CN113110723A

CN113110723A - Heat dissipation mechanism and server

Info

Publication number: CN113110723A
Application number: CN202110379156.5A
Authority: CN
Inventors: 徐梦娜; 李宁; 徐江鑫; 黄建新; 倪健斌; 舒彬; 周丽平; 赵黎明; 胡显涛
Original assignee: Zhongke Controllable Information Industry Co Ltd
Current assignee: Zhongke Controllable Information Industry Co Ltd
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2021-07-13

Abstract

The application discloses heat dissipation mechanism and server relates to radiator technical field. The heat dissipation mechanism includes: the wind scooper comprises a first wind channel; the heat conduction pipe component is wound on the outer side wall of the air guide cover and surrounds the first air channel; the base is connected with the heat conduction pipe assembly and arranged at one end of the air guide cover; and the plurality of radiating fins are connected with the heat conduction pipe component and are arranged at one end, far away from the base, of the wind scooper. The application provides a heat dissipation mechanism can have wind-guiding and radiating effect concurrently, and improves the radiating efficiency.

Description

Heat dissipation mechanism and server

Technical Field

The application relates to the technical field of radiators, in particular to a heat dissipation mechanism and a server.

Background

With the development of science and technology towards miniaturization and integration, the heat flux density of electrical elements such as chips in electronic equipment is increasing, and a heat dissipation assembly needs to be arranged in the electronic equipment to dissipate heat of the electrical elements in the equipment.

However, the heat dissipation assembly in the prior art has a single function and occupies a large space, which is not favorable for the integration development of equipment.

Disclosure of Invention

The application provides a heat dissipation mechanism and server, has the effect of heat dissipation and air guide concurrently, and occupation space is less simultaneously.

The present application provides:

a heat dissipation mechanism, comprising:

the wind scooper comprises a first wind channel;

the heat conduction pipe component is wound on the outer side wall of the air guide cover and surrounds the first air channel;

the base is connected with the heat conduction pipe assembly and arranged at one end of the air guide cover; and

the radiating fins are connected with the heat conduction pipe assembly and are arranged at one end, far away from the base, of the air guide cover.

In some possible embodiments, the heat pipe assembly comprises:

the heat conduction pipe is wound on the outer side wall of the air guide cover;

the liquid metal is arranged in the heat conduction pipe; and

and the electromagnetic pump set is used for driving the liquid metal to flow in the heat conduction pipe.

In some possible embodiments, the heat pipe is a closed loop circuit, and the electromagnetic pump set includes a first electromagnetic pump generating a first magnetic field;

the first electromagnetic pump is used for driving the liquid metal to circularly flow in the heat conduction pipe.

In some possible embodiments, the heat pipe comprises two ends, the electromagnetic pump group comprises a first electromagnetic pump generating a first magnetic field and a second electromagnetic pump generating a second magnetic field, the first magnetic field being in a direction opposite to the second magnetic field;

the first electromagnetic pump and the second electromagnetic pump are used for driving the liquid metal to flow back and forth between the two ends of the heat conduction pipe.

In some possible embodiments, the liquid metal includes one or more of a gallium alloy, an indium alloy, a gallium indium alloy, and a gallium indium tin alloy.

In some possible embodiments, the plurality of cooling fins are arranged at intervals, and a second air duct is formed between two adjacent cooling fins and is parallel to the first air duct.

In some possible embodiments, a limiting groove is formed in a side of the base close to the heat pipe assembly, and the side of the heat pipe assembly close to the base is connected to the limiting groove in a limiting manner.

In some possible embodiments, a fool-proof portion is provided on the base for fool-proof connection of the base with the heat generating source.

In some possible embodiments, the heat dissipation mechanism further includes a heat conduction sheet disposed on a side of the base away from the heat conduction pipe assembly.

In addition, the application also provides a server which comprises the heat dissipation mechanism.

