CN113070801A - Automatic polishing device for U-shaped groove of target back plate and using method of automatic polishing device - Google Patents
Automatic polishing device for U-shaped groove of target back plate and using method of automatic polishing device Download PDFInfo
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- CN113070801A CN113070801A CN202110349661.5A CN202110349661A CN113070801A CN 113070801 A CN113070801 A CN 113070801A CN 202110349661 A CN202110349661 A CN 202110349661A CN 113070801 A CN113070801 A CN 113070801A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides an automatic polishing device for a U-shaped groove of a target back plate and a using method thereof, wherein the polishing device comprises a polishing platform, a polishing robot, a robot ground rail, a circuit control cabinet and a tool platform; the two polishing platforms are arranged on two sides of the robot ground rail in parallel; the circuit control cabinet is positioned between the two polishing platforms and is arranged at any end of the robot ground rail; the tool platform is arranged on the circuit control cabinet; the polishing robot is placed on the robot ground rail; the polishing robot comprises a main body and a mechanical arm, wherein a clamping hole is formed in the front end of the mechanical arm, and a polishing brush is connected in the clamping hole; the polishing device realizes the automatic polishing function of the U-shaped groove of the target back plate through the optimized design of various structures, has a simple use method, obviously improves the production efficiency and the product percent of pass, and has better industrial application prospect.
Description
Technical Field
The invention belongs to the technical field of target preparation, and particularly relates to an automatic polishing device for a U-shaped groove of a target back plate and a using method thereof.
Background
Physical Vapor Deposition (PVD) is the most common sputtering process in the fabrication of semiconductor chip liquid crystal displays. In the sputtering process, the target assembly consists of a sputtering target meeting the sputtering performance and a target back plate with certain hardness and electric conductivity, and the target back plate not only plays a supporting role when the target assembly is clamped to a sputtering base station, but also is used as a conductor in the sputtering process.
In the prior art, after the sputtering target material and the target material back plate are welded, burrs exist on the edge, the copper material is easy to rust, the surface processing treatment is carried out through a turning process, then the artificial pistol drill is matched with the steel brush to polish a U-shaped groove on the back plate, finally, the U-shaped groove is directly provided for a customer to use through cleaning and vacuum packaging, and no other surface treatment exists. In the prior art, the target backboard is easy to oxidize, foreign matters in the U-shaped groove on the backboard are processed manually, the efficiency is low, the effect is poor, once the foreign matters are oxidized, the conductivity of the target backboard is seriously influenced, the sputtering target may be abnormally discharged or power-off in the sputtering process, the quality of the sputtering target is further influenced, and the sputtering target is even scrapped. Therefore, according to the above situation, the surface treatment process of the target backing plate needs to be optimized to solve the problem that the target backing plate in the prior art is easily oxidized.
CN106312565A discloses a method for processing a target assembly, which uses rough polishing and finish polishing for multiple polishing processes to polish a target backing plate of the target assembly, but the method uses a piece of sandpaper with a velvet back to polish the target backing plate manually, so that the polishing efficiency is low, and polished lines of the polished target backing plate have orientation and also cause a certain amount of silicon residue.
CN112077674A A polishing process of a back plate in a target assembly, which comprises sequentially performing first mechanical polishing and second mechanical polishing on the target back plate; the abrasive belt used in the first mechanical polishing is a 600# non-woven fabric ring belt; the abrasive belt used in the second mechanical polishing is a 240# non-woven fabric ring belt; the process needs two times of polishing, needs long time, and does not relate to the process of polishing the U-shaped groove on the back plate.
