CN113109600A - Inclined plane grinding, clamping and positioning device for semiconductor test probe - Google Patents
Inclined plane grinding, clamping and positioning device for semiconductor test probe Download PDFInfo
- Publication number
- CN113109600A CN113109600A CN202110342925.4A CN202110342925A CN113109600A CN 113109600 A CN113109600 A CN 113109600A CN 202110342925 A CN202110342925 A CN 202110342925A CN 113109600 A CN113109600 A CN 113109600A
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- clamping
- clamping plate
- test probe
- plate
- positioning device
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
The invention discloses an inclined plane grinding clamping and positioning device for a semiconductor test probe, which comprises: a base plate; the first clamping plate is arranged on the bottom plate, and a plurality of first clamping holes are formed in the first clamping plate; the second clamping plate is arranged on the first clamping plate in a sliding mode, and a plurality of second clamping holes matched with the first clamping holes are formed in the second clamping plate; the two limiting blocks are arranged on two opposite sides of the bottom plate, and the first clamping plate and the second clamping plate are located between the two limiting blocks. This semiconductor test probe presss from both sides tight positioner with grinding inclined plane has solved the current tight positioning mode of clamp and has had the tight degree of clamp to be difficult to control and the problem that work efficiency is low.
Description
Technical Field
The invention belongs to the technical field of semiconductor testing equipment processing, and particularly relates to an inclined plane grinding, clamping and positioning device for a semiconductor testing probe.
Background
In recent years, with the rapid development of the semiconductor industry, test probes have also been widely used. The test probe is mainly used for detecting the electrical property of electronic products, has been widely applied to the fields of aviation, aerospace, military industry, medical treatment, photoelectricity and the like along with the development of the electronic products, and plays a great role in the development process of modern science and technology.
When the test probe is processed, the test probe needs to be subjected to bevel grinding, and the bevel grinding is mainly carried out through a grinding tool. The test probe needs to be clamped and positioned in the process of grinding the inclined surface, so that the test probe is ensured not to loosen in the process of grinding the inclined surface, and the precision of grinding the inclined surface is influenced.
However, at present, the clamping and positioning of the test probe are mainly completed by a person through a clamp, and the operation mode has the following defects:
(1) the force application of a person is not easy to control, the test probe is easy to damage when the force application is too large, the test probe is difficult to clamp when the force application is too small, and the test probe is easy to deviate in the process of grinding the inclined plane, so that the precision of the ground inclined plane is influenced; (2) only one test probe can be clamped and positioned at each time, the other test probe needs to be replaced after one test probe is completed, the working efficiency is low, and the device cannot be suitable for large-scale industrial production.
Disclosure of Invention
The invention aims to provide an inclined plane grinding clamping and positioning device for a semiconductor test probe, which solves the problems that the clamping degree is difficult to control and the working efficiency is low in the existing clamping and positioning mode.
In order to achieve the purpose, the invention adopts the technical scheme that: a bevel clamping and positioning device for a semiconductor test probe comprises:
a base plate;
the first clamping plate is arranged on the bottom plate, and a plurality of first clamping holes are formed in the first clamping plate;
the second clamping plate is arranged on the first clamping plate in a sliding mode, and a plurality of second clamping holes matched with the first clamping holes are formed in the second clamping plate;
the two limiting blocks are arranged on two opposite sides of the bottom plate, and the first clamping plate and the second clamping plate are located between the two limiting blocks.
As a preferable technical scheme, adjusting screws are arranged on the two limiting blocks.
As a preferred technical scheme of the invention, two fixing screws are arranged on the two limiting blocks respectively, the two fixing screws are positioned on two sides of the corresponding adjusting screws, and the end part of each fixing screw is provided with a compression spring.
As a preferred technical solution of the present invention, two opposite sides of the bottom plate are respectively provided with a limiting side plate, and the first clamping plate and the second clamping plate are located between the two limiting side plates.
As a preferable technical scheme of the invention, two sides of the first clamping plate are respectively provided with a limiting groove matched with the compression spring and the adjusting screw.
As a preferable aspect of the present invention, the first clamping hole and the second clamping hole are both inclined holes.
As a preferable technical scheme of the invention, a plurality of backing grooves for assembling the adjusting nut and the fixing nut are arranged on the limiting block.
