CN113036335B - Glass-packaged ceramic feed-through filter and preparation method thereof - Google Patents
Glass-packaged ceramic feed-through filter and preparation method thereof Download PDFInfo
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- CN113036335B CN113036335B CN202110400663.2A CN202110400663A CN113036335B CN 113036335 B CN113036335 B CN 113036335B CN 202110400663 A CN202110400663 A CN 202110400663A CN 113036335 B CN113036335 B CN 113036335B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
Abstract
The invention discloses a glass-packaged ceramic feed-through filter and a preparation method thereof, wherein the glass-packaged ceramic feed-through filter comprises a guide pin and a metal shell sleeved in the middle of the guide pin; the bottom of the metal shell is packaged through a glass body; a gasket sleeved on the guide pin is arranged above the glass body; a disc-shaped multilayer ceramic capacitor is sleeved on the guide pin above the gasket; a first gap is formed between the bottom of the disc-shaped multilayer ceramic capacitor and the top of the glass body; a second gap is formed between the disc-shaped multilayer ceramic capacitor and the inner wall of the metal shell; the first gap is in communication with the second gap. According to the invention, the size of the first gap is increased through the gasket, so that the organic solvent can conveniently enter for soaking and washing at the later stage, and the second gap is reserved between the disc-shaped multilayer ceramic capacitor and the inner side surface of the metal shell, so that the first gap is communicated with the second gap, the residual position of the soldering flux can be conveniently and effectively cleaned, and the residual problem of the soldering flux is effectively avoided.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a glass-packaged ceramic feed-through filter and a preparation method thereof.
Background
Glass-encapsulated ceramic feedthrough filters are generally used in electronic products with high sealing requirements due to their superior sealing properties. The structure product is that the guide pin and the metal shell are fixed by glass sintering, and a certain space is reserved in the metal shell without sintering the glass, and the reserved space is used for subsequently welding the disc-shaped multilayer ceramic capacitor; then, carrying out surface electroplating treatment on the sintered shell; then, a disc-shaped multilayer ceramic capacitor is arranged in the shell and welded by lead alloy solder, and the soldering flux is cleaned after welding; and finally, encapsulating epoxy resin and curing.
The technical scheme of the prior art has the following defects: the soldering flux after soldering of the glass-encapsulated ceramic feed-through filter is difficult to clean. Because one end of the product is sealed by glass sintering, the disc-shaped multilayer ceramic capacitor is arranged close to the surface of the glass, when the disc-shaped multilayer ceramic capacitor is welded subsequently, part of soldering flux can remain in a gap between the disc-shaped multilayer ceramic capacitor and the glass, and the residual soldering flux is sealed by lead alloy solder, so that the disc-shaped multilayer ceramic capacitor cannot be cleaned. These feedthrough capacitors with residual flux are prone to a decrease in insulation performance, and although the products are tested and removed after production, a partial decrease in insulation performance of the products after being incorporated into circuits occurs, because the products are soldered once more while being incorporated into circuits, and the residual flux is liquefied and becomes free inside the products during the second soldering, so that the products also exhibit a partial decrease in insulation performance after being incorporated into circuits.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a glass-packaged ceramic feed-through filter which effectively solves the problem of flux residue and improves the stability of the feed-through filter and a preparation method thereof.
The invention is realized by the following modes: a glass-packaged ceramic feed-through filter comprises a guide pin and a metal shell sleeved in the middle of the guide pin; the bottom of the metal shell is fixed through a glass body and is hermetically connected with a guide pin to package the end part of the metal shell; the glass body top is formed with metal casing top inside and holds the chamber, its characterized in that: a gasket sleeved on the guide pin is arranged above the glass body; a disc-shaped multilayer ceramic capacitor is sleeved on the guide pin above the gasket; a first gap is formed between the bottom of the disc-shaped multilayer ceramic capacitor and the top of the glass body; the disc-shaped multilayer ceramic capacitor is welded and fixed in the accommodating cavity; at least one second gap is formed between the disc-shaped multilayer ceramic capacitor and the inner wall of the metal shell or the outer side of the guide pin; the first gap is communicated with the second gap; and the top of the disc-shaped multilayer ceramic capacitor is packaged by pouring sealant.
Further, the glass body is fixed with the guide pin and the metal shell through sintering.
Further, the sum of the thicknesses of the gasket and the disc-shaped multilayer ceramic capacitor is less than the height of the accommodating cavity.