In summary, how to provide an automatic polishing process for a U-shaped groove of a target back plate, which can ensure product quality and improve production efficiency is a problem to be solved at present.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
on one hand, the invention provides an automatic polishing device for a U-shaped groove of a target back plate, which comprises a polishing platform, a polishing robot, a robot ground rail, a circuit control cabinet and a tool platform, wherein the polishing robot is arranged on the polishing platform;
the two polishing platforms are arranged on two sides of the robot ground rail in parallel; the circuit control cabinet is positioned between the two polishing platforms and is arranged at any end of the robot ground rail; the tool platform is arranged on the circuit control cabinet; the polishing robot is placed on the robot ground rail; the polishing robot comprises a main body and a mechanical arm, wherein a clamping hole is formed in the front end of the mechanical arm, and a polishing brush is connected in the clamping hole;
the polishing platform is provided with a target, the target comprises a target main body and a target back plate, and a U-shaped groove is formed in the target back plate.
According to the polishing device, the polishing device realizes the function of automatically polishing the U-shaped groove of the target back plate through the optimized design of various functional structures; the polishing device is beneficial to the horizontal movement of the polishing robot through the arrangement of the robot ground rail; the time for replacing consumables is reduced through the arrangement of the tool platform, and the production efficiency is improved; meanwhile, a certain space is formed between the polishing platform and the robot ground rail, so that a manual overhaul channel is formed, and the device is convenient to maintain and repair; the polishing device replaces manual operation, improves the stability of roughness and production efficiency, and is beneficial to large-scale application in production.
In the invention, the polishing device is provided with two polishing platforms, the polishing robot can perform interactive polishing, and the waiting time for feeding and discharging is reduced, namely: when the target material on one side is polished, the target material on the other side is subjected to blanking and loading, so that the polishing efficiency is greatly improved.
In the polishing device, if the polishing brush is damaged in the polishing process, the polishing brush can be automatically replaced, so that the efficiency is improved.
In the invention, the operation of the whole device is controlled by the circuit control cabinet.
The following technical solutions are preferred technical solutions of the present invention, but not limited to the technical solutions provided by the present invention, and technical objects and advantageous effects of the present invention can be better achieved and achieved by the following technical solutions.
In a preferred embodiment of the present invention, the grinding platform is provided with pneumatic suction cups near the long side of the robot ground rail, and the number of the pneumatic suction cups provided for each grinding platform is not less than 5, for example, 5, 6, 7, or 8, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
According to the invention, the target can be effectively fixed through the design of the pneumatic sucker, the target is prevented from being damaged, and the product percent of pass is improved.
As the preferable technical scheme of the invention, one side of the short edge of the polishing platform, which is far away from the circuit control cabinet, is provided with a positioning block parallel to the short edge.
Preferably, the polishing platform is provided with the safe grating on the long limit symmetry in the inboard of locating piece one end.
In the invention, the safety grating can prevent the brush head from falling off and hurting people due to the high rotating speed of the steel wire brush.
As the preferable technical scheme of the invention, two grooves are arranged in the middle of each grinding platform.
In the invention, the grooves are formed in the forklift for feeding and discharging, so that the product is prevented from being damaged by manual carrying, and the efficiency is improved.
As a preferred technical scheme of the invention, the tool platform comprises a standby polishing brush containing area and a scrapped polishing brush containing area.
Preferably, the abrasive brush comprises a wire brush.
Preferably, the brush head diameter of the wire brush is 14 to 16mm, such as 14mm, 14.5mm, 15mm, 15.5mm or 16mm, but not limited to the values listed, and other values not listed in the range of values are equally applicable, preferably 15 mm.
In the present invention, the size of the polishing brush has some effect on the final polishing effect. If the diameter of the brush head of the steel wire brush is too wide, the damage of the U-shaped groove can be caused; if the diameter of the brush head of the steel wire brush is too small, the product cannot be processed at one time, and needs to be processed again, so that the production efficiency is reduced.
As a preferred embodiment of the present invention, the target includes a flat target for LCD.
Preferably, the planar target for the LCD is a split type target.
Preferably, the planar target for LCD includes a G10.5 series target.
Preferably, the G10.5 series target comprises a copper target.
In the invention, the target main body and the target back plate are both made of copper materials.
