CN113053276B

CN113053276B - Display module, display device and binding detection method

Info

Publication number: CN113053276B
Application number: CN202110286464.3A
Authority: CN
Inventors: 李传勇; 龚雪瑞; 贾群; 刘奇; 喻勇; 张昌
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-03-17
Filing date: 2021-03-17
Publication date: 2023-09-19
Anticipated expiration: 2041-03-17
Also published as: CN113053276A

Abstract

The embodiment of the application provides a display module, a display device and a binding detection method. This display module assembly includes: a first panel, a circuit connection, and at least one pair of test units; two test pins in the test unit are positioned in the binding area of the first panel and are electrically connected with each other; the other two test pins are positioned in the binding area of the circuit connecting piece; the four test pins are respectively bound in a corresponding mode of at least partially overlapping; the first size of at least one test pin in the four test pins is monotonously changed along the first direction, and the first size of the other test pin correspondingly bound with the first size is unchanged; in at least one pair of test units, the direction of change of the first dimension of the test pin in one test unit is opposite to the direction of change of the first dimension of the test pin in the other test unit. The embodiment of the application realizes that the binding offset and the binding on-resistance value are fitted to form a functional relation, and improves the binding detection efficiency.

Description

Display module, display device and binding detection method

Technical Field

The application relates to the technical field of display, in particular to a display module, a display device and a binding detection method.

Background

Binding is an indispensable procedure in the field of display technology. The bonding process typically connects pins in the bonding region of the COF (Chip On Film) or FPC (Flexible Printed Circuit, flexible circuit board) with pins in the bonding region of the first panel.

However, certain binding offset can occur in the binding process, so that the negative effects of larger on-resistance and even binding disconnection are brought to the binding product, and the product yield is influenced. Therefore, the bound product needs to be detected, and the product performance is controlled.

Binding on-resistance and binding offset are two important control parameters in the binding process. In the existing binding detection mode, the binding on-resistance is obtained by detecting through an electrical method, and the binding offset is obtained by measuring the alignment mark offset by means of a microscope and indirectly feeding back the binding pin offset. Therefore, the existing binding detection mode is complicated and low-efficiency, and the binding detection is to be improved.

Disclosure of Invention

Aiming at the defects of the prior art, the application provides a display module, a display device and a binding detection method, which are used for solving the technical problems of complicated and low-efficiency binding detection mode in the prior art.

In a first aspect, an embodiment of the present application provides a display module, including: a first panel, a circuit connection, and at least one pair of test units;

the test unit comprises four test pins; wherein the two test pins are positioned in the binding area of the first panel and are electrically connected with each other; the other two test pins are positioned in the binding area of the circuit connecting piece and are respectively used for connecting the detection signal output end and the detection signal feedback end of the detection equipment; the four test pins are respectively bound in a corresponding mode of at least partially overlapping; the first dimension of at least one test pin of the four test pins is monotonously changed along a first direction, the first dimension of the other test pin which is correspondingly bound with the first dimension is unchanged, the first dimension is perpendicular to the first direction, and the first direction is parallel to a binding area of the first panel or a binding area of the circuit connecting piece;

in at least one pair of test units, the direction of change of the first dimension of the test pin in one test unit is opposite to the direction of change of the first dimension of the test pin in the other test unit.

In a second aspect, an embodiment of the present application provides a display apparatus, including: the display module as provided in the first aspect.

In a third aspect, an embodiment of the present application provides a binding detection method based on the display module provided in the first aspect, including:

obtaining a pair of resistance values of at least one pair of test units, wherein at least one resistance value in the pair of resistance values comprises the sum of sub-resistance values of binding contact areas between every two corresponding binding test pins in the corresponding test unit;

determining a magnitude relationship between one resistance value and the other resistance value of the pair of resistance values;

and determining the offset direction and the offset amount between every two corresponding bound test pins of at least one test unit according to the size relation and the change direction of the first dimension of the test unit in at least one pair of test units.

In a fourth aspect, an embodiment of the present application provides a binding detection apparatus, including:

the resistance value measuring module is used for obtaining a pair of resistance values of at least one pair of test units, wherein at least one resistance value in the pair of resistance values comprises the sum of sub-resistance values of binding contact areas between every two corresponding binding test pins in the corresponding test unit;

a resistance value comparison module for determining a magnitude relationship between one resistance value and the other resistance value of the pair of resistance values;

And the analysis module is used for determining the offset direction and the offset between every two corresponding bound test pins of at least one test unit according to the size relation and the change direction of the first dimension of the test unit in at least one pair of test units.

In a fifth aspect, an embodiment of the present application provides a detection apparatus, including:

a processor;

a memory electrically connected to the processor;

at least one program stored in the memory and configured to be executed by the processor, the at least one program configured to: the binding detection method as provided in the second aspect is performed.

In a sixth aspect, an embodiment of the present application provides a computer readable storage medium having a computer program stored thereon, which when executed by a processor implements the binding detection method as provided in the second aspect.

The technical scheme provided by the embodiment of the application has the beneficial technical effects that:

1. in the test unit, two test pins positioned in the binding area of the circuit connecting piece are respectively used for receiving the detection signal and the feedback detection signal, and the two test pins positioned in the binding area of the first panel are mutually and electrically connected to form a detection loop, so that on one hand, a feasible condition is created for electrical detection, and on the other hand, the signal connection of external detection equipment can be facilitated;

2. The first size of at least one test pin in the test unit is monotonously changed along the first direction, and the first size of the other test pin which is correspondingly bound with the first size is unchanged, so that under the condition that the first panel and the circuit connecting piece are bound and offset, the detection signals passing through the four test pins of each test unit can be obviously electrically changed, the identification degree of the detection equipment is improved, and the detection precision or sensitivity is improved;