Furthermore, the gasket is a C-shaped gap gasket, and the inner diameter of the C-shaped gap gasket is equivalent to the outer diameter of the guide pin.
Further, the thickness of the gasket is 0.05-0.5mm.
Furthermore, solder is arranged between the inner hole of the center of the disc-shaped multilayer ceramic capacitor and the outer side of the guide pin for full-length welding fixation.
Further, the disc-shaped multilayer ceramic capacitor and the inner wall of the metal shell are partially filled with solder for local fixation so that at least one second gap is formed in the non-welding area.
A method of making a glass-encapsulated ceramic feedthrough filter, comprising the steps of:
s1: selecting a metal shell and a guide pin, packaging the end part of the metal shell by using a glass body, and forming a containing cavity capable of containing a gasket and a disc-shaped multilayer ceramic capacitor at the other end;
s2: carrying out surface electroplating treatment on the packaged metal shell;
s3: c-shaped gaskets with inner apertures equivalent to the outer diameters of the guide pins are selected to be sleeved on the guide pins above the glass body;
s4: selecting a disc-shaped multilayer ceramic capacitor to be sleeved on a guide pin above a gasket;
s5: coating soldering flux in the gap between the guide pin and the central through hole of the disc-shaped multilayer ceramic capacitor and the gap between the outer side of the disc-shaped multilayer ceramic capacitor and the inner side of the metal shell;
s6: filling solder in a gap between the guide pin and the central through hole of the disc-shaped multilayer ceramic capacitor for welding; locally plugging solder into a gap between the outer side of the disc-shaped multilayer ceramic capacitor and the inner side of the metal shell along the circumferential direction for welding, so that at least one second gap is formed in a non-welded area;
s7: after welding, washing for many times by adopting an organic solvent, wherein the organic solvent enters the first gap through the second gap to effectively remove the residual soldering flux in the first gap;
s8: encapsulating and curing the cleaned product by using an encapsulating adhesive;
further, the washing step in the step S7 is to put the welded disc-shaped multilayer ceramic capacitor into an organic solvent for vacuum pumping, then put the capacitor into the organic solvent for soaking for 20 to 30 minutes, finally spin-dry the residual organic solvent inside by using a centrifuge, repeat the above steps for 2 to 5 times, and use new organic solvent for each soaking.
Further, the organic solvent is absolute ethyl alcohol or other organic solvents capable of dissolving the soldering flux.
Further, the pouring sealant is liquid epoxy resin, vacuum filling and sealing equipment is adopted, or the product is placed into a vacuum box for exhaust treatment after filling and sealing are carried out in a normal-pressure environment, so that the liquid epoxy resin can flow into the space between the first gap and the second gap for insulation sealing, and finally the liquid epoxy resin is cured, and product manufacturing is completed.
The invention has the beneficial effects that: increase the distance between disc multilayer ceramic capacitor and the vitreous body upper surface through the gasket, the size in first clearance has been increased, make things convenient for later stage organic solvent to get into to steep and wash, and remain the second clearance between disc multilayer ceramic capacitor and metal casing medial surface, make first clearance and second clearance be linked together, thereby the convenient remains the position to the scaling powder and carries out effectual washing, the effectual problem of remaining of scaling powder of having avoided, the structural design of C shape gasket can make things convenient for organic solvent more free to flow between first clearance simultaneously, the cleaning efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
FIG. 1 is a cross-sectional view of a welded feedthrough filter of the present invention;
fig. 2 is a cross-sectional view of a feed-through filter package of the present invention;
FIG. 3 is a schematic view of a gasket construction of the present invention;
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It is to be understood that the described embodiments are only a few, but not all embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The embodiment is as follows:
as shown in fig. 1-3, a glass-encapsulated ceramic feedthrough filter includes a lead 100 and a metal housing 101 sleeved on the middle portion of the lead 100; the bottom of the metal casing 101 is fixed through a glass body 102 and hermetically connected with a guide pin 100 to carry out encapsulation on the end part of the metal casing 101; an accommodating cavity 103 is formed above the glass body 102 and inside the metal casing 101, and a gasket 104 sleeved on the guide pin 100 is arranged above the glass body 102; a disc-shaped multilayer ceramic capacitor 105 is sleeved on the guide pin 100 above the gasket 104; a first gap 107 is formed between the bottom of the disc-shaped multilayer ceramic capacitor 105 and the top of the glass body 102; the disc-shaped multilayer ceramic capacitor 105 is welded and fixed in the accommodating cavity 103; at least one second gap 108 is formed between the disc-shaped multilayer ceramic capacitor 105 and the inner wall of the metal case 101 or the outer side of the lead 100; the first gap 107 is in communication with the second gap 108; the top of the disc-shaped multilayer ceramic capacitor 105 is encapsulated by a potting adhesive 106.
