CN113122894A - Tinned copper wire of 5G signal data power cable - Google Patents
Tinned copper wire of 5G signal data power cable Download PDFInfo
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- CN113122894A CN113122894A CN202110411452.9A CN202110411452A CN113122894A CN 113122894 A CN113122894 A CN 113122894A CN 202110411452 A CN202110411452 A CN 202110411452A CN 113122894 A CN113122894 A CN 113122894A
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- copper wire
- treatment
- electroplating
- signal data
- power cable
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a tinned copper wire of a 5G signal data power cable, which comprises a copper wire and electroplating solution, wherein the copper wire is subjected to electroplating treatment through the electroplating solution, and the copper wire is treated by a surface treatment process before electroplating, and the specific operation method comprises the following steps: the method comprises the following steps: firstly carrying out thermalization treatment on a copper wire, wherein the conditions of the thermalization treatment are as follows: the copper wire is placed in a thermalization furnace for primary heat treatment, the temperature of the primary heat treatment is 210-250 ℃, and the time of the primary heat treatment is 20-30 min. According to the invention, the homogenization effect of the copper wire is improved by carrying out thermalization treatment on the copper wire, subsequent plasma treatment and sparse agent treatment are facilitated, the treatment effect can be improved, the surface activity of the copper wire can be improved by plasma treatment, the sparsity of the surface structure of the copper wire can be enhanced after sparse agent treatment, the outer layer structure of the copper wire is loose, and meanwhile, the activity energy of the surface of the copper wire can be further improved by the activating solution.
Description
Technical Field
The invention relates to the technical field of 5G signal data, in particular to a tinned copper wire of a 5G signal data power cable.
Background
At present, the domestic power supply cable is used more and more, and the cable is electrically connected and transmits signals between devices, assemblies and between systems and is a necessary basic element for forming a complete system; the tinned copper wire is mainly used for conducting wire cores of rubber-insulated mining cables, flexible wires, flexible cables, boat cables and the like, and free sulfur precipitated from rubber can be prevented from chemically reacting with copper after tinning of the copper wire. The solderability of the lead can be improved after tinning, and the phenomena of insufficient soldering and false soldering during soldering are avoided; when the tinned copper wire is used as a bare wire, the tinned copper wire has the function of protecting the copper wire from being oxidized.
The existing copper wire is electroplated in an electroplating mode, the electroplating process is simple, and further improvement is needed to improve the electroplating efficiency.
Disclosure of Invention
The invention aims to provide a tinned copper wire of a 5G signal data power cable, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention discloses a tinned copper wire of a 5G signal data power cable, which comprises a copper wire and electroplating solution, wherein the copper wire is subjected to electroplating treatment through the electroplating solution, and the copper wire is treated by a surface treatment process before electroplating, and the specific operation method comprises the following steps:
the method comprises the following steps: firstly carrying out thermalization treatment on a copper wire, wherein the conditions of the thermalization treatment are as follows: placing the copper wire in a thermalization furnace for primary heat treatment, wherein the temperature of the primary heat treatment is 210 ℃ and 250 ℃, and the time of the primary heat treatment is 20-30 min;
step two: then raising the reaction temperature to 380-400 ℃ at the speed of 1-5 ℃/min, continuing to preserve heat for 10-20min, and then annealing to room temperature after the heat preservation is finished;
step three: feeding the copper wire into a plasma box for bombardment treatment, and soaking in a thinning agent at 55-65 ℃ for 10-20 min;
step four: and (3) sending the copper wire into the activating solution, reacting for 45-55min at the reaction temperature of 45-55 ℃, finishing the reaction, then carrying out current treatment, taking out, washing and drying after the treatment is finished.
Preferably, the processing power in the plasma chamber is 100-500W, and the processing time is 10-20 min.