3. the change directions of the first dimension between at least one pair of test units are opposite, so that under the condition that the first panel and the circuit connecting piece deviate, detection signals passing through four test pins of each test unit can generate different electrical changes, the binding offset and the binding on-resistance value can be fitted into a functional relation by means of the different electrical changes of at least one pair of test units, the binding on-resistance and the binding offset of the display module can be rapidly monitored by utilizing the functional relation through one-time electrical detection, rapid discovery and response of the binding offset problem are finally realized, and binding detection efficiency and data collection capacity in the mass production of the display module can be remarkably improved.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

fig. 1 is a schematic diagram of a binding structure of a binding area of a first panel and a binding area of a circuit connector in a display module according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a binding area of a first panel in a display module according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a binding area of a circuit connector in a display module according to an embodiment of the present application;

fig. 4 is a schematic diagram of a binding structure of a binding area of a first panel and a binding area of a circuit connector in another display module according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a binding area of a circuit connector in another display module according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a frame of a detection device according to an embodiment of the present application;

FIG. 7 is a flowchart of a binding detection method according to an embodiment of the present application;

FIG. 8 is a schematic flow chart of a first embodiment of determining an offset direction and an offset between each two corresponding bound test pins of each test unit according to a size relationship and a direction of a change in a first dimension of the test unit in each pair of test units in a binding detection method according to an embodiment of the present application;

FIG. 9 is a schematic flow chart of a second embodiment of determining an offset direction and an offset between every two corresponding bound test pins of each test unit according to a size relationship and a direction of variation of a first dimension of the test unit in each pair of test units in the binding detection method according to the embodiment of the present application;

fig. 10 is a schematic diagram of a framework of a binding detection apparatus according to an embodiment of the present application.

In the figure:

100-a first panel; 200-circuit connection;

310-a first test unit; 311-a first test pin; 312-a second test pin; 313-third test pin; 314-fourth test pins;

320-a second test unit; 321-fifth test pins; 322-sixth test pin; 323-seventh test pin; 324-eighth test pin;

330-a work unit; 331-first working pin; 332-a second working pin;

400-detecting equipment; 410-a detection signal transceiver; 420-memory; 430-a processor;

500-binding detection means; 510-a resistance measurement module; 520-a resistance value comparison module; 530-an analysis module;

A-A' is the first direction.

Detailed Description

The present application is described in detail below, examples of embodiments of the application are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. Further, if detailed description of the known technology is not necessary for the illustrated features of the present application, it will be omitted. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.

It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.

The inventor of the application researches and discovers that in the existing binding product, each pin of the binding area is in a slender square bar shape, and the test pin is not different from other conventional working pins, so that a functional relation is difficult to fit between the binding offset and the binding on resistance value, and therefore, two sets of detection methods are needed to detect the binding on resistance and the binding offset respectively, namely, the binding on resistance is obtained by adopting an electrical method to detect, the alignment mark offset is measured by a microscope, and the binding offset is indirectly obtained. Therefore, the existing binding detection mode is complicated and low-efficiency, and the binding detection is to be improved.

The application provides a display module, a display device and a binding detection method, and aims to solve the technical problems in the prior art.

The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments.

The embodiment of the application provides a display module, and a structural schematic diagram of the display module is shown in fig. 1-5, including but not limited to: the first panel 100, the circuit connection 200, and at least one pair of test units.

The test unit includes, but is not limited to, four test pins. Wherein two test pins are located in the bonding area of the first panel 100 and are electrically connected to each other. The other two test pins are located in the binding area of the circuit connector 200 and are respectively used for connecting the detection signal output end and the detection signal feedback end of the detection device 400. The four test pins are respectively bound in a corresponding pair in an at least partially overlapped mode. The first dimension of at least one of the four test pins monotonously varies along a first direction, and the first dimension of the other test pin bound correspondingly thereto is unchanged, the first dimension being a dimension perpendicular to the first direction, the first direction being parallel to the binding area of the first panel 100 or the binding area of the circuit connector 200.

In the display module provided in this embodiment, at least one pair of test units, that is, at least two test units, are disposed between the first panel 100 and the circuit connector 200 that need to be bound to each other, where the two test units are paired. In the test unit, two test pins located in the binding area of the circuit connector 200 are respectively used for receiving the detection signal and the feedback detection signal, and two test pins located in the binding area of the first panel 100 are mutually electrically connected to form a detection loop, so that on one hand, a feasible condition is created for electrical detection, and on the other hand, signal connection of the external detection device 400 can be facilitated.

The first size of at least one test pin in the test unit is monotonously changed along the first direction, and the first size of the other test pin bound correspondingly is unchanged, so that under the condition that the first panel 100 and the circuit connecting piece 200 are bound and offset, the detection signals passing through the four test pins of each test unit can be obviously electrically changed, thereby being beneficial to improving the identification degree of the detection equipment 400 and further being beneficial to improving the detection precision or sensitivity.

Optionally, the electrical change comprises a change in resistance. Specifically, the resistance value between every two corresponding bound test pins is inversely proportional to the binding contact area of the two test pins during binding, i.e. the larger the binding contact area, the smaller the resistance value, and vice versa. The first dimension of at least one test pin in each test unit is monotonically changed along the first direction, so that the change amplitude of the binding contact area between two corresponding bound test pins is increased under the condition that the first panel 100 and the circuit connector 200 are subjected to binding offset, and further, the change of the resistance values of the two corresponding bound test pins is more obvious, namely, the detection signals passing through four test pins of each test unit can be subjected to more obvious electrical change.

The direction of change of the first dimension between at least one pair of test units is opposite, so that under the condition that the first panel 100 and the circuit connecting piece 200 deviate, detection signals passing through four test pins of each test unit can generate different electrical changes, the binding deviation amount and the binding on-resistance value can be fitted into a functional relation by means of the different electrical changes of at least one pair of test units, the binding on-resistance and the binding deviation amount of the display module can be rapidly monitored by using the functional relation through one-time electrical detection, rapid discovery and response of the binding deviation problem are finally realized, and binding detection efficiency and data collection capacity in the mass production of the display module can be remarkably improved.

The inventor contemplates that the first dimension of at least one of the four test pins in each test unit varies monotonically along the first direction and the first dimension of the other test pin bound corresponding thereto does not vary. For this purpose, the application provides one possible implementation manner for the display module assembly as follows:

as shown in fig. 1 or 4, at least one pair of test units according to an embodiment of the present application includes, but is not limited to: a first test unit 310 and a second test unit 320.

The first test unit 310 includes, but is not limited to: a first test pin 311, a second test pin 312, a third test pin 313, and a fourth test pin 314.

