CN113128038B - Intelligent sensing method for heat source overload of skin array unit - Google Patents

Intelligent sensing method for heat source overload of skin array unit Download PDF

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CN113128038B
CN113128038B CN202110381140.8A CN202110381140A CN113128038B CN 113128038 B CN113128038 B CN 113128038B CN 202110381140 A CN202110381140 A CN 202110381140A CN 113128038 B CN113128038 B CN 113128038B
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temperature
array
sub
overload
heat source
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CN113128038A (en
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冷国俊
肖滨
李佳
保宏
王从思
黄永安
蒙春城
赖天华
廖长江
王伟
陈显才
张逸群
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CETC 29 Research Institute
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Abstract

The invention particularly discloses an intelligent sensing method for overload of a heat source of a skin array unit, which comprises the following steps: inputting a temperature design boundary required by the system on the array unit, an allowable upper temperature limit of the input unit, a geometric size of the boundary of the vibration array and the temperature; dividing the array unit into sub-arrays, collecting temperature data of the transmitting unit, and calculating equivalent temperature values of the sub-arrays; carrying out time domain data expansion on the sub-array equivalent temperature values to obtain a jth sub-array temperature vector, and storing the equivalent values of a plurality of sub-arrays; determining a plurality of direction vectors of the overload heat source, determining the geometric spatial position of the overload heat source in a cross positioning mode, and obtaining a determined subarray through convergence; an array unit switch topology is provided to a system control center to prevent overload damage. The invention can give consideration to both the detection accuracy and the system resource occupation ratio, and ensures certain accuracy of real-time temperature monitoring on the premise of not increasing the system resource occupation.

