CN113114824A - Electronic device - Google Patents
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- Publication number
- CN113114824A CN113114824A CN202110521149.4A CN202110521149A CN113114824A CN 113114824 A CN113114824 A CN 113114824A CN 202110521149 A CN202110521149 A CN 202110521149A CN 113114824 A CN113114824 A CN 113114824A
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- cavity
- circuit board
- hole
- acoustic device
- frame body
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Telephone Set Structure (AREA)
Abstract
The application provides an electronic equipment belongs to electronic product technical field, an electronic equipment includes: the acoustic device comprises a frame body, an acoustic device, a first circuit board and a first support, wherein the first circuit board comprises a first through hole and a second through hole which are arranged at intervals; the frame body, the first circuit board and the first support are sequentially stacked, a first cavity is formed by enclosing between the frame body and the first circuit board, a second cavity and a third cavity are formed between the first support and the first circuit board at intervals, the first through hole is communicated with the first cavity and the second cavity, and the second through hole is communicated with the first cavity and the third cavity; the frame body is provided with a first mounting hole, the acoustic device is arranged in the first mounting hole and is in sealing connection with the first mounting hole, and the first cavity, the second cavity and the third cavity form a rear cavity of the acoustic device.
Description
Technical Field
The application relates to the technical field of electronic products, in particular to an electronic device.
Background
Existing electronic devices are generally provided with acoustic devices such as a speaker, a receiver, a microphone, and the like inside. An acoustic device disposed inside an electronic apparatus generally includes a front chamber communicating with the outside and a rear chamber located inside the electronic apparatus.
With the development of electronic devices towards the direction of light and thin, the installation space inside the electronic devices will be gradually reduced, and then the spatial positions between the components installed inside the electronic devices will be more and more compact. This tends to cause the volume of the back volume of the acoustic device to be compressed, which in turn causes the low frequency effect of the acoustic device to be poor. Therefore, the existing electronic equipment has the problem that the back cavity of the acoustic device is small in volume.
Disclosure of Invention
The application provides an electronic equipment, can alleviate current electronic equipment and have the less problem of back cavity volume of acoustic device.
In order to solve the above technical problem, an embodiment of the present application provides an electronic device, including: the acoustic device comprises a frame body, an acoustic device, a first circuit board and a first support, wherein the first circuit board comprises a first through hole and a second through hole which are arranged at intervals;
the frame body, the first circuit board and the first support are sequentially stacked, a first cavity is formed by enclosing between the frame body and the first circuit board, a second cavity and a third cavity are formed between the first support and the first circuit board at intervals, the first through hole is communicated with the first cavity and the second cavity, and the second through hole is communicated with the first cavity and the third cavity;
the frame body is provided with a first mounting hole, the acoustic device is arranged in the first mounting hole and is in sealing connection with the first mounting hole, and the first cavity, the second cavity and the third cavity form a rear cavity of the acoustic device.
In the embodiment of the application, the first cavity is formed between the frame body and the first circuit board, the second cavity and the third cavity are formed between the first circuit board and the first support, and meanwhile, the first through hole and the second through hole are formed in the first circuit board, so that the first cavity, the second cavity and the third cavity are communicated, the first cavity, the second cavity and the third cavity jointly form the rear cavity of the acoustic device, and the rear cavity volume of the acoustic device can be effectively increased.
Drawings
Fig. 1 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application;
fig. 2 is one of exploded structural views of an electronic device provided in an embodiment of the present application;
fig. 3 is a second exploded view of the electronic device according to the embodiment of the present disclosure;
FIG. 4 is an exploded view of the first carrier and the second annular seal;
fig. 5 is a second schematic cross-sectional view of an electronic device according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;
fig. 7 is a frequency response diagram of an acoustic device.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.
