CN113077449B - Image detection method for corner defects of rectangular wafer - Google Patents
Image detection method for corner defects of rectangular wafer Download PDFInfo
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- CN113077449B CN113077449B CN202110375654.2A CN202110375654A CN113077449B CN 113077449 B CN113077449 B CN 113077449B CN 202110375654 A CN202110375654 A CN 202110375654A CN 113077449 B CN113077449 B CN 113077449B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G06T7/00—Image analysis
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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Abstract
The invention provides an image detection method for corner defects of a rectangular wafer, which is used for respectively detecting four corner images of the rectangular wafer after pretreatment, firstly obtaining corner edge coordinate series of the corner images, then obtaining judgment series according to the corner edge coordinate series, and finally judging whether the wafer has the corner defects or not according to the numerical value of the judgment series. The invention solves the evaluation series through the same wafer, is based on the self-comparison of the same wafer, overcomes the detection error generated by the angle difference of different wafers, can be widely applied to the wafer angle defect detection of polished surfaces, semi-corrosion and total corrosion, has the advantages of high detection speed and accuracy and no need of training and learning, and can meet the requirements of high-speed and high-precision wafer defect detection instruments and equipment.
Description
Technical Field
The invention belongs to the technical field of image detection, relates to a detection method of high-speed and high-precision defect detection instrument equipment, and particularly relates to an image detection method of corner defects of a rectangular wafer.
Background
In an industrial production process, a machine vision method is generally adopted to judge whether the surface of a product has defects. Due to differences in manufacturing processes, batches and corrosion degrees, the corners of the rectangular wafers are not sharp, have a certain radian and the radian is variable, and the angular radians of different types of rectangular wafers and even of the same type of rectangular wafers all have a certain difference. The angular arc of a rectangular wafer is not a constant value, but fluctuates within a certain range. On the other hand, corner defects of rectangular wafers tend to be only one or two pixels in size, commensurate with the range of angular radian fluctuations. The detection of angular defects is greatly disturbed by the fluctuation of the angular radian. The traditional defect detection technology mainly depends on filtering and feature extraction methods, cannot eliminate the influence of angular radian fluctuation, and is difficult to provide an effective angular defect detection result. The defect detection technology based on the learning algorithm is low in calculation speed, needs a large amount of training and learning, and is difficult to meet the speed requirement of high-speed defect detection instruments and equipment.
Disclosure of Invention
The invention provides an image detection method for corner defects of a rectangular wafer, which aims to solve the defects of the prior art.
In order to achieve the above object, the present invention provides an image detecting method for corner defects of a rectangular wafer, which detects four corner images of the rectangular wafer, which have been preprocessed, respectively, and determines whether there is a defect at each of the four corners of the rectangular wafer, wherein the positions of corner vertices of the rectangular wafer in the four corner images of the rectangular wafer, which have been preprocessed, are the same, and a bisector of a corner passes through a midpoint of the corner image and is vertical or horizontal, the image detecting method comprising the steps of:
the method comprises the following steps that firstly, according to the fact that an angle bisector is vertical, all rows of pixel points of an angle image are selected to be searched according to the sequence of the rows, the row number of the pixel point which reaches a given threshold value in the first row is searched, all the row numbers are arranged according to the sequence of the rows, and an angle edge coordinate series is obtained; or the like, or, alternatively,
according to the fact that the angular bisector is horizontal, selecting to search pixel points of all rows of the angular image according to the row sequence, searching for a column number of a pixel point of each row reaching a given threshold value firstly, and arranging all the column numbers according to the row sequence to obtain an angular edge coordinate number sequence;
step two, rearranging all data of the corner edge coordinate series according to the sequence numbers of the data from large to small to obtain a corner edge symmetric coordinate series;
thirdly, taking the maximum value or the minimum value of the data with the same sequence number in the corner edge coordinate array and the corner edge symmetric coordinate array to obtain a corner edge standard coordinate array;
calculating the absolute value of the difference value of the data with the same sequence number in the angle edge coordinate series and the angle edge standard coordinate series to obtain a judgment series, and judging that a defect exists if the maximum value of the judgment series exceeds a given threshold;
and step five, repeating the steps for the other three corner images of the rectangular wafer.
Further, in the first step, the line number of the pixel point which reaches the given threshold in the first column or the line number of the pixel point which reaches the given threshold in the first row is obtained through interpolation operation of the pixel point which exceeds the given threshold in the first step and the previous pixel point.
Further, the method comprises a sixth step of calculating the average value of data with the same serial number in the standard coordinate series of the corner edges of the four corner images of the rectangular wafer to obtain an average value series; and respectively calculating the absolute value of the difference value of the data with the same serial number in the corner edge coordinate array and the mean value array of the four corner images of the rectangular wafer to obtain a second judgment array, and judging that the defect exists if the maximum value of the second judgment array exceeds a given threshold value.
The invention obtains the result of whether the wafer has corner defects or not by obtaining the corner edge data of the four corner images of the rectangular wafer and carrying out self-comparison and mutual comparison.
The invention has the following beneficial effects:
even if there are differences in manufacturing processes, lots, and degrees of etching, two sides of the corners of a rectangular wafer are similar, and four corners of the same rectangular wafer are similar. The invention utilizes the characteristic to obtain the result of whether the wafer has corner defects or not by self-comparing and mutually comparing the images of the four corners of the rectangular wafer; the invention is based on the self-comparison of the same rectangular wafer, and can self-adapt to the angle difference of different rectangular wafers and eliminate the error generated by the angle difference.
