CN113102751A - Method for coating copper on surface of sodium chloride particle - Google Patents
Method for coating copper on surface of sodium chloride particle Download PDFInfo
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- CN113102751A CN113102751A CN202110408637.4A CN202110408637A CN113102751A CN 113102751 A CN113102751 A CN 113102751A CN 202110408637 A CN202110408637 A CN 202110408637A CN 113102751 A CN113102751 A CN 113102751A
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- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 title claims abstract description 220
- 239000010949 copper Substances 0.000 title claims abstract description 134
- 239000002245 particle Substances 0.000 title claims abstract description 112
- 239000011780 sodium chloride Substances 0.000 title claims abstract description 110
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000011248 coating agent Substances 0.000 title claims abstract description 21
- 238000000576 coating method Methods 0.000 title claims abstract description 21
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 150
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000003756 stirring Methods 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 12
- 239000012298 atmosphere Substances 0.000 claims abstract description 9
- 238000002791 soaking Methods 0.000 claims abstract description 8
- 230000009467 reduction Effects 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 10
- 238000005253 cladding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 238000009776 industrial production Methods 0.000 abstract 1
- 235000002639 sodium chloride Nutrition 0.000 description 88
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 38
- 239000000243 solution Substances 0.000 description 38
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 12
- 239000003960 organic solvent Substances 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
- B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a method for coating copper on the surface of sodium chloride particles, belonging to the technical field of surface treatment of particle materials. Firstly, a proper amount of Cu (NO) is added3)2Dissolving in acetone solution to obtain Cu (NO)3)2In acetone solution, and then placing sodium chloride particles into Cu (NO)3)2Stirring in acetone solution and ultrasonic vibrating to make sodium chloride particles in Cu (NO)3)2Fully soaking in acetone solution, and baking at low temperature to volatilize acetone to obtain coated Cu (NO)3)2·3H2O sodium chloride particles, heating at high temperature to make Cu (NO) on the surface of the sodium chloride particles3)2·3H2Decomposing O into CuO, heating the CuO in a reducing atmosphere, preserving heat for a period of time, and reducing the CuO into a Cu simple substance to obtain the sodium chloride particles with the surfaces coated with Cu.The surface treatment technology of the copper-coated sodium chloride particles has the characteristics of simple process and low cost, and can realize industrial production.
Description
Technical Field
The invention relates to a method for coating copper on the surface of sodium chloride particles, belonging to the technical field of surface treatment of particle materials.
Background
The through-hole foamed aluminum has good mechanical and sound absorption properties, and the mechanical and sound absorption properties are greatly improved along with the reduction of the aperture under the condition of certain porosity.
Infiltration casting is the mainstream preparation method of the through-hole foamed aluminum, and the used precursor material is sodium chloride particles. At present, through-hole porous aluminum with the aperture of more than 1mm can be prepared, but through-hole foamed aluminum with the aperture of less than 1mm, particularly foamed aluminum with a large-size through-hole structure, can not be stably realized, because sodium chloride particles are not wetted with aluminum and aluminum alloy melts, so that the melts are difficult to permeate into gaps among the sodium chloride particles with the diameter of less than 1 mm. The copper metallized surface modification of the sodium chloride particles can improve the wettability of the sodium chloride particles with aluminum and aluminum alloy melts and improve the seepage performance of the melts, thereby making the preparation of the foamed aluminum with a micro-pore structure and a large size possible.
The method for coating the particle surface mainly comprises chemical plating, electroplating, vapor deposition and the like. The chemical plating is to form a metal plating layer by selectively reducing and depositing metal ions in a solution on the surface of a catalytically active object with a reducing agent without passing an external current. Electroplating is a process of depositing and covering a layer of metal film on the surface of an object to be plated by the action of electricity by utilizing the principle of electrolysis. Vapor deposition is the generation of a vapor of the material to be deposited in a vacuum, which is then condensed onto a substrate material to produce the desired film layer.
Because sodium chloride is easily dissolved in water, the conventional chemical plating and electroplating methods which relate to aqueous solutions cannot realize copper metallization on the surface of the copper chloride; the vapor deposition method has the disadvantages of high cost, incapability of processing sodium chloride particles in large batch and the like.
