CN113092911B - Temperature acceleration reference stress determination method in accelerated life test of space electronic equipment - Google Patents
Temperature acceleration reference stress determination method in accelerated life test of space electronic equipment Download PDFInfo
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- CN113092911B CN113092911B CN202110372431.0A CN202110372431A CN113092911B CN 113092911 B CN113092911 B CN 113092911B CN 202110372431 A CN202110372431 A CN 202110372431A CN 113092911 B CN113092911 B CN 113092911B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/005—Testing of electric installations on transport means
- G01R31/008—Testing of electric installations on transport means on air- or spacecraft, railway rolling stock or sea-going vessels
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- G—PHYSICS
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- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
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Abstract
The application belongs to the technical field of electronic equipment, and discloses a temperature acceleration reference stress determining method in a space electronic equipment acceleration life test, wherein the temperature acceleration reference stress determining system in the space electronic equipment acceleration life test comprises the following steps: the device comprises an accelerated life test module, a temperature data acquisition module, a central control module, a communication module, a temperature data summarizing module, a section demarcating module, a time-temperature correlation module, a reliability judging module, an equivalent transformation module and a reference stress determining module. According to the application, the time-temperature correlation module is used for demarcating the interval of the test time and correlating the time with the temperature to obtain a plurality of time intervals, so that the reliability analysis is more accurate, and the obtained reference stress is more reliable. The method is convenient to operate, has good accuracy of data acquisition, and accurately determines the temperature acceleration reference stress, so that the acceleration coefficient and the final reliability evaluation result can be accurately determined.
Description
Technical Field
The application belongs to the technical field of electronic equipment, and particularly relates to a temperature acceleration reference stress determination method in a space electronic equipment acceleration life test.
Background
At present: reliability prediction is a work performed for estimating the reliability of a product under given working conditions, and one of the main purposes is to provide basis for researches on reliability growth tests, authentication tests, cost accounting and the like. From this object, it appears that it is crucial to provide accurate reliability prediction results for the product. For electronic products, reliability prediction is typically the calculation of the reliability of the product.
As an electronic product, a space electronic device adopts a stress analysis method to conduct reliability prediction, and a stress value during the working process of the space electronic device should be constant to calculate according to a reliability index formula, so that more practical situations are: the electric stress value is constant during the operation of the space electronic equipment, the environmental stress value is changed, and the environmental stress suffered by the space electronic equipment also presents periodic change along with the periodic change of the attitude and the orbit position of the spacecraft, so that the periodic change of the working environment temperature which has important influence on the on-orbit reliability of the space electronic equipment is particularly remarkable. The reliability is pre-calculated in space electronic equipment by adopting a stress analysis method, and the current method in the field of aerospace at home and abroad is as follows: the electric stress takes its actual value due to the constant, and the working environment temperature takes its maximum value due to the variation, i.e. the working environment temperature takes its maximum value and is regarded as constant temperature. It is clear that the reliability prediction results obtained in this way are inaccurate and very conservative, especially when the range of operating environment temperature is very wide, the drawbacks of using this method are more evident. The current method for determining the temperature acceleration reference stress in the accelerated life test of the space electronic equipment is high in cost and complex in operation.
Through the above analysis, the problems and defects existing in the prior art are as follows: the current method for determining the temperature acceleration reference stress in the accelerated life test of the space electronic equipment is high in cost and complex in operation.
Disclosure of Invention
Aiming at the problems existing in the prior art, the application provides a temperature acceleration reference stress determination method in a space electronic equipment acceleration life test.