Referring to fig. 1, an electronic device provided in an embodiment of the present application includes: the acoustic device comprises a frame body 100, an acoustic device 200, a first circuit board 300 and a first support 400, wherein the first circuit board 300 comprises a first through hole 301 and a second through hole 302 which are arranged at intervals;
the frame body 100, the first circuit board 300 and the first support 400 are sequentially stacked, a first cavity 101 is formed by enclosing the frame body 100 and the first circuit board 300, a second cavity 102 and a third cavity 103 are formed between the first support 400 and the first circuit board 300 at intervals, the first through hole 301 is communicated with the first cavity 101 and the second cavity 102, and the second through hole 302 is communicated with the first cavity 101 and the third cavity 103;
the frame 100 is provided with a first mounting hole 104, the acoustic device 200 is disposed in the first mounting hole 104, the acoustic device 200 is hermetically connected to the first mounting hole 104, and the first cavity 101, the second cavity 102, and the third cavity 103 form a rear cavity of the acoustic device 200.
Specifically, referring to fig. 1, the frame body 100 may refer to a middle frame of an electronic device, the first circuit board 300 may be a main board of the electronic device, and accordingly, the supporting member may be a main board bracket of the electronic device, and the first bracket 400 is used to support the first circuit board 300. Specifically, the first circuit board 300 is fixed between the frame body 100 and the first bracket 400.
The first cavity 101 may be a cavity defined by a groove on a side of the frame 100 facing the first circuit board 300 and the first circuit board 300. Accordingly, the second cavity 102 may also be a cavity formed by the first circuit board 300 and a groove on the side of the first bracket 400 facing the first circuit board 300. The third cavity 103 may be a cavity formed by the first circuit board 300 and a groove on the side of the first bracket 400 facing the first circuit board 300. In addition, referring to fig. 1, the third cavity 103 may also be a structural member disposed between the first circuit board 300 and the supporting plate, and is a cavity enclosed by the first circuit board 300.
It is understood that the rear cavity formed by the first cavity 101, the second cavity 102 and the third cavity 103 may be a closed cavity, so that the rear cavity of the acoustic device 200 may be relatively separated from the rear cover 900 of the electronic device, thereby avoiding the problem of vibration of the rear cover 900 of the electronic device caused by the audio output of the acoustic device 200.
Further, the above-mentioned acoustic device 200 may be an acoustic device 200 commonly found in electronic equipment, and for example, may be a speaker, a receiver, a microphone, and the like. The structure of the electronic device provided in the present application is further explained below by taking the acoustic device 200 as a speaker as an example.
Referring to fig. 1 and fig. 3, the first mounting hole 104 may be opened on a cavity wall of the first cavity 101, so that when the acoustic device 200 is mounted in the first mounting hole 104, the sound outlet surface of the acoustic device 200 is located on a side opposite to the first cavity 101, so that the first cavity 101, the second cavity 102, and the third cavity 103 together form a rear cavity of the acoustic device 200.
In this embodiment, the first cavity 101 is formed between the frame 100 and the first circuit board 300, the second cavity 102 and the third cavity 103 are formed between the first circuit board 300 and the first support 400, and meanwhile, the first through hole 301 and the second through hole 302 are formed in the first circuit board 300, so that the first cavity 101, the second cavity 102 and the third cavity 103 are communicated, and the first cavity 101, the second cavity 102 and the third cavity 103 jointly form a rear cavity of the acoustic device 200, thereby effectively increasing the volume of the rear cavity of the acoustic device 200.
Optionally, the frame body 100 includes a first annular boss 105 protruding toward one side of the first circuit board 300, and the frame body 100, the first annular boss 105 and the first circuit board 300 together enclose the first cavity 101.
Referring to fig. 1 and 3, the first annular projection 105 is provided on the first circuit board 300, so that the inner space of the first annular projection 105 forms a mounting space of the acoustic device 200. The acoustic device 200 may be located in the first cavity 101, and of course, the acoustic device 200 may also be located in both the first cavity 101 and the second cavity 102.