The beneficial effect of this application is: the application provides a heat dissipation mechanism and server, and the server includes this heat dissipation mechanism. The heat dissipation mechanism comprises an air guide cover, a heat conduction pipe component, a base and a plurality of heat dissipation fins, wherein the air guide cover comprises a first air channel, and the air guide cover can play a role in guiding air flowing in the server in use. The heat pipe assembly twines in the lateral wall of wind scooper, is about to combine wind pipe assembly and wind scooper, compares and sets up radiator unit in the wind scooper separately sets up among the prior art, and great space can be saved in this application. Meanwhile, the heat conduction pipe assembly surrounds the first air duct, and the first air duct can be prevented from being shielded. The base and the plurality of radiating fins are respectively arranged at two ends of the air guide cover and are connected with the heat conduction pipe assembly to realize heat transfer and heat dissipation.

When in use, the base can be used for absorbing heat of heating sources such as electronic devices and the like, the heat is transferred to the radiating fins through the heat pipe assembly, and then the heat is dissipated into flowing air through the radiating fins. Therefore, the heat can be dissipated outwards at the end far away from the heating source, and the heat is prevented from returning to the position of the heating source again, so that the heat dissipation quality and efficiency can be improved. In the process of heat transfer of the heat pipe assembly, part of heat can be transferred to flowing air in the first air channel through the air guide cover, and the heat dissipation efficiency is improved.

Therefore, the wind scooper is combined with the heat conduction pipe component, the base and the radiating fins to be arranged, the wind scooper can have the functions of wind guiding and heat dissipation, and has high heat dissipation efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

FIG. 1 shows an exploded view of a heat dissipation mechanism;

FIG. 2 is a schematic diagram of a heat dissipation mechanism;

FIG. 3 shows a schematic view of a heat sink configuration;

FIG. 4 shows a schematic view of a partial structure of a heat pipe assembly;

figure 5 shows a schematic view of a partial structure of another heat conductive pipe assembly;

FIG. 6 is a schematic view of a base;

FIG. 7 shows a schematic structural view of another susceptor;

fig. 8 shows a partial structural diagram of a server.

Description of the main element symbols:

100-a heat dissipation mechanism; 10-a heat sink; 11-a card slot; 12-a second air duct; 20-a heat pipe assembly; 21-a heat conducting pipe; 211-a first end portion; 212-a second end; 22-an electromagnetic pump set; 221-a first electromagnetic pump; 222-a second electromagnetic pump; 30-a wind scooper; 31-a first air duct; 40-a base; 41-a limiting groove; 42-fool-proof part; 43-a connecting part; 50-a heat conducting sheet;

200-a heat-generating source; 300-a chassis; 400-radiator fan.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

The mainstream heat dissipation technology of the server mainly undergoes the third generation revolution, and the first generation heat radiator is realized by mainly depending on the heat conductivity of metals such as copper, aluminum and the like. The second generation radiator mainly utilizes a heat pipe to realize heat transfer by means of phase-change heat absorption and capillary reflux. The third generation radiator is mainly realized by water cooling and water convection heat exchange. However, as electronic devices such as chips are being developed toward miniaturization, integration and high frequency, the heat generating power per unit area of the electronic devices such as chips is becoming larger and the temperature is becoming higher, and the heat dissipation requirements of the electronic devices such as chips cannot be met by the existing third generation heat dissipaters.

The application provides a heat dissipation mechanism 100, can have wind-guiding and radiating effect concurrently, has characteristics such as radiating efficiency height, small to satisfy the heat dissipation needs of present chip isoelectron device.

As shown in fig. 2, a cartesian coordinate system is established, wherein an x-axis direction is defined as a length direction of the heat dissipation mechanism 100, a y-axis direction is defined as a width direction of the heat dissipation mechanism 100, and a z-axis direction is defined as a height direction of the heat dissipation mechanism 100. It is to be understood that the above definitions are only for facilitating understanding of the relative position relationship of the parts in the heat dissipation mechanism 100, and should not be construed as limiting the present application.

Example one

The heat dissipation mechanism 100 provided in the embodiment can be used in a server for dissipating heat of electronic devices such as chips in the server. Therefore, the electronic devices in the server can work at a proper temperature, and damage caused by overhigh temperature is avoided.

