CN113122005A - High-dielectric-constant silica gel and preparation method thereof - Google Patents
High-dielectric-constant silica gel and preparation method thereof Download PDFInfo
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- CN113122005A CN113122005A CN202110550125.1A CN202110550125A CN113122005A CN 113122005 A CN113122005 A CN 113122005A CN 202110550125 A CN202110550125 A CN 202110550125A CN 113122005 A CN113122005 A CN 113122005A
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- high dielectric
- silicone oil
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 239000000741 silica gel Substances 0.000 title claims abstract description 21
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title description 4
- 229920002545 silicone oil Polymers 0.000 claims abstract description 16
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 9
- 239000001257 hydrogen Substances 0.000 claims abstract description 9
- -1 maleic acid ester Chemical class 0.000 claims abstract description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 7
- 229910002113 barium titanate Inorganic materials 0.000 claims abstract description 7
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 7
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011976 maleic acid Substances 0.000 claims abstract description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 5
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004480 active ingredient Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 14
- 239000003989 dielectric material Substances 0.000 description 12
- 239000003292 glue Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910002796 Si–Al Inorganic materials 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 241000907903 Shorea Species 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910003471 inorganic composite material Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/05—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Insulating Materials (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
The invention discloses a high dielectric constant silica gel, which comprises the following raw materials in parts by weight: 10 to 20 percent of vinyl silicone oil, 0.4 to 1 percent of hydrogen-containing silicone oil, 0.03 to 0.1 percent of chloroplatinic acid, 0.03 to 0.08 percent of maleic acid ester, 0.1 to 1 percent of silane coupling agent, 1 to 10 percent of ferrum-silicon-aluminum and 70 to 90 percent of barium titanate. Compared with the prior art, the invention can obtain a flexible material (the thickness of a product test block is 1mm) with the dielectric constant more than 10, the tensile strength more than 1mpa and the heat conduction more than 2w, and the obtained dielectric constant silica gel gasket has high dielectric property, excellent mechanical property and heat dissipation performance, convenient mass production, convenient operation and manufacture and simple process.
Description
Technical Field
The invention belongs to the field of chemical industry, relates to a silica gel material, and particularly relates to a high-dielectric-constant silica gel.
Background
Dielectric materials, also known as dielectrics, are electrical insulators. Dielectric materials can be used to control/store charge and electrical energy, and are of great strategic importance in modern electronic and power systems. The research on dielectric materials began initially with inorganic piezoelectric ceramic materials, which have high dielectric constants and high thermoelectric stabilities, but are brittle and have high processing temperatures. With the rapid development of the information and microelectronic industries, the requirements for dielectric materials are higher and higher, that is, the dielectric materials have excellent dielectric properties and good mechanical properties and processability. Therefore, a single inorganic dielectric material has not been able to satisfy the above requirements. The inorganic composite material with high dielectric property and excellent mechanical property has remarkable prospect.
Disclosure of Invention
In order to solve the technical problems, the invention provides a high-dielectric-constant silica gel, which solves the problems of high brittleness, high processing temperature, poor mechanical property, high mass production difficulty and the like of the conventional dielectric material.
A high dielectric constant silica gel comprises the following raw materials in parts by weight: 10 to 20 percent of vinyl silicone oil, 0.4 to 1 percent of hydrogen-containing silicone oil, 0.03 to 0.1 percent of chloroplatinic acid, 0.03 to 0.08 percent of maleic acid ester, 0.1 to 1 percent of silane coupling agent, 1 to 10 percent of ferrum-silicon-aluminum and 70 to 90 percent of barium titanate.
Preferably, the viscosity of the vinyl silicone oil is 200-. The glue base material can provide different mechanical properties according to different viscosities and structural collocation.
Preferably, the hydrogen content of the hydrogen-containing silicone oil is 0.1-0.36%. The glue reacts with the cross-linking agent to provide hardness and strength to the product.