Description

Intelligent sensing method for heat source overload of skin array unit
Technical Field
The invention relates to the technical field of electronics, which is applied to the temperature data filtering of a skin array unit array, the time domain expansion of sub-array equivalent temperature, the search of an overload unit and the design of an array unit switch topological scheme in an aviation environment, in particular to an intelligent sensing method for the overload of a heat source of the skin array unit.
Background
In recent decades of rapid development of aerospace electronic devices, high-integration array systems are widely applied, and the power of heat sources with high heat flux density is increasingly improved. However, in practical engineering, due to the problems of unreasonable heat dissipation topology planning, short circuit of components, power mismatch and the like, a chip can generate thermal overload and can be damaged into a subarray unit after a certain overload time, meanwhile, certain deviation and even errors can exist in reported data of the chip temperature saving, a subarray with high integration level is usually expensive, particularly, the replacement cost on aerospace electronic equipment is extremely high, various aerospace aircrafts have strict requirements on sensing of the overload state of an array heat source of electronic equipment used by the aerospace aircrafts in a harsh environment, and the situation brings unprecedented challenges to related design of a health monitoring system. The radiation power of the electronic system is influenced by the effective array scale, and the temperature overload of the array system in a complex environment is simultaneously influenced by the heat conductivity of the structural frame and the equivalent temperature value of the sub-array. The temperature overload characteristic of the array, which is shown along with the change of the heat load environment of the electronic system, directly influences the function guarantee of the whole electronic system. Therefore, it is an urgent need to study the sensing of the heat source overload of the array unit.
A high-density heat source is often brought in a large array system, and a light-weight heat sensor such as an optical fiber is introduced into a control system to realize the function of sensing the overload condition of the whole array system in real time. At present, a main monitoring method is mainly reported by chip temperature saving, a monitoring method adopted in the industry is relatively mature on ground equipment, but on an aerospace platform, a monitoring circuit is often in short circuit or open circuit due to complex and changeable array system use working conditions such as vibration, temperature impact and the like, so that a sensor fails, the reliability of temperature signal transmission is reduced, and a wireless sensor is adopted, so that the problem of occupying more system resources is solved.
In summary, the existing skin array unit heat source overload temperature monitoring method cannot give consideration to the aspects of detection accuracy and system resource ratio on the premise of not greatly increasing the system complexity, has certain limitations, and is not enough to meet the temperature overload monitoring requirement of the existing high heat source electronic system and provide real-time and accurate adjustment for the corresponding subarray switch topology scheme.
Disclosure of Invention
The invention aims to solve the technical problem of providing an intelligent sensing method for the overload of a heat source of a skin array unit; the method can give consideration to the detection accuracy and the system resource occupation ratio, and ensures certain accuracy of real-time temperature monitoring on the premise of not increasing the system resource occupation.
The technical problem to be solved by the invention is as follows:
an intelligent sensing method for heat source overload of a skin array unit specifically comprises the following steps:
step S1: inputting the temperature design boundary required by the system to the array unit and the allowable upper temperature limit T of the input unitmaxVibration array boundary geometry
Figure GDA0003555241250000021
And a temperature T;
step S2: dividing the array unit into sub-arrays, collecting temperature data of the emitting unit by using a temperature collecting system, and calculating equivalent temperature T of the sub-arraysj；
Step S3: according to the sub-array division, performing data expansion on the time domain on the sub-array equivalent temperature value to obtain the jth sub-array temperature vector
Figure GDA0003555241250000022
Storing the equivalent values of the plurality of sub-arrays;
step S4: searching direction of overload unit to determine direction vector of overload heat source
Figure GDA0003555241250000023
Step S5: determining a plurality of direction vectors of the overload heat source, determining the geometric spatial position of the overload heat source in a cross positioning mode, and obtaining a determined subarray through convergence;
step S6: an array unit switch topology is provided to a system control center to prevent overload damage.
In some possible embodiments, in step S2, the temperature data acquisition system is used to acquire temperature data of the transmitting unit, specifically:
reporting the temperature measurement value to a control system, dividing according to the geometric boundary of the system, performing topological mapping, reading the boundary temperature of the system and storing data; and meanwhile, the temperature-saving data is stored.
In some possible embodiments, the sub-array equivalent temperature value T is calculated in step S2jSpecifically, the method comprises the following steps:
the method comprises the following steps of (1) dividing the boundary of the subsystem into determined sub-arrays according to the arrays, and calculating the equivalent temperature value of the sub-arrays, wherein the method comprises the following steps:
for the jth sub-array, assume commonnumThe number of the chip units is j,
Figure GDA0003555241250000031
Figure GDA0003555241250000032
wherein, TjIs the equivalent temperature value of the jth sub-array.
In some possible embodiments, in step S3, performing data expansion on the subarray equivalent temperature values in the time domain, specifically:
according to the sub-array division, for the jth sub-array, each equivalent temperature value is different at different time, and the assumption is thatThe sampling period of the system temperature is t0Setting the time domain spreading width to nt0Performing data expansion in time domain to form jth sub-array temperature vector
Figure GDA0003555241250000033
Information about temperature changes with time in the form of discrete point recordings.
In some possible embodiments, the step S4 specifically refers to: recording different subarray temperatures T by the same timej(ii) a Recording the temperature difference change of the same subarray at different moments
Figure GDA0003555241250000034
Figure GDA0003555241250000035