In other embodiments, the heat dissipation mechanism 100 may also be used in a television, a computer host, an intelligent appliance, and other devices to dissipate heat of electronic devices in the devices, so that the corresponding devices operate normally.

As shown in fig. 1 and 2, the heat dissipation mechanism 100 may include a heat sink 10, a heat pipe assembly 20, a wind scooper 30, and a base 40.

The wind scooper 30 may be a hood structure with two open ends, and the two open ends are disposed oppositely. The other side wall of the wind scooper 30 may be a closed structure, and the wind scooper 30 may be substantially in a closed ring shape. In an embodiment, the wind scooper 30 may include a first wind channel 31, and the first wind channel 31 communicates with the surrounding environment through openings at two ends of the wind scooper 30 to realize air circulation. Meanwhile, the wind scooper 30 may also guide the flow direction of the air. In some specific embodiments, the first air duct 31 may extend along the width direction of the heat dissipation mechanism 100.

In some embodiments, the wind scooper 30 may be made of copper, aluminum, copper alloy, aluminum alloy, or the like.

The heat pipe assembly 20 can be wound around the outer sidewall of the wind scooper 30. It is understood that, in the wind scooper 30, a side close to the first wind tunnel 31 may be an inner side wall of the wind scooper 30. Accordingly, a side of the wind scooper 30 away from the first wind tunnel 31 may be an outer side wall of the wind scooper 30, that is, a side wall of the wind scooper 30 that can be directly observed by a user. Meanwhile, the wind scooper 30 may also carry the heat pipe assembly 20 to support and fix the heat pipe assembly 20.

The heat sink 10 can be disposed at one end of the air guiding cover 30 and connected to the heat conducting pipe assembly 20 to realize heat transfer between the heat conducting pipe assembly 20 and the heat sink 10. The heat sink 10 is disposed outside the air guide cover 30. When the heat dissipation mechanism 100 is placed upright at the height, the heat sink 10 may be located on top of the wind scooper 30.

In the embodiment, the heat sink 10 may be provided with several pieces, and for example, the heat sink 10 may be provided with one piece, two pieces, three pieces, five pieces, six pieces, nine pieces, fifteen pieces, and the like. In use, the heat sink 10 may be in contact with the surrounding flowing air to facilitate heat exchange between the heat sink 10 and the flowing air to dissipate heat to the flowing air. In an embodiment, the heat sink 10 may have a rectangular plate structure, and may have a larger contact area with the flowing air, so that the heat sink 10 exchanges heat with the flowing air, and the heat dissipation efficiency is improved. The area of the heat sink 10 may be set as desired, and is not particularly limited herein.

In other embodiments, the shape of the heat sink 10 may also be a plate-like structure with a square shape, a circular shape, etc., and may be specifically configured as required.

Further, the base 40 may be disposed at an end of the wind scooper 30 away from the heat sink 10, and the base 40 is connected to the heat pipe assembly 20, so as to facilitate heat transfer between the heat pipe assembly 20 and the base 40. The base 40 may be disposed outside the wind scooper 30. When the heat dissipating mechanism 100 is vertically placed at the height, the base 40 may be located at the bottom of the wind scooper 30.

In use, the base 40 may be used to contact the heat-generating source 200 to absorb heat from the heat-generating source 200. The susceptor 40 may transfer the absorbed heat to the heat pipe assembly 20. Heat can be gradually transferred to the heat sink 10 through the heat pipe assembly 20. Then, the heat sink 10 exchanges heat with the surrounding flowing air to transfer heat to the flowing air, thereby dissipating heat.

For example, the heat generating source 200 may be an electronic device in a server, for example, a Central Processing Unit (CPU) chip, and the base 40 may be disposed to be attached to a surface of the electronic device, so as to facilitate heat transfer. During the operation of the server, the electronic device will generate heat continuously, and this part of heat can be absorbed by the base 40 and transferred from the base 40 to the heat pipe assembly 20 and the heat sink 10 in turn, and then the heat is dissipated to the flowing air around, and the flowing air carries the heat out of the server, so as to dissipate the heat of the server. Meanwhile, the wind scooper 30 can guide the flow direction of the flowing air.