The second test unit 320 includes, but is not limited to: fifth test pin 321, sixth test pin 322, seventh test pin 323, and eighth test pin 324.

The first test pin 311 is electrically connected to the second test pin 312, the fifth test pin 321 is electrically connected to the sixth test pin 322, and the first test pin 311, the second test pin 312, the fifth test pin 321 and the sixth test pin 322 are all located in the binding area of the first panel 100.

The third test pin 313 and the fourth test pin 314 are respectively connected to the detection signal output end and the detection signal feedback end of the detection device 400, and the seventh test pin 323 and the eighth test pin 324 are also respectively connected to the detection signal output end and the detection signal feedback end of the detection device 400. The third test pin 313, the fourth test pin 314, the seventh test pin 323, and the eighth test pin 324 are all located in the binding region of the circuit connector 200.

The first test pin 311, the second test pin 312, the fifth test pin 321 and the sixth test pin 322 are respectively bonded with the third test pin 313, the fourth test pin 314, the seventh test pin 323 and the eighth test pin 324 in a one-to-one correspondence manner in an at least partially overlapping manner.

The first dimensions of the first test pin 311, the second test pin 312, the fifth test pin 321, and the sixth test pin 322 are all unchanged. The direction of change of the first dimension of at least one of the third test pin 313 and the fourth test pin 314 is opposite to the direction of change of the first dimension of at least one of the seventh test pin 323 and the eighth test pin 324.

In the display module provided in this embodiment, among the four test pins of the first test unit 310, a test pin (at least one of the third test pin 313 and the fourth test pin 314) whose first size monotonically changes along the first direction is located in the binding area of the circuit connector 200; also, among the four test pins of the second test unit 320, a test pin (at least one of the fifth test pin 321 and the sixth test pin 322) whose first size monotonically varies along the first direction is located at the bonding region of the circuit connection 200. This may be advantageous in reducing the semiconductor patterning process for the first panel 100.

Optionally, as shown in fig. 3 or fig. 5, the first dimension of the third test pin 313 and the first dimension of the fourth test pin 314 both change monotonically along the first direction. The first size of the seventh test pin 323 and the first size of the eighth test pin 324 each change monotonically in the same direction along the first direction.

In this embodiment, the direction of the monotonic change of the first dimension of the third test pin 313 is the same as the direction of the monotonic change of the first dimension of the fourth test pin 314, so that, in the case that the binding offset occurs between the first panel 100 and the circuit connector 200, the direction of the electrical change of the detection signal between the first test pin 311 and the third test pin 313 can be the same as the direction of the electrical change between the second test pin 312 and the fourth test pin 314, which is beneficial to the detection signal passing through the four test pins of the first test unit 310, and the total electrical change is larger, i.e. the total electrical change is more obvious, thus being beneficial to improving the identification degree of the detection device 400 and further improving the detection precision.

Similarly, the direction of the monotonic change of the first size of the seventh test pin 323 is the same as the direction of the monotonic change of the first size of the eighth test pin 324, which is favorable for the detection signal to pass through the four test pins of the second test unit 320, and the total electrical change is larger, i.e. the total electrical change is more obvious, so that the identification degree of the detection device 400 can be improved, and the detection precision can be improved.

Optionally, as shown in fig. 3, the first dimension of the third test pin 313 and the first dimension of the fourth test pin 314 are gradually increased along the first direction, and the first dimension of the seventh test pin 323 and the first dimension of the eighth test pin 324 are gradually decreased along the first direction.

Optionally, as shown in fig. 5, the first dimension of the third test pin 313 and the first dimension of the fourth test pin 314 are gradually reduced along the first direction, and the first dimension of the seventh test pin 323 and the first dimension of the eighth test pin 324 are gradually increased along the first direction.

In some possible embodiments, the projections of the third test pin 313, the fourth test pin 314, the seventh test pin 323, and the eighth test pin 324 on the plane of the bonding area of the first panel 100 or the plane of the bonding area of the circuit connector 200 are any one of triangle, trapezoid, inferior bow, or semicircle.

Alternatively, if the projections of the third test pin 313, the fourth test pin 314, the seventh test pin 323, and the eighth test pin 324 on the plane of the bonding area of the first panel 100 or the plane of the bonding area of the circuit connector 200 are triangles, respectively, the height of the triangles may be parallel to the first direction, and the bottom of the triangles may be perpendicular to the first direction.

Alternatively, if the third test pin 313, the fourth test pin 314, the seventh test pin 323, and the eighth test pin 324 are respectively projected on the plane of the bonding area of the first panel 100 or the plane of the bonding area of the circuit connector 200 to be trapezoidal, the height of the trapezoid may be parallel to the first direction, and the upper bottom or the lower bottom of the trapezoid may be perpendicular to the first direction.

Alternatively, if the third test pin 313, the fourth test pin 314, the seventh test pin 323, and the eighth test pin 324 are respectively projected as inferior bows or semicircles on the plane of the bonding area of the first panel 100 or the plane of the bonding area of the circuit connector 200, the chords of the inferior bows or semicircles may be perpendicular to the first direction.

The inventor considers that each pin of the binding area in the existing display module is in a slender rectangular bar shape, and if the test pin is too slender, the possible electrical variation amplitude of the detection signal can be reduced, which is not beneficial to the identification of the detection device 400. For this purpose, the application provides one possible implementation manner for the display module assembly as follows:

as shown in fig. 1 to 5, the display module according to the embodiment of the present application further includes, but is not limited to, at least one working unit 330, where the working unit 330 includes, but is not limited to, at least two working pins (e.g., a first working pin 331 located in a binding area of the first panel 100 and a second working pin 332 located in a binding area of the circuit connector 200), and the working pins are respectively located in the binding area of the first panel 100 and the binding area of the circuit connector 200, and are bound in a one-to-one correspondence manner in an at least partially overlapping manner.

The second dimension of any test pin is larger than the second dimension of the working pin, and the second dimension is parallel to the first direction.