The invention has the beneficial effects that: (1) according to the bevel grinding clamping and positioning device for the semiconductor test probe, the first clamping hole and the second clamping hole which are concentrically arranged in the first clamping plate and the second clamping plate are adopted to carry out staggered clamping on the test probe, the sliding displacement of the second clamping plate on the first clamping plate is accurately controlled, the clamping force of the test probe can be controlled, and the problem that the force is too large or too small is avoided; (2) the bevel grinding clamping and positioning device for the semiconductor test probe can finish clamping of a plurality of test probes at one time, workers do not need to finish replacing one test probe, the time of processing operation is greatly shortened, and a large-scale industrial operation mode can be used for production; (3) the bevel grinding clamping and positioning device for the semiconductor test probe is simple in structure, convenient to operate, low in manufacturing cost and good in market popularization and application prospect.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of an inclined plane grinding, clamping and positioning device for a semiconductor test probe according to the present invention;
FIG. 2 is an exploded view of a bevel clamping and positioning device for a semiconductor test probe according to the present invention.
In the figure: 1. the clamping device comprises a bottom plate, 2 parts of a limiting block, 3 parts of a first clamping plate, 4 parts of an adjusting screw, 5 parts of a fixing screw, 6 parts of a compression spring, 7 parts of a limiting side plate, 8 parts of a withdrawing groove, 9 parts of a second clamping plate, 10 parts of a second clamping hole, 11 parts of a first clamping hole and 12 parts of a limiting groove.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
As shown in fig. 1, the bevel clamping and positioning device for a semiconductor test probe according to the present invention comprises: the bottom plate 1, the first splint 3, the second splint 9 and two stopper 2.
In connection with fig. 2, in particular: the first clamping plate 3 is arranged on the bottom plate 1 through bolts, and a plurality of first clamping holes 11 are formed in the first clamping plate 3; the second clamping plate 9 is slidably arranged on the first clamping plate 3, and a plurality of second clamping holes 10 matched with the first clamping holes 11 are formed in the second clamping plate 9; two stopper 2 set up the both sides relative on bottom plate 1, and first splint 3 and second splint 9 are located between two stopper 2.
Before clamping the test probe, the second clamping plate 9 is placed on the first clamping plate 3, and it is ensured that the second clamping hole 10 on the second clamping plate 9 is completely overlapped with the first clamping hole 11 on the first clamping plate 3. Thereafter, a test probe is inserted into each pair of the first clamping hole 11 and the second clamping hole 10. And then, the second clamping plate 9 slides for a certain displacement, so that a certain dislocation is formed between the first clamping hole 11 and the second clamping hole 10, and the clamping of the test probe is completed. And finally, fixing the second clamping plate 9, namely, sequentially carrying out bevel grinding on the clamped test probes by using a grinding tool.
Obviously, according to the bevel clamping and positioning device for the semiconductor test probe, the test probe is subjected to staggered clamping by adopting the first clamping hole 11 and the second clamping hole 10 which are concentrically arranged in the first clamping plate 3 and the second clamping plate 9, the clamping force of the test probe can be controlled by accurately controlling the sliding displacement of the second clamping plate 9 on the first clamping plate 3, the problem of overlarge and undersize force is avoided, and the subsequent processing quality of a product is ensured. In addition, the bevel grinding clamping and positioning device for the semiconductor test probe can finish clamping of a plurality of test probes at one time, workers do not need to finish replacing one test probe, the processing time is greatly shortened, and a large-scale industrial operation mode can be used for production. In general, the bevel grinding clamping and positioning device for the semiconductor test probe has the advantages of simple structure, convenience in operation, lower manufacturing cost and better market popularization and application prospect.
As shown in fig. 1, in the bevel clamping and positioning device for a semiconductor test probe of the present invention, two limiting blocks 2 are provided with adjusting screws 4.
The worker can realize the pushing and positioning of the second clamping plate 9 by adjusting the depth of the adjusting screw 4 screwed into the limiting block 2. One of the adjusting screws 4 is pushed, and the other adjusting screw 4 arranged oppositely is pushed to complete accurate positioning, so that preset dislocation between the first clamping hole 11 and the second clamping hole 10 is ensured, and finally the magnitude of the applied force is controlled.
As shown in fig. 1, in the bevel clamping and positioning device for a semiconductor test probe of the present invention, two fixing screws 5 are disposed on two limiting blocks 2, the two fixing screws 5 are disposed on two sides of a corresponding adjusting screw 4, and a compression spring 6 is disposed at an end of each fixing screw 5.
When the second splint 10 removed, accessible compression spring 6 formed certain buffering, formed elasticity, ensured that the second splint 10 can slow removal, in addition can also ensure when adjusting screw resets, slow reseing under four compression spring 6's elasticity effect of second splint 10 can not take place the violent removal, causes the damage to the test probe.