Wherein the content of the first and second substances,
k is the k-th time interval;
n is the nth time interval;
Figure GDA0003555241250000041
is the temperature of the subarray representing the kth time interval;
Figure GDA0003555241250000042
is the temperature of the subarray representing the nth time interval;
determining overloaded heat source direction vector
Figure GDA0003555241250000043
In some possible embodiments, the step S5 specifically refers to:
the array elements are divided into m sub-arrays, and at time t,
Figure GDA0003555241250000044
Figure GDA0003555241250000045
wherein, Delta TminThe minimum value of the temperature difference change of the same subarray is obtained;
ΔTmaxthe maximum value of the temperature difference change of the same subarray is obtained;
for a maximum value Δ TmaxMinimum value Δ TminRespectively corresponding to two corresponding sub-arrays A1、B1And is marked as A at the next moment2、B2The vectors are respectively noted as
Figure GDA0003555241250000046
Obtaining a preliminary overload subarray;
and calculating based on different time widths, and iteratively solving until convergence to obtain a determined subarray.
In some possible embodiments, the equivalent values of the plurality of sub-arrays are stored in an array.
Compared with the prior art, the invention has the beneficial effects that:
the invention has high intelligence degree and strong robustness, and can still provide accurate overload unit information even if the temperature sensor is damaged;
the invention improves the real-time sensing capability of the control system to the temperature overload on the premise of not increasing the occupation of system resources.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a diagram illustrating step S5 according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail and completely with reference to the accompanying drawings. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the detailed description of the embodiments of the present invention provided below is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention.
In the description of the present invention, it is to be understood that the terms indicating an orientation or positional relationship are based on the orientation or positional relationship shown in the drawings only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the drawings of the present invention, it should be understood that different technical features which are not mutually substituted are shown in the same drawing only for the convenience of simplifying the drawing description and reducing the number of drawings, and the embodiment described with reference to the drawings does not indicate or imply that all the technical features in the drawings are included, and thus the present invention is not to be construed as being limited thereto.
The present invention will be described in detail below.
An intelligent sensing method for heat source overload of a skin array unit specifically comprises the following steps:
step S1: inputting the temperature design boundary required by the system to the array unit and the allowable upper temperature limit T of the input unitmaxVibration array boundary geometry
Figure GDA0003555241250000051
And a temperature T;
step S2: dividing the array unit into sub-arrays, collecting temperature data of the emitting unit by using a temperature collecting system, and calculating equivalent temperature T of the sub-arraysj；
Utilize temperature acquisition system to carry out temperature data acquisition to the transmitting element, specifically refer to:
reporting the temperature measurement value to a control system, dividing according to the geometric boundary of the system, performing topological mapping, reading the boundary temperature of the system and storing data; and meanwhile, the temperature-saving data is stored.
Calculating equivalent temperature T of subarrayjSpecifically, the method comprises the following steps:
the method comprises the following steps of (1) dividing the boundary of the subsystem into determined sub-arrays according to the arrays, and calculating the equivalent temperature value of the sub-arrays, wherein the method comprises the following steps:
for the jth sub-array, assume that there are numj chip units,
Figure GDA0003555241250000061
Figure GDA0003555241250000062
Tjis the equivalent temperature value of the jth sub-array.
Step S3: according to the sub-array division, performing data expansion on the time domain on the sub-array equivalent temperature value to obtain the jth sub-array temperature vector
Figure GDA0003555241250000063
Storing the equivalent values of a plurality of sub-arrays in an array form;
performing data expansion on a time domain on the subarray equivalent temperature value, specifically:
according to the sub-array division, for the jth sub-array, different time and each equivalent temperature value are different, and the system temperature sampling period is assumed to be t0Setting the time domain spreading width to nt0Performing data expansion in time domain to form jth sub-array temperature vector
Figure GDA0003555241250000064
Information about temperature changes with time in the form of discrete point recordings.
Step S4: searching direction of overload unit to determine direction vector of overload heat source
Figure GDA0003555241250000065
The method specifically comprises the following steps:
recording different subarray temperatures T by the same timej；
Recording the temperature difference change of the same subarray at different moments
Figure GDA0003555241250000066
Figure GDA0003555241250000067
Wherein the content of the first and second substances,
k is the k-th time interval;
n is the nth time interval;
Figure GDA0003555241250000068
is the temperature of the subarray representing the kth time interval;
Figure GDA0003555241250000071
is the temperature of the subarray representing the nth time interval;
determining overloaded heat source direction vector
Figure GDA0003555241250000072
Step S5: determining a plurality of direction vectors of the overload heat source, determining the geometric spatial position of the overload heat source in a cross positioning mode, and obtaining a determined subarray through convergence; the method specifically comprises the following steps:
the array elements are divided into m sub-arrays, and at time t,
Figure GDA0003555241250000073
Figure GDA0003555241250000074
wherein, Delta TminThe minimum value of the temperature difference change of the same subarray is obtained;
ΔTmaxthe maximum value of the temperature difference change of the same subarray is obtained;
as shown in fig. 2, for a maximum value Δ TmaxMinimum value Δ TminRespectively corresponding to two corresponding sub-arrays A1、B1And is marked as A at the next moment2、B2The vectors are respectively noted as
Figure GDA0003555241250000075
Obtaining a preliminary overload subarray;
and calculating based on different time widths, and iteratively solving until convergence to obtain a determined subarray.
Step S6: an array unit switch topology is provided to a system control center to prevent overload damage.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.