In this embodiment, the second size of any one of the test pins is larger than the second size of the working pin, so that the test pins can obtain more binding contact space in the first direction, and the binding contact area between two corresponding binding test pins has larger variation amplitude under the condition that the first panel 100 and the circuit connector 200 are subjected to binding offset, so that the resistance value variation of two corresponding binding test pins is more obvious, namely, the detection signals passing through four test pins of each test unit can be subjected to more obvious electrical variation.

It will be appreciated that each working pin is used for conventional information transfer between the first panel 100 and the circuit connector 200, and the size and shape of each working pin may be of conventional design, so as to meet the information transfer requirement.

The inventor contemplates that the first dimension of at least one of the four test pins in each test unit varies monotonically along the first direction and the first dimension of the other test pin bound corresponding thereto does not vary. To this end, the present application provides another possible implementation manner for the display module as follows:

At least one pair of test units of embodiments of the present application includes, but is not limited to: a first test unit 310 and a second test unit 320.

The first dimensions of the third test pin 313, the fourth test pin 314, the fifth test pin 321, and the sixth test pin 322 are all unchanged. The direction of change of the first size of at least one of the first test pin 311 and the second test pin 312 is opposite to the direction of change of the first size of at least one of the seventh test pin 323 and the eighth test pin 324.

In the display module provided in this embodiment, among the four test pins of the first test unit 310, a test pin (at least one of the first test pin 311 and the second test pin 312) whose first size monotonically changes along the first direction is located in the binding area of the first panel 100; also, among the four test pins of the second test unit 320, a test pin (at least one of the seventh test pin 323 and the eighth test pin 324) whose first size monotonically varies along the first direction is located at the bonding region of the circuit connection member 200. This may be advantageous to accommodate partially personalized product structure requirements.

The inventor contemplates that the first dimension of at least one of the four test pins in each test unit varies monotonically along the first direction and the first dimension of the other test pin bound corresponding thereto does not vary. To this end, the present application provides a further possible implementation manner for the display module as follows:

The first dimensions of the first test pin 311, the second test pin 312, the seventh test pin 323, and the eighth test pin 324 are all unchanged. The direction of change of the first dimension of at least one of the third test pin 313 and the fourth test pin 314 is opposite to the direction of change of the first dimension of at least one of the fifth test pin 321 and the sixth test pin 322.

In the display module provided in this embodiment, among the four test pins of the first test unit 310, a test pin (at least one of the third test pin 313 and the fourth test pin 314) whose first size monotonically changes along the first direction is located in the binding area of the circuit connector 200; also, among the four test pins of the second test unit 320, a test pin (at least one of the fifth test pin 321 and the sixth test pin 322) whose first size monotonically varies along the first direction is located at the bonding region of the first panel 100. This may be advantageous to accommodate partially personalized product structure requirements.

The first dimensions of the third test pin 313, the fourth test pin 314, the seventh test pin 323, and the eighth test pin 324 are all unchanged. The direction of change of the first dimension of at least one of the first test pin 311 and the second test pin 312 is opposite to the direction of change of the first dimension of at least one of the fifth test pin 321 and the sixth test pin 322.

In the display module provided in this embodiment, among the four test pins of the first test unit 310, a test pin (at least one of the first test pin 311 and the second test pin 312) whose first size monotonically changes along the first direction is located in the binding area of the first panel 100; also, among the four test pins of the second test unit 320, a test pin (at least one of the fifth test pin 321 and the sixth test pin 322) whose first size monotonically varies along the first direction is located at the bonding region of the circuit connection 200. This may be advantageous in reducing the semiconductor patterning process for the circuit connector 200.

The inventor considers that any display module provided in the above embodiments needs to have a display function. For this purpose, the application provides one possible implementation manner for the display module assembly as follows:

the first panel 100 of an embodiment of the present application includes, but is not limited to, a display panel.

The circuit connector 200 includes, but is not limited to, a flip chip film or a flexible circuit board.

Two of the four test pins of each test unit are located in the binding area of the display panel, and the other two test pins are located in the binding area of the flip chip film or the flexible circuit board.

Alternatively, the display panel may include an anode layer, a Light Emitting layer, a cathode layer, and the like, which are sequentially stacked to constitute a display structure such as an LED (Light Emitting Diode) or Micro-LED (Micro Light Emitting Diode) or OLED (Organic Light-Emitting Diode).

Alternatively, the display panel may include a backlight, an array substrate, a liquid crystal encapsulation layer, and the like, which are sequentially stacked to constitute an LCD (Liquid Crystal Display ) display structure.

The inventor considers that any display module provided in the above embodiments may further have a touch function. For this purpose, the application provides one possible implementation manner for the display module assembly as follows:

The first panel 100 of the embodiment of the present application includes, but is not limited to, a display panel and a touch panel that are stacked.

Two of the four test pins of each test unit are located in the binding area of the touch panel, and the other two test pins are located in the binding area of the flip chip film or the flexible circuit board.

Based on the same inventive concept, embodiments of the present application provide a display device including, but not limited to: any one of the display modules provided in the foregoing embodiments.

In this embodiment, the display device may be at least one of any product or component with a display function, such as a television, a digital photo frame, a mobile phone, a smart watch, and a tablet computer.

Because the display device adopts any one of the display modules provided in the foregoing embodiments, the principle and technical effects thereof will be described in the foregoing embodiments, and will not be described in detail herein.

Based on the same inventive concept, an embodiment of the present application provides a detection apparatus 400, as shown in fig. 6, the detection apparatus 400 includes, but is not limited to: a detection signal transceiver 410, a memory 420, and a processor 430.

The memory 420 is electrically connected to the processor 430, such as via a bus.

The detection signal transceiver 410 is electrically connected to the processor 430, such as via a bus.

At least one computer program stored in memory 420 and configured to be executed by processor 430, the at least one program configured to: various alternative implementations of a binding detection method as provided by the foregoing embodiments are performed. The binding detection method will be described in detail below, and thus is not described here.

Those skilled in the art will appreciate that the detection apparatus 400 provided by embodiments of the present application may be specially designed and manufactured for the desired purposes, or may also include, but is not limited to, known devices in general purpose computers. These devices have computer programs stored therein that are selectively activated or reconfigured. Such a computer program may be stored in a device (e.g., computer) readable medium or in any type of medium suitable for storing electronic instructions and coupled to a bus, respectively.