Disclosure of Invention
The invention aims to provide a technical method for coating copper on the surface of sodium chloride particles, which specifically comprises the following steps:
(1) adding Cu (NO)3)2Dissolving in acetone to obtain Cu (NO)3)2By adding sodium chloride particles to Cu (NO)3)2Stirring in acetone solution, and ultrasonic vibrating to make sodium chloride particles in Cu (NO)3)2Fully soaking in acetone solution.
(2) Mixing NaCl-Cu (NO)3)2Baking acetone solution at low temperature to volatilize acetone to obtain Cu (NO) coated product3)2·3H2Sodium chloride particles of O.
(3) Coating the Cu (NO) prepared in the step (2)3)2·3H2Heating the sodium chloride particles of O to make Cu (NO) on the surfaces of the sodium chloride particles3)2·3H2The O is decomposed and converted into CuO, and the sodium chloride particles coated with the CuO are obtained.
(4) Sodium chloride particles coated with CuO are put in H2Heating and preserving heat in the atmosphere to reduce CuO into simple substance Cu, thereby obtaining the sodium chloride particles with the surfaces coated with Cu.
Preferably, the Cu (NO) of the present invention3)2Cu (NO) in acetone solution3)2The amount of (2) is (20-110) g/100 g.
Preferably, the sodium chloride particles in step (1) of the present invention have a particle size of 0.05-1mm, and the sodium chloride particles are mixed with Cu (NO)3)2The mass ratio of the acetone solution is 0.5:1-2:1, and the ultrasonic vibration time is 30-60 minutes.
Preferably, the low-temperature baking conditions in step (2) of the present invention are: baking at 50 deg.C for 30-120 min.
Preferably, the heating conditions in step (3) of the present invention are: keeping the temperature at 300 ℃ and 450 ℃ for 1-3 hours.
Preferably, the reduction temperature of CuO in the step (4) of the invention is 400-.
The sodium chloride particles of the invention are commercial industrial salts or sea salts.
The principle of the invention is as follows:
(1) the selection principle of the acetone organic solvent is as follows: in the aspect of solvent selection, since NaCl is a water-soluble salt, the solubility in water is very high, the melting point is low, and the sodium chloride particle surface is difficult to coat in the presence of water, and only the sodium chloride particle surface is treated in an organic solvent which does not dissolve NaCl. In addition, because copper and aluminum melt are mutually wet, surface coating of copper is a reasonable way for surface modification of sodium chloride particles, and an organic solvent capable of dissolving copper salt needs to be selected. In summary, acetone is an organic solvent that can dissolve NaCl but copper salts, and thus acetone is selected as the organic solvent of the present invention.
(2) The principle of copper cladding on the surface of sodium chloride particles is as follows: adding proper amount of Cu (NO)3)2Dissolving in acetone solution to obtain Cu (NO)3)2In acetone solution, and then placing sodium chloride particles into Cu (NO)3)2Stirring in acetone solution and ultrasonic vibrating to make sodium chloride particles in Cu (NO)3)2Fully soaking in an acetone solution; then drying at low temperature of 50 ℃ to volatilize acetone, and screening to obtain the coated Cu (NO)3)2·3H2Sodium chloride particles of O; heating at high temperature to make Cu (NO)3)2·3H2Decomposing O to obtain CuO; CuO is heated in a reducing atmosphere and is changed into a Cu simple substance after being kept warm for a period of time.
Volatilization of acetone solvent: acetone (CH)3COCH3) Is an organic solvent which is colorless liquid at normal temperature, is easy to dissolve in water, has a melting point of-94.9 ℃ and a boiling point of 56.53 ℃, can volatilize at a lower temperature, and can ensure that Cu (Cu)NO3)2Supersaturated precipitation, and Cu (NO) precipitated due to the large specific surface area of sodium chloride particles3)2Can be deposited on the surface of sodium chloride particles to realize Cu (NO)3)2·3H2And (3) coating the sodium chloride particles by O.