The application is realized in such a way that a temperature acceleration reference stress determining method in a space electronic equipment acceleration life test comprises the following steps:
step one, an accelerated life test module is used for carrying out an accelerated life test on electronic equipment by utilizing an accelerated life test program; the central control module controls each module to normally operate by using the main control computer;
acquiring the ambient temperature of the accelerated life test of the space electronic equipment by using a temperature sensor arranged in the space electronic equipment through a temperature data acquisition module to obtain temperature data; the communication module is used for communicating by utilizing wireless communication equipment to transmit temperature data;
the communication is carried out by utilizing wireless communication equipment through a communication module, and temperature data are transmitted, and the method comprises the following steps:
(2.1) acquiring temperature data;
(2.2) determining the value of the access capacity parameter adopted in the process of transmitting the temperature data according to the mapping relation between the load parameter of the temperature data and the access capacity parameter;
(2.3) the network side equipment obtains the value of the access capability parameter adopted when transmitting the temperature data according to the mapping relation;
(2.4) transmitting temperature data according to the value of the access capability parameter;
step three, summarizing the acquired temperature data by using a temperature data summarizing program through a temperature data summarizing module to obtain temperature data corresponding to different time points in an accelerated life test, and obtaining time and temperature corresponding information;
step four, a time interval of the accelerated life test is defined by a interval definition module through an interval definition program, so that a time interval is obtained; the time-temperature correlation module is used for carrying out correlation between the time interval and the corresponding temperature information according to the time-temperature correlation program and the corresponding temperature information, so as to obtain temperature data in different time intervals;
the time interval and the corresponding temperature information are associated by the time-temperature association module according to the time-temperature association program and the corresponding temperature information, and the method comprises the following steps:
(4.1) acquiring time and temperature corresponding information;
(4.2) reading the obtained time and temperature corresponding information piece by piece;
(4.3) traversing all the read data, and judging whether the read data has the same data as the current read data;
(4.4) if the same data exist, assigning id of the read same data to the current read data to obtain temperature data in different time intervals;
analyzing temperature data in different time intervals by using a reliability judging program through a reliability judging module, and judging the reliability of the acquired data through an analysis result to obtain a conclusion of whether the acquired data are reliable or not;
the analysis of the temperature data in different time intervals is carried out by the reliability judging module by utilizing the reliability judging program, and the reliability of the collected data is judged by the analysis result, so that the conclusion of whether the collected data is reliable or not is obtained comprises the following steps:
(5.1) constructing a plurality of reliability analysis models according to a plurality of characteristic combinations comprising temperature data sub-characteristics;
(5.2) acquiring temperature data to be analyzed, which are the same as the sub-feature types of the temperature data; grouping the temperature data to be analyzed according to the characteristic combination to form a plurality of temperature data combinations to be analyzed;
(5.3) inputting the temperature data to be analyzed into the reliability analysis model in a combined way to obtain a plurality of reliability analysis results;
(5.4) fusing the reliability analysis results to obtain a final reliability analysis result;
step six, performing equivalent transformation of the test space temperature by an equivalent transformation module through an equivalent transformation program to obtain constant temperature; the determination of the reference stress is performed by the reference stress determination module using a reference stress determination program.
Further, the access capability parameter is derived from an unlicensed frequency band.
In the fourth step, the step of demarcating the time zone of the accelerated lifetime test by the demarcation module using a demarcation program includes:
1) Acquiring information corresponding to the acquired time and temperature;
2) Extracting information corresponding to the acquired time and temperature to obtain the acquired time length;
3) Dividing the time length into equal N parts;
4) And dividing the acquired time and temperature corresponding information to obtain N time intervals.
Further, the time length is the total time of the accelerated life test of the electronic equipment.
Further, the N is a natural number.
In the sixth step, the equivalent transformation module performs equivalent transformation of the test space temperature by using an equivalent transformation program, including: on the premise of unchanged reliability, the working environment temperature is equivalently converted into a constant working environment temperature.
Further, in step six, the determining of the reference stress by the reference stress determining module using a reference stress determining program includes determining the reference stress by a constant operating environment temperature.