Claims (5)

1. An intelligent sensing method for heat source overload of a skin array unit is characterized by comprising the following steps:
step S1: inputting the temperature design boundary required by the system to the array unit and the allowable upper temperature limit T of the input unitmaxVibration array boundary geometry
Figure FDA0003555241240000011
And a temperature T;
step S2: dividing the array unit into sub-arrays, collecting temperature data of the emitting unit by using a temperature collecting system, and calculating equivalent temperature T of the sub-arraysj；
Calculating the subarray equivalent temperature value T in the step S2jSpecifically, the method comprises the following steps:
the method comprises the following steps of (1) dividing the boundary of the subsystem into determined sub-arrays according to the arrays, and calculating the equivalent temperature value of the sub-arrays, wherein the method comprises the following steps:
for the jth sub-array, assume commonnumThe number of the chip units is j,
Figure FDA0003555241240000012
Figure FDA0003555241240000013
Tjthe equivalent temperature value of the jth sub-array;
step S3: according to the sub-array division, performing data expansion on the time domain on the sub-array equivalent temperature value to obtain the jth sub-array temperature vector
Figure FDA0003555241240000014
Storing the equivalent values of the plurality of sub-arrays;
step S4: searching direction of overload unit to determine direction vector of overload heat source
Figure FDA0003555241240000015
Step S5: determining a plurality of direction vectors of the overload heat source, determining the geometric spatial position of the overload heat source in a cross positioning mode, and obtaining a determined subarray through convergence;
the step S5 specifically includes:
the array elements are divided into m sub-arrays, and at time t,
Figure FDA0003555241240000016
Figure FDA0003555241240000017
wherein, Delta TminThe minimum value of the temperature difference change of the same subarray is obtained;
ΔTmaxthe maximum value of the temperature difference change of the same subarray is obtained;
for a maximum value Δ TmaxMinimum value Δ TminRespectively corresponding to two corresponding sub-arrays A1、B1And is marked as A at the next moment2、B2The vectors are respectively noted as
Figure FDA0003555241240000021
Obtaining a preliminary overload subarray;
calculating based on different time widths, and iteratively solving until convergence to obtain a determined subarray;
step S6: an array unit switch topology is provided to a system control center to prevent overload damage.
2. The intelligent sensing method for the overload of the heat source of the skin array unit according to claim 1, wherein in the step S2, a temperature acquisition system is used for acquiring temperature data of the transmitting unit, specifically:
reporting the temperature measurement value to a control system, dividing according to the geometric boundary of the system, performing topological mapping, reading the boundary temperature of the system and storing data; and meanwhile, the temperature-saving data is stored.
3. The method for intelligently sensing the heat source overload of the skin array unit according to claim 2, wherein in the step S3, the time-domain data expansion is performed on the subarray equivalent temperature value, specifically:
according to the sub-array division, for the jth sub-array, different time and each equivalent temperature value are different, and the system temperature sampling period is assumed to be t0Setting the time domain spreading width to nt0Performing data expansion in time domain to form jth sub-array temperature vector
Figure FDA0003555241240000022
Information about temperature changes with time in the form of discrete point recordings.
4. The method for intelligently sensing the heat source overload of the skin array unit according to claim 3, wherein the step S4 specifically includes:
recording different subarray temperatures T by the same timej；
Recording the temperature difference change of the same subarray at different moments
Figure FDA0003555241240000023
Wherein the content of the first and second substances,
k is the k-th time interval;
n is the nth time interval;
Figure FDA0003555241240000031
is the temperature of the subarray representing the kth time interval;
Figure FDA0003555241240000032
is the temperature of the subarray representing the nth time interval;
determining overloaded heat source direction vector
Figure FDA0003555241240000033
5. The method for intelligently sensing the heat source overload of the skin array unit according to any one of claims 1 to 4, wherein the equivalent values of a plurality of sub-arrays are stored in an array mode.
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