Preferably, the preparation method of the thinning agent comprises the following steps: adding 30-40 parts of sodium methallyl sulfonate into 50-60 parts of sodium citrate, then adding hydrochloric acid to adjust the pH value, then adding 2-8 parts of ferric chloride, stirring at the rotating speed of 100-200r/min for 20-30min, and obtaining the thinning agent after the stirring is finished.
Preferably, the pH is adjusted to 4.0-5.0 after the addition of the hydrochloric acid.
Preferably, the activating solution is obtained by feeding 5-10 parts of rare earth lanthanum chloride into 10-30 parts of sodium dodecyl sulfate, then adding 2-5 parts of sodium phosphate, stirring at the rotating speed of 50-100r/min for 20-30min, and finishing stirring.
Preferably, the current density of the current treatment is 5-7A/dm2。
Preferably, the current density of the current treatment is 6A/dm2。
Preferably, the specific operation steps of the copper wire electroplating treatment are as follows: adding tin sulfate into sodium molybdate according to the weight ratio of 4:1, then adding ionized montmorillonite, stirring for 10-20min at the stirring speed of 50-100r/min, obtaining electroplating solution after stirring is finished, and then sending a copper wire into the electroplating solution for electroplating treatment, wherein the electroplating current is 1-3A/dm2The electroplating temperature is 30-40 ℃, and the electroplating is finished.
Preferably, the ionized montmorillonite is montmorillonite dispersed in water, then sodium chloride is added for ionization treatment, the voltage of ionization is 160-200V, and the current is 4-6A.
Preferably, the voltage is 180V and the current is 5A.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the homogenization effect of the copper wire is improved by carrying out thermalization treatment on the copper wire, subsequent plasma treatment and sparse agent treatment are facilitated, the treatment effect can be improved, the surface activity of the copper wire can be improved by plasma treatment, the sparsity of the surface structure of the copper wire can be enhanced after the sparse agent treatment, the outer structure of the copper wire is loose, the activity of the surface of the copper wire can be further improved by the activating liquid, electroplating treatment in tin plating is facilitated, the ionized montmorillonite is added into the tin plating liquid, the dispersion of raw materials can be promoted, the bonding strength of the tin plating layer and the copper wire can be enhanced by the ionized montmorillonite, and the treatment effect of the product is improved.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to specific embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the tinned wire of 5G signal data power supply cable of this embodiment, including copper line, plating solution, the copper line carries out electroplating treatment through the plating solution, and the copper line is handled through surface treatment process before electroplating, and specific operating method is:
the method comprises the following steps: firstly carrying out thermalization treatment on a copper wire, wherein the conditions of the thermalization treatment are as follows: placing the copper wire in a thermalization furnace for primary heat treatment, wherein the temperature of the primary heat treatment is 210 ℃, and the time of the primary heat treatment is 20 min;
step two: then raising the reaction temperature to 380 ℃ at the speed of 1 ℃/min, continuing to preserve heat for 10min, finishing the heat preservation, and then annealing to room temperature;
step three: firstly, conveying a copper wire into a plasma box for bombardment treatment, and soaking in a thinning agent at the temperature of 55 ℃ for 10 min;
step four: and (3) sending the copper wire into the activating solution, reacting for 45min at the reaction temperature of 45 ℃, then carrying out current treatment, taking out, washing and drying after the reaction is finished.
The processing power in the plasma chamber of this example was 100W, and the processing time was 10 min.
The preparation method of the thinning agent of the embodiment comprises the following steps: adding 30-part of sodium methallyl sulfonate into 50 parts of sodium citrate, then adding hydrochloric acid to adjust the pH value, then adding 2 parts of ferric chloride, stirring at the rotating speed of 100r/min for 20min, and obtaining the thinning agent after stirring.
After the hydrochloric acid addition of this example, the pH was adjusted to 4.0.
The activating solution of this embodiment is obtained by feeding 5 parts of rare earth lanthanum chloride into 10 parts of sodium dodecyl sulfate, adding 2 parts of sodium phosphate, stirring at a rotation speed of 50r/min for 20min, and stirring.