Another object of the present application is to provide a temperature acceleration reference stress determining system in a space electronic device accelerated lifetime test for implementing the temperature acceleration reference stress determining method in a space electronic device accelerated lifetime test, the temperature acceleration reference stress determining system in a space electronic device accelerated lifetime test comprising:
the system comprises an accelerated life test module, a temperature data acquisition module, a central control module, a communication module, a temperature data summarizing module, a section demarcating module, a time-temperature association module, a reliability judging module, an equivalent transformation module and a reference stress determining module;
the accelerated life test module is connected with the central control module and is used for carrying out accelerated life test on the electronic equipment through an accelerated life test program;
the temperature data acquisition module is connected with the central control module and is used for acquiring the ambient temperature of the accelerated life test of the space electronic equipment through a temperature sensor arranged in the space electronic equipment to obtain temperature data;
the central control module is connected with the accelerated life test module, the temperature data acquisition module, the communication module, the temperature data summarizing module, the interval demarcating module, the time-temperature correlation module, the reliability judging module, the equivalent transformation module and the reference stress determining module and used for controlling the normal operation of each module through the main control computer;
the communication module is connected with the central control module and used for communicating through wireless communication equipment and transmitting temperature data;
the temperature data summarizing module is connected with the central control module and is used for summarizing the temperature data acquired through a temperature data summarizing program to obtain temperature data corresponding to different time points in an accelerated life test and obtain time and temperature corresponding information;
the interval demarcation module is connected with the central control module and is used for demarcating a time interval of the accelerated life test through an interval demarcation program to obtain the time interval;
the time-temperature association module is connected with the central control module and is used for carrying out association between the time interval and the corresponding temperature information according to the time-temperature association program and obtaining temperature data in different time intervals;
the reliability judging module is connected with the central control module and is used for analyzing temperature data in different time intervals through a reliability judging program and judging the reliability of the acquired data through an analysis result to obtain a conclusion of whether the acquired data are reliable or not;
the equivalent transformation module is connected with the central control module and is used for carrying out equivalent transformation on the temperature of the test space through an equivalent transformation program to obtain constant temperature;
and the reference stress determining module is connected with the central control module and is used for determining the reference stress through a reference stress determining program.
It is another object of the present application to provide a computer program product stored on a computer readable medium, comprising a computer readable program for providing a user input interface for implementing a temperature acceleration reference stress determination method in an accelerated lifetime test of a spatial electronic device when executed on an electronic device.
Another object of the present application is to provide a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the method for determining a temperature acceleration reference stress in an accelerated lifetime test of a space electronic device.
By combining all the technical schemes, the application has the advantages and positive effects that: according to the application, through temperature data acquisition and summarization, the acquisition of temperature information of a test environment in the accelerated life test process is realized; the time-temperature correlation module is used for demarcating the interval of the test time and correlating the time with the temperature to obtain a plurality of time intervals, so that the reliability analysis is more accurate, and the obtained reference stress is more reliable. The method is convenient to operate, has good accuracy of data acquisition, and accurately determines the temperature acceleration reference stress, so that the acceleration coefficient and the final reliability evaluation result can be accurately determined.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for determining a temperature acceleration reference stress in a test for accelerated lifetime of a space electronic device according to an embodiment of the present application.
Fig. 2 is a block diagram of a temperature acceleration reference stress determining system in an accelerated lifetime test of a space electronic device according to an embodiment of the present application.
Fig. 3 is a flowchart of a communication module for communicating with a wireless communication device and transmitting temperature data according to an embodiment of the present application.
Fig. 4 is a flowchart of a time interval demarcation procedure for an accelerated lifetime test by a demarcation module according to an embodiment of the present application.
Fig. 5 is a flowchart of a correlation between a time interval and corresponding temperature information according to time and temperature corresponding information by a time-temperature correlation module according to an embodiment of the present application.
In fig. 2: 1. an accelerated life test module; 2. a temperature data acquisition module; 3. a central control module; 4. a communication module; 5. a temperature data summarizing module; 6. a section demarcation module; 7. a time-temperature correlation module; 8. a reliability judging module; 9. an equivalent transformation module; 10. and a reference stress determination module.
