CN113025267A - Preparation method of solvent-free UV light-initiated heating moisture dual-curing organic silicon optical adhesive - Google Patents
Preparation method of solvent-free UV light-initiated heating moisture dual-curing organic silicon optical adhesive Download PDFInfo
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- CN113025267A CN113025267A CN202011423711.1A CN202011423711A CN113025267A CN 113025267 A CN113025267 A CN 113025267A CN 202011423711 A CN202011423711 A CN 202011423711A CN 113025267 A CN113025267 A CN 113025267A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- 238000010438 heat treatment Methods 0.000 title claims abstract description 29
- 239000000853 adhesive Substances 0.000 title claims abstract description 27
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 229920002545 silicone oil Polymers 0.000 claims abstract description 20
- 239000003112 inhibitor Substances 0.000 claims abstract description 14
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 10
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 27
- 238000003756 stirring Methods 0.000 claims description 24
- 238000001723 curing Methods 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- 239000008096 xylene Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 2
- HKVYMVXTDAHXIB-UHFFFAOYSA-N dimethyl(phenyl)phosphane platinum Chemical compound [Pt].CP(C1=CC=CC=C1)C HKVYMVXTDAHXIB-UHFFFAOYSA-N 0.000 claims description 2
- 150000001282 organosilanes Chemical class 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 150000003384 small molecules Chemical class 0.000 claims description 2
- -1 tetrakis (1-phenyl-3 hexyltriazene) platinum Chemical compound 0.000 claims description 2
- 239000002318 adhesion promoter Substances 0.000 claims 2
- KLFRPGNCEJNEKU-FDGPNNRMSA-L (z)-4-oxopent-2-en-2-olate;platinum(2+) Chemical compound [Pt+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O KLFRPGNCEJNEKU-FDGPNNRMSA-L 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- UYXWTYRQGBBXHB-UHFFFAOYSA-N platinum 1,2,3,4-tetramethylcyclopenta-1,3-diene Chemical compound [Pt].CC1=C(C(=C(C1)C)C)C UYXWTYRQGBBXHB-UHFFFAOYSA-N 0.000 claims 1
- XAKYZBMFCZISAU-UHFFFAOYSA-N platinum;triphenylphosphane Chemical compound [Pt].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 XAKYZBMFCZISAU-UHFFFAOYSA-N 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 18
- 238000003475 lamination Methods 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 abstract 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract 1
- 230000009977 dual effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000012788 optical film Substances 0.000 abstract 1
- 238000012015 optical character recognition Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000003848 UV Light-Curing Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- FBSNEJXXSJHKHX-UHFFFAOYSA-N CC1=C(C(C=C1)([Pt]C)C)C Chemical compound CC1=C(C(C=C1)([Pt]C)C)C FBSNEJXXSJHKHX-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000002635 aromatic organic solvent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a preparation method of a solvent-free UV-initiated heating and moisture dual-curing organic silicon optical adhesive, which comprises the following components in parts by weight: a) 60-90 parts of optical grade alkoxy modified vinyl silicone oil, 10-30 parts of optical grade organic silicon resin, 5-15 parts of optical grade hydrogen-containing silicone oil cross-linking agent, 0.5-3 parts of tackifier, 0.001-0.1 part of inhibitor and 0.5-2 parts of catalyst. According to the invention, through the combination of optical-grade organic silicon raw materials, the organic silicon optical glue which is initiated by UV light, is subjected to post-heating and moisture dual curing is provided, the bonding strength of the glue with a base material after film forming is good, and a film formed by the glue has excellent flexibility and cohesion, so that the glue can replace the traditional acrylic acid OCR/LOCA glue or be used for preparing an OCA optical film and is used for full lamination of a large-size touch screen.
Description
Technical Field
The invention relates to the technical field of preparation of organic silicon optical adhesives, in particular to a preparation method of a solvent-free type UV light-initiated heating moisture dual-curing organic silicon optical adhesive.