In an embodiment of the present invention, the glass body 1 is fixed to the guide pin 100 and the metal casing 101 by sintering.
In an embodiment of the present invention, the sum of the thicknesses of the spacer 104 and the disc-shaped multilayer ceramic capacitor 105 is smaller than the height of the accommodating chamber 103.
In an embodiment of the present invention, the pad 104 is a C-shaped gap pad, and the inner diameter thereof is equivalent to the outer diameter of the lead 100.
In an embodiment of the present invention, the two end portions of the opening of the spacer 104 have a height difference, which can further increase the distance between the disc-shaped multilayer ceramic capacitor 105 and the upper surface of the glass body 102, facilitate the flow of the organic solvent, and increase the size of the first gap 107 without increasing the thickness of the spacer 104.
In an embodiment of the present invention, the thickness of the spacer 104 is 0.05-0.5mm. The thickness is preferably 0.1mm.
In an embodiment of the present invention, the solder 109 is disposed between the inner hole of the center of the disc-shaped multi-layer ceramic capacitor 105 and the outer side of the lead 100 for full-soldering fixation, and since the space at this position is small, the processing difficulty is relatively large if the space is used as the forming space of the second gap 108, the processing difficulty can be reduced by the full-soldering mode, and the cost can be reduced.
In an embodiment of the present invention, the disc-shaped multilayer ceramic capacitor 105 and the inner wall of the metal housing 101 are partially filled with solder 109 for local fixation so that at least one second gap 108 is formed in the non-soldering region; the solder 109 is arranged in half along the circumferential gap between the disc-shaped multilayer ceramic capacitor 105 and the inner wall of the metal shell 101, and can be continuously arranged in half for filling or alternatively arranged in half for filling, and the left half space is used as the second gap 108, so that the welding stability can be ensured, meanwhile, the sufficient size of the second gap 108 can be ensured, and the subsequent cleaning can be conveniently and smoothly carried out.
A method of making a glass-encapsulated ceramic feedthrough filter, comprising the steps of:
s1: selecting a metal shell 101 and a guide pin 100, packaging the end part of the metal shell 101 by using a glass body 102, and forming a containing cavity 103 capable of containing a gasket 104 and a disc-shaped multilayer ceramic capacitor 105 at the other end;
s2: performing surface electroplating treatment on the packaged metal shell 101;
s3: c-shaped gaskets 104 with inner apertures equivalent to the outer diameters of the guide pins 100 are selected to be sleeved on the guide pins 100 above the glass body 102;
s4: selecting a disc-shaped multilayer ceramic capacitor 105 to be sleeved on the guide pin 100 above the gasket 104;
s5: coating flux in the gap between the lead 100 and the central through hole of the disc-shaped multilayer ceramic capacitor 105 and the gap between the outer side of the disc-shaped multilayer ceramic capacitor 105 and the inner side of the metal case 101;
s6: filling solder 109 in the gap between the guide pin 100 and the central through hole of the disc-shaped multilayer ceramic capacitor 105 for soldering; welding is performed by partially inserting solder 109 in the circumferential direction at a gap between the outside of the disc-shaped multilayer ceramic capacitor 105 and the inside of the metal case 101 so that an unwelded region is formed with at least one second gap 108;
s7: after welding, an organic solvent is adopted for washing for multiple times, and the organic solvent enters the first gap 107 through the second gap 108 to effectively remove the residual soldering flux in the first gap 107;
s8: encapsulating and curing the cleaned product by using an encapsulating adhesive 106;
further, the rinsing step in step S7 is to put the welded disc-shaped multilayer ceramic capacitor 105 into an organic solvent for vacuum pumping, then to put the capacitor into the organic solvent for soaking for 20 to 30 minutes, and finally to spin-dry the residual organic solvent inside by using a centrifuge, and repeat the above steps 2 to 5 times, and a new organic solvent is used for each soaking.
Further, the organic solvent is absolute ethyl alcohol or other organic solvents capable of dissolving the soldering flux.