As a preferable technical scheme of the invention, the number of the U-shaped grooves is 4.
Preferably, each of the U-shaped grooves includes a first U-shaped groove and a second U-shaped groove.
Preferably, the first U-shaped groove target is disposed on a side of the target backing plate away from the target body.
Preferably, the width of the U-shaped groove is 19 to 21mm, such as 19mm, 19.5mm, 20mm, 20.5mm or 21mm, but not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the depth of the U-shaped groove is 5 to 7mm, such as 5mm, 5.5mm, 6mm, 6.5mm or 7mm, but not limited to the values listed, and other values not listed in the range of values are also applicable.
Preferably, the length of the U-shaped groove is 45 to 50mm, such as 45mm, 46mm, 47mm, 48mm, 49mm or 50mm, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the bottom of the first U-shaped groove is provided with a second U-shaped groove.
Preferably, the sum of the depth of the second U-shaped groove and the depth of the first U-shaped groove is equal to the thickness of the target backing plate.
Preferably, the width of the second U-shaped groove is smaller than that of the first U-shaped groove.
Preferably, the length of the second U-shaped groove is smaller than that of the first U-shaped groove.
In the invention, 4U-shaped grooves are divided into 2 groups, and each group of U-shaped grooves are arranged with openings aligned back to back.
According to the polishing device, the first U-shaped groove is machined, namely the side face and the bottom face of the first U-shaped groove are polished when the target material back plate is placed on the operation platform upwards.
In the invention, the bottom of the first U-shaped groove is also provided with 2 threaded holes, and the 2 threaded holes are respectively positioned at two sides of the second U-shaped groove.
In another aspect, the present invention provides a method of using the above polishing apparatus, the method comprising the steps of:
the target backboard is placed on the polishing platform upwards, the polishing brush is arranged in a clamping hole of the mechanical arm, the polishing robot is started to control the mechanical arm, the polishing brush is placed in the U-shaped groove of the target backboard, and then polishing is carried out.
In a preferred embodiment of the present invention, the down force during polishing is 0.4 to 0.6kg, preferably 0.5kg, for example, 0.4kg, 0.45kg, 0.5kg, 0.55kg, or 0.6kg, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
In the present invention, the down pressure during polishing needs to be controlled. If the lower pressure is too low, the oxide layer on the surface of the U-shaped groove and foreign matters are not completely treated; if the downward pressure is too high, the surface of the U-shaped groove is damaged, and obvious scars are formed.
Preferably, during the polishing process, the rotating speed of the steel wire brush is 1450-1550 r/min, such as 1450r/min, 1480r/min, 1500r/min, 1520r/min, 1540r/min or 1550r/min, and the like, and 1500r/min is preferred.
In the invention, the rotating speed of the polishing brush needs to be controlled in the polishing process. If the rotating speed of the grinding brush is too high, the steel wire brush head can fall off due to too high centrifugal force; if the rotational speed of the grinding brush is too slow, the machining speed will be affected.
In a preferred embodiment of the present invention, the depth of the target after polishing is not more than 0.04mm, for example, 0.01mm, 0.02mm, 0.03mm, or 0.04mm, but the target is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the polishing device, through the optimized design of various functional structures, the device realizes the function of automatically polishing the U-shaped groove of the target back plate, manual operation is replaced by the polishing device, the production efficiency and the product yield are greatly improved, and the processing time of 4U-shaped grooves of a single target is shortened by 50%;
(2) the polishing device provided by the invention improves the processing depth stability of the U-shaped groove of the target backboard by matching the mechanical arm with the polishing brush and controlling the condition parameters in the polishing process, so that the processing depth is below 0.04mm, the roughness is below 2.1 mu m, the passing rate of the product is improved to be above 95%, the generation of dust can be effectively reduced, the working environment is improved, the large-scale production is facilitated, and the polishing device has a good industrial application prospect.