The current density of the current treatment of this example was 5A/dm2。
The specific operation steps of the copper wire electroplating treatment in the embodiment are as follows: adding tin sulfate into sodium molybdate according to the weight ratio of 4:1, adding ionized montmorillonite, stirring for 10min at the stirring speed of 50r/min to obtain electroplating solution, and feeding copper wire into the electroplating solution for electroplating treatment at the electroplating current of 1A/dm2And the electroplating temperature is 30 ℃, and the electroplating is finished.
The ionized montmorillonite of the embodiment is montmorillonite dispersed in water, and then sodium chloride is added for ionization treatment, wherein the ionization voltage is 160V, and the current is 4A.
Example 2:
the tinned wire of 5G signal data power supply cable of this embodiment, including copper line, plating solution, the copper line carries out electroplating treatment through the plating solution, and the copper line is handled through surface treatment process before electroplating, and specific operating method is:
the method comprises the following steps: firstly carrying out thermalization treatment on a copper wire, wherein the conditions of the thermalization treatment are as follows: placing the copper wire in a thermalization furnace for primary heat treatment, wherein the temperature of the primary heat treatment is 250 ℃, and the time of the primary heat treatment is 30 min;
step two: then, raising the reaction temperature to 400 ℃ at the speed of 5 ℃/min, continuing to preserve heat for 20min, finishing the heat preservation, and then annealing to room temperature;
step three: sending the copper wire into a plasma box for bombardment treatment, and soaking in a thinning agent at 65 ℃ for 20 min;
step four: and (3) sending the copper wire into the activating solution for reaction for 55min at the reaction temperature of 55 ℃, finishing the reaction, then carrying out current treatment, taking out, washing with water and drying.
The processing power in the plasma chamber of this example was 500W, and the processing time was 20 min.
The preparation method of the thinning agent of the embodiment comprises the following steps: adding 40 parts of sodium methallyl sulfonate into 60 parts of sodium citrate, then adding hydrochloric acid to adjust the pH value, then adding 8 parts of ferric chloride, stirring at the rotating speed of 200r/min for 30min, and obtaining the thinning agent after stirring.
After the hydrochloric acid addition of this example, the pH was adjusted to 5.0.
The activating solution of this embodiment is obtained by feeding 10 parts of rare earth lanthanum chloride into 30 parts of sodium dodecyl sulfate, adding 5 parts of sodium phosphate, stirring at a rotation speed of 100r/min for 30min, and stirring.
The current density of the current treatment of this example was 7A/dm2。
The specific operation steps of the copper wire electroplating treatment in the embodiment are as follows: adding tin sulfate into sodium molybdate according to the weight ratio of 4:1, adding ionized montmorillonite, stirring for 20min at the stirring speed of 100r/min to obtain electroplating solution, and feeding copper wire into the electroplating solution for electroplating treatment at the electroplating current of 3A/dm2And the electroplating temperature is 40 ℃, and the electroplating is finished.
The ionized montmorillonite of the embodiment is montmorillonite dispersed in water, and then sodium chloride is added for ionization treatment, wherein the ionization voltage is 200V, and the current is 6A.
The voltage of this embodiment is 180V and the current is 5A.
Example 3:
the tinned wire of 5G signal data power supply cable of this embodiment, including copper line, plating solution, the copper line carries out electroplating treatment through the plating solution, and the copper line is handled through surface treatment process before electroplating, and specific operating method is:
the method comprises the following steps: firstly carrying out thermalization treatment on a copper wire, wherein the conditions of the thermalization treatment are as follows: placing the copper wire in a thermalization furnace for primary heat treatment, wherein the temperature of the primary heat treatment is 230 ℃, and the time of the primary heat treatment is 25 min;
step two: then, the reaction temperature is increased to 390 ℃ at the speed of 3 ℃/min, the temperature is kept for 15min, and the annealing is carried out to the room temperature after the temperature is kept;
step three: sending the copper wire into a plasma box for bombardment treatment, and soaking in a thinning agent at 60 ℃ for 15 min;
step four: and (3) sending the copper wire into the activating solution for reacting for 50min at the reaction temperature of 50 ℃, then carrying out current treatment, taking out, washing and drying after the reaction is finished.