Preferably, the content of the active ingredient of the chloroplatinic acid is 200ppm to 5000 ppm. And glue reaction catalyst is used for regulating and controlling glue reaction and time.
Preferably, the content of the effective components of the maleic ester is 1.5% -5%. And the glue reaction inhibitor inhibits the activity of the catalyst so as to regulate and control the curing time.
Preferably, the silane coupling agent is selected from one or more of dodecyl alkane and hexadecyl alkane. Improve the combination between the glue and the organic filler, and increase the filling proportion and the mechanical property of the product.
Preferably, the particle size of the sendust is D50:20-50 microns. Providing dielectric and thermal conductivity properties.
Preferably, the particle size of the barium titanate is D50:1-5 microns. Providing dielectric and thermal conductivity properties.
The preparation method of the silica gel with high dielectric constant specifically comprises the following operations:
(1) putting vinyl silicone oil, hydrogen-containing silicone oil, maleic acid ester and a silane coupling agent into a stirring cylinder, stirring and vacuumizing at the rotating speed of 40r/min, and stirring for 30 min;
(2) adding Fe-Si-Al into the mixture obtained in the step (1), stirring and vacuumizing at the rotating speed of 50r/min for 30 min;
(3) adding barium titanate into the mixture obtained in the step (2), stirring and vacuumizing at the rotating speed of 60r/min for 30 min;
(4) adding chloroplatinic acid into the mixture obtained in the step (3), stirring and vacuumizing at the rotating speed of 30r/min, and stirring for 20 min;
(5) and finally, putting the stirred slurry into calendaring equipment, pressing into sheets, baking at a high temperature (baking temperature of 120 ℃) for forming, and rolling to obtain the high dielectric constant silica gel gasket.
Compared with the traditional method, the invention adopts a new formula, adopts powder with different particle sizes and matching with silicone oil on the premise of a certain proportion of high dielectric material, mixes the powder with different particle sizes and matching with silicone oil according to different proportions and processes, and then carries out high-temperature crosslinking vulcanization to obtain a flexible material (the thickness of a product test block is 1mm) with the dielectric constant of more than 10, the tensile strength of more than 1mpa and the heat conduction of more than 2 w.
Drawings
FIG. 1 is a schematic diagram of a high dielectric constant silica gel product according to the present invention.
Detailed Description
The present invention will be further specifically described with reference to the drawings and examples.
The preparation method of the high dielectric constant silica gel provided by the invention specifically comprises the following steps (the used raw materials of each example are shown in table 1):
(1) putting vinyl silicone oil, hydrogen-containing silicone oil, maleic acid ester and a silane coupling agent into a stirring cylinder, stirring and vacuumizing at the rotating speed of 40r/min, and stirring for 30 min;
(2) adding Fe-Si-Al into the mixture obtained in the step (1), stirring and vacuumizing at the rotating speed of 50r/min for 30 min;
(3) adding barium titanate into the mixture obtained in the step (2), stirring and vacuumizing at the rotating speed of 60r/min for 30 min;
(4) adding chloroplatinic acid into the mixture obtained in the step (3), stirring and vacuumizing at the rotating speed of 30r/min, and stirring for 20 min;
(5) and finally, putting the stirred slurry into calendaring equipment to be pressed into sheets, baking at a high temperature (baking temperature of 120 ℃) for forming and rolling to obtain the high dielectric constant silica gel gasket provided by the invention, as shown in figure 1.
TABLE 1
The product test block is tested when the thickness is 1 mm:
the dielectric material obtained in example 1 has the following properties: hardness shore 0070, dielectric constant (100hz)11, tensile strength 0.7mpa, elongation at break > 200%, and thermal conductivity 2.5 w;
the performance of the dielectric material obtained in example 2: hardness shoreA 40, dielectric constant (100hz)12, tensile strength 2mpa, elongation at break more than 400 percent and heat conduction 2 w;
the performance of the dielectric material obtained in example 3: hardness shore 0080, dielectric constant (100hz)20, tensile strength 0.5mpa, elongation at break > 150%, and thermal conductivity 3 w.