Detailed Description
The present application will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Aiming at the problems existing in the prior art, the application provides a temperature acceleration reference stress determining method in a space electronic equipment acceleration life test, and the application is described in detail below with reference to the accompanying drawings.
As shown in fig. 1, the method for determining the temperature acceleration reference stress in the accelerated lifetime test of the space electronic equipment provided by the embodiment of the application comprises the following steps:
s101, performing an accelerated life test on the electronic equipment by using an accelerated life test program through an accelerated life test module; the central control module controls each module to normally operate by using the main control computer;
s102, acquiring the ambient temperature of an accelerated life test of the space electronic equipment by using a temperature sensor arranged in the space electronic equipment through a temperature data acquisition module to obtain temperature data; the communication module is used for communicating by utilizing wireless communication equipment to transmit temperature data;
s103, summarizing the acquired temperature data by using a temperature data summarizing program through a temperature data summarizing module to obtain temperature data corresponding to different time points in an accelerated life test, and obtaining time and temperature corresponding information;
s104, a section demarcation module uses a section demarcation program to demarcate a time section of the accelerated life test to obtain a time section; the time-temperature correlation module is used for carrying out correlation between the time interval and the corresponding temperature information according to the time-temperature correlation program and the corresponding temperature information, so as to obtain temperature data in different time intervals;
s105, analyzing temperature data in different time intervals by using a reliability judging program through a reliability judging module, and judging the reliability of the acquired data through an analysis result to obtain a conclusion of whether the acquired data is reliable or not;
s106, performing equivalent transformation of the test space temperature by an equivalent transformation module through an equivalent transformation program to obtain a constant temperature; the determination of the reference stress is performed by the reference stress determination module using a reference stress determination program.
As shown in fig. 2, the temperature acceleration reference stress determining system in the accelerated lifetime test of a space electronic device according to the embodiment of the present application includes:
the system comprises an accelerated life test module 1, a temperature data acquisition module 2, a central control module 3, a communication module 4, a temperature data summarization module 5, a section demarcation module 6, a time-temperature association module 7, a reliability judgment module 8, an equivalent transformation module 9 and a reference stress determination module 10;
the accelerated life test module 1 is connected with the central control module 3 and is used for carrying out accelerated life test on the electronic equipment through an accelerated life test program;
the temperature data acquisition module 2 is connected with the central control module 3 and is used for acquiring the ambient temperature of the accelerated life test of the space electronic equipment through a temperature sensor arranged in the space electronic equipment to obtain temperature data;
the central control module 3 is connected with the accelerated life test module 1, the temperature data acquisition module 2, the communication module 4, the temperature data summarizing module 5, the interval demarcating module 6, the time-temperature association module 7, the reliability judging module 8, the equivalent transformation module 9 and the reference stress determining module 10 and is used for controlling the normal operation of each module through the main control computer;
the communication module 4 is connected with the central control module 3 and is used for communicating through wireless communication equipment and transmitting temperature data;
the temperature data summarizing module 5 is connected with the central control module 3 and is used for summarizing the temperature data acquired through a temperature data summarizing program to obtain temperature data corresponding to different time points in an accelerated life test and obtain time and temperature corresponding information;
the interval demarcation module 6 is connected with the central control module 3 and is used for demarcating a time interval of the accelerated life test through an interval demarcation program to obtain the time interval;
the time-temperature correlation module 7 is connected with the central control module 3 and is used for carrying out correlation between the time interval and the corresponding temperature information according to the time-temperature correlation program and obtaining temperature data in different time intervals;
the reliability judging module 8 is connected with the central control module 3 and is used for analyzing temperature data in different time intervals through a reliability judging program and judging the reliability of the acquired data through an analysis result to obtain a conclusion of whether the acquired data are reliable or not;
the equivalent transformation module 9 is connected with the central control module 3 and is used for carrying out equivalent transformation of the test space temperature through an equivalent transformation program to obtain constant temperature;
the reference stress determination module 10 is connected to the central control module 3 and is used for determining the reference stress through a reference stress determination program.