Background
OCR/LOCA (optical Clear resin) is one type of optical glue, also called liquid optical glue, optical water glue or LOCA, because the glue is in a liquid state. The glue is colorless and transparent after being cured, has the light transmittance of more than 98 percent, and has the characteristics of small curing shrinkage rate, yellowing resistance and the like. The applicability is strong, and one glue can correspond to a plurality of attached products; the liquid glue has strong fluidity, is insensitive to the thickness of the printing ink and has good gap filling property; the laminating machine is suitable for large-size lamination, and the size of a laminated product is not limited; the method is suitable for curved surface fitting or complex structure fitting; the laminating yield is high, and the reworking performance is good; chemical bonding, the bonding is little influenced by temperature, and the bonding stability is strong. In the field of full lamination, compared with the traditional OCA adhesive tape, the OCR/LOCA has unique advantages in the fields of large size, curved surface, severe environment and the like. The mainstream OCR products in the market still mainly comprise acrylic products, and the acrylic products have the advantages of high adhesion and quick curing, have the defects of strong smell and poor weather resistance, and are easy to generate yellow spots or crack on a fitted screen particularly under the condition of receiving light and damp heat for a long time. The lamination process is relatively complicated and requires special processes in the edge ink area because UV light is not irradiated. By means of the excellent long-term weather resistance, extremely low shrinkage rate, excellent optical performance, lower dielectric constant and other excellent performances of the organic silicon, the organic silicon OCR optical adhesive is easy to coat, fast to cure, high in bonding yield and reworkable, so that an OCR organic silicon optical bonding scheme is adopted by more and more display factories.
At present, the silicone pressure-sensitive adhesive technology available for OCR/LOCA is based on a thermal curing system, including a platinum catalyst curing system.
The platinum curing system has the advantages of low vulcanization temperature, high transparency and the like, and is increasingly applied to the electronic field. However, the platinum vulcanization system has a low cohesive force and a poor adhesive force due to insufficient vulcanization speed, and thus it is difficult to obtain a high adhesive force. In order to meet the requirements for preparing OCR (optical character recognition) attaching products, improvement and innovation on raw materials of the system and related technologies are needed so as to improve cohesive strength and substrate bonding strength.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a preparation method of a solvent-free type UV light-initiated heating moisture dual-curing organic silicon optical adhesive.
In order to achieve the purpose, the invention provides the following technical scheme:
the preparation method of the optical transparent organic silica gel for manufacturing the solvent-free type UV-initiated heating and moisture dual-curing comprises the following steps:
a) adding toluene or xylene or a mixture thereof into a reaction kettle with stirring and heating functions, adding organic silicon resin at the constant temperature of 40-60 ℃, and stirring for 1-2 hours;
b) adding vinyl silicone oil, and stirring for 1-3 hours;
c) vacuum extraction, namely extracting and removing toluene, xylene or other organic solvents;
d) adding a hydrogen-containing silicone oil cross-linking agent and a tackifier, and stirring for 1-3 hours;
e) adding inhibitor, and stirring for 0.5-2 hours;
f) adding catalyst, stirring for 0.5-1 hr, filtering, detecting and discharging.
Preferably, the weight percentages of the components in the step a) are as follows: 30-50 parts of toluene or xylene or a mixture thereof or other organic solvents and 10-30 parts of organic silicon resin.
Preferably, the weight portion of the vinyl silicone oil in the step b) is 60-90 portions, the viscosity is 300-30000cSt, and the vinyl content is 0.05-0.7%.
Preferably, the solvent in the step c) comprises an aromatic organic solvent, a straight-chain alkane solvent and a low-viscosity volatile organic silicon solvent, and the vacuum extraction temperature is 100-200 ℃.
Preferably, the hydrogen content of the hydrogen-containing silicone oil in the step d) is 0.01-1.0%, and the weight part is 5-15 parts.
Preferably, the weight part of the tackifier in the step d) is 0.5-3 parts. The tackifier is alkyl-modified, acrylic-modified, epoxy-modified organosilane or oligomer thereof.
Preferably, the weight part of the inhibitor in the step e) is 0.005-0.1 part. The inhibitor is alkynol and small molecule polymer inhibitor containing multiple vinyl groups.