The processor 430 may be a CPU (Central Processing Unit ), general purpose processor, DSP (Digital Signal Processor, data signal processor), ASIC (Application Specific Integrated Circuit ), FPGA (Field-Programmable Gate Array, field programmable gate array) or other programmable logic device, transistor logic device, hardware component, or any combination thereof. Which may implement or perform the various exemplary logic blocks, modules and circuits described in connection with this disclosure. Processor 430 may also be a combination that performs computing functions, such as including one or more microprocessor combinations, a combination of a DSP and a microprocessor, and the like.

A bus may include, but is not limited to, a path that communicates information between the components described above. The bus may be a PCI (Peripheral Component Interconnect, peripheral component interconnect standard) bus or an EISA (Extended Industry Standard Architecture ) bus, or the like. The buses may be divided into address buses, data buses, control buses, etc.

Memory 420 may be, but is not limited to, ROM (Read-Only Memory) or other type of static storage device that can store static information and instructions, RAM (random access Memory ) or other type of dynamic storage device that can store information and instructions, EEPROM (Electrically Erasable Programmable Read Only Memory, electrically erasable programmable Read-Only Memory), CD-ROM (Compact Disc Read-Only Memory) or other optical disk storage, optical disk storage (including but not limited to compact disk, laser disk, optical disk, digital versatile disk, blu-ray disk, etc.), magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer.

Optionally, the detection device 400 may also include, but is not limited to, a transceiver. The transceiver may be used for both reception and transmission of signals. The transceiver may allow the detection device 400 to communicate wirelessly or by wire with other devices to exchange data. It should be noted that the transceiver is not limited to one in practical application.

Optionally, the detection device 400 may also include, but is not limited to, an input unit. The input unit may be used to receive input digital, character, image and/or sound information or to generate key signal inputs related to user settings and function control of the detection device 400. The input unit may include, but is not limited to, one or more of a touch screen, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a track ball, a mouse, a joystick, a camera, a microphone, etc.

Optionally, the detection device 400 may also include, but is not limited to, an output unit. An output unit may be used to output or present information processed by the processor 430. The output unit may include, but is not limited to, one or more of a display screen, a speaker, a vibration device, and the like.

Optionally, the memory 420 is used for storing application program codes for executing the inventive arrangements, and is controlled to be executed by the processor 430. The processor 430 is configured to execute application code stored in the memory 420 to implement any of the binding detection methods provided by the embodiments of the present application.

Based on the same inventive concept, the embodiment of the present application provides a binding detection method for any one of the display modules provided in the foregoing embodiments, and a flow chart of the method is shown in fig. 7, where the method includes, but is not limited to, steps S101 to S103:

s101: a pair of resistance values of at least one pair of test units is obtained, wherein at least one resistance value in the pair of resistance values comprises, but is not limited to, the sum of sub-resistance values of binding contact areas between every two corresponding binding test pins in the corresponding test units.

Optionally, the processor 430 in the detecting device 400 provided by the foregoing embodiment controls the detecting signal transceiver 410 to send the detecting signal to at least one pair of the test units in any one of the display modules provided by the foregoing embodiment according to the computer program in the memory 420, the detecting signal transceiver 410 transmits the feedback signal received from the at least one test unit to the processor 430, and the processor 430 calculates a pair of resistance values of the at least one pair of test units according to the difference between the detecting signal and the feedback signal corresponding to the at least one pair of test units.

Alternatively, the detection signal may be a voltage signal or a current signal, or the like.

S102: a magnitude relationship between one resistance value and the other resistance value of a pair of resistance values is determined.

Optionally, a magnitude relationship between one resistance value and the other resistance value of the pair of resistance values is determined by processor 430.

S103: and determining the offset direction and the offset amount between every two corresponding bound test pins of at least one test unit according to the size relation and the change direction of the first dimension of the test unit in at least one pair of test units.

Optionally, the processor 430 determines an offset direction and an offset between each two corresponding bonded test pins of the at least one test unit according to the magnitude relation and a direction of the change of the first dimension of the test unit in the at least one pair of test units. The change direction of the first dimension of the test unit in the test unit is determined by the factory structure of the display module and is a known parameter.

According to the binding detection method provided by the embodiment, the structural characteristics that detection signals passing through four test pins of each test unit can generate different electrical changes under the condition that the first panel 100 and the circuit connecting piece 200 are offset are caused by the opposite changing directions of the first dimension between at least one pair of test units in the display module are fully utilized, the binding offset and the binding on-resistance value can be fitted into a functional relation by means of the different electrical changes of at least one pair of test units, the binding on-resistance and the binding offset of the display module can be rapidly monitored by utilizing the functional relation through one-time electrical detection, the rapid finding and response of the binding offset problem are finally realized, and the binding detection efficiency and the data collection capability in the mass production of the display module can be remarkably improved.

In some possible embodiments, the step S103 determines the offset direction and the offset amount between each two corresponding bonded test pins of the at least one test unit according to the size relationship and the direction of the change of the first dimension of the test unit in the at least one pair of test units, as shown in fig. 8, including but not limited to steps S201-S202:

s201: under the condition that one test unit with the first size gradually increasing along the first direction and the other test unit with the first size gradually decreasing along the first direction are positioned at the upstream of the other test unit, if the resistance value of one test unit is smaller than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is the same as the first direction; if the resistance value of one test unit is larger than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is opposite to the first direction.

S202: and determining the offset between every two corresponding bound test pins of at least one test unit according to the relation between the offset and the pair of resistance values and the area of the binding contact area.

In the present application, "upstream" and "downstream" are described as a relative positional relationship between front and rear positions in a first direction, for example: the first direction is a left-to-right direction, then "upstream" is to the left of "downstream" and "downstream" is to the right of "upstream".

The following exemplifies the above step S201 and step S202, taking an example one as an example:

example one: as shown in fig. 1-3, in the display module, the first direction is from left to right, and the first test unit 310 is located at the left side of the second test unit 320.

The first test pins 311 and the second test pins 312 of the first test unit 310 located at the bonding area of the first panel 100 are bonded in one-to-one correspondence with the third test pins 313 and the fourth test pins 314 located at the bonding area of the circuit connection 200. The first test pin 311 is electrically connected to the second test pin 312, and the third test pin 313 and the fourth test pin 314 are respectively connected to a detection signal output end and a detection signal feedback end of the detection device 400.