Cu(NO3)2·3H2Thermal decomposition of O Cu (NO)3)2·3H2Melting O at 118 deg.C, removing crystal water at 203 deg.C, and converting into HNO3And Cu (NO)3)2·3Cu(OH)2And the final product CuO is completely decomposed at about 310 ℃, and the reaction is as follows:
Cu(NO3)2·3H2O→1/4Cu(NO3)2·3Cu(OH)2+2/3H2O+3/2 HNO3（1）
1/4Cu(NO3)2·3Cu(OH)2+3/2 HNO3→1/2O2+3/2H2O+CuO +2NO2（2）
and (3) total reaction: cu (NO)3)2·3H2O→CuO↓+2NO2↑+1/2O2↑+3H2O（3）
Experiments prove that the Cu (NO) can be ensured by keeping the temperature at 300-450 ℃ for 1-3 hours3)2·3H2O decomposes to CuO.
(3) Reduction of CuO
The reaction that occurs when hydrogen reduces copper oxide is:
CuO（s） + H2（g）→H2O （g）+ Cu （4）
according to thermodynamic calculation, within the temperature range of 25-527 ℃, the Gibbs free energy change values of the copper oxide reduced by the hydrogen in the formula (4) are all negative, which indicates that the reaction can spontaneously proceed; through experiments, the reduction temperature of reducing CuO into copper is 400-500 ℃, and the reduction time is 2-4 hours.
The invention has the advantages of
Aiming at the problem of difficulty in preparing porous aluminum with a micro-pore structure through hole, the invention adopts a copper-clad treatment technology for the surface of micro sodium chloride particles based on an acetone solvent; has the following advantages:
（1）Cu(NO3)2mixing acetone solution with sodium chloride particles, baking at low temperature, heating for decomposition, and reacting with H2The sodium chloride particles with copper coated on the surface are obtained by reduction, the problem that the water-soluble sodium chloride particles are coated with copper is solved, the process is simple and easy to operate, and the sodium chloride particles have deeper and wider application in future development.
(2) The technology of coating copper on the surface of sodium chloride particles with the diameter of less than 1mm can prepare the porous aluminum with high porosity and small aperture, enriches the method for preparing the porous aluminum with the through holes, and provides a certain basis for realizing industrialized and continuous production.
Drawings
FIG. 1 is a process flow chart of copper coating on the surface of sodium chloride particles.
Detailed Description
The invention will be described in more detail with reference to the following figures and examples, but the scope of the invention is not limited thereto.
Example 1
A method for coating copper on the surface of sodium chloride particles is characterized by comprising the following steps:
（1）Cu(NO3)2preparing an acetone solution: according to Cu (NO)3)2Mixing with acetone solution with concentration of 20g/100g, and adding Cu (NO)3)2Adding into acetone, and stirring to make Cu (NO)3)2Dissolving in acetone to obtain Cu (NO)3)2In acetone.
(2) Mixing sodium chloride particles: adding the following components in percentage by weight according to the addition amount of sodium chloride particles: cu (NO)3)2Acetone solution mass =0.5, and commercial industrial salt having a particle size of 0.05mm is added to Cu (NO) obtained in step (2)3)2Stirring in acetone solution, and ultrasonic vibrating for 60 min to make sodium chloride particles in Cu (NO)3)2Fully soaking in acetone solution.
(3) Baking and volatilizing acetone: NaCl-Cu (NO) obtained in the step (2)3)2Baking the acetone solution at 50 deg.C for 30 min to volatilize acetone to obtain Cu-coated productNO3)2·3H2Sodium chloride particles of O.
（4）Cu(NO3)2Heating and decomposing: coating the Cu (NO) prepared in the step (3)3)2·3H2Heating the sodium chloride particles of O to 300 ℃ and preserving the heat for 3 hours to ensure that Cu (NO) on the surfaces of the sodium chloride particles3)2·3H2The O is decomposed and converted into CuO, and the sodium chloride particles coated with the CuO are obtained.
(5) And (3) CuO reduction: adding the CuO-coated sodium chloride particles obtained in the step (4) into H2Heating to 400 ℃ in the atmosphere, and preserving the heat for 4 hours to reduce CuO into simple substance Cu, thereby obtaining copper-coated sodium chloride particles with the thickness of the copper-coated layer of 5 microns.
Example 2
A method for coating copper on the surface of sodium chloride particles is characterized by comprising the following steps:
（1）Cu(NO3)2preparing an acetone solution: according to Cu (NO)3)2Mixing with acetone solution with concentration of 50g/100g, adding Cu (NO)3)2Adding into acetone, and stirring to make Cu (NO)3)2Dissolving in acetone to obtain Cu (NO)3)2In acetone.