In the prior art, the fan housing and the heat sink are usually disposed separately, and the heat sink is disposed below the fan housing and connected to the chip. In use, the heat sink primarily dissipates heat near the chip so that the ambient temperature around the chip will still be at a higher temperature. Meanwhile, the fan housing and the radiator both need to occupy separate assembly space, so that the whole body needs to occupy larger space.

In the present application, the heat pipe assembly 20 is wound around the outer side wall of the wind scooper 30, so that the wind scooper 30 is combined with the heat pipe assembly 20, the heat sink 10 and the base 40, and the wind scooper 30 does not need to be separately arranged and occupies an additional assembly space, so that the space occupied by the heat dissipation mechanism 100 can be greatly reduced, the space inside the server can be saved, and the server can be favorably developed in a light and thin manner. Meanwhile, the heat sink 10 is disposed at an end of the wind scooper 30 away from the base 40, even if the heat sink 10 is disposed away from the electronic device, the heat of the heat dissipation mechanism 100 can be dissipated away from the electronic device, the ambient temperature around the electronic device is reduced, and the heat dissipation and cooling of the electronic device are further facilitated.

Therefore, the heat dissipation mechanism 100 provided by the present application combines and assembles the wind scooper 30 and the heat pipe assembly 20, has a smaller volume, and can significantly reduce the occupied space of the heat dissipation mechanism 100. Meanwhile, the heat dissipation mechanism 100 can have both wind guiding and heat dissipation functions, and can also significantly improve the heat dissipation efficiency, thereby ensuring the normal operation of the electronic device and the server.

Example two

In the embodiment, a heat dissipation mechanism 100 is provided, and it is understood that the present embodiment may be further modified on the basis of the first embodiment.

As shown in fig. 1, 2 and 8, in some embodiments, heat sink 10 may be provided in a plurality of pieces, with the plurality of pieces of heat sink 10 being spaced apart from one another. A second air duct 12 may be formed between two adjacent heat dissipation fins 10 to allow the flowing air to pass therethrough, thereby facilitating heat exchange between the heat dissipation fins 10 and the flowing air. In some embodiments, the plurality of fins 10 may be evenly spaced, and the second air duct 12 may be parallel to the first air duct 31.

In the server, the heat dissipation mechanism 100 may be commonly used with a heat dissipation fan 400, and the heat dissipation fan 400 may be correspondingly disposed at one end of the first air duct 31 to serve as a power source for flowing air. Accordingly, the flowing air may flow along the extending direction of the first wind tunnel 31. When the second air duct 12 is parallel to the first air duct 31, the flowing air can smoothly pass through the second air duct 12, and the generation of wind resistance is avoided. When the second air duct 12 forms a certain included angle with respect to the first air duct 31, correspondingly, the heat sink 10 may obstruct the flowing air passing through, and reduce the flowing speed of the air, thereby affecting the heat dissipation efficiency. Therefore, in the present application, the second air duct 12 is parallel to the first air duct 31, and the width extending direction of the heat sink 10 is also parallel to the first air duct 31.

In some embodiments, the plurality of fins 10 may be parallel to each other, and the fins 10 may be perpendicular to the end surface of the wind scooper 30 at the corresponding end, i.e. the fins 10 may be disposed on the y-z plane.

In other embodiments, the heat sink 10 may also be disposed obliquely with respect to the end surface of the wind scooper 30, that is, an acute angle exists between the heat sink 10 and the end surface of the wind scooper 30. The heat sink 10 can be rotationally tilted about the y-axis as a rotation axis.

In other embodiments, the plurality of fins 10 may be non-uniformly spaced, and the fins 10 may be inclined relative to each other.

