068903A4 (en) 2019-12-31 2020-12-29 Heating circuit
PCT/CN2020/141094 WO2021136306A1 (en) 2019-12-31 2020-12-29 Heating circuit
JP2022540723A JP7424683B2 (en) 2019-12-31 2020-12-29 heating circuit
US17/843,903 US20220361299A1 (en) 2019-12-31 2022-06-17 Heating Circuit

Applications Claiming Priority (1)

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CN201911416405.2A CN113133147B (en) 2019-12-31 2019-12-31 Heating circuit

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CN113133147B true CN113133147B (en) 2022-10-11

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2101681U (en) * 1991-08-16 1992-04-15 张国安 Micro computer control energy-saving temp. controlling cabinet with double loop
CN102177765A (en) * 2008-10-08 2011-09-07 松下电器产业株式会社 Inductive heating device
CN106152193A (en) * 2015-04-08 2016-11-23 美的集团股份有限公司 Electromagnetic heating system and pan testing circuit, detection method
JP2017199585A (en) * 2016-04-28 2017-11-02 日立アプライアンス株式会社 High frequency heating cooker
CN209562837U (en) * 2018-12-29 2019-10-29 佛山市顺德区美的电热电器制造有限公司 Electromagnetic heating system and its control circuit and electric cooking pot

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2101681U (en) * 1991-08-16 1992-04-15 张国安 Micro computer control energy-saving temp. controlling cabinet with double loop
CN102177765A (en) * 2008-10-08 2011-09-07 松下电器产业株式会社 Inductive heating device
CN106152193A (en) * 2015-04-08 2016-11-23 美的集团股份有限公司 Electromagnetic heating system and pan testing circuit, detection method
JP2017199585A (en) * 2016-04-28 2017-11-02 日立アプライアンス株式会社 High frequency heating cooker
CN209562837U (en) * 2018-12-29 2019-10-29 佛山市顺德区美的电热电器制造有限公司 Electromagnetic heating system and its control circuit and electric cooking pot

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