In addition, the method has the advantages of simplicity, less calculation amount, capability of meeting the speed requirement of high-speed defect detection instruments and equipment and the like.
The present invention will be described in further detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a flowchart of an image inspection method for corner defects of a rectangular wafer according to example 1 of the present invention;
FIG. 2 is a diagram of a rectangular wafer and four corner images thereof that have been preprocessed according to example 1 of the present invention;
FIG. 3 is a diagram showing the coordinate series of four corner edges obtained in example 1 of the present invention;
FIG. 4 is a series of symmetric coordinates of four corner edges obtained in example 1 of the present invention;
FIG. 5 is a standard coordinate array of four corner edges obtained in example 1 of the present invention;
FIG. 6 is a series of four judgments obtained in example 1 of the present invention;
FIG. 7 is a graph of the mean values obtained in example 1 of the present invention;
FIG. 8 shows the two four evaluation sequences obtained in example 1 of the present invention.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
Example 1
An image detection method for corner defect of rectangular wafer comprises preprocessing four corner images P of the rectangular wafer shown in FIG. 2k(k is 1,2,3,4) and the four corners of the rectangular wafer are detected and judged whether there is a defect or not, and the four corner image P iskThe following pretreatment has been carried out: for the example where the angular vertex positions of the rectangular wafers are the same and the bisector is through the midpoint of the angular image and the bisector is vertical, the steps of the image inspection method are described as follows:
s1, setting PkIs a pixel of
Wherein r and c are respectively a row number and a column number,
let k equal to 1, take the angle image PkSearching from top to bottomThe row number of the first pixel in each column reaching the given threshold T-30
Namely, it is
The conditions are satisfied:
wherein
Then by means of a first pixel point exceeding a given threshold T
And the previous pixel point
By interpolation operation
All of
Arranging in the order of columns to obtain the coordinate series of corner edge
S2, rearranging all data of the corner edge coordinate series according to the sequence numbers from big to small to obtain the corner edge symmetric coordinate series
S3 corner edge coordinate series LkNumber series D of symmetric coordinates of corner edgeskObtaining the corner edge standard coordinate series by the minimum value of the data with the same sequence number
S4, calculating the corner edge coordinate series LkArray of standard coordinates S with corner edgekObtaining the evaluation sequence by the absolute value of the difference value of the data with the same sequence number
If the maximum value of the evaluation series exceeds a given threshold value
Judging that the defect exists;
s5, respectively setting k to 2,3,4, circularly executing S1 to S4, and processing the other three corner images PkAnd (6) detecting.
S6, calculating the corner edge standard coordinate series S of the four corner imageskThe average value of the data with the same sequence number is obtained, and the average value sequence A is { a ═ ac},
Calculating corner edge coordinate series L of four corner images of rectangular wafer respectivelykAnd obtaining a second evaluation number series by the absolute value of the difference value of the data with the same sequence number in the mean value number series A:
if the maximum value of the evaluation number series two exceeds a given threshold value
It is judged that there is a defect.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that changes may be made without departing from the scope of the invention, and it is intended that all matter contained in the above description or shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.
Claims (3)
1. An image detection method for detecting corner defects of a rectangular wafer, which is used for respectively detecting four corner images of the rectangular wafer which are preprocessed and judging whether the four corners of the rectangular wafer have defects or not, wherein the corner vertex positions of the rectangular wafer in the four corner images of the rectangular wafer which are preprocessed are the same, a bisector of a corner passes through the middle point of the corner image, and the bisector of the corner is vertical or horizontal, the image detection method comprises the following steps:
the method comprises the following steps that firstly, according to the fact that an angle bisector is vertical, all rows of pixel points of an angle image are selected to be searched according to the sequence of the rows, the row number of the pixel point which reaches a given threshold value in the first row is searched, all the row numbers are arranged according to the sequence of the rows, and an angle edge coordinate series is obtained; or the like, or, alternatively,
according to the fact that the angular bisector is horizontal, selecting to search pixel points of all rows of the angular image according to the row sequence, searching for a column number of a pixel point of each row reaching a given threshold value firstly, and arranging all the column numbers according to the row sequence to obtain an angular edge coordinate number sequence;
step two, rearranging all data of the corner edge coordinate series according to the sequence numbers of the data from large to small to obtain a corner edge symmetric coordinate series;
thirdly, taking the maximum value or the minimum value of the data with the same sequence number in the corner edge coordinate array and the corner edge symmetric coordinate array to obtain a corner edge standard coordinate array;
calculating the absolute value of the difference value of the data with the same sequence number in the angle edge coordinate series and the angle edge standard coordinate series to obtain a judgment series, and judging that a defect exists if the maximum value of the judgment series exceeds a given threshold;
and step five, repeating the steps for the other three corner images of the rectangular wafer.
2. The image inspection method of rectangular wafer corner defects according to claim 1, wherein in step one, the line number of the first pixel that reaches the given threshold in each row or the column number of the first pixel that reaches the given threshold in each row is obtained by interpolation operation of the first pixel that exceeds the given threshold and the previous pixel.
3. The method for image inspection of rectangular wafer corner defects according to claim 1, further comprising:
calculating the average value of data with the same serial number in the corner edge standard coordinate series of the four corner images of the rectangular wafer to obtain an average value series;
and respectively calculating the absolute value of the difference value of the data with the same serial number in the corner edge coordinate array and the mean value array of the four corner images of the rectangular wafer to obtain a second judgment array, and judging that the defect exists if the maximum value of the second judgment array exceeds a given threshold value.
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