The technical scheme of the application is further described below with reference to specific embodiments.
Example 1
The method for determining the temperature acceleration reference stress in the accelerated lifetime test of the space electronic equipment provided by the embodiment of the application is shown in fig. 1, and as a preferred embodiment, as shown in fig. 3, the method for communicating by using the wireless communication equipment through the communication module provided by the embodiment of the application, and transmitting temperature data comprises the following steps:
s201, acquiring temperature data;
s202, determining the value of the access capacity parameter adopted in the process of transmitting the temperature data according to the mapping relation between the load parameter of the temperature data and the access capacity parameter;
s203, the network side equipment acquires the value of the access capability parameter adopted when transmitting the temperature data according to the mapping relation;
s204, transmitting the temperature data according to the value of the access capability parameter.
The access capability parameter provided by the embodiment of the application is derived from an unlicensed frequency band.
Example 2
As shown in fig. 1, as a preferred embodiment, as shown in fig. 4, a method for determining a temperature acceleration reference stress in an accelerated lifetime test of a space electronic device according to an embodiment of the present application uses a section defining program to define a time section of the accelerated lifetime test by a section defining module according to an embodiment of the present application, including:
s301, acquiring information corresponding to the acquired time and temperature;
s302, extracting information corresponding to the acquired time and temperature to obtain the acquired time length;
s303, dividing the time length into equal N parts;
s304, dividing the acquired time and temperature corresponding information to obtain N time intervals.
The time length provided by the embodiment of the application is the total time of the accelerated life test of the electronic equipment.
The N provided by the embodiment of the application is a natural number.
Example 3
As shown in fig. 1, as a preferred embodiment, as shown in fig. 5, a method for determining a temperature acceleration reference stress in a test of accelerated lifetime of a space electronic device according to an embodiment of the present application, the method for performing association between a time interval and information of a corresponding temperature according to information of a time and a temperature by using a time-temperature association program by using a time-temperature association module according to an embodiment of the present application includes:
s401, obtaining time and temperature corresponding information;
s402, reading the obtained time and temperature corresponding information piece by piece;
s403, traversing all the read data, and judging whether the read data has the same data as the current read data;
if the same data exists, the id of the read same data is given to the current read data, and the temperature data in different time intervals is obtained in S404.
Example 4
As a preferred embodiment, the method for determining the temperature acceleration reference stress in the accelerated lifetime test of the space electronic equipment provided by the embodiment of the application is shown in fig. 1, and the method for analyzing the temperature data in different time intervals by using the reliability judging program by the reliability judging module and judging the reliability of the acquired data by the analysis result, wherein the method for obtaining the conclusion about whether the acquired data is reliable comprises the following steps:
(5.1) constructing a plurality of reliability analysis models according to a plurality of characteristic combinations comprising temperature data sub-characteristics;
(5.2) acquiring temperature data to be analyzed, which are the same as the sub-feature types of the temperature data; grouping the temperature data to be analyzed according to the characteristic combination to form a plurality of temperature data combinations to be analyzed;
(5.3) inputting the temperature data to be analyzed into the reliability analysis model in a combined way to obtain a plurality of reliability analysis results;
and (5.4) fusing the reliability analysis results to obtain a final reliability analysis result.
Example 5
As a preferred embodiment, the method for determining the temperature acceleration reference stress in the accelerated lifetime test of the space electronic equipment provided by the embodiment of the application is shown in fig. 1, and the method for performing equivalent transformation of the test space temperature by using an equivalent transformation program through an equivalent transformation module provided by the embodiment of the application comprises the following steps: on the premise of unchanged reliability, the working environment temperature is equivalently converted into a constant working environment temperature.