The fifth test pin 321 and the sixth test pin 322 of the second test unit 320 located at the bonding area of the first panel 100 are bonded in one-to-one correspondence with the seventh test pin 323 and the eighth test pin 324 located at the bonding area of the circuit connection 200. The fifth test pin 321 is electrically connected to the sixth test pin 322, and the seventh test pin 323 and the eighth test pin 324 are also respectively connected to the detection signal output terminal and the detection signal feedback terminal of the detection device 400.

And (3) making: the projection of the first test pin 311, the second test pin 312, the fifth test pin 321 and the sixth test pin 322 on the plane of the binding area of the first panel 100 or the plane of the binding area of the circuit connector 200 is rectangular, wherein the length direction of each rectangle is perpendicular to the first direction, and the width direction is parallel to the first direction.

The third test pin 313, the fourth test pin 314, the seventh test pin 323 and the eighth test pin 324 are all projected on the plane of the binding area of the first panel 100 or the plane of the binding area of the circuit connector 200 to be triangular, wherein the bottom edge direction of each triangle is perpendicular to the first direction, the height direction is parallel to the first direction, the bottom edge of the third test pin 313 and the bottom edge of the fourth test pin 314 are all right-facing, and the bottom edge of the seventh test pin 323 and the bottom edge of the eighth test pin 324 are all left-facing.

The length of the bottom edge of each triangle is equal to the length of each rectangle, and is l; the height of each triangle is equal to the width of each rectangle, and m is the same.

The first size of the third test pin 313 and the first size of the fourth test pin 314 in the first test unit 310 are gradually increased along the first direction; the first size of the seventh test pin 323 and the first size of the eighth test pin 324 in the second test unit 320 are each gradually reduced in the first direction.

The detection device 400 is used to transmit a detection signal to one of the third test pin 313 and the fourth test pin 314, and to transmit a detection signal to one of the seventh test pin 323 and the eighth test pin 324, and to receive a feedback signal output from the other of the third test pin 313 and the fourth test pin 314, and to receive a feedback signal output from the other of the seventh test pin 323 and the eighth test pin 324.

According to the difference between the detection signal and the feedback signal in the first test unit 310, the resistance R of the first test unit 310 is calculated _left The method comprises the steps of carrying out a first treatment on the surface of the According to the difference between the detection signal and the feedback signal in the second test unit 320, the resistance R of the second test unit 320 is calculated _right 。

Because the triangular pins in the first test unit 310 and the second test unit 320 are opposite in left and right directions, when a binding offset exists between the first panel 100 and the circuit connector 200, the binding contact area between the corresponding binding pins in the first test unit 310 and the second test unit 320 has different change values, so that R can be caused _left And R is _right The change amplitude is different, so that the binding offset x and the left binding on-resistance value and the right binding on-resistance value can be fitted to form a functional relation, and the binding offset x is calculated by utilizing the functional relation.

When the circuit connector 200 is offset in a first direction (i.e., the binding whole right-hand offset) relative to the first panel 100, the contact area S between every two corresponding binding pins in the first test unit 310 _left ＝l/2m(m-|x|) ² Then the resistance value of the first test unit 310 At the same time, the contact area S between every two corresponding bonded pins in the second test unit 320 _right ＝l/2m(m ² -x ² ) Then the resistance value of the second test unit 320

When the circuit connector 200 is offset in the opposite direction of the first direction (i.e., the binding whole left-hand offset) relative to the first panel 100, the firstContact area S between every two corresponding bonded pins in test unit 310 _left ＝l/2m(m ² -x ² ) Then the resistance value of the first test unit 310 At the same time, the contact area S between every two corresponding bonded pins in the second test unit 320 _right ＝l/2m(m-|x|) ² Then the resistance value of the second test unit 320 +.>

In the foregoing formulas, the binding offset is denoted as x, x >0 represents right bias, and x <0 represents binding left bias. After binding, binding on-resistance r=k/S, where S is the binding contact area; k is the physical quantity of the fitting coefficient between the resistance and 1/S, and is related to the specification of ACF (Anisotropic Conductive Film ) adhesive products.

In some possible implementations, based on the foregoing embodiments, the at least one resistance value is inversely proportional to an area of the bonding contact region between two corresponding bonded test pins. I.e., binding on-resistance r=k/S in the foregoing example one.

In some possible embodiments, the step S103 determines the offset direction and the offset amount between each two corresponding bonded test pins of the at least one test unit according to the size relationship and the direction of the change of the first dimension of the test unit in the at least one pair of test units, as shown in fig. 9, including but not limited to steps S301-S302:

s301: under the condition that one test unit with the first size gradually increasing along the first direction and the other test unit with the first size gradually decreasing along the first direction are positioned at the downstream of the other test unit, if the resistance value of one test unit is smaller than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is the same as the first direction; if the resistance value of one test unit is larger than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is opposite to the first direction.

S302: and determining the offset between every two corresponding bound test pins of at least one test unit according to the relation between the offset and the pair of resistance values and the area of the binding contact area.

The following exemplifies the above step S301 and step S302 by taking the example two as an example:

example two: as shown in fig. 4 and 5, in the display module, the first direction is still the left-to-right direction, and the first test unit 310 is still located at the left side of the second test unit 320.

Example two differs from example one described above in that: the triangular base of the third test pin 313 and the triangular base of the fourth test pin 314 in the first test unit 310 are both directed to the left, and the triangular base of the seventh test pin 323 and the triangular base of the eighth test pin 324 are both directed to the right.