Drawings
Fig. 1 is a schematic top view of an automatic polishing apparatus for a U-shaped groove of a target backing plate according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a U-shaped groove of a target backing plate provided in embodiment 1 of the present invention;
the method comprises the following steps of 1-polishing platform, 2-polishing robot, 3-robot ground rail, 4-tool platform, 5-target back plate, 6-pneumatic sucker, 7-positioning block, 8-safety grating, 9-groove, 10-polishing brush containing area, 11-scrapping polishing brush containing area, 12-first U-shaped groove and 13-second U-shaped groove.
Detailed Description
In order to better illustrate the present invention and facilitate the understanding of the technical solutions of the present invention, the present invention is further described in detail below. However, the following examples are only simple examples of the present invention and do not represent or limit the scope of the present invention, which is defined by the claims.
The invention provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, wherein the polishing device comprises a polishing platform 1, a polishing robot 2, a robot ground rail 3, a circuit control cabinet and a tool platform 4;
two polishing platforms 1 are arranged on two sides of the robot ground rail 3 in parallel; the circuit control cabinet is positioned between the two polishing platforms 1 and is arranged at any end of the robot ground rail 3; the tool platform 4 is arranged on the circuit control cabinet; the grinding robot 2 is placed on the robot ground rail 3; the polishing robot 2 comprises a main body and a mechanical arm, wherein a clamping hole is formed in the front end of the mechanical arm, and a polishing brush is connected in the clamping hole;
the polishing platform 1 is provided with a target material, the target material comprises a target material main body and a target material back plate 5, and the target material back plate 5 is provided with a U-shaped groove.
The use method of the device comprises the following steps:
the target backboard 5 is placed on the polishing platform 1 upwards, the polishing brush is arranged in a clamping hole of the mechanical arm, the polishing robot 2 is started to control the mechanical arm, the polishing brush is placed in a U-shaped groove of the target backboard 5, and then polishing is carried out.
The following are typical but non-limiting examples of the invention:
example 1:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, a schematic top view structure of the polishing device is shown in fig. 1, and the target adopted in the embodiment is a G10.5 series copper target with the length of 3830mm and the width of 340mm for an LCD.
The polishing device comprises a polishing platform 1, a polishing robot 2, a robot ground rail 3, a circuit control cabinet and a tool platform 4;
two polishing platforms 1 are arranged on two sides of the robot ground rail 3 in parallel; the circuit control cabinet is positioned between the two polishing platforms 1 and is arranged at any end of the robot ground rail 3; the tool platform 4 is arranged on the circuit control cabinet; the grinding robot 2 is placed on the robot ground rail 3; the polishing robot 2 comprises a main body and a mechanical arm, wherein a clamping hole is formed in the front end of the mechanical arm, and a polishing brush is connected in the clamping hole;
the polishing platform 1 is provided with a target material, the target material comprises a target material main body and a target material back plate 5, the target material back plate 5 is provided with a U-shaped groove, and the structural schematic diagram of the U-shaped groove is shown in fig. 2.
The polishing platform 1 is close to one side of the long edge of the robot ground rail 3 is provided with a pneumatic sucker 6, and the number of the pneumatic suckers 6 arranged on each polishing platform 1 is 5.
A positioning block 8 parallel to the short edge is arranged on one side of the short edge of the polishing platform 1, which is far away from the circuit control cabinet; the inboard long limit symmetry that platform 1 of polishing was provided with locating piece 8 one end is provided with safety grating 8.
The middle part of each grinding platform 1 is provided with two grooves 9.
The tool platform 4 comprises a standby polishing brush containing area 10 and a scrapped polishing brush containing area 11; the polishing brush is a steel wire brush, and the diameter of the brush head of the polishing brush is 15 mm.