As shown in FIG. 1, in the bevel clamping and positioning device for semiconductor test probes of the present invention, two opposite sides of a bottom plate 1 are respectively provided with a position-limiting side plate 7, and a first clamping plate 3 and a second clamping plate 9 are positioned between the two position-limiting side plates 7.
Spacing curb plate 7 mainly plays the guide effect, can ensure that second splint 9 can move on certain orbit, takes place the skew when preventing to play the removal, easily causes the problem that the test probe takes place the kink.
As shown in FIG. 1, in the bevel clamping and positioning device for a semiconductor test probe according to the present invention, two sides of the first clamping plate 3 are respectively provided with a limiting groove 12 matching with the compression spring 6 and the adjusting screw 4.
Like this relate to, compression spring 6 and adjusting screw 4 only can implement to pass the location to second splint 9, and when the contact first splint 3, will be located the spacing groove 12 that first splint 3 both sides set up, can not be to first splint 3 application of force.
As shown in fig. 1, in an inclined clamping and positioning device for a semiconductor test probe according to the present invention, a first clamping hole 11 and a second clamping hole 10 are both inclined holes.
The first clamping hole 11 and the second clamping hole 10 are preferably concentric inclined holes, and compared with straight holes, the inclined holes are more suitable for carrying out staggered clamping on the test probes, so that the contact damage to the test probes can be reduced.
As shown in figure 1, in the bevel clamping and positioning device for the semiconductor test probe, a plurality of withdrawing grooves 12 for assembling an adjusting nut 4 and a fixing nut 5 are arranged on a limiting block 2.
The outermost ends of the adjusting nut 4 and the fixing nut 5 are located in the backing groove 12, so that the phenomenon that the adjusting nut and the fixing nut extend out of the limiting block 2 to scratch workers during working operation can be avoided.
While the foregoing description shows and describes several preferred embodiments of the invention, it is to be understood, as noted above, that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. The utility model provides a semiconductor test probe presss from both sides tight positioner with grinding inclined plane which characterized in that includes:
a base plate (1);
the first clamping plate (3), the first clamping plate (3) is arranged on the bottom plate (1), and a plurality of first clamping holes (11) are formed in the first clamping plate (3);
the second clamping plate (9) is arranged on the first clamping plate (3) in a sliding mode, and a plurality of second clamping holes (10) matched with the first clamping holes (11) are formed in the second clamping plate (9);
two limiting blocks (2), two limiting blocks (2) are arranged on two opposite sides of the bottom plate (1), and the first clamping plate (3) and the second clamping plate (9) are positioned between the two limiting blocks (2).
2. The bevel-grinding clamping and positioning device for the semiconductor test probe according to claim 1, wherein two limiting blocks (2) are provided with adjusting screws (4).
3. The bevel-grinding clamping and positioning device for the semiconductor test probe according to claim 2, wherein two fixing screws (5) are arranged on each of the two limiting blocks (2), the two fixing screws (5) are located on two sides of the corresponding adjusting screw (4), and a compression spring (6) is arranged at the end of each fixing screw (5).
4. The bevel clamping and positioning device for the semiconductor test probe according to claim 3, wherein two opposite sides of the bottom plate (1) are respectively provided with a limiting side plate (7), and the first clamping plate (3) and the second clamping plate (9) are located between the two limiting side plates (7).
5. The bevel clamping and positioning device for the semiconductor test probe according to claim 4, wherein the first clamping plate (3) is provided with a limiting groove (12) at each side thereof, the limiting groove being matched with the compression spring (6) and the adjusting screw (4).
6. The bevel clamping and positioning device for semiconductor test probes as recited in claim 5, wherein the first clamping hole (11) and the second clamping hole (10) are both inclined holes.