The processing power in the plasma chamber of this example was 300W, and the processing time was 15 min.
The preparation method of the thinning agent of the embodiment comprises the following steps: adding 35 parts of sodium methallyl sulfonate into 55 parts of sodium citrate, then adding hydrochloric acid to adjust the pH value, then adding 5 parts of ferric chloride, stirring at the rotating speed of 150r/min for 25min, and obtaining the thinning agent after stirring.
After the hydrochloric acid addition of this example, the pH was adjusted to 4.5.
In the activating solution of the embodiment, 7.5 parts of rare earth lanthanum chloride is fed into 20 parts of sodium dodecyl sulfate, then 3.5 parts of sodium phosphate is added, the mixture is stirred for 25min at the rotating speed of 75r/min, and the activating solution is obtained after the stirring is finished.
The current density of the current treatment of this example was 6A/dm2。
The specific operation steps of the copper wire electroplating treatment in the embodiment are as follows: adding tin sulfate into sodium molybdate according to the weight ratio of 4:1, adding ionized montmorillonite, stirring for 15min at the stirring speed of 75r/min to obtain electroplating solution, and feeding copper wire into the electroplating solution for electroplating treatment at the electroplating current of 2A/dm2And the electroplating temperature is 35 ℃, and the electroplating is finished.
The ionized montmorillonite of the embodiment is montmorillonite dispersed in water, and then sodium chloride is added for ionization treatment, wherein the ionization voltage is 180V, and the current is 5A.
Comparative example 1:
the materials and preparation process were substantially the same as those of example 3, except that the treatment with the thinning agent was not performed.
The performance test was performed on examples 1 to 3 and comparative example 1, and the adhesion strength (MPa) of the tin-plated layer to the copper wire was obtained.
| Group of | Adhesive Strength (MPa) |
| Example 1 | 16.1 |
| Example 2 | 16.6 |
| Example 3 | 17.3 |
| Comparative example 1 | 13.3 |
The tin-plated layer and the copper wire of the product have the best bonding strength, and the bonding effect can be improved by treatment of the thinning agent, as shown in examples 1-3 and comparative example 1 of the invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The utility model provides a 5G signal data power cable's tinned wire, a serial communication port, including copper line, plating solution, the copper line carries out electroplating treatment through the plating solution, and the copper line is handled through surface treatment process before electroplating, and specific operating method is:
the method comprises the following steps: firstly carrying out thermalization treatment on a copper wire, wherein the conditions of the thermalization treatment are as follows: placing the copper wire in a thermalization furnace for primary heat treatment, wherein the temperature of the primary heat treatment is 210 ℃ and 250 ℃, and the time of the primary heat treatment is 20-30 min;
step two: then raising the reaction temperature to 380-400 ℃ at the speed of 1-5 ℃/min, continuing to preserve heat for 10-20min, and then annealing to room temperature after the heat preservation is finished;
step three: feeding the copper wire into a plasma box for bombardment treatment, and soaking in a thinning agent at 55-65 ℃ for 10-20 min;
step four: and (3) sending the copper wire into the activating solution, reacting for 45-55min at the reaction temperature of 45-55 ℃, finishing the reaction, then carrying out current treatment, taking out, washing and drying after the treatment is finished.
2. The tinned copper wire of a 5G signal data power cable of claim 1, wherein the processing power in the plasma chamber is 100- & 500W, and the processing time is 10-20 min.