The number of the U-shaped grooves is 4, and each U-shaped groove comprises a first U-shaped groove 12 and a second U-shaped groove 13; the first U-shaped groove 12 is arranged on one side, away from the target body, of the target back plate 5; the width of the first U-shaped groove 12 is 21mm, the depth is 7mm, and the length is 50 mm; the bottom in first U type groove 12 is provided with second U type groove 13, the width in second U type groove 13 is 11mm, the degree of depth is 7mm, length is 28 mm.
The use method of the polishing device comprises the following steps:
placing a target material back plate 5 on the polishing platform 1 upwards, wherein the side edge of the target material is fixed through a pneumatic sucker 6; a steel wire brush with the brush head diameter of 15mm is arranged in a clamping hole of a mechanical arm, the grinding robot 2 is started to control the mechanical arm, the steel wire brush is placed in a first U-shaped groove 12 of the target material back plate 5, and polishing is started; in the polishing process, the down force of the steel wire brush is 0.5kg, and the rotating speed of the steel wire brush is 1500 r/min.
Example 2:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment is the same as that in the embodiment 1.
The polishing device comprises a polishing platform 1, a polishing robot 2, a robot ground rail 3, a circuit control cabinet and a tool platform 4;
two polishing platforms 1 are arranged on two sides of the robot ground rail 3 in parallel; the circuit control cabinet is positioned between the two polishing platforms 1 and is arranged at any end of the robot ground rail 3; the tool platform 4 is arranged on the circuit control cabinet; the grinding robot 2 is placed on the robot ground rail 3; the polishing robot 2 comprises a main body and a mechanical arm, wherein a clamping hole is formed in the front end of the mechanical arm, and a polishing brush is connected in the clamping hole;
the polishing platform 1 is provided with a target material, the target material comprises a target material main body and a target material back plate 5, and the target material back plate 5 is provided with a U-shaped groove.
The polishing platform 1 is close to one side of the long edge of the robot ground rail 3 is provided with 6 pneumatic suckers, and the number of the pneumatic suckers 6 arranged on each polishing platform 1 is 6.
A positioning block 8 parallel to the short edge is arranged on one side of the short edge of the polishing platform 1, which is far away from the circuit control cabinet; the inboard long limit symmetry that platform 1 of polishing was provided with locating piece 8 one end is provided with safety grating 8.
The middle part of each grinding platform 1 is provided with two grooves 9.
The tool platform 4 comprises a standby polishing brush containing area 10 and a scrapped polishing brush containing area 11; the polishing brush is a steel wire brush, and the diameter of the brush head of the polishing brush is 14 mm.
The number of the U-shaped grooves is 4, and each U-shaped groove comprises a first U-shaped groove 12 and a second U-shaped groove 13; the first U-shaped groove 12 is arranged on one side, away from the target body, of the target back plate 5; the width of the first U-shaped groove 12 is 19mm, the depth is 5mm, and the length is 45 mm; the bottom in first U type groove 12 is provided with second U type groove 13, the width in second U type groove 13 is 11mm, the degree of depth is 7mm, length is 28 mm.
The use method of the polishing device comprises the following steps:
placing a target material back plate 5 on the polishing platform 1 upwards, wherein the side edge of the target material is fixed through a pneumatic sucker 6; a steel wire brush with the brush head diameter of 14mm is arranged in a clamping hole of a mechanical arm, the grinding robot 2 is started to control the mechanical arm, the steel wire brush is placed in a first U-shaped groove 12 of the target material back plate 5, and polishing is started; in the polishing process, the down force of the steel wire brush is 0.4kg, and the rotating speed of the steel wire brush is 1450 r/min.
Example 3:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment is the same as that in the embodiment 1.
The polishing device comprises a polishing platform 1, a polishing robot 2, a robot ground rail 3, a circuit control cabinet and a tool platform 4;
two polishing platforms 1 are arranged on two sides of the robot ground rail 3 in parallel; the circuit control cabinet is positioned between the two polishing platforms 1 and is arranged at any end of the robot ground rail 3; the tool platform 4 is arranged on the circuit control cabinet; the grinding robot 2 is placed on the robot ground rail 3; the polishing robot 2 comprises a main body and a mechanical arm, wherein a clamping hole is formed in the front end of the mechanical arm, and a polishing brush is connected in the clamping hole;
the polishing platform 1 is provided with a target material, the target material comprises a target material main body and a target material back plate 5, and the target material back plate 5 is provided with a U-shaped groove.