In this embodiment, by providing the first annular boss 105 on the frame body 100, the acoustic device 200 can be conveniently mounted, and the first cavity 101 formed by enclosing the first annular boss 105 and the first circuit board 300 can be used as the rear cavity space of the acoustic device 200, so that the volume of the rear cavity of the acoustic device 200 is effectively increased.
Optionally, the first bracket 400 includes a second annular boss 401 protruding toward a side of the first circuit board 300, and the first bracket 400, the second annular boss 401 and the first circuit board 300 together enclose the second cavity 102.
Specifically, referring to fig. 1 and 4, the end surface of the second annular boss 401 may form a supporting surface of the first bracket 400 for the first circuit board 300, so as to effectively support the first circuit board 300.
In one embodiment of the present application, the second cavity 102 and the third cavity 103 may be relatively separated by the second annular boss 401. Specifically, the first cavity 101 may be an inner region of the first annular boss 105, and the second cavity 102 may be a region outside the first annular boss 105.
In this embodiment, by providing the second annular projection 401 on the side of the first bracket 400 facing the first circuit board 300, the second annular projection 401 can effectively support the first circuit board 300, and at the same time, the second annular projection 401 and the first annular projection 105 can jointly form a mounting space for the acoustic device 200. In addition, the second cavity 102 enclosed between the second annular boss 401 and the first circuit board 300 is used as a back cavity space of the acoustic device 200, so that the back cavity volume of the acoustic device 200 is effectively increased.
Optionally, the electronic device further includes a first component, the first component is located between the first circuit board 300 and the first bracket 400, the first component is located outside the second annular boss 401, and the third cavity 103 is formed by enclosing between the first circuit board 300 and the first component.
Since the second annular boss 401 relatively separates the first bracket 400 from the first circuit board 300, various functional components in an electronic device can be mounted in an area between the first circuit board 300 and the first bracket 400.
Specifically, the first component may be various functional components in the electronic device, for example, a chassis of the first circuit board 300, a periscope, or the like. In this way, when the first component is mounted on the first circuit board 300 and the first bracket 400, due to the structural characteristics of the first component, the third cavity 103 is enclosed between the first circuit board 300 and the first component, where the third cavity 103 may be a functional cavity of the first component, for example, when the first component is a periscope, the third cavity 103 may be a light guide channel of the periscope.
In this embodiment, the second through hole 302 is disposed to communicate the second cavity 102 and the third cavity 103, so that the third cavity 103 can be reused, thereby further increasing the volume of the rear cavity of the acoustic device 200.
Optionally, the first assembly includes a second circuit board 500 and a ring-shaped first adapter plate 600, and the second circuit board 500 is electrically connected with the first circuit board 300 through the first adapter plate 600;
wherein the first circuit board 300, the first adapter board 600 and the second circuit board 500 together enclose to form the third cavity 103.
Specifically, the second circuit board 500 may be a chassis of the first circuit board 300. The connection between the first circuit board 300 and the second circuit board 500 may be achieved by pins of the first transfer board 600. The above-described acoustic device 200 may be electrically connected to one of the first circuit board 300 and the second circuit board 500 through a flexible circuit board.
In this embodiment, the second circuit board 500 is disposed in the electronic device, so that different components in the electronic device can be respectively mounted on the first circuit board 300 and the second circuit board 500, thereby increasing the mounting positions of electrical components in the electronic device and placing more electrical components in the electronic device. Meanwhile, by multiplexing the third cavity 103 formed between the first circuit board 300 and the second circuit board 500, the back cavity volume of the acoustic device 200 can be further increased.
Optionally, the first mounting hole 104 is opposite to the first through hole 301, and a first end of the acoustic device 200 is hermetically connected to the first mounting hole 104, and a second end of the acoustic device 200 penetrates through the first through hole 301 and extends into the second cavity 102;
a gap is formed between the acoustic device 200 and the first through hole 301, and the first cavity 101 and the second cavity 102 communicate through the gap.