(2) Mixing sodium chloride particles: adding the following components in percentage by weight according to the addition amount of sodium chloride particles: cu (NO)3)2Acetone solution mass =1, and commercial industrial salt with a particle size of 0.2mm is added to Cu (NO) obtained in step (2)3)2Stirring in acetone solution, and ultrasonic vibrating for 50 min to make sodium chloride particles in Cu (NO)3)2Fully soaking in acetone solution.
(3) Baking and volatilizing acetone: NaCl-Cu (NO) obtained in the step (2)3)2Baking the acetone solution at 50 deg.C for 60 min to volatilize acetone to obtain Cu (NO) coated solution3)2·3H2Sodium chloride particles of O.
（4）Cu(NO3)2Heating and decomposing: coating the Cu (NO) prepared in the step (3)3)2·3H2Heating the sodium chloride particles of O to 350Keeping the temperature for 2 hours to ensure that Cu (NO) on the surface of the sodium chloride particles3)2·3H2The O is decomposed and converted into CuO, and the sodium chloride particles coated with the CuO are obtained.
(5) And (3) CuO reduction: adding the CuO-coated sodium chloride particles obtained in the step (4) into H2Heating to 430 ℃ in the atmosphere, and preserving the heat for 3 hours to reduce CuO into simple substance Cu, thereby obtaining copper-coated sodium chloride particles with the thickness of a copper-coated layer of 10 microns.
Example 3
A method for coating copper on the surface of sodium chloride particles is characterized by comprising the following steps:
（1）Cu(NO3)2preparing an acetone solution: according to Cu (NO)3)2Mixing with acetone solution with concentration of 80g/100g, and adding Cu (NO)3)2Adding into acetone, and stirring to make Cu (NO)3)2Dissolving in acetone to obtain Cu (NO)3)2In acetone.
(2) Mixing sodium chloride particles: adding the following components in percentage by weight according to the addition amount of sodium chloride particles: cu (NO)3)2Acetone solution mass =1.5, and commercial industrial salt having a particle size of 0.6mm is added to Cu (NO) obtained in step (2)3)2Stirring in acetone solution, and ultrasonic vibrating for 40 min to make sodium chloride particles in Cu (NO)3)2Fully soaking in acetone solution.
(3) Baking and volatilizing acetone: NaCl-Cu (NO) obtained in the step (2)3)2Baking the acetone solution at 50 deg.C for 90 min to volatilize acetone to obtain Cu (NO) coated solution3)2·3H2Sodium chloride particles of O.
(4) Cu (NO3)2 thermal decomposition: coating the Cu (NO) prepared in the step (3)3)2·3H2Heating the sodium chloride particles of O to 400 ℃ and preserving the heat for 1.5 hours to ensure that Cu (NO) on the surfaces of the sodium chloride particles3)2·3H2The O is decomposed and converted into CuO, and the sodium chloride particles coated with the CuO are obtained.
(5) And (3) CuO reduction: adding the CuO-coated sodium chloride particles obtained in the step (4) into H2Heating to 470 ℃ in the atmosphere, and preserving the heat for 2.5 hours to reduce CuO into simple substance Cu, thereby obtaining copper-coated sodium chloride particles with the thickness of a copper-coated layer of 15 microns.
Example 4
A method for coating copper on the surface of sodium chloride particles is characterized by comprising the following steps:
（1）Cu(NO3)2preparing an acetone solution: according to Cu (NO)3)2Preparing the acetone solution with the concentration of 110g/100g, and adding Cu (NO)3)2Adding into acetone, and stirring to make Cu (NO)3)2Dissolving in acetone to obtain Cu (NO)3)2In acetone.
(2) Mixing sodium chloride particles: adding the following components in percentage by weight according to the addition amount of sodium chloride particles: cu (NO)3)2The acetone solution mass =2 was dosed, and commercial industrial salt having a particle size of 1mm was put in the Cu (NO) obtained in step (2)3)2Stirring in acetone solution, and ultrasonic vibrating for 30 min to make sodium chloride particles in Cu (NO)3)2Fully soaking in acetone solution.