Claims (8)
1. The high dielectric constant silica gel is characterized by comprising the following raw materials in parts by weight: 10 to 20 percent of vinyl silicone oil, 0.4 to 1 percent of hydrogen-containing silicone oil, 0.03 to 0.1 percent of chloroplatinic acid, 0.03 to 0.08 percent of maleic acid ester, 0.1 to 1 percent of silane coupling agent, 1 to 10 percent of ferrum-silicon-aluminum and 70 to 90 percent of barium titanate.
2. The silica gel with high dielectric constant as claimed in claim 1, wherein the viscosity of the vinyl silicone oil is 200-.
3. The high dielectric constant silica gel of claim 1, wherein: the hydrogen content of the hydrogen-containing silicone oil is 0.1-0.36%.
4. The high dielectric constant silica gel of claim 1, wherein: the content of the active ingredient of the chloroplatinic acid is 200ppm-5000 ppm.
5. The high dielectric constant silica gel of claim 1, wherein: the content of the effective component of the maleic ester is 1.5% -5%.
6. The high dielectric constant silica gel of claim 1, wherein: the silane coupling agent is selected from one or more of dodecyl alkane and hexadecyl alkane.
7. The high dielectric constant silica gel of claim 1, wherein: the grain size of the ferro-silicon-aluminum is D50:20-50 microns.
8. The high dielectric constant silica gel of claim 1, wherein: the particle size of the barium titanate is D50:1-5 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110550125.1A CN113122005A (en) | 2021-05-20 | 2021-05-20 | High-dielectric-constant silica gel and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110550125.1A CN113122005A (en) | 2021-05-20 | 2021-05-20 | High-dielectric-constant silica gel and preparation method thereof |
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| Publication Number | Publication Date |
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| CN113122005A true CN113122005A (en) | 2021-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110550125.1A Pending CN113122005A (en) | 2021-05-20 | 2021-05-20 | High-dielectric-constant silica gel and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116376252A (en) * | 2023-05-19 | 2023-07-04 | 西南科技大学 | High-dielectric polylactic acid composite material for 3D printing and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336793A (en) * | 2000-04-10 | 2002-02-20 | 株式会社日立制作所 | Electromagnetic wave absorber, its mfg. method, and articles equipped with said absorber |
| CN101575451A (en) * | 2008-11-12 | 2009-11-11 | 广东标美硅氟精细化工研究所有限公司 | High dielectric constant silastic used for electric stress control and preparation method and application thereof |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN107057370A (en) * | 2017-05-18 | 2017-08-18 | 平湖阿莱德实业有限公司 | A kind of high heat conduction calking boundary material and preparation method thereof |
-
2021
- 2021-05-20 CN CN202110550125.1A patent/CN113122005A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336793A (en) * | 2000-04-10 | 2002-02-20 | 株式会社日立制作所 | Electromagnetic wave absorber, its mfg. method, and articles equipped with said absorber |
| CN101575451A (en) * | 2008-11-12 | 2009-11-11 | 广东标美硅氟精细化工研究所有限公司 | High dielectric constant silastic used for electric stress control and preparation method and application thereof |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN107057370A (en) * | 2017-05-18 | 2017-08-18 | 平湖阿莱德实业有限公司 | A kind of high heat conduction calking boundary material and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116376252A (en) * | 2023-05-19 | 2023-07-04 | 西南科技大学 | High-dielectric polylactic acid composite material for 3D printing and preparation method thereof |
| CN116376252B (en) * | 2023-05-19 | 2024-04-26 | 西南科技大学 | High-dielectric polylactic acid composite material for 3D printing and preparation method thereof |
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Application publication date: 20210716 |
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