CN1130340A

CN1130340A - Comected plate body

Info

Publication number: CN1130340A
Application number: CN95116661A
Authority: CN
Inventors: 白井浩史; 内田昌树
Original assignee: Whitaker LLC
Current assignee: Whitaker LLC
Priority date: 1994-08-29
Filing date: 1995-08-29
Publication date: 1996-09-04
Also published as: JPH0878824A; TW323035U; KR960009808A

Abstract

The invention aims to secure a good state or connection, even when solder is adhered to a land when an electronic part is soldered to a tabular member to be connected on a tabular member to be connected interconnected by a pressure welded pinching type electric connector. A land 21 of a tabular member 20 to be connected is composed of a plurality of electrically conducting small land parts 21a of narrow widths, so that a height (h) of solder 22 to be adhered is suppressed low.

Description

Comected plate body

The present invention relates to a kind of comected plate body that is connected with crimping clamp-type electric connector.

Comected plate body known in the prior art is: with crimping clamp-type electric connector be clipped in the middle mutually relatively configuration, the IC chip-carrier that is electrically connected mutually by this crimping clamp-type electric connector and printed circuit board (PCB) etc.

This comected plate body generally has rectangle or circular a plurality of bonding lands (flange connector), tend to form this bonding land at electronic unit etc. on by the face of the comected plate body of flow welding, in this case, when flow welding, flow and be attached to danger on the bonding land with regard to scolding tin that fusion is arranged.Owing to forming protective layer scolding tin can not be adhered to around the bonding land, then when scolding tin flows to the bonding land, scolding tin will be attached on the face of bonding land and swell.When scolding tin adheres to and when forming this protuberance, the height on surface, bonding land just together with the actual (real) thickness of scolding tin uprise the same also to exceed so much.In case the height of bonding land uprises the danger of the distortion more than the elastic portion generation allowance that just has the contact that links to each other with the bonding land, and, the height inconsistency of having adhered to the bonding land of scolding tin and not adhered to the bonding land of scolding tin will become greatly, and the very big danger of contact pressure difference of the contact between the bonding land is just arranged.Thus, the problem with the abundant connection of electric connector will take place to realize in the result.

In view of the above problems, the purpose of this invention is to provide the high comected plate body of a kind of connection reliability, although when flow welding, adhere to scolding tin on the bonding land owing to scolding tin flows to, but can make the adhesion amount of scolding tin less, bump height is suppressed on the reduced levels, thereby guarantees the good connection status of bonding land with the contact of electric connector.

To achieve these goals, comected plate body of the present invention is characterised in that: the bonding land is made of the very little tiny junction surface of the width that conducts of some.

According to comected plate body of the present invention, because the bonding land is made of the very little tiny junction surface of the width that conducts of some, when flow welding, flow at scolding tin under the situation of bonding land, scolding tin will be attached to respectively on a plurality of tiny junction surfaces.Because tiny junction surface is to form with very little width, the adhesion amount of scolding tin is less, the height step-down of the scolding tin that adheres to.Thus, just do not have bonding land that the scolding tin that adheres to becomes bigger protuberance and adhered to scolding tin and occur the situation of making great difference with the height of the bonding land of not adhering to scolding tin.Therefore, because the contact with the continuous electric connector in the bonding land of having adhered to scolding tin can not be deformed to more than the allowance, and the contact pressure that is connected between each contact on each bonding land can not produce bigger difference yet, so can guarantee good connection status, thereby can improve the reliability of connection always with electric connector.

Embodiments of the invention are described below with reference to the accompanying drawings.

Fig. 1 represents the sectional view of the bonding land of comected plate body according to an embodiment of the invention with the contact condition of contact;

Fig. 2 is the figure of the shape of the bonding land in the expression one embodiment of the invention;

Fig. 3 is the figure of the variation of expression bonding land;

Fig. 4 is the figure of another variation of expression bonding land;

Fig. 5 is the figure of another variation of expression bonding land;

Fig. 6 is the figure of another variation of expression bonding land;

Fig. 7 is the perspective view of the brief configuration of expression electric connector and comected plate body;

Fig. 8 is the figure that represents an example of the bonding land that has earlier;

Fig. 9 is the figure that is equivalent to the IX-IX line cross section among Fig. 8.

Label among the figure is represented:

10: connector 11: contact

11a: contact site 20: comected plate body

21,21A, 21B, 21C, 21D: bonding land

21a: tiny junction surface 22: scolding tin

Fig. 1 represents that comected plate body is with the sectional view (Fig. 1 is equivalent to the I-I line sectional view among Fig. 2) of the contact condition of the contact site of the contact of crimping clamp-type electric connector according to an embodiment of the invention, and Fig. 2 is the plane graph of the form of expression bonding land shown in Figure 1.

Bonding land 21 shown in Figure 1 is by constituting with the very little tiny junction surface 21a of the formed width in gap that can fully contact with the contact site 11a of contact 11.As shown in Figure 2, bonding land 21 each interior tiny junction surface 21a form to obtain mutual conducting by conductors such as Copper Foil are whole.By making bonding land 21 become this structure, electronic unit etc. is being watered when being soldered on the comected plate body 20, even under scolding tin 22 is attached to situation on the bonding land 21, also can be limited in the height h that has adhered to scolding tin 22 as shown in Figure 1 on the small degree.Thus, the scolding tin that adheres to just can not become bigger protuberance, and the bonding land of having adhered to scolding tin just can not occur bigger inconsistent with the difference in height of the bonding land of not adhering to scolding tin.Therefore, the contact of the crimping clamp-type electric connector that is connected on the bonding land of having adhered to scolding tin just can not be deformed to more than the allowance, and bigger difference can not appear with the contact pressure between each continuous contact of each bonding land respectively yet, thereby just can guarantee all the time can improve the reliability of connection with the good connection status of crimping clamp-type electric connector.

The shape of bonding land can also be taked various ways except shown in Figure 2.In Fig. 3 to Fig. 6, express variation 21A, 21B, 21C, the 21D of bonding land.And a plurality of tiny junction surface 21a can form simultaneously by an operation, also can be formed and finally be formed the bonding land of integral body by a plurality of operations step by step.

Fig. 7 is the perspective view of the brief configuration of expression comected plate body of one embodiment of the invention and press contact clamping connector.Wherein, illustrated press contact clamping connector 10 only exemplifies, and is not limited in this.

In order to compare, respectively in Fig. 8 the existing general bonding land shape of expression and in Fig. 9 the state of expression scolding tin attached on this bonding land time.Because the bonding land 21E of Fig. 8 is made of whole conductor, when adhering to scolding tin 22, as shown in Figure 9, the height H of scolding tin 22 is quite high.

Claims

1. comected plate body, on the soldered face of electronic unit, has the bonding land, this bonding land is by contacting with the contact site from the outstanding above-mentioned contact in the electric connector surface that holds contact and being connected with this contact site, it is characterized in that above-mentioned bonding land is made of the very little tiny junction surface of the width that conducts of some.