(3) Baking and volatilizing acetone: NaCl-Cu (NO) obtained in the step (2)3)2Baking the acetone solution at 50 deg.C for 120 min to volatilize acetone to obtain Cu (NO) coated solution3)2·3H2Sodium chloride particles of O.
（4）Cu(NO3)2Heating and decomposing: coating the Cu (NO) prepared in the step (3)3)2·3H2Heating the sodium chloride particles of O to 450 ℃ and preserving the heat for 1 hour to ensure that Cu (NO) on the surfaces of the sodium chloride particles3)2·3H2The O is decomposed and converted into CuO, and the sodium chloride particles coated with the CuO are obtained.
(5) And (3) CuO reduction: adding the CuO-coated sodium chloride particles obtained in the step (4) into H2Heating to 500 ℃ in the atmosphere, and preserving the heat for 2 hours to reduce CuO into simple substance Cu, thereby obtaining copper-coated sodium chloride particles with the thickness of the copper-coated layer being 20 microns.
NaCl does not dissolve in propanol, but Cu (NO) in the examples of the invention3)2In propanolHas high solubility, and uses propanol as solvent to dissolve Cu (NO)3)2Adding NaCl, heating to volatilize propanol, and heating to high temperature to volatilize Cu (NO)3)2Decomposing the sodium chloride into CuO, and reducing the CuO into simple substance Cu in reducing atmosphere to finally obtain copper-coated sodium chloride particles; by adopting the copper-coated sodium chloride particles treated by the method as the seepage precursor, as the wetting angle of copper and aluminum melt at the seepage temperature is less than 90 degrees and the wettability is good, the aluminum melt can smoothly permeate into gaps of superfine sodium chloride particles, and the preparation problem of the porous aluminum with the through hole with the superfine aperture (less than 1 mm) is solved.
Claims (6)
1. A method for coating copper on the surface of sodium chloride particles is characterized by comprising the following steps:
(1) adding Cu (NO)3)2Dissolving in acetone to obtain Cu (NO)3)2By adding sodium chloride particles to Cu (NO)3)2Stirring in acetone solution, and ultrasonic vibrating to make sodium chloride particles in Cu (NO)3)2Fully soaking in an acetone solution;
(2) mixing NaCl-Cu (NO)3)2Baking acetone solution at low temperature to volatilize acetone to obtain Cu (NO) coated product3)2·3H2Sodium chloride particles of O;
(3) coating the Cu (NO) prepared in the step (2)3)2·3H2Heating the sodium chloride particles of O to make Cu (NO) on the surfaces of the sodium chloride particles3)2·3H2Decomposing O into CuO to obtain CuO-coated sodium chloride particles;
(4) sodium chloride particles coated with CuO are put in H2Heating and preserving heat in the atmosphere to reduce CuO into simple substance Cu, thereby obtaining the sodium chloride particles with the surfaces coated with Cu.
2. The method of claim 1, wherein the sodium chloride particles are coated with copper on the surface, and wherein: cu (NO)3)2Cu (NO) in acetone solution3)2The amount of (2) added is (20-110) g/100 g.
3. The method of claim 1, wherein the sodium chloride particles are coated with copper on the surface, and wherein: the sodium chloride particles in the step (1) have the particle size of 0.05-1mm, and are mixed with Cu (NO)3)2The mass ratio of the acetone solution is 0.5:1-2:1, and the ultrasonic vibration time is 30-60 minutes.
4. The method of claim 1, wherein the sodium chloride particles are coated with copper on the surface, and wherein: the low-temperature baking conditions in the step (2) are as follows: baking at 50 deg.C for 30-120 min.
5. The method of claim 1, wherein the sodium chloride particles are coated with copper on the surface, and wherein: the heating conditions in the step (3) are as follows: keeping the temperature at 300 ℃ and 450 ℃ for 1-3 hours.
6. The method of claim 1, wherein the sodium chloride particles are coated with copper on the surface, and wherein: the reduction temperature of the CuO in the step (4) is 400-500 ℃, the reduction time is 2-4 hours, and the thickness of the obtained copper cladding is 5-20 microns.
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| CN113102751B (en) | 2022-09-09 |
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