In some embodiments, the heat sink 10 may be a copper plate or an aluminum plate, which facilitates heat exchange with the flowing air to improve heat dissipation efficiency.

As shown in fig. 1-4, in some embodiments, the heat pipe assembly 20 may include a heat pipe 21, an electromagnetic pump set 22, and a liquid metal (not shown).

The heat pipe 21 can be wound around the outer sidewall of the wind scooper 30, and the heat pipe 21 can be wound around a plurality of turns, and correspondingly, the heat pipe 21 can also be a spiral structure. The heat pipe 21 can contact with the outer sidewall of the wind scooper 30, so that the heat pipe 21 can also perform corresponding heat exchange with the wind scooper 30, and then the wind scooper 30 performs heat exchange with the flowing air passing through the first air duct 31, thereby achieving heat dissipation and increasing the heat dissipation efficiency of the heat dissipation mechanism 100.

In some embodiments, the heat conducting pipe 21 may be wound according to the structure of the wind scooper 30. The shape of the wind scooper 30 may be set as required, and for example, the cross section of the wind scooper 30 may be a cover body structure having a shape of a rectangle, a square, an irregular polygon, or the like. The heat transfer pipe 21 may be wound according to the shape of the side wall of the air guide cover 30.

In some embodiments, the heat conducting pipe 21 may be one of a copper pipe, an aluminum pipe, a copper alloy pipe, an aluminum alloy pipe, and other tubular structures.

Referring to fig. 2 and 3, the heat sink 10 can be connected to the heat pipe 21, and in particular, the heat sink 10 can be connected to a section of the heat pipe 21 near the top of the wind scooper 30. In some specific embodiments, the side of the heat sink 10 close to the heat pipe 21 is provided with a locking groove 11 for locking the heat pipe 21. Meanwhile, the shape of the locking groove 11 can be adapted to the outer wall of the heat conducting pipe 21 to adhere to the outer wall of the heat conducting pipe 21, so that the heat sink 10 can have a larger contact area with the heat conducting pipe 21 to facilitate heat transfer.

It is understood that the same heat pipe 21 can be connected to the heat sinks 10 at the same time, and the same heat sink 10 can be connected to the heat pipes 21 passing through at the same time. Accordingly, one side of the same heat sink 10 close to the heat conducting pipe 21 may be provided with a plurality of slots 11, and the number of the slots 11 may be equal to the number of windings of the heat conducting pipe 21. This increases the chance of contact between the heat pipe 21 and the heat sink 10, improves the heat transfer between the heat pipe 21 and the heat sink 10, and efficiently transfers the heat in the heat pipe assembly 20 to the heat sink 10, thereby achieving rapid heat dissipation.

In some embodiments, the heat sink 10 and the heat pipe 21 can be fixedly connected by soldering to ensure the heat transfer efficiency between the heat sink 10 and the heat pipe 21. Specifically, welding may be performed at a position where the heat pipe 21 is connected to the neck 11.

Further, the liquid metal can be disposed in the heat conducting pipe 21 in a flowing manner, and the heat conducting pipe 21 can be a sealing pipe, so that the liquid metal can be prevented from leaking, and the inside of the server can be prevented from being polluted. During operation, the liquid metal can carry heat in the heat pipe 21 to flow for heat transfer. In particular, the liquid metal may absorb heat at the base 40 and may then transfer the heat in the direction of the heat sink 10. At the location of the heat sink 10, the liquid metal may transfer heat to the heat sink 10 through the heat pipe 21, dissipating the heat from the heat sink 10 to the flowing air. In the process of flowing the liquid metal, there may be some heat dissipated to the flowing air in the first air duct 31 through the heat conduction pipe 21 and the air guiding cover 30.