Example 6
The method for determining the reference stress of temperature acceleration in the accelerated life test of the space electronic equipment provided by the embodiment of the application is shown in fig. 1, and as a preferred embodiment, the reference stress determination module provided by the embodiment of the application determines the reference stress by using a reference stress determination program, and the reference stress is determined by a constant working environment temperature.
While the application has been described with respect to what is presently considered to be the most practical and preferred embodiments, it is to be understood that the application is not limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications, equivalents, and alternatives falling within the spirit and scope of the application.
Claims (10)
1. The method for determining the temperature acceleration reference stress in the accelerated life test of the space electronic equipment is characterized by comprising the following steps of:
step one, an accelerated life test module is used for carrying out an accelerated life test on electronic equipment by utilizing an accelerated life test program; the central control module controls each module to normally operate by using the main control computer;
acquiring the ambient temperature of the accelerated life test of the space electronic equipment by using a temperature sensor arranged in the space electronic equipment through a temperature data acquisition module to obtain temperature data; the communication module is used for communicating by utilizing wireless communication equipment to transmit temperature data;
the communication is carried out by utilizing wireless communication equipment through a communication module, and temperature data are transmitted, and the method comprises the following steps:
(2.1) acquiring temperature data;
(2.2) determining the value of the access capacity parameter adopted in the process of transmitting the temperature data according to the mapping relation between the load parameter of the temperature data and the access capacity parameter;
(2.3) the network side equipment obtains the value of the access capability parameter adopted when transmitting the temperature data according to the mapping relation;
(2.4) transmitting temperature data according to the value of the access capability parameter;
step three, summarizing the acquired temperature data by using a temperature data summarizing program through a temperature data summarizing module to obtain temperature data corresponding to different time points in an accelerated life test, and obtaining time and temperature corresponding information;
step four, a time interval of the accelerated life test is defined by a interval definition module through an interval definition program, so that a time interval is obtained; the time-temperature correlation module is used for carrying out correlation between the time interval and the corresponding temperature information according to the time-temperature correlation program and the corresponding temperature information, so as to obtain temperature data in different time intervals;
the time interval and the corresponding temperature information are associated by the time-temperature association module according to the time-temperature association program and the corresponding temperature information, and the method comprises the following steps:
(4.1) acquiring time and temperature corresponding information;
(4.2) reading the obtained time and temperature corresponding information piece by piece;
(4.3) traversing all the read data, and judging whether the read data has the same data as the current read data;
(4.4) if the same data exist, assigning id of the read same data to the current read data to obtain temperature data in different time intervals;
analyzing temperature data in different time intervals by using a reliability judging program through a reliability judging module, and judging the reliability of the acquired data through an analysis result to obtain a conclusion of whether the acquired data are reliable or not;
the analysis of the temperature data in different time intervals is carried out by the reliability judging module by utilizing the reliability judging program, and the reliability of the collected data is judged by the analysis result, so that the conclusion of whether the collected data is reliable or not is obtained comprises the following steps:
(5.1) constructing a plurality of reliability analysis models according to a plurality of characteristic combinations comprising temperature data sub-characteristics;
(5.2) acquiring temperature data to be analyzed, which are the same as the sub-feature types of the temperature data; grouping the temperature data to be analyzed according to the characteristic combination to form a plurality of temperature data combinations to be analyzed;
(5.3) inputting the temperature data to be analyzed into the reliability analysis model in a combined way to obtain a plurality of reliability analysis results;
(5.4) fusing the reliability analysis results to obtain a final reliability analysis result;
step six, performing equivalent transformation of the test space temperature by an equivalent transformation module through an equivalent transformation program to obtain constant temperature; the determination of the reference stress is performed by the reference stress determination module using a reference stress determination program.
2. The method for determining temperature acceleration reference stress in accelerated life test of space electronic equipment according to claim 1, wherein the access capability parameter is derived from an unlicensed frequency band.