When the circuit connector 200 is offset in a first direction (i.e., the binding whole right-hand offset) relative to the first panel 100, the contact area S between every two corresponding binding pins in the first test unit 310 _left ＝l/2m(m ² -x ² ) Then the resistance value of the first test unit 310 At the same time, the contact area S between every two corresponding bonded pins in the second test unit 320 _right ＝l/2m(m-x) ² Then the resistance value of the second test unit 320

When the circuit connector 200 is offset in the opposite direction of the first direction (i.e., binding overall left bias) relative to the first panel 100Contact area S between every two corresponding bonded pins in the first test unit 310 _left ＝l/2m(m-|x|) ² Then the resistance value of the first test unit 310 At the same time, the contact area S between every two corresponding bonded pins in the second test unit 320 _right ＝l/2m(m ² -x ² ) Then the resistance value of the second test unit 320 +.>

Based on the same inventive concept, a schematic structural frame of a binding detection apparatus 500 according to an embodiment of the present application is shown in fig. 10, including but not limited to: a resistance measurement module 510, a resistance comparison module 520, and an analysis module 530.

The resistance measurement module 510 is configured to obtain a pair of resistance values of at least one pair of test units, where at least one resistance value of the pair of resistance values includes, but is not limited to, a sum of sub-resistance values of a binding contact area between every two corresponding binding test pins in the corresponding test unit.

The resistance value comparison module 520 is configured to determine a magnitude relationship between one resistance value and the other resistance value of a pair of resistance values.

The analysis module 530 is configured to determine an offset direction and an offset amount between each two corresponding bound test pins of the at least one test unit according to the magnitude relation and a direction of a change of the first dimension of the test unit in the at least one pair of test units.

The detection device of the present embodiment may execute any binding detection method provided in the embodiment of the present application, and its implementation principle is similar, and will not be described herein.

In some possible embodiments, the analysis module 530 is further configured to determine that the offset direction between each two corresponding bound test pins of at least one test unit is the same as the first direction if the resistance value of one test unit is smaller than the resistance value of another test unit under the condition that the first size of one test unit gradually increases along the first direction and the first size of another test unit gradually decreases along the first direction; if the resistance value of one test unit is larger than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is opposite to the first direction; and determining the offset between every two corresponding bound test pins of at least one test unit according to the relation between the offset and the pair of resistance values and the area of the binding contact area.

In some possible embodiments, the analysis module 530 is further configured to determine that the offset direction between each two corresponding bound test pins of the at least one test unit is the same as the first direction if the resistance value of one test unit is smaller than the resistance value of the other test unit under the condition that the first size of one test unit gradually increases along the first direction and the first size of another test unit gradually decreases along the first direction; if the resistance value of one test unit is larger than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is opposite to the first direction; and determining the offset between every two corresponding bound test pins of at least one test unit according to the relation between the offset and the pair of resistance values and the area of the binding contact area.

Based on the same inventive concept, embodiments of the present application provide a computer readable storage medium having a computer program stored thereon, which when executed by the processor 430 implements any of the binding detection methods provided in the previous embodiments.

Embodiments of the present application provide various alternative implementations of a computer readable storage medium suitable for use in any of the above binding detection methods. And will not be described in detail herein.

It will be appreciated by those skilled in the art that the computer-readable storage media provided by the present embodiments can be any available media that can be accessed by the electronic device, including both volatile and nonvolatile media, removable and non-removable media. Computer readable storage media includes, but is not limited to, any type of disk including floppy disks, hard disks, optical disks, CD-ROMs, and magneto-optical disks, ROM, RAM, EPROM (Erasable Programmable Read-Only Memory ), EEPROMs (Electrically Erasable Programmable Read Only Memory, electrically erasable programmable read-Only Memory), flash Memory, magnetic cards, or optical cards. That is, computer-readable storage media includes any medium that stores or transmits information in a form readable by a device (e.g., a computer).

By applying the embodiment of the application, at least the following beneficial effects can be realized:

1. in the test unit, two test pins located in the binding area of the circuit connector 200 are respectively used for receiving the detection signal and the feedback detection signal, and two test pins located in the binding area of the first panel 100 are mutually electrically connected to form a detection loop, so that on one hand, a feasible condition is created for electrical detection, and on the other hand, signal connection of the external detection device 400 can be facilitated.

2. The first size of at least one test pin in the test unit is monotonously changed along the first direction, and the first size of the other test pin bound correspondingly is unchanged, so that under the condition that the first panel 100 and the circuit connecting piece 200 are bound and offset, the detection signals passing through the four test pins of each test unit can be obviously electrically changed, thereby being beneficial to improving the identification degree of the detection equipment 400 and further being beneficial to improving the detection precision or sensitivity.

3. The direction of change of the first dimension between at least one pair of test units is opposite, so that under the condition that the first panel 100 and the circuit connecting piece 200 deviate, detection signals passing through four test pins of each test unit can generate different electrical changes, the binding deviation amount and the binding on-resistance value can be fitted into a functional relation by means of different electrical changes of each pair of test units, the binding on-resistance and the binding deviation amount of the display module can be rapidly monitored by using the functional relation through one-time electrical detection, rapid discovery and response of the binding deviation problem are finally realized, and binding detection efficiency and data collection capacity in the mass production of the display module can be remarkably improved.

4. The second size of any one test pin is larger than the second size of the working pin, so that the test pins can obtain more binding contact space in the first direction, and under the condition that the first panel 100 and the circuit connecting piece 200 are subjected to binding offset, the binding contact area between two corresponding binding test pins is larger in change amplitude, and further the resistance value of the two corresponding binding test pins is more obvious, namely the detection signals of four test pins passing through each test unit can be subjected to more obvious electrical change.

Those of skill in the art will appreciate that the various operations, methods, steps in the flow, acts, schemes, and alternatives discussed in the present application may be alternated, altered, combined, or eliminated. Further, other steps, means, or steps in a process having various operations, methods, or procedures discussed herein may be alternated, altered, rearranged, disassembled, combined, or eliminated. Further, steps, measures, schemes in the prior art with various operations, methods, flows disclosed in the present application may also be alternated, altered, rearranged, decomposed, combined, or deleted.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.

The foregoing is only a partial embodiment of the present application, and it should be noted that it will be apparent to those skilled in the art that modifications and adaptations can be made without departing from the principles of the present application, and such modifications and adaptations are intended to be comprehended within the scope of the present application.