3. The tinned copper wire of a 5G signal data power cable according to claim 1, wherein the preparation method of the thinning agent is as follows: adding 30-40 parts of sodium methallyl sulfonate into 50-60 parts of sodium citrate, then adding hydrochloric acid to adjust the pH value, then adding 2-8 parts of ferric chloride, stirring at the rotating speed of 100-200r/min for 20-30min, and obtaining the thinning agent after the stirring is finished.
4. The tinned copper wire of a 5G signal data power cable according to claim 3, wherein the pH is adjusted to 4.0-5.0 after the hydrochloric acid is added.
5. The tinned copper wire of a 5G signal data power cable according to claim 1, wherein the activating solution is prepared by adding 5-10 parts of rare earth lanthanum chloride into 10-30 parts of sodium dodecyl sulfate, adding 2-5 parts of sodium phosphate, stirring at a speed of 50-100r/min for 20-30min, and stirring.
6. The tinned copper wire of 5G signal data power cable of claim 1, characterized in that the current density of the current treatment is 5-7A/dm2。
7. The tinned copper wire of 5G signal data power cable of claim 6, characterized in that the current density of the current treatment is 6A/dm2。
8. The tinned copper wire of a 5G signal data power cable according to claim 1, characterized in that the specific operation steps of the copper wire electroplating treatment are as follows: adding tin sulfate into sodium molybdate according to the weight ratio of 4:1, then adding ionized montmorillonite, stirring for 10-20min at the stirring speed of 50-100r/min, obtaining electroplating solution after stirring is finished, and then sending a copper wire into the electroplating solution for electroplating treatment, wherein the electroplating current is 1-3A/dm2The electroplating temperature is 30-40 ℃, and the electroplating is finished.
9. The tinned copper wire of a 5G signal data power cable of claim 8, wherein the ionized montmorillonite is montmorillonite dispersed in water, and then sodium chloride is added to carry out ionization treatment, the voltage of ionization is 160-200V, and the current is 4-6A.
10. The tinned copper wire of a 5G signal data power cable of claim 9, characterized in that the voltage is 180V and the current is 5A.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110411452.9A CN113122894B (en) | 2021-04-16 | 2021-04-16 | Tinned copper wire of 5G signal data power cable |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110411452.9A CN113122894B (en) | 2021-04-16 | 2021-04-16 | Tinned copper wire of 5G signal data power cable |
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| CN113122894B CN113122894B (en) | 2022-05-20 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103160893A (en) * | 2011-12-18 | 2013-06-19 | 蔡成俊 | Steel wire copper plating process |
| CN103184492A (en) * | 2011-12-31 | 2013-07-03 | 赵春美 | Copper plating method |
| CN103388165A (en) * | 2012-05-10 | 2013-11-13 | 浙江正导光电股份有限公司 | Method for coating surface of copper wire with tin and a tin-coated copper wire prepared by method |
| CN111197176A (en) * | 2019-12-30 | 2020-05-26 | 中国科学院青海盐湖研究所 | Electrochemical treatment method of copper foil and composite copper foil material |
| CN111850637A (en) * | 2020-07-15 | 2020-10-30 | 杭州科技职业技术学院 | Tin electroplating process for alloy surface of lead frame |
-
2021
- 2021-04-16 CN CN202110411452.9A patent/CN113122894B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103160893A (en) * | 2011-12-18 | 2013-06-19 | 蔡成俊 | Steel wire copper plating process |
| CN103184492A (en) * | 2011-12-31 | 2013-07-03 | 赵春美 | Copper plating method |
| CN103388165A (en) * | 2012-05-10 | 2013-11-13 | 浙江正导光电股份有限公司 | Method for coating surface of copper wire with tin and a tin-coated copper wire prepared by method |
| CN111197176A (en) * | 2019-12-30 | 2020-05-26 | 中国科学院青海盐湖研究所 | Electrochemical treatment method of copper foil and composite copper foil material |
| CN111850637A (en) * | 2020-07-15 | 2020-10-30 | 杭州科技职业技术学院 | Tin electroplating process for alloy surface of lead frame |
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