In some embodiments, the liquid metal may be selected from one or more of gallium alloy, indium alloy, gallium indium alloy, and gallium indium tin alloy. The liquid metal is liquid at normal temperature, can realize free flow, can keep the characteristics of the metal at the same time, has a heat conductivity coefficient far larger than that of the existing heat conducting agents such as formaldehyde, water and the like, and has a specific heat capacity close to half of that of water per unit volume of the liquid metal due to the density of the liquid metal compared with that of the heat conducting agents such as water and the like, so that the comprehensive heat conductivity of the liquid metal is far better than that of the existing heat conducting agents. Accordingly, the liquid metal has a higher heat transport efficiency and a higher heat dissipation efficiency, and the heat dissipation mechanism 100 can have a higher heat dissipation efficiency. In addition, the liquid metal has the characteristics of no toxicity, stable physicochemical properties, difficult volatilization, difficult leakage and the like, so that the liquid metal can run efficiently and stably for a long time, and the working efficiency of the heat dissipation mechanism 100 is ensured.

In an embodiment, the electromagnetic pump unit 22 may be used as a power source for flowing the liquid metal, and the electromagnetic pump unit 22 may drive the liquid metal to flow in the heat pipe 21 to achieve heat transfer.

Referring to fig. 4, in some embodiments, the heat pipe 21 may be a closed loop, and the liquid metal may circulate inside the heat pipe 21. The electromagnetic pump group 22 may include a first electromagnetic pump 221, and the first electromagnetic pump 221 may generate a first magnetic field. In an embodiment, the magnetic field direction of the first magnetic field may be perpendicular to the axis of the heat conductive pipe 21, i.e. perpendicular to the flow direction of the liquid metal. During operation, a suitable current can be applied to the liquid metal, so that the liquid metal can be driven to move under the action of the lorentz force, that is, the liquid metal can flow in the heat conduction pipe 21 in a circulating manner.

In an embodiment, the heat pipe 21 may be filled with liquid metal, and when the first electromagnetic pump 221 drives the liquid metal at the corresponding position to move, the liquid metal in the whole heat pipe 21 may be driven to move at the same time, that is, the liquid metal circulates in the heat pipe 21, so as to continuously transfer heat.

In some embodiments, the heat conducting pipe 21 may be disposed inside the wind scooper 30, i.e. inside the first wind channel 31. The first electromagnetic pump 221 may be disposed on the section of the structure of the heat conducting pipe 21, such that the first electromagnetic pump 221 is located in the first air duct 31. On one hand, the first electromagnetic pump 221 can be prevented from interfering with the assembly of other electronic devices in the server, and on the other hand, the flowing air in the first air duct 31 can also dissipate heat and cool the first electromagnetic pump 221, so as to ensure the smooth operation of the first electromagnetic pump 221.

In other embodiments, the electromagnetic pump group 22 may further include two, three, four, six, etc. first electromagnetic pumps 221, and the directions of the magnetic fields generated by the plurality of first electromagnetic pumps 221 may be the same, and may be used to drive the liquid metal to flow in the same direction, so as to jointly promote the circulation flow of the liquid metal in the heat pipe 21.

As shown in fig. 5, in other embodiments, the heat conductive pipes 21 may include two ends, namely, a first end 211 and a second end 212. The solenoid-pump group 22 may include a first solenoid pump 221 and a second solenoid pump 222. The first solenoid pump 221 may generate a first magnetic field, and the second solenoid pump 222 may generate a second magnetic field, and a direction of the first magnetic field may be opposite to a direction of the second magnetic field. In some embodiments, there may be gaps in the heat pipes 21, i.e. the liquid metal does not fill the heat pipes 21. The first electromagnetic pump 221 and the second electromagnetic pump 222 may be provided in plurality and may be provided at intervals along the length of the heat conductive pipe 21. During operation, the first electromagnetic pump 221 and the second electromagnetic pump 222 can be used to drive the liquid metal to flow in different directions. Illustratively, the plurality of first electromagnetic pumps 221 can drive the liquid metal to flow from the first end 211 to the second end 212 of the heat pipe 21. The plurality of second electromagnetic pumps 222 can drive the liquid metal to flow from the second end 212 to the first end 211 of the heat pipe 21. Namely, the first electromagnetic pump 221 and the second electromagnetic pump 222 can be used to drive the liquid metal to reciprocate in the heat conductive pipe 21. It is understood that the first and second solenoid pumps 221 and 222 are operated in an interleaved manner. Because the heat pipe 21 is in a spiral structure and is wound with a plurality of turns, when the liquid metal reciprocates, the liquid metal can flow through the position of the base 40 and the position of the heat sink 10, and the heat transfer between the base 40 and the heat sink 10 can also be realized.