Claims

1. A display module, comprising: a first panel, a circuit connection, and at least one pair of test units;

the test unit comprises four test pins; wherein two test pins are positioned in the binding area of the first panel and are electrically connected with each other; the other two test pins are positioned in the binding area of the circuit connecting piece and are respectively used for connecting the detection signal output end and the detection signal feedback end of the detection equipment; the four test pins are bound in a corresponding mode of at least partially overlapping; the first dimension of at least one test pin of the four test pins is monotonously changed along a first direction, and the first dimension of the other test pin which is bound with the first test pin is unchanged, wherein the first dimension is perpendicular to the first direction, and the first direction is parallel to a binding area of the first panel or a binding area of the circuit connecting piece;

in at least one pair of the test units, the direction of change of the first dimension of the test pin in one of the test units is opposite to the direction of change of the first dimension of the test pin in the other test unit.

2. The display module of claim 1, wherein at least one pair of the test units comprises: a first test unit and a second test unit;

The first test unit includes: the first test pin, the second test pin, the third test pin and the fourth test pin;

the second test unit includes: a fifth test pin, a sixth test pin, a seventh test pin, and an eighth test pin;

the first test pin is electrically connected with the second test pin, the fifth test pin is electrically connected with the sixth test pin, and the first test pin, the second test pin, the fifth test pin and the sixth test pin are all positioned in a binding area of the first panel;

the third test pin and the fourth test pin are respectively used for connecting a detection signal output end and a detection signal feedback end of the detection equipment, and the seventh test pin and the eighth test pin are also respectively used for connecting a detection signal output end and a detection signal feedback end of the detection equipment; the third test pin, the fourth test pin, the seventh test pin and the eighth test pin are all located in a binding region of the circuit connector;

the first test pin, the second test pin, the fifth test pin and the sixth test pin are respectively bound with the third test pin, the fourth test pin, the seventh test pin and the eighth test pin in a one-to-one correspondence manner in an at least partially overlapped manner;

The first dimensions of the first test pin, the second test pin, the fifth test pin and the sixth test pin are all unchanged; the direction of change of the first dimension of at least one of the third test pin and the fourth test pin is opposite to the direction of change of the first dimension of at least one of the seventh test pin and the eighth test pin.

3. The display module of claim 2, wherein the first dimension of the third test pin and the first dimension of the fourth test pin both vary monotonically in the same direction along the first direction;

the first dimension of the seventh test pin and the first dimension of the eighth test pin are both monotonically varying in the same direction along the first direction.

4. A display module according to claim 3, wherein the first dimension of the third test pin and the first dimension of the fourth test pin each gradually increase along a first direction, and the first dimension of the seventh test pin and the first dimension of the eighth test pin each gradually decrease along the first direction;

or, the first dimension of the third test pin and the first dimension of the fourth test pin are gradually reduced along the first direction, and the first dimension of the seventh test pin and the first dimension of the eighth test pin are gradually increased along the first direction.

5. The display module of claim 4, wherein the projection of the third test pin, the fourth test pin, the seventh test pin, and the eighth test pin on the plane of the binding area of the first panel or the plane of the binding area of the circuit connector is any one of triangle, trapezoid, inferior bow, and semicircle.

6. The display module of claim 1, further comprising at least one working unit, wherein the working unit comprises at least two working pins, the working pins are respectively located in a binding area of the first panel and a binding area of the circuit connector, and are bound in a one-to-one correspondence manner in an at least partially overlapping manner;

7. The display module of claim 1, wherein at least one pair of the test units comprises: a first test unit and a second test unit;

The first dimensions of the third test pin, the fourth test pin, the fifth test pin and the sixth test pin are all unchanged; the direction of change of the first dimension of at least one of the first test pin and the second test pin is opposite to the direction of change of the first dimension of at least one of the seventh test pin and the eighth test pin.

8. The display module of claim 1, wherein at least one pair of the test units comprises: a first test unit and a second test unit;

the first dimensions of the first test pin, the second test pin, the seventh test pin and the eighth test pin are all unchanged; the direction of change of the first dimension of at least one of the third test pin and the fourth test pin is opposite to the direction of change of the first dimension of at least one of the fifth test pin and the sixth test pin.

9. The display module of claim 1, wherein at least one pair of the test units comprises: a first test unit and a second test unit;

the first dimensions of the third test pin, the fourth test pin, the seventh test pin, and the eighth test pin are all unchanged; the direction of change of the first dimension of at least one of the first test pin and the second test pin is opposite to the direction of change of the first dimension of at least one of the fifth test pin and the sixth test pin.

10. The display module of claim 1, wherein the first panel comprises a display panel; the circuit connecting piece comprises a flip chip film or a flexible circuit board; two of the four test pins of the test unit are positioned in the binding area of the display panel, and the other two test pins are positioned in the binding area of the flip chip film or the flexible circuit board;

or, the first panel comprises a display panel and a touch panel which are stacked; the circuit connecting piece comprises a flip chip film or a flexible circuit board; and two of the four test pins of the test unit are positioned in the binding area of the display panel or the binding area of the touch panel, and the other two test pins are positioned in the binding area of the flip chip film or the flexible circuit board.

11. A display device, comprising: the display module of any one of claims 1-10.

12. A binding detection method based on the display module set of any one of claims 1 to 10, comprising:

obtaining a pair of resistance values of at least one pair of test units, wherein at least one resistance value of the pair of resistance values comprises the sum of sub-resistance values of binding contact areas between every two corresponding binding test pins in the corresponding test units;

determining the offset direction and the offset between every two corresponding bound test pins of at least one test unit according to the size relation and the change direction of the first dimension of the test unit in the at least one pair of test units; the at least one resistance value is inversely proportional to an area of a binding contact area between two corresponding bound test pins.

13. The binding detection method of claim 12, wherein determining the offset direction and the offset between each two corresponding bound test pins of at least one test unit based on the magnitude relation and the direction of the change in the first dimension of the test unit of the at least one pair of test units comprises:

under the condition that one test unit with the first size gradually increasing along the first direction and the other test unit with the first size gradually decreasing along the first direction are positioned at the upstream of the other test unit, if the resistance value of the one test unit is smaller than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is the same as the first direction; if the resistance value of one test unit is larger than that of the other test unit, determining that the offset direction between every two corresponding bound test pins of at least one test unit is opposite to the first direction;

And determining the offset between every two corresponding bound test pins of at least one test unit according to the relation between the offset and the pair of resistance values and the area of the binding contact area.