Preferably, the catalyst used in step f) is one or a mixture of two or more of acetylacetonatoplatinum, cis-dichloro-tris (triphenylphosphine) platinum, cis-dichloro-bis (dimethylphenylphosphine) platinum, trimethyl methylcyclopentadienyl platinum, tetrakis (1-phenyl-3-hexyltriazene) platinum, and platinum/oxalate complex, beta-dicarbonyl platinum. .
The beneficial effects brought by the invention are as follows: the combination of the organic silicon oil raw material with a proper chemical structure, the cross-linking agent, the tackifier and the catalyst is adopted, so that the operability and the curing process of the glue are improved, and good operating parameters and high bonding strength are achieved:
1. the modified vinyl silicone oil with a specific structure is adopted, so that a certain cohesive strength can be achieved, and the adhesive force of a system can be enhanced;
2. the organic silicon resin with proper molecular weight and M/Q ratio is adopted, so that the cohesive strength can be improved, the adhesive force can be increased, and the hardness of the glue after film forming can be reduced;
3. the proper cross-linking agent is used for adjusting the film forming property and the cohesive strength of the glue;
4. the UV activated platinum catalyst is adopted, so that the operable time and the initial adhesive force of the glue are improved, and the glue can be quickly cured after being initiated.
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided to enable those skilled in the art to more easily understand the advantages and features of the present invention, and to clearly and clearly define the scope of the present invention.
The first embodiment is as follows: 60-90 parts of optical grade alkoxy modified vinyl silicone oil, 10-30 parts of optical grade organic silicon resin, 5-15 parts of optical grade hydrogen-containing silicone oil cross-linking agent, 0.5-3 parts of tackifier, 0.001-0.1 part of inhibitor and 0.5-2 parts of catalyst.
A preparation method of solvent-free UV-initiated heating curing organic silicon optical adhesive comprises the following steps:
a) adding 50 parts of toluene into a reaction kettle with stirring and heating functions, and heating to 40 ℃ for constant temperature; adding 15 parts of organic silicon resin with the molecular weight of 5000, and stirring for 1 hour;
b) adding 500cst modified vinyl silicone oil, and stirring for 1 hour;
c) the mixture was vacuum extracted for 1.5 hours at 130 ℃ with stirring.
d) Adding 8 parts of hydrogen-containing silicone oil and 0.5 part of tackifier, and stirring for 30 minutes.
e) 0.05 part of an inhibitor was added thereto, and the mixture was stirred for 30 minutes.
f) 0.5 part of a catalyst was added thereto, and the mixture was stirred for 30 minutes. Filtering, detecting and discharging.
The obtained organic silicon pressure-sensitive adhesive is coated on 1cm×Pressing a glass sheet with the same size on the surface of a 1cm glass block, after primary UV curing, further heating and curing for 2 minutes, and after standing for 3 days at room temperature, testing the adhesive strength.
Example two:
a preparation method of solvent-free UV-initiated heating curing organic silicon optical adhesive comprises the following steps:
a) adding 50 parts of toluene into a reaction kettle with stirring and heating functions, and heating to 40 ℃ for constant temperature; adding 20 parts of organic silicon resin with the molecular weight of 5000, and stirring for 1 hour;
b) adding 1000cSt alkoxy modified vinyl silicone oil, and stirring for 1 hour;
c) vacuum extraction was carried out at 140 ℃ for 1.5 hours.
d) Adding 8 parts of hydrogen-containing silicone oil and 1 part of tackifier, and stirring for 30 minutes.
e) 0.05 part of an inhibitor was added thereto, and the mixture was stirred for 30 minutes.
f) 0.5 part of a catalyst was added thereto, and the mixture was stirred for 30 minutes. Filtering, detecting and discharging.
The obtained organic silicon pressure-sensitive adhesive is coated on 1cm×Pressing a glass sheet with the same size on the surface of a 1cm glass block, after primary UV curing, further heating and curing for 2 minutes, and after standing for 3 days at room temperature, testing the adhesive strength.