The polishing platform 1 is close to one side of the long edge of the robot ground rail 3 is provided with 6 pneumatic suckers, and the number of the pneumatic suckers 6 arranged on each polishing platform 1 is 6.
A positioning block 8 parallel to the short edge is arranged on one side of the short edge of the polishing platform 1, which is far away from the circuit control cabinet; the inboard long limit symmetry that platform 1 of polishing was provided with locating piece 8 one end is provided with safety grating 8.
The middle part of each grinding platform 1 is provided with two grooves 9.
The tool platform 4 comprises a standby polishing brush containing area 10 and a scrapped polishing brush containing area 11; the polishing brush is a steel wire brush, and the diameter of the brush head of the polishing brush is 16 mm.
The number of the U-shaped grooves is 4, and each U-shaped groove comprises a first U-shaped groove 12 and a second U-shaped groove 13; the first U-shaped groove 12 is arranged on one side, away from the target body, of the target back plate 5; the width of the first U-shaped groove 12 is 20mm, the depth is 6mm, and the length is 47 mm; the bottom in first U type groove 12 is provided with second U type groove 13, the width in second U type groove 13 is 12mm, the degree of depth is 8mm, length is 29 mm.
The use method of the polishing device comprises the following steps:
placing a target material back plate 5 on the polishing platform 1 upwards, wherein the side edge of the target material is fixed through a pneumatic sucker 6; a steel wire brush with the brush head diameter of 16mm is arranged in a clamping hole of a mechanical arm, the grinding robot 2 is started to control the mechanical arm, the steel wire brush is placed in a first U-shaped groove 12 of the target material back plate 5, and polishing is started; in the polishing process, the down force of the steel wire brush is 0.6kg, and the rotating speed of the steel wire brush is 1550 r/min.
Example 4:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment refers to the target used in embodiment 2.
The polishing apparatus was referred to as the polishing apparatus in example 2.
The method of use of the above polishing apparatus was as described in example 2, except that: the rotating speed of the steel wire brush is 1300 r/min.
Example 5:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment refers to the target used in embodiment 3.
The polishing apparatus was the one according to example 3.
The method of use of the above polishing apparatus was as described in example 3, except that: the rotating speed of the wire brush is 1700 r/min.
Example 6:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment refers to the target used in embodiment 2.
The polishing apparatus was referred to as the polishing apparatus in example 2.
The method of use of the above polishing apparatus was as described in example 2, except that: the down force of the wire brush was 0.2 kg.
Example 7:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment refers to the target used in embodiment 3.
The polishing apparatus was the one according to example 3.
The method of use of the above polishing apparatus was as described in example 3, except that: the down force of the wire brush was 0.8 kg.
Example 8:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment refers to the target used in embodiment 2.
The polishing apparatus was referred to the polishing apparatus in example 2, except that: the diameter of the brush head of the polishing brush is 12 mm.
The method of using the polishing apparatus described above refers to the method of use in example 2.
Example 9:
the embodiment provides an automatic polishing device for a U-shaped groove of a target back plate and a use method thereof, and the target adopted in the embodiment refers to the target used in embodiment 3.
The polishing apparatus was referred to the polishing apparatus in example 3, except that: the diameter of the brush head of the polishing brush is 18 mm.
The method of using the polishing apparatus described above refers to the method of use in example 3.
Comparative example 1:
the comparative example provides a polishing method for a target back plate U-shaped groove, and the target adopted in the comparative example refers to the target used in example 1, and the method comprises the following steps: the target material back plate 5 is placed on an operation table in an upward mode, 1 operator uses a pistol drill to match with a steel wire brush with the brush head diameter being 15mm for polishing, and the rotating speed of the steel wire brush in the polishing process is 1500 r/min.