In an embodiment, the electromagnetic pump unit 22 may be connected to a controller (not shown), and the controller may control the operation of each electromagnetic pump.

Of course, in some embodiments, in use, the electromagnetic pump package 22 may be directly electrically connected to the central processor of the server, and the central processor of the server directly controls the operation of the electromagnetic pump package 22.

In the embodiment, each electromagnetic pump can be a miniature electromagnetic pump so as to reduce the occupied space.

Referring to fig. 1, 2 and 6, the base 40 may have a plate-like structure. The susceptor 40 is provided with a plurality of limiting grooves 41 on a side thereof close to the heat pipe assembly 20, and the number of the limiting grooves 41 may be equal to the number of turns of the heat pipes 21 passing therethrough. The limiting grooves 41 correspond to the number of turns of the heat conduction pipes 21, and the limiting grooves 41 can limit and fix the heat conduction pipes 21. When the heat pipe 21 is assembled with the base 40, the heat pipe 21 can be pre-fixed by the limiting groove 41, so that the base 40 and the heat pipe 21 are prevented from randomly shaking, and the subsequent reinforcing and connecting operation is facilitated.

In an embodiment, the heat pipe 21 may be welded to the base 40, and specifically, the heat pipe 21 may be soldered to the base 40. The gap between the stopper groove 41 and the heat transfer pipe 21 can be filled with solder, and the heat transfer efficiency between the base 40 and the heat transfer pipe 21 can be ensured.

In some specific embodiments, two convex portions are disposed at an end of the wind scooper 30 away from the heat sink 10. Correspondingly, two sets of the base 40 can be provided, and correspond to the two convex parts of the wind scooper 30 one by one. The two bases 40 can support the wind scooper 30 together, and the two bases 40 are connected to the heat conduction pipes 21 at the corresponding positions. The two bases 40 can be used to connect with the same heat source 200 or different heat sources 200 to dissipate heat and reduce temperature of the corresponding heat sources 200.

In other embodiments, as shown in fig. 7, a U-shaped groove is disposed on a side of the base 40 close to the wind scooper 30 to limit the protrusion of the wind scooper 30. Meanwhile, the limiting groove 41 may be disposed on the inner wall of the U-shaped groove to further limit the heat pipe 21.

In an embodiment, the base 40 may be used to connect the heat generating source 200, so that the heat dissipation mechanism 100 may be fixed relative to the heat generating source 200, thereby ensuring stable heat transfer between the heat dissipation mechanism 100 and the heat generating source 200, and ensuring stable dissipation of heat of the heat generating source 200.

The base 40 may be provided with a connection part 43 for connecting the heat generating source 200. The connecting portion 43 may be one or a combination of a connecting post, a connecting hole, a buckle, and the like. Correspondingly, the heat source 200 may also be provided with a connecting hole, a connecting column, a buckle, etc. which are matched with the connecting portion 43, so that the base 40 is fixedly connected with the heat source 200.

In some embodiments, a connection portion 43 may be respectively disposed at four corners of the base 40 to ensure that the base 40 is stably connected to the heat generating source 200.

Further, a fool-proof portion 42 is disposed on the base 40 for fool-proof connection between the base 40 and the heat source 200. Fool-proof portion 42 may be disposed in a non-central location of base 40. Specifically, the fool-proof portion 42 may be disposed at an edge of the base 40 to identify the assembly position. Fool-proof portion 42 may be one of a positioning post, a positioning hole, a positioning groove, etc.

In some embodiments, the base 40 may be made of copper.