7. The bevel clamping and positioning device for the semiconductor test probe as claimed in claim 6, wherein the limiting block (2) is provided with a plurality of receding grooves (12) for assembling the adjusting nut (4) and the fixing nut (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110342925.4A CN113109600B (en) | 2021-03-30 | 2021-03-30 | Inclined plane grinding, clamping and positioning device for semiconductor test probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110342925.4A CN113109600B (en) | 2021-03-30 | 2021-03-30 | Inclined plane grinding, clamping and positioning device for semiconductor test probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113109600A true CN113109600A (en) | 2021-07-13 |
| CN113109600B CN113109600B (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110342925.4A Active CN113109600B (en) | 2021-03-30 | 2021-03-30 | Inclined plane grinding, clamping and positioning device for semiconductor test probe |
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| CN (1) | CN113109600B (en) |
Citations (13)
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|---|---|---|---|---|
| JP2006125988A (en) * | 2004-10-28 | 2006-05-18 | Yokowo Co Ltd | Method of manufacturing inspection unit |
| CN101105507A (en) * | 2006-07-10 | 2008-01-16 | 东京毅力科创株式会社 | Probe card |
| CN204524883U (en) * | 2015-01-08 | 2015-08-05 | 广州市中新塑料有限公司 | A kind of processing mold electrode is with switching fixture |
| CN205263143U (en) * | 2015-12-29 | 2016-05-25 | 苏州韬盛电子科技有限公司 | A grip block for probe |
| CN208196576U (en) * | 2018-04-11 | 2018-12-07 | 新昌县泰如科技有限公司 | A kind of flat mouth clamp of the lathe convenient for fixation |
| CN208880200U (en) * | 2018-08-21 | 2019-05-21 | 江苏金隆新材料有限公司 | A kind of new material part engagement Anti-dislocation equipment |
| CN208959975U (en) * | 2018-09-05 | 2019-06-11 | 厦门冠力塑胶科技有限公司 | A kind of three-roll grinder |
| CN110531126A (en) * | 2019-10-09 | 2019-12-03 | 严日东 | A kind of fastening assembly type Vertrical probe clasp |
| CN209963690U (en) * | 2019-02-24 | 2020-01-17 | 王颖 | Install handy electric terminal box |
| CN210878568U (en) * | 2019-07-11 | 2020-06-30 | 徐其明 | Platform device for multi-station machining |
| CN211355810U (en) * | 2019-12-08 | 2020-08-28 | 华中科技大学同济医学院附属协和医院 | Cross Kirschner wire external fixing device |
| CN211603428U (en) * | 2019-12-29 | 2020-09-29 | 徐州久利电子有限公司 | Differential mode inductance turn-to-turn impact voltage resistance testing device |
| CN211841622U (en) * | 2019-12-30 | 2020-11-03 | 石家庄金域医学检验实验室有限公司 | Slide clamping device |
-
2021
- 2021-03-30 CN CN202110342925.4A patent/CN113109600B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006125988A (en) * | 2004-10-28 | 2006-05-18 | Yokowo Co Ltd | Method of manufacturing inspection unit |
| CN101105507A (en) * | 2006-07-10 | 2008-01-16 | 东京毅力科创株式会社 | Probe card |
| CN204524883U (en) * | 2015-01-08 | 2015-08-05 | 广州市中新塑料有限公司 | A kind of processing mold electrode is with switching fixture |
| CN205263143U (en) * | 2015-12-29 | 2016-05-25 | 苏州韬盛电子科技有限公司 | A grip block for probe |
| CN208196576U (en) * | 2018-04-11 | 2018-12-07 | 新昌县泰如科技有限公司 | A kind of flat mouth clamp of the lathe convenient for fixation |
| CN208880200U (en) * | 2018-08-21 | 2019-05-21 | 江苏金隆新材料有限公司 | A kind of new material part engagement Anti-dislocation equipment |
| CN208959975U (en) * | 2018-09-05 | 2019-06-11 | 厦门冠力塑胶科技有限公司 | A kind of three-roll grinder |
| CN209963690U (en) * | 2019-02-24 | 2020-01-17 | 王颖 | Install handy electric terminal box |
| CN210878568U (en) * | 2019-07-11 | 2020-06-30 | 徐其明 | Platform device for multi-station machining |
| CN110531126A (en) * | 2019-10-09 | 2019-12-03 | 严日东 | A kind of fastening assembly type Vertrical probe clasp |
| CN211355810U (en) * | 2019-12-08 | 2020-08-28 | 华中科技大学同济医学院附属协和医院 | Cross Kirschner wire external fixing device |
| CN211603428U (en) * | 2019-12-29 | 2020-09-29 | 徐州久利电子有限公司 | Differential mode inductance turn-to-turn impact voltage resistance testing device |
| CN211841622U (en) * | 2019-12-30 | 2020-11-03 | 石家庄金域医学检验实验室有限公司 | Slide clamping device |
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| CN113109600B (en) | 2022-12-13 |
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Address after: 714000 No. 18, chongye Second Road, high tech Industrial Development Zone, Weinan City, Shaanxi Province Applicant after: Weinan Muwang Intelligent Technology Co.,Ltd. Address before: 710000 northwest corner of cross between Dongfeng Street and Shiquan Road, high tech Industrial Development Zone, Weinan City, Shaanxi Province Applicant before: WEINAN HI-TECH ZONE WOOD KING TECHNOLOGY Co.,Ltd. |
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