Specifically, referring to fig. 1 and fig. 3, in an embodiment of the present application, the first mounting hole 104 is disposed on a wall of the first cavity 101, and the first mounting hole 104 is opposite to the first through hole 301. A first end of the acoustic device 200 is hermetically connected to the first mounting hole 104, a second end of the acoustic device 200 passes through the first through hole 301 and extends to the second cavity 102, a gap is formed between the acoustic device 200 and the first through hole 301, and the first cavity 101 and the second cavity 102 communicate through the gap. In this way, since the acoustic device 200 is disposed through the first circuit board 300, the thickness of the electronic apparatus can be reduced compared to the prior art in which the acoustic device 200 is disposed on the first circuit board 300.
Optionally, the first circuit board 300 includes a first portion located between the first cavity 101 and the second cavity 102, and a second portion located between the first cavity 101 and the third cavity 103;
the first through hole 301 is opened in the first portion to communicate the first cavity 101 and the second cavity 102; the second through hole 302 is opened in the second portion to communicate the first cavity 101 and the third cavity 103.
Specifically, since the second cavity 102 is spaced from the third cavity 103, in this embodiment, the first through hole 301 is disposed at a portion of the first cavity 101 opposite to the second cavity 102, and the through hole is disposed at a portion of the first cavity 101 opposite to the third cavity 103, so that the second cavity 102 can communicate with the third cavity 103 through the first cavity 101, and thus the first cavity 101, the second cavity 102, and the third cavity 103 can jointly form a rear cavity of the acoustic device 200.
Optionally, the electronic device further includes a first annular seal 700, and the first annular boss 105 is connected to the first circuit board 300 through the first annular seal 700 in a sealing manner.
Referring to fig. 2, the shape of the first annular seal 700 may be the same as the shape of the end face of the first annular boss 105, wherein the first annular seal 700 may be a sealing plate supported by a sealing foam.
In specific implementation, the first annular sealing member 700 may be pressed between the first annular boss 105 and the first circuit board 300 under the action of the pressing force between the first annular boss 105 and the first circuit board 300, and the first annular sealing member 700 may be further bonded to the first annular boss 105 and the first circuit board 300, respectively, so as to achieve the sealing of the first cavity 101. Therefore, the problem that the sound wave in the first cavity 101 is transmitted to the rear cover 900 of the electronic device through the gap between the first annular boss 105 and the first circuit board 300 and the rear cover 900 vibrates due to the gap between the first annular boss 105 and the first circuit board 300 is avoided.
Optionally, the electronic device further includes a second annular seal 800, and the second annular boss 401 is connected to the first circuit board 300 through the second annular seal 800 in a sealing manner.
Referring to fig. 2, the shape of the second annular seal 800 may be the same as the shape of the end surface of the second annular boss 401, wherein the second annular seal 800 may be a sealing plate supported by a sealing foam.
In specific implementation, the second annular sealing element 800 may be pressed between the second annular boss 401 and the first circuit board 300 under the action of the pressing force between the second annular boss 401 and the first circuit board 300, and the second annular sealing element 800 may be further bonded to the second annular boss 401 and the first circuit board 300, respectively, so as to achieve the sealing of the second cavity 102. Therefore, the problem that the sound wave in the second cavity 102 is transmitted to the rear cover 900 of the electronic device through the gap between the second annular boss 401 and the first circuit board 300 and the rear cover 900 vibrates due to the gap between the second annular boss 401 and the first circuit board 300 is avoided.
Optionally, the electronic device further includes a rear cover 900 and a display module 1100, the rear cover 900 is located on a side of the first bracket 400 opposite to the first circuit board 300, and the rear cover 900 is attached to the first bracket 400;
the display module 1100 is located on a side of the frame body 100 opposite to the first circuit board 300, a sound guide channel is formed between the display module 1100 and the frame body 100, the sound guide channel is communicated with the first mounting hole 104, and a sound outlet surface of the acoustic device 200 is communicated with the outside through the first mounting hole 104 and the sound guide channel in sequence.