Example three:
a) adding 50 parts of toluene into a reaction kettle with stirring and heating functions, and heating to 40 ℃ for constant temperature; adding 20 parts of organic silicon resin with the molecular weight of 5000, and stirring for 1 hour;
b) 10000cSt alkoxy modified vinyl silicone oil is added and stirred for 1 hour;
c) vacuum extraction was carried out at 130 ℃ for 1.5 hours.
d) Adding 8 parts of hydrogen-containing silicone oil and 1.5 parts of tackifier, and stirring for 30 minutes.
e) 0.05 part of an inhibitor was added thereto, and the mixture was stirred for 30 minutes.
f) 0.5 part of a catalyst was added thereto, and the mixture was stirred for 30 minutes. Filtering, detecting and discharging.
The obtained organic silicon pressure-sensitive adhesive is coated on 1cm×Pressing a glass sheet with the same size on the surface of a 1cm glass block, after primary UV curing, further heating and curing for 2 minutes, and after standing for 3 days at room temperature, testing the adhesive strength.
Table 1 test results of performance of silicone OCA glue obtained in example
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be made by those skilled in the art without inventive work within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (12)
1. A preparation method of a solvent-free UV light-initiated heating and moisture dual-curing organic silicon optical adhesive is characterized by comprising the following steps:
adding toluene or xylene or a mixture thereof into a reaction kettle with stirring and heating functions, adding organic silicon resin at the constant temperature of 40-60 ℃, and stirring for 1-2 hours;
adding vinyl silicone oil, and stirring for 1-3 hours;
vacuum extraction, namely extracting and removing the toluene or xylene solvent;
adding a hydrogen-containing silicone oil cross-linking agent and a tackifier, and stirring for 1-3 hours;
adding inhibitor, and stirring for 0.5-2 hours;
adding catalyst, stirring for 0.5-1 hr, filtering, detecting and discharging.
2. The preparation method of the solvent-free UV light-initiated heating and moisture dual-curing silicone optical adhesive according to claim 1, wherein the components in the step a) are in parts by weight: 30-50 parts of toluene or xylene or a mixture thereof and 10-30 parts of organic silicon resin.
3. The method for preparing the solvent-free UV light-initiated heating and moisture dual-curing silicone optical adhesive according to claim 1, wherein the weight part of the vinyl silicone oil in the step b) is 60-90 parts.
4. The preparation method of the solvent-free UV light-initiated heating and moisture dual-curing silicone optical adhesive according to claim 1, wherein in the step d), the amount of the cross-linking agent containing hydrogen silicone oil is 5-15 parts by weight, and the amount of the adhesion promoter is 0.5-3 parts by weight.
5. The method for preparing the solvent-free UV light-induced heating moisture dual-curing silicone optical adhesive according to claim 1, wherein the weight part of the inhibitor in the step e) is 0.001-0.1 part.
6. The method for preparing the solvent-free UV light-induced heating moisture dual-curing silicone optical adhesive according to claim 1, wherein the amount of the catalyst added in the step f) is 0.5-2 parts.
7. The method for preparing the solvent-free UV light-initiated heat-curable silicone optical adhesive according to claim 1, wherein the viscosity of the vinyl silicone oil is between 300-30000 cSt.
8. The method for preparing the solvent-free UV light-induced heating moisture dual-curing silicone optical adhesive according to claim 1, wherein the M/Q ratio of the silicone resin is between 0.5 and 1.2.
9. The molecular weight is between 3000 and 20000.
10. The method of claim 1 wherein the adhesion promoter is an alkyl-modified, acrylic-modified, epoxy-modified organosilane or oligomer thereof.
11. The method for preparing the solvent-free UV light-initiated heating and moisture dual-curing organic silicon optical adhesive according to claim 1, wherein the inhibitor is an alkynol inhibitor and a small-molecule polymer inhibitor containing multiple vinyl groups.
12. The method for preparing the solvent-free UV light-induced heating and moisture dual-curing organic silicon optical adhesive according to claim 1, wherein the catalyst is one or a mixture of platinum acetylacetonate, cis-dichlorotris (triphenylphosphine) platinum, cis-dichlorobis (dimethylphenylphosphine) platinum, trimethylmethylcyclopentadiene platinum, tetrakis (1-phenyl-3 hexyltriazene) platinum, and platinum/oxalate complex, beta-dicarbonyl platinum.
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| Publication number | Priority date | Publication date | Assignee | Title |
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