Further, the potting adhesive 106 is liquid epoxy resin, and vacuum potting equipment is adopted, or the product is placed in a vacuum box for exhaust treatment after potting in a normal pressure environment, so that the liquid epoxy resin can flow into the space between the first gap 107 and the second gap 108 for insulation sealing, and finally the liquid epoxy resin is cured, and the product manufacturing is completed.
According to the invention, the distance between the disc-shaped multilayer ceramic capacitor and the upper surface of the glass body is increased through the gasket, the size of the first gap is increased, the organic solvent can conveniently enter the disc-shaped multilayer ceramic capacitor for soaking and washing in the later period, the second gap is reserved between the disc-shaped multilayer ceramic capacitor and the inner side surface of the metal shell, and the first gap is communicated with the second gap, so that the residual position of the soldering flux can be conveniently and effectively cleaned, the residual problem of the soldering flux is effectively avoided, meanwhile, the structural design of the C-shaped gasket can facilitate the organic solvent to more freely flow between the first gap, and the cleaning efficiency is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A glass-packaged ceramic feed-through filter comprises a guide pin (100) and a metal shell (101) sleeved in the middle of the guide pin (100); the bottom of the metal shell (101) is fixed through a glass body (102) and hermetically connected with a guide pin (100) to carry out encapsulation on the end part of the metal shell (101); the glass body (102) top and metal casing (101) top inside are formed with and hold chamber (103), its characterized in that: a gasket (104) sleeved on the guide pin (100) is arranged above the glass body (102); a disc-shaped multilayer ceramic capacitor (105) is sleeved on the guide pin (100) above the gasket (104); a first gap (107) is formed between the bottom of the disc-shaped multilayer ceramic capacitor (105) and the top of the glass body (102); the disc-shaped multilayer ceramic capacitor (105) is welded and fixed in the accommodating cavity (103); at least one second gap (108) is formed between the disc-shaped multilayer ceramic capacitor (105) and the inner wall of the metal shell (101) or the outer side of the guide pin (100); the first gap (107) is in communication with a second gap (108); the top of the disc-shaped multilayer ceramic capacitor (105) is encapsulated by a potting adhesive (106).
2. The glass-encapsulated ceramic feedthrough filter of claim 1, wherein: the glass body (102) is fixed with the guide pin (100) and the metal casing (101) through sintering.
3. The glass-encapsulated ceramic feedthrough filter of claim 1, wherein: the sum of the thicknesses of the gasket (104) and the disc-shaped multilayer ceramic capacitor (105) is less than the height of the accommodating cavity (103).
4. The glass-encapsulated ceramic feedthrough filter of claim 1, wherein: the gasket (104) is a C-shaped gap gasket, and the inner diameter of the C-shaped gap gasket is equivalent to the outer diameter of the guide pin (100).
5. The glass-encapsulated ceramic feed-through filter of claim 1 or 4, wherein: the thickness of the gasket (104) is 0.05-0.5mm.
6. The glass-encapsulated ceramic feedthrough filter of claim 1, wherein: and a solder (109) is arranged between the inner hole at the center of the disc-shaped multilayer ceramic capacitor (105) and the outer side of the guide pin (100) for full-length welding and fixing.
7. The glass-encapsulated ceramic feedthrough filter of claim 1, wherein: the disc-shaped multilayer ceramic capacitor (105) and the inner wall of the metal shell (101) are partially filled with solder (109) for local fixation so that at least one second gap (108) is formed in the non-welding area.
8. The method of making a glass-encapsulated ceramic feedthrough filter of any of claims 1-7, comprising the steps of:
s1: selecting a metal shell (101) and a guide pin (100), packaging the end part of the metal shell (101) by using a glass body (102), and forming a containing cavity (103) capable of containing a gasket (104) and a disc-shaped multilayer ceramic capacitor (105) at the other end;
s2: carrying out surface electroplating treatment on the packaged metal shell (101);
s3: c-shaped gaskets (104) with inner apertures equivalent to the outer diameters of the guide pins (100) are selected to be sleeved on the guide pins (100) above the glass body (102);
s4: selecting a disc-shaped multilayer ceramic capacitor (105) to be sleeved on the guide pin (100) above the gasket (104);
s5: coating soldering flux in the clearance between the guide pin (100) and the central through hole of the disc-shaped multilayer ceramic capacitor (105) and the clearance between the outer side of the disc-shaped multilayer ceramic capacitor (105) and the inner side of the metal shell (101);
s6: filling solder (109) in a gap between the guide pin (100) and a central through hole of the disc-shaped multilayer ceramic capacitor (105) for welding; partially inserting solder (109) in the circumferential direction at a gap between the outer side of the disc-shaped multilayer ceramic capacitor (105) and the inner side of the metal case (101) to perform soldering so that a non-soldered region is formed with at least one second gap (108);
s7: after welding, an organic solvent is adopted for washing for multiple times, and the organic solvent enters the first gap (107) through the second gap (108) to effectively remove the residual soldering flux in the first gap (107);
s8: and (3) encapsulating and curing the cleaned product by using an encapsulating adhesive (106).