In the embodiment, the heat dissipation mechanism 100 further includes a heat conductive sheet 50, and the heat conductive sheet 50 is disposed on a side of the base 40 away from the wind scooper 30. The heat conductive sheet 50 may be used to accelerate heat transfer between the heat generating source 200 and the base 40. In some embodiments, the heat-conducting sheet 50 may be a heat-conducting silicone grease.

In use, heat generated by the heat generating source 200 can be transferred to the base 40 through the thermally conductive sheet 50, and then the base 40 can transfer the heat to the liquid metal in the heat pipe assembly 20. Under the driving action of the electromagnetic pump unit 22, the liquid metal can continuously flow in the heat pipe 21 to transfer heat from one end of the base 40 to the heat sink 10. At the location of the heat sink 10, heat from the liquid metal can be transferred to the heat sink 10 via the heat pipe 21, and the heat is dissipated by the heat sink 10 into the flowing air. Meanwhile, during the heat transfer, the liquid metal may partially dissipate heat to the first air duct 31 through the heat pipe 21 and the air guiding cover 30 to flow air. In the heat dissipation process, the heat dissipation mechanism 100 can transfer most of the heat to the end far away from the heat source 200 for heat dissipation, so as to avoid the over-high ambient temperature around the heat source 200, promote the heat dissipation of the heat source 200, and improve the heat dissipation efficiency.

In summary, the heat dissipation mechanism 100 provided in the present application can have both wind guiding and heat dissipating functions, and has the characteristics of small volume, small impedance, and high heat dissipation efficiency.

EXAMPLE III

As shown in fig. 8, a server is further provided in the embodiment, and includes the heat dissipation mechanism 100 provided in the embodiment.

The server may include a chassis 300, an electronic device (not shown) disposed in the chassis 300, and a heat dissipation fan 400. The heat dissipation fan 400 may be disposed corresponding to one end of the heat dissipation mechanism 100 and corresponding to one end of the first air duct 31 and the second air duct 12. It is to be understood that only a partial structure of the server is shown in the figure.

In use, the heat dissipation fan 400 can be used to promote the flow of air in the chassis 300, and the heat dissipation mechanism 100 can transfer the heat generated by the electronic device to the flowing air, so that the flowing air dissipates the heat to the external environment. It is understood that a vent (not shown) may be provided in the housing 300 to facilitate air flow inside and outside the housing 300.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. A heat dissipation mechanism, comprising:

the wind scooper comprises a first wind channel;

2. The heat dissipation mechanism of claim 1, wherein the heat pipe assembly comprises:

the liquid metal is arranged in the heat conduction pipe; and

3. The heat dissipation mechanism of claim 2, wherein the heat pipe is a closed loop circuit, the electromagnetic pump set comprises a first electromagnetic pump generating a first magnetic field;

4. The heat dissipation mechanism of claim 2, wherein the heat pipe comprises two ends, the set of electromagnetic pumps comprises a first electromagnetic pump generating a first magnetic field and a second electromagnetic pump generating a second magnetic field, the first magnetic field being in an opposite direction to the second magnetic field;

5. The heat dissipation mechanism of any of claims 2 to 4, wherein the liquid metal comprises one or more of a gallium alloy, an indium alloy, a gallium indium alloy and a gallium indium tin alloy.

6. The heat dissipating mechanism of claim 1, wherein the plurality of heat dissipating fins are spaced apart from each other, and a second air channel is formed between two adjacent heat dissipating fins, and the second air channel is parallel to the first air channel.

7. The heat dissipation mechanism as claimed in claim 1, wherein a limiting groove is disposed on a side of the base close to the heat pipe assembly, and the side of the heat pipe assembly close to the base is connected to the limiting groove in a limiting manner.

8. The heat dissipation mechanism as claimed in claim 1 or 7, wherein the base is provided with a fool-proof portion for fool-proof connection of the base with a heat source.

9. The heat dissipating mechanism of claim 1, further comprising a heat conducting plate disposed on a side of the base away from the heat conducting tube assembly.

10. A server, comprising the heat dissipation mechanism of any one of claims 1 to 9.