The polishing time and the processing depth and the roughness of the polished U-shaped groove of the target backing plate were measured in examples 1 to 9 and comparative example 1, and the results are shown in table 1.
Table 1 polishing time and depth of U-shaped groove and roughness of target backing plate after polishing in examples 1 to 9 and comparative example 1
| Polishing time 5min | Depth of machining/mm | Roughness/mum | |
| Example 1 | 5 | 0.04 | 2.0 |
| Example 2 | 5 | 0.03 | 2.1 |
| Example 3 | 5 | 0.04 | 2.0 |
| Example 4 | 5 | 0.06 | 2.3 |
| Example 5 | 5 | 0.07 | 2.4 |
| Example 6 | 5 | 0.05 | 2.3 |
| Example 7 | 5 | 0.06 | 2.5 |
| Example 8 | 5 | 0.08 | 2.7 |
| Example 9 | 5 | 0.07 | 2.6 |
| Comparative example 1 | 10 | 0.09 | 2.8 |
In embodiments 1 to 3, the polishing device of the present invention is used to shorten the polishing time by 50% by matching with a polishing brush and further controlling parameters given during the polishing process, so that the processing depth of the U-shaped groove of the target backing plate after polishing is not greater than 0.04mm, and the roughness is below 2.1 μm; example 4 the rotational speed of the grinding brush in the polishing process was reduced and the roughness increased; example 5 the rotational speed of the sanding brush during polishing was increased, resulting in a deeper depth of cut; example 6 reduces the down force during polishing, resulting in unclean treatment of the surface oxide layer and foreign matter of the U-shaped groove; example 7 increased down force during polishing, resulting in damage to the polished surface and a deeper depth of finish; the brush head diameter of the steel wire brush used in example 8 is too small, so that the use standard cannot be reached after one-time processing, and the processing depth is deep and the roughness is large; the brush head of the wire brush used in example 9 was too large in diameter, resulting in damage to the U-shaped channel and failure to meet the use standards.
In contrast, in comparative example 1, manual polishing was used, the polishing time was significantly increased, and observation of the polished texture revealed that the depth of finish and the roughness after polishing were unstable.
It can be seen from the above embodiments and comparative examples that the polishing device of the present invention realizes the function of automatic polishing of the U-shaped groove of the target back plate by the optimized design of various functional structures, and the manual operation is replaced by the polishing device, so that the production efficiency and the product yield are greatly improved, and the processing time of a single target is shortened by more than 50%; the polishing device improves the processing depth stability of the U-shaped groove of the target backboard by matching the mechanical arm with the polishing brush and controlling the condition parameters in the polishing process, so that the processing depth is below 0.04mm, the roughness is below 2.1 mu m, the generation of dust can be effectively reduced, the working environment is improved, the large-scale production is facilitated, and the polishing device has a good industrial application prospect.
The applicant states that the present invention is illustrated by the above examples to show the products and detailed methods of the present invention, but the present invention is not limited to the above products and detailed methods, i.e. it is not meant that the present invention must rely on the above products and detailed methods to be carried out. It will be apparent to those skilled in the art that any modifications to the present invention, equivalents thereof, additions of additional operations, selection of specific ways, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. An automatic polishing device for a U-shaped groove of a target back plate is characterized by comprising a polishing platform, a polishing robot, a robot ground rail, a circuit control cabinet and a tool platform;
the two polishing platforms are arranged on two sides of the robot ground rail in parallel; the circuit control cabinet is positioned between the two polishing platforms and is arranged at any end of the robot ground rail; the tool platform is arranged on the circuit control cabinet; the polishing robot is placed on the robot ground rail; the polishing robot comprises a main body and a mechanical arm, wherein a clamping hole is formed in the front end of the mechanical arm, and a polishing brush is connected in the clamping hole;
the polishing platform is provided with a target, the target comprises a target main body and a target back plate, and a U-shaped groove is formed in the target back plate.