Referring to fig. 1, in this embodiment, the first support 400 separates the rear cover 900 from the rear cavity of the acoustic device 200, so that the problem of vibration of the rear cover 900 caused by sound waves in the rear cavity is avoided. Furthermore, the sound guiding channel may form a front cavity of the acoustic device 200.
Optionally, referring to fig. 2, in an embodiment of the present application, the frame body 100 includes a first mounting groove 106, a second mounting groove 107 and a third mounting groove 108 which are relatively spaced apart, and the second mounting groove 107 is located between the first mounting groove 106 and the third mounting groove 108. The electronic device includes a top speaker, a bottom speaker 1300, and a battery 1200; the acoustic device 200 may be the top speaker; the first circuit board 300 is a main board of the electronic device, the second circuit board 500 is a shelf board of the main board, and the first bracket 400 is a main board bracket. The acoustic device 200, the first circuit board 300, the first bracket 400 and the second circuit board 500 are mounted to the first mounting groove 106, respectively. The second mounting groove 107 forms a battery compartment of the battery 1200, and the battery 1200 is mounted in the second mounting groove 107. The bottom speaker 1300 is disposed in the third mounting groove 108.
The electronic equipment can further comprise a third circuit board, a fourth circuit board and a second support, wherein the third circuit board comprises a third through hole and a fourth through hole which are arranged at intervals; the frame body 100, the third circuit board and the second support are sequentially stacked, a fourth cavity is formed by enclosing between the frame body 100 and the third circuit board, a fifth cavity is formed between the second support and the third circuit board, the fourth circuit board is located between the third circuit board and the second support, the fourth circuit board is electrically connected with the third circuit board through an annular second adapter plate, and a sixth cavity is formed by enclosing between the third circuit board, the second adapter plate and the fourth circuit board. The third through hole is communicated with the fourth cavity and the fifth cavity, and the fourth through hole is communicated with the fourth cavity and the sixth cavity; a second mounting hole is formed in the frame body 100, the bottom speaker 1300 is disposed in the second mounting hole, the bottom speaker 1300 is hermetically connected to the second mounting hole, and the fourth cavity, the fifth cavity and the sixth cavity form a rear cavity of the bottom speaker 1300.
The third circuit board may be a sub-board of the electronic device, and the fourth circuit board may be a chassis of the sub-board.
Fig. 7 is a graph comparing frequency response curves of the acoustic device 200 in the embodiment of the present application and the acoustic device 200 in the prior art, in which a solid line portion is a frequency response curve of the acoustic device 200 in the prior art, and a dashed line portion is a frequency response curve of the acoustic device 200 in the embodiment of the present application. As can be seen from fig. 7, compared with the prior art, the low frequency effect of the acoustic device 200 in the embodiment of the present application is significantly improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling an electronic device (e.g., a mobile phone, a computer, a server, an air conditioner, a vehicle-mounted device or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An electronic device, comprising: the acoustic device comprises a frame body, an acoustic device, a first circuit board and a first support, wherein the first circuit board comprises a first through hole and a second through hole which are arranged at intervals;
the frame body, the first circuit board and the first support are sequentially stacked, a first cavity is formed by enclosing between the frame body and the first circuit board, a second cavity and a third cavity are formed between the first support and the first circuit board at intervals, the first through hole is communicated with the first cavity and the second cavity, and the second through hole is communicated with the first cavity and the third cavity;
the frame body is provided with a first mounting hole, the acoustic device is arranged in the first mounting hole and is in sealing connection with the first mounting hole, and the first cavity, the second cavity and the third cavity form a rear cavity of the acoustic device.
2. The electronic device of claim 1, wherein the frame body comprises a first annular boss protruding toward one side of the first circuit board, and the frame body, the first annular boss and the first circuit board jointly enclose the first cavity.