9. The method of claim 8, wherein the step of forming the glass-encapsulated ceramic feedthrough filter comprises: and the washing step in the step S7 is to put the welded disc-shaped multilayer ceramic capacitor (105) into an organic solvent for vacuumizing treatment, then put the capacitor into the organic solvent for soaking for 20 to 30 minutes, finally spin-dry the residual organic solvent in the capacitor by a centrifuge, repeat the steps for 2 to 5 times, and use new organic solvent during soaking each time.
10. A method of making a glass-encapsulated ceramic feed-through filter as claimed in claim 8 or 9, wherein: the organic solvent is absolute ethyl alcohol or other organic solvents capable of dissolving the soldering flux.
11. The method of claim 8, wherein the step of forming the glass-encapsulated ceramic feedthrough filter comprises: the pouring sealant (106) is liquid epoxy resin, vacuum filling and sealing equipment is adopted, or the product is placed into a vacuum box for exhaust treatment after filling and sealing are carried out under the normal pressure environment, so that the liquid epoxy resin can flow into the space between the first gap (107) and the second gap (108) for insulation sealing, and finally the liquid epoxy resin is solidified, and the product manufacturing is completed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110400663.2A CN113036335B (en) | 2021-04-14 | 2021-04-14 | Glass-packaged ceramic feed-through filter and preparation method thereof |
| PCT/CN2022/086566 WO2022218332A1 (en) | 2021-04-14 | 2022-04-13 | Glass-packaged ceramic feed-through filter and preparation method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110400663.2A CN113036335B (en) | 2021-04-14 | 2021-04-14 | Glass-packaged ceramic feed-through filter and preparation method thereof |
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| CN113036335A CN113036335A (en) | 2021-06-25 |
| CN113036335B true CN113036335B (en) | 2023-03-14 |
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| CN113036335B (en) * | 2021-04-14 | 2023-03-14 | 福建欧中电子有限公司 | Glass-packaged ceramic feed-through filter and preparation method thereof |
| CN116190969B (en) * | 2023-04-23 | 2023-06-23 | 成都宏科电子科技有限公司 | Feed-through filter and capacitor chip packaging method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11224982A (en) * | 1998-02-05 | 1999-08-17 | Sumitomo Metal Electronics Devices Inc | Mounting of chip capacitor on ceramic board |
| US5999398A (en) * | 1998-06-24 | 1999-12-07 | Avx Corporation | Feed-through filter assembly having varistor and capacitor structure |
| CN102769007B (en) * | 2012-08-10 | 2016-03-30 | 福建闽航电子有限公司 | A kind of pad structure of integrated antenna package |
| CN204315551U (en) * | 2014-12-18 | 2015-05-06 | 中国电子科技集团公司第四十三研究所 | Metal sealing glass-ceramic compound sealing structure |
| CN210780697U (en) * | 2019-11-29 | 2020-06-16 | 成都新欣神风电子科技有限公司 | Feed-through filter |
| CN211879241U (en) * | 2020-04-14 | 2020-11-06 | 福建欧中电子有限公司 | Core-through capacitor for air-tight device and packaged by non-glass |
| CN111807854A (en) * | 2020-06-10 | 2020-10-23 | 中国电子科技集团公司第五十五研究所 | Preparation method of high-airtightness packaged ceramic feed-through filter |
| CN212909450U (en) * | 2020-07-31 | 2021-04-06 | 成都宏明电子股份有限公司 | Split assembled filter |
| CN113036335B (en) * | 2021-04-14 | 2023-03-14 | 福建欧中电子有限公司 | Glass-packaged ceramic feed-through filter and preparation method thereof |
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| CN113036335A (en) | 2021-06-25 |
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