2. The polishing device as recited in claim 1, wherein the grinding platform is provided with at least 5 pneumatic suction cups on one side of the long side close to the robot ground rail.
3. The polishing device according to claim 1 or 2, wherein a positioning block parallel to the short side is arranged on one side of the short side of the grinding platform away from the circuit control cabinet;
preferably, the polishing platform is provided with the safe grating on the long limit symmetry in the inboard of locating piece one end.
4. A polishing system according to any one of claims 1 to 3 in which two grooves are provided in the central region of each sanding platform.
5. The polishing apparatus of any one of claims 1-4, wherein the tool platform comprises a backup scrub brush storage area and a discard scrub brush storage area;
preferably, the sanding brush comprises a wire brush;
preferably, the diameter of the brush head of the steel wire brush is 14-16 mm, and preferably 15 mm.
6. The polishing apparatus according to any one of claims 1 to 5, wherein the target comprises a flat target for LCD;
preferably, the planar target for the LCD is a split target;
preferably, the planar target for LCD includes a G10.5 series target;
preferably, the G10.5 series target comprises a copper target.
7. The polishing apparatus as set forth in any one of claims 1 to 6, wherein the number of the U-shaped grooves is 4;
preferably, each of the U-shaped grooves includes a first U-shaped groove and a second U-shaped groove;
preferably, the first U-shaped groove target is arranged on one side of the target backing plate, which is far away from the target main body;
preferably, the width of the first U-shaped groove is 19-21 mm;
preferably, the depth of the first U-shaped groove is 5-7 mm and is smaller than the thickness of the target back plate;
preferably, the length of the first U-shaped groove is 45-50 mm;
preferably, a second U-shaped groove is formed in the bottom of the first U-shaped groove;
preferably, the sum of the depth of the second U-shaped groove and the depth of the first U-shaped groove is equal to the thickness of the target backing plate;
preferably, the width of the second U-shaped groove is smaller than that of the first U-shaped groove;
preferably, the length of the second U-shaped groove is smaller than that of the first U-shaped groove.
8. A method of using the polishing apparatus as recited in any one of claims 1 to 7, comprising the steps of:
the target backboard is placed on the polishing platform upwards, the polishing brush is arranged in a clamping hole of the mechanical arm, the polishing robot is started to control the mechanical arm, the polishing brush is placed in the U-shaped groove of the target backboard, and then polishing is carried out.
9. Use according to claim 8, characterized in that the down force of the polishing brush during polishing is 0.4-0.6 kg, preferably 0.5 kg;
preferably, in the polishing process, the rotating speed of the polishing brush is 1450-1550 r/min, and is preferably 1500 r/min.
10. The use method according to claim 8 or 9, wherein the machined depth of the polished U-shaped groove of the target backing plate is not more than 0.04 mm.
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| CN202110349661.5A CN113070801B (en) | 2021-03-31 | 2021-03-31 | Automatic polishing device for U-shaped groove of target backboard and use method of automatic polishing device |
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| CN112536664A (en) * | 2020-11-27 | 2021-03-23 | 常州润拓不锈钢有限公司 | A burr grinding device for sheet metal component |
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| JPH09244722A (en) * | 1996-03-06 | 1997-09-19 | Toyota Autom Loom Works Ltd | Teaching data generation method for industrial robot, teaching data generation device for industrial robot and industrial robot system |
| CN105081903A (en) * | 2015-09-06 | 2015-11-25 | 东莞市莞智成机器人技术有限公司 | Robot grinding system for outer surface of cylinder with boss |
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| CN110026743A (en) * | 2019-04-30 | 2019-07-19 | 江苏富浩电子科技有限公司 | A kind of aluminum pipe milling process |
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| CN113070801B (en) | 2023-04-21 |
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