3. The electronic device of claim 2, wherein the first bracket comprises a second annular boss protruding towards one side of the first circuit board, and the first bracket, the second annular boss and the first circuit board together enclose the second cavity.
4. The electronic device of claim 3, further comprising a first component positioned between the first circuit board and the first bracket and outside the second annular boss, the first circuit board and the first component enclosing a third cavity.
5. The electronic apparatus according to claim 4, wherein the first assembly includes a first relay board in a ring shape and a second circuit board electrically connected to the first circuit board through the first relay board;
the first circuit board, the first adapter plate and the second circuit board jointly enclose to form the third cavity.
6. The electronic device of claim 1, wherein the first mounting hole is opposite to the first through hole, and a first end of the acoustic device is hermetically connected with the first mounting hole, and a second end of the acoustic device penetrates through the first through hole and extends into the second cavity;
a gap is formed between the acoustic device and the first through hole, and the first cavity and the second cavity are communicated through the gap.
7. The electronic device of claim 1, wherein the first circuit board comprises a first portion and a second portion, the first portion being located between the first cavity and the second cavity, the second portion being located between the first cavity and the third cavity;
the first through hole is formed in the first part so as to communicate the first cavity with the second cavity; the second through hole is formed in the second portion to communicate the first cavity with the third cavity.
8. The electronic device of claim 2, further comprising a first annular seal, wherein the first annular boss is sealingly connected to the first circuit board by the first annular seal.
9. The electronic device of claim 3, further comprising a second annular seal, the second annular boss being sealingly connected to the first circuit board by the second annular seal.
10. The electronic equipment according to claim 1, further comprising a rear cover and a display module, wherein the rear cover is located on a side of the first bracket opposite to the first circuit board, and the rear cover is attached to the first bracket;
the display module is located one side of the frame body, back to the first circuit board, a sound guide channel is formed between the display module and the frame body and communicated with the first mounting hole, and a sound outlet surface of the acoustic device is communicated with the outside through the first mounting hole and the sound guide channel in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110521149.4A CN113114824A (en) | 2021-05-13 | 2021-05-13 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110521149.4A CN113114824A (en) | 2021-05-13 | 2021-05-13 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113114824A true CN113114824A (en) | 2021-07-13 |
Family
ID=76722009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110521149.4A Pending CN113114824A (en) | 2021-05-13 | 2021-05-13 | Electronic device |
Country Status (1)
| Country | Link |
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| CN (1) | CN113114824A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023227019A1 (en) * | 2022-05-26 | 2023-11-30 | 维沃移动通信有限公司 | Electronic device |
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| CN112261187A (en) * | 2020-10-23 | 2021-01-22 | 维沃移动通信有限公司 | Electronic device |
| CN112398987A (en) * | 2020-11-18 | 2021-02-23 | 维沃移动通信有限公司 | Electronic device |
| CN112769988A (en) * | 2020-12-31 | 2021-05-07 | Oppo广东移动通信有限公司 | Electronic device |
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| CN103139680A (en) * | 2011-11-28 | 2013-06-05 | 联想(北京)有限公司 | Electronic equipment |
| CN103888866A (en) * | 2012-12-24 | 2014-06-25 | 深圳富泰宏精密工业有限公司 | Portable electronic device provided with loudspeaker assembly |
| CN204795473U (en) * | 2015-07-03 | 2015-11-18 | 上海与德通讯技术有限公司 | Electronic device |
| CN108712695A (en) * | 2018-05-18 | 2018-10-26 | 维沃移动通信有限公司 | The manufacturing method and terminal of a kind of microphone module, printing board PCB |
| CN211830849U (en) * | 2020-05-29 | 2020-10-30 | 维沃移动通信有限公司 | Electronic device |
| CN112261187A (en) * | 2020-10-23 | 2021-01-22 | 维沃移动通信有限公司 | Electronic device |
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| WO2023227019A1 (en) * | 2022-05-26 | 2023-11-30 | 维沃移动通信有限公司 | Electronic device |
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