3. The method for determining temperature acceleration reference stress in an accelerated lifetime test of a space electronic device according to claim 1, wherein in the fourth step, the demarcation of the time interval of the accelerated lifetime test by the demarcation module using a demarcation program comprises:
1) Acquiring information corresponding to the acquired time and temperature;
2) Extracting information corresponding to the acquired time and temperature to obtain the acquired time length;
3) Dividing the time length into equal N parts;
4) And dividing the acquired time and temperature corresponding information to obtain N time intervals.
4. The method for determining temperature acceleration reference stress in an accelerated lifetime test of a spatial electronic device of claim 3, wherein the length of time is a total time of the accelerated lifetime test of the electronic device.
5. The method for determining temperature acceleration reference stress in an accelerated lifetime test of a space electronic device according to claim 3, wherein N is a natural number.
6. The method for determining temperature acceleration reference stress in an accelerated lifetime test of a space electronic device according to claim 1, wherein in step six, the equivalent transformation of the test space temperature by the equivalent transformation module using an equivalent transformation program comprises: on the premise of unchanged reliability, the working environment temperature is equivalently converted into a constant working environment temperature.
7. The method for determining a reference stress for temperature acceleration in an accelerated life test of a space electronic device according to claim 1, wherein in the step six, the determining of the reference stress by the reference stress determining module using a reference stress determining program includes determining the reference stress by a constant working environment temperature.
8. A temperature acceleration reference stress determining system in a space electronic device accelerated lifetime test for implementing the temperature acceleration reference stress determining method in a space electronic device accelerated lifetime test according to any one of claims 1 to 7, characterized in that the temperature acceleration reference stress determining system in a space electronic device accelerated lifetime test comprises:
the system comprises an accelerated life test module, a temperature data acquisition module, a central control module, a communication module, a temperature data summarizing module, a section demarcating module, a time-temperature association module, a reliability judging module, an equivalent transformation module and a reference stress determining module;
the accelerated life test module is connected with the central control module and is used for carrying out accelerated life test on the electronic equipment through an accelerated life test program;
the temperature data acquisition module is connected with the central control module and is used for acquiring the ambient temperature of the accelerated life test of the space electronic equipment through a temperature sensor arranged in the space electronic equipment to obtain temperature data;
the central control module is connected with the accelerated life test module, the temperature data acquisition module, the communication module, the temperature data summarizing module, the interval demarcating module, the time-temperature correlation module, the reliability judging module, the equivalent transformation module and the reference stress determining module and used for controlling the normal operation of each module through the main control computer;
the communication module is connected with the central control module and used for communicating through wireless communication equipment and transmitting temperature data;
the temperature data summarizing module is connected with the central control module and is used for summarizing the temperature data acquired through a temperature data summarizing program to obtain temperature data corresponding to different time points in an accelerated life test and obtain time and temperature corresponding information;
the interval demarcation module is connected with the central control module and is used for demarcating a time interval of the accelerated life test through an interval demarcation program to obtain the time interval;
the time-temperature association module is connected with the central control module and is used for carrying out association between the time interval and the corresponding temperature information according to the time-temperature association program and obtaining temperature data in different time intervals;
the reliability judging module is connected with the central control module and is used for analyzing temperature data in different time intervals through a reliability judging program and judging the reliability of the acquired data through an analysis result to obtain a conclusion of whether the acquired data are reliable or not;
the equivalent transformation module is connected with the central control module and is used for carrying out equivalent transformation on the temperature of the test space through an equivalent transformation program to obtain constant temperature;
and the reference stress determining module is connected with the central control module and is used for determining the reference stress through a reference stress determining program.
9. A computer program product stored on a computer readable medium, comprising a computer readable program for, when executed on an electronic device, providing a user input interface to implement a method of determining a temperature acceleration reference stress in an accelerated life test of a spatial electronic device according to any of claims 1-7.
10. A computer readable storage medium storing instructions that when run on a computer cause the computer to perform the temperature acceleration reference stress determination method in the accelerated life test of a space electronic device according